CN214745046U - LED photoelectric module assembly - Google Patents

Abstract

The utility model discloses a LED photovoltaic module subassembly relates to LED lamps and lanterns technical field. The utility model discloses a LED base plate and heating panel, LED base plate bottom surface array have a plurality of LED lamp pearls, and the heat-conducting plate is installed to the heating panel bottom surface, and the mounting groove has been seted up to heat-conducting plate and LED base plate laminating, heating panel upper surface, and fixed surface is connected with the thermal-insulated installing frame in the mounting groove, and surface mounting has photovoltaic module on the LED base plate, is provided with insulating cover between LED base plate and the photovoltaic module, and photovoltaic module installs inside the thermal-insulated installing frame. The utility model discloses a set up heating panel, heat radiation fins and heat-conducting plate, let the radiating effect of this subassembly better, the circuit is more stable during the illumination of lamp pearl to the subassembly can easily load and unload, has promoted the packaging efficiency of this subassembly, and later maintenance is also more convenient.

Description

LED photoelectric module assembly

Technical Field

The utility model belongs to the technical field of the LED lamps and lanterns, especially, relate to a LED photovoltaic module subassembly.

Background

The LED is used as a fourth generation lighting source, and has the advantages of remarkable energy saving and service life. With the development of society, the problem of illumination energy consumption in daily life is increasingly prominent, so that the LED lamp with the remarkable energy-saving advantage is more and more favored by people.

The existing LED photoelectric module assembly is not provided with good heat dissipation performance, so that the circuit of the LED photoelectric module is easily burnt out, and therefore the LED photoelectric module assembly is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED photovoltaic module subassembly solves current LED photovoltaic module unit mount and does not possess fine thermal diffusivity again, burns out the problem of the circuit of LED photovoltaic module very easily like this.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a LED photoelectric module subassembly, including LED base plate and heating panel, LED base plate bottom surface array has a plurality of LED lamp pearls, the heat-conducting plate is installed to the heating panel bottom surface, the heat-conducting plate is laminated with the LED base plate, the mounting groove has been seted up to the heating panel upper surface, fixed surface is connected with the thermal-insulated installing frame in the mounting groove, surface mounting has the photoelectric module on the LED base plate, be provided with insulating cover between LED base plate and the photoelectric module, the photoelectric module is installed inside the thermal-insulated installing frame, when LED lamp pearl is luminous, the LED base plate can produce a large amount of heats, the heat passes through heat-conducting plate conduction to heating panel, promote the radiating efficiency of LED base plate, the thermal-insulated installing frame carries out the installation of photoelectric module, and avoid heat conduction to lead to the circuit to burn out in the photoelectric module, promote the stability of module when using, the holistic security of insulating cover promotion subassembly.

Furthermore, the upper surface of the heat dissipation plate is provided with the heat dissipation fins, the heat dissipation fins improve the overall heat dissipation rate of the heat dissipation plate, the heat dissipation effect of the assembly is better, and the circuit is more stable during lamp bead illumination.

Furthermore, side grooves are formed in the two opposite side walls of the heat dissipation plate, and heat insulation plates are arranged in the side grooves.

Furthermore, the upper surface of the LED substrate is fixedly connected with a plurality of inserting columns, the bottom surface of the heat insulation plate is provided with a plurality of slots, and the inserting columns are clamped and matched with the slots.

Furthermore, a spring groove is formed in one side wall of the inserting column, a first spring is arranged in the spring groove, a clamping block is fixedly connected to one end of the first spring, a clamping groove is formed in one side wall of the inserting groove, and the clamping block is clamped and matched with the clamping groove.

Furthermore, a plurality of pressure grooves are formed in one side wall of the heat insulation plate and are connected with the clamping grooves, a plurality of second springs are fixedly connected to the inner side wall of each pressure groove, one end of each second spring is fixedly connected with a connecting plate, one side wall of each connecting plate is fixedly connected with a pressure column, and the position of each pressure column is matched with the corresponding clamping block.

Furthermore, a button is arranged on the other surface of the connecting plate, when the LED substrate and the heat dissipation plate need to be assembled, the inserting column is inserted into the slot, the clamping block is extruded by the inner wall and pressed into the spring slot, when the position of the spring slot is aligned with the clamping slot, the first spring ejects the clamping block, the clamping block is clamped into the clamping slot, the LED substrate and the heat dissipation plate are fixed, when the LED substrate needs to be disassembled and maintained subsequently, the button is pressed, the connecting plate pushes the pressing column, the pressing column pushes the clamping block into the spring slot, and therefore the heat dissipation plate can be separated from the substrate; the heat insulation board prevents the loading and unloading mechanism from being influenced by high temperature.

The utility model discloses following beneficial effect has:

the utility model discloses a set up heating panel, heat radiation fins and heat-conducting plate, conduct the heat to the heating panel through the heat-conducting plate, promote the radiating efficiency of LED base plate, heat radiation fins promotes the whole heat dissipation rate of heating panel, lets the radiating effect of this subassembly better, the circuit is more stable when the lamp pearl is lighted; by arranging the heat insulation mounting frame, the circuit is prevented from being burnt out due to heat conduction into the photoelectric module, and the stability of the module in use is improved; through setting up the heat insulating board, inserting post, slot, fixture block and draw-in groove, let the heating panel can with the light equipment of base plate dismantlement, promoted the packaging efficiency of this subassembly, later maintenance is also more convenient.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic isometric view of an LED photovoltaic module assembly;

FIG. 2 is a schematic top view of an LED optoelectronic module assembly;

FIG. 3 is a schematic view of the cross-sectional structure A-A of FIG. 2;

FIG. 4 is a partial enlarged view of portion B of FIG. 3;

fig. 5 is a schematic diagram of a right-side perspective structure of an LED photovoltaic module assembly.

In the drawings, the components represented by the respective reference numerals are listed below: 1. a heat dissipation plate; 2. heat dissipation fins; 3. mounting grooves; 4. a heat insulating mounting frame; 5. an LED substrate; 6. an insulating sleeve; 7. a photovoltaic module; 8. LED lamp beads; 9. a heat conducting plate; 10. a side groove; 11. a heat insulation plate; 12. inserting a column; 13. a slot; 14. a spring slot; 15. a first spring; 16. a clamping block; 17. a card slot; 18. pressing a groove; 19. a second spring; 20. a connecting plate; 21. pressing the column; 22. a button.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-5, the present invention relates to a LED photovoltaic module assembly, which comprises a LED substrate 5 and a heat sink 1, wherein a plurality of LED beads 8 are arrayed on the bottom surface of the LED substrate 5, a heat conducting plate 9 is mounted on the bottom surface of the heat sink 1, the heat conducting plate 9 is attached to the LED substrate 5, a mounting groove 3 is formed on the upper surface of the heat sink 1, a heat insulating mounting frame 4 is fixedly connected to the inner surface of the mounting groove 3, a photovoltaic module 7 is mounted on the upper surface of the LED substrate 5, an insulating sleeve 6 is disposed between the LED substrate 5 and the photovoltaic module 7, the photovoltaic module 7 is mounted inside the heat insulating mounting frame 4, when the LED beads 8 emit light, the LED substrate 5 generates a large amount of heat, the heat is conducted to the heat sink 1 through the heat conducting plate 9, the heat radiating efficiency of the LED substrate 5 is improved, the heat insulating mounting frame 4 is used for mounting the photovoltaic module 7, and the circuit is prevented from being burnt out due to the heat conducted into the photovoltaic module 7, the stability of the module in use is improved, and the overall safety of the assembly is improved by the insulating sleeve 6; the upper surface of the heat dissipation plate 1 is provided with the heat dissipation fins 2, and the heat dissipation fins 2 improve the overall heat dissipation rate of the heat dissipation plate 1, so that the heat dissipation effect of the assembly is better, and the circuit is more stable during lamp bead illumination.

The opposite two side walls of the heat radiation plate 1 are provided with side grooves 10, and heat insulation plates 11 are arranged in the side grooves 10.

The upper surface of the LED substrate 5 is fixedly connected with a plurality of inserting columns 12, the bottom surface of the heat insulation plate 11 is provided with a plurality of slots 13, and the inserting columns 12 are clamped and matched with the slots 13; a spring groove 14 is formed in one side wall of the inserting column 12, a first spring 15 is arranged in the spring groove 14, one end of the first spring 15 is fixedly connected with a clamping block 16, a clamping groove 17 is formed in one side wall of the inserting groove 13, and the clamping block 16 is clamped and matched with the clamping groove 17; a plurality of pressure grooves 18 are formed in one side wall of the heat insulation plate 11, the pressure grooves 18 are connected with the clamping grooves 17, a plurality of second springs 19 are fixedly connected to the inner side wall of the pressure grooves 18, one ends of the second springs 19 are fixedly connected with a connecting plate 20, one side wall of the connecting plate 20 is fixedly connected with pressure columns 21, and the positions of the pressure columns 21 are matched with the clamping blocks 16; the button 22 is arranged on the other surface of the connecting plate 20, when the LED substrate 5 and the heat dissipation plate 1 need to be assembled, the inserting column 12 is inserted into the slot 13, the fixture block 16 is extruded by the inner wall and pressed into the spring groove 14, when the position of the spring groove 14 is aligned with the clamp groove 17, the first spring 15 ejects the fixture block 16, the fixture block 16 is clamped into the clamp groove 17, so that the LED substrate 5 and the heat dissipation plate 1 are fixed, when the LED substrate 5 needs to be disassembled and maintained subsequently, the button 22 is pressed, the connecting plate 20 pushes the pressing column 21, the pressing column 21 pushes the fixture block 16 into the spring groove 14, and the heat dissipation plate 1 can be separated from the substrate; the heat shield 11 prevents the attachment and detachment mechanism from being affected by high temperature.

The embodiment shown in fig. 1-5 is a method for using an LED optoelectronic module assembly: the thermal-insulated installing frame 4 carries out the installation of optoelectronic module 7, and avoid heat conduction to lead to the circuit to burn out in the optoelectronic module 7, insulating cover 6 promotes the holistic security of subassembly, heat radiation fin 2 promotes the whole rate of heat dissipation of heating panel 1, when needing to assemble LED base plate 5 with heating panel 1, insert post 12 in slot 13, fixture block 16 receives the inner wall extrusion, be impressed in spring groove 14, when spring groove 14 position aligns with draw-in groove 17, first spring 15 pops out fixture block 16, fixture block 16 card goes into draw-in groove 17, thereby make and fix between LED base plate 5 and the heating panel 1, follow-up when needing to dismantle the maintenance to LED base plate 5, press button 22, connecting plate 20 promotes compression leg 21, compression leg 21 pushes in spring groove 14 with fixture block 16, thereby can separate heating panel 1 and base plate, this mode has promoted the packaging efficiency of this subassembly.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims (7)

1. The utility model provides a LED photovoltaic module subassembly, includes LED base plate (5) and heating panel (1), its characterized in that: LED base plate (5) bottom surface array has a plurality of LED lamp pearls (8), heat-conducting plate (9) are installed to heating panel (1) bottom surface, heat-conducting plate (9) and LED base plate (5) laminating, mounting groove (3) have been seted up to heating panel (1) upper surface, fixed surface is connected with thermal-insulated installing frame (4) in mounting groove (3), surface mounting has photovoltaic module (7) on LED base plate (5), be provided with between LED base plate (5) and photovoltaic module (7) insulating cover (6), photovoltaic module (7) are installed inside thermal-insulated installing frame (4).

2. The LED photovoltaic module assembly according to claim 1, wherein the heat sink (1) has heat sink fins (2) mounted on its upper surface.

3. The LED photovoltaic module assembly according to claim 1, wherein the heat dissipation plate (1) has side grooves (10) formed on both opposite side walls, and the heat insulation plate (11) is installed inside the side grooves (10).

4. The LED photovoltaic module assembly according to claim 3, wherein a plurality of insertion posts (12) are fixedly connected to the upper surface of the LED substrate (5), a plurality of insertion slots (13) are formed in the bottom surface of the thermal insulation board (11), and the insertion posts (12) are in clamping fit with the insertion slots (13).

5. The LED photovoltaic module assembly according to claim 4, wherein a spring groove (14) is formed in a side wall of the plug post (12), a first spring (15) is disposed inside the spring groove (14), a clamping block (16) is fixedly connected to one end of the first spring (15), a clamping groove (17) is formed in a side wall of the insertion groove (13), and the clamping block (16) is in clamping fit with the clamping groove (17).

6. The LED photovoltaic module assembly according to claim 5, wherein a plurality of pressing grooves (18) are formed in one side wall of the heat insulation plate (11), the pressing grooves (18) are connected with the clamping grooves (17), a plurality of second springs (19) are fixedly connected to the inner side wall of each pressing groove (18), one end of each second spring (19) is fixedly connected with a connecting plate (20), a pressing column (21) is fixedly connected to one side wall of each connecting plate (20), and the position of each pressing column (21) is matched with the corresponding clamping block (16).

7. The LED photovoltaic module assembly according to claim 6, wherein the other surface of the connection plate (20) is provided with a button (22).

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