CN219809838U - A high-efficiency and energy-saving semiconductor lighting module - Google Patents

Abstract

The utility model discloses a high-efficiency and energy-saving semiconductor lighting module, which includes a housing. An inverted T-shaped installation frame is fixedly connected to the housing. There are slots on both left and right sides of the lower part of the installation frame. The installation frame There are two slots on the left and right sides of the upper part. The LED light board is inserted into slot one, and the thermal conductive plate is inserted into slot two. The power supply component is fixed on the bottom of the thermal conductive plate, and the top of the shell is evenly penetrated with There are several through holes, and several heat dissipation plates are evenly arranged on the top of the installation frame. The heat dissipation plates pass upward out of the through holes, and the left end of the housing is threadedly connected to a cover plate. The installation process of the practical semiconductor lighting module is simpler, and it is convenient for subsequent disassembly and maintenance, which improves the installation and maintenance efficiency of the semiconductor lighting module. At the same time, dual heat dissipation measures are adopted, thereby improving the heat dissipation performance of the semiconductor lighting module, thereby improving the efficiency of the semiconductor lighting module. improve the service life of semiconductor lighting modules.

Description

A high-efficiency and energy-saving semiconductor lighting module

Technical field

The utility model relates to the technical field of semiconductor lighting modules, specifically a high-efficiency and energy-saving semiconductor lighting module.

Background technique

Semiconductor lighting is an emerging lighting technology. Its basic device is a light-emitting diode (LED for short). It is a semiconductor solid-state light-emitting device that uses solid semiconductor chips as luminescent materials to release excess light through carrier recombination in the semiconductor. Energy causes photon emission, directly emitting red, yellow, blue, green, cyan, orange, purple, and white light. Energy-saving semiconductor lighting modules are lighting fixtures manufactured using LEDs as light sources. They have significant features such as high efficiency, energy saving, environmental protection, and easy maintenance. They are an effective way to achieve energy saving and emission reduction. However, the assembly of existing semiconductor lighting modules is time-consuming and requires the use of a large number of screws to install the power supply components and lighting panels in the housing. The installation process is cumbersome and inconvenient for disassembly and maintenance, resulting in low installation and maintenance efficiency.

Utility model content

The purpose of this utility model is to provide a high-efficiency and energy-saving semiconductor lighting module to solve the problem of low installation and maintenance efficiency of semiconductor lighting modules proposed in the above background technology.

In order to solve the above technical problems, the present utility model provides the following technical solutions:

A high-efficiency and energy-saving semiconductor lighting module includes a shell. An inverted T-shaped mounting frame is fixedly connected to the shell. There are slots on both left and right sides of the lower part of the mounting frame. The mounting frame There are two slots on the left and right sides of the upper part of the frame. An LED light panel is inserted into the first slot. A heat conduction plate is inserted into the second slot. A power supply component is fixedly connected to the bottom surface of the heat conduction plate. A number of through holes are evenly penetrated on the top of the housing, and a number of heat dissipation plates are evenly arranged on the top of the mounting frame. The heat dissipation plates pass upward out of the through holes. The left end of the housing is threadedly connected with a cover. plate.

Furthermore, several heat dissipation holes are evenly arranged on the upper ends of the left and right sides of the installation frame.

Furthermore, a lampshade is clipped onto the bottom end of the housing, and mounting feet are provided on both left and right sides of the lower part.

Further, a wiring hole is penetrated through the center of the cover plate, and the wiring hole is used for the circuits of the power supply assembly to pass through.

Further, the cover plate is screwed to the left end of the housing through bolts.

Furthermore, both the bottom and the left side of the housing are open structures.

Compared with the existing technology, the beneficial effects achieved by this utility model are:

1. This utility model directly inserts the LED light panel and power supply assembly into the installation frame, and then seals the cover. In this way, the semiconductor lighting module is installed. The installation process is simpler, and it is convenient for subsequent disassembly and maintenance, which improves the efficiency of semiconductor lighting. Module installation and maintenance efficiency;

2. This utility model dissipates the heat in the installation frame to the top of the casing through the heat dissipation holes, and then is dissipated by the heat dissipation plate. At the same time, the heat conductive plate guides the heat generated by the power supply component to the heat dissipation plate and then dissipates it, using double heat dissipation. Measures are taken to improve the heat dissipation performance of the semiconductor lighting module, thereby increasing the service life of the semiconductor lighting module.

Description of the drawings

The accompanying drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. They are used to explain the present utility model together with the embodiments of the present utility model, and do not constitute a limitation of the present utility model. In the attached picture:

Figure 1 is a main cross-sectional view of the utility model;

FIG. 2 is a left cross-sectional view along section line A in FIG. 1 .

In the picture: 1. Shell; 2. Installation frame; 3. Slot one; 4. Slot two; 5. LED light panel; 6. Heat conductor plate; 7. Power supply component; 8. Through hole; 9. Heat sink plate ; 10. Cover plate; 11. Heat dissipation holes; 12. Lampshade; 13. Installation feet; 14. Wiring holes.

Detailed ways

In order to further explain each embodiment, the present invention provides drawings, which are part of the disclosure of the present utility model. They are mainly used to illustrate the embodiments and can be used to explain the operating principles of the embodiments in conjunction with the relevant descriptions in the specification. By referring to these contents, those skilled in the art will be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

According to embodiments of the present invention, a high-efficiency and energy-saving semiconductor lighting module is provided.

Example 1:

As shown in Figure 1-2, a high-efficiency and energy-saving semiconductor lighting module includes a shell 1. A mounting frame 2 with an inverted T-shaped structure is fixedly connected to the shell 1. The left and right sides of the lower part of the mounting frame 2 are Slot one 3 is provided, and slot two 4 is provided on the left and right sides of the upper part of the installation frame 2. An LED light panel 5 is inserted into slot one 3, and a heat conduction plate 6 is inserted into slot two 4. The heat conduction plate A power supply component 7 is fixedly connected to the bottom of 6. A number of through holes 8 are evenly penetrated on the top of the housing 1. A number of heat dissipation plates 9 are evenly arranged on the top of the mounting frame 2. The heat dissipation plates 9 pass upward through the through holes 8. The left end of the body 1 is threadedly connected with a cover plate 10;

Example 2:

There are several heat dissipation holes 11 evenly arranged on the upper ends of the left and right sides of the installation frame 2. The heat in the installation frame 2 is dissipated through the heat dissipation holes 11 to the top of the housing 1, and then the heat is dissipated from the heat dissipation plate 9;

The bottom end of the housing 1 is connected with a lampshade 12, and the left and right sides of the lower part are provided with mounting feet 13;

A threading hole 14 runs through the center of the cover 10, and the threading hole 14 allows the circuits of the power supply assembly 7 to pass through;

The cover 10 is screwed to the left end of the housing 1 through bolts;

The bottom and left side of the housing 1 are open structures;

The working principle of this utility model:

When installing the semiconductor lighting module, first insert the mounting frame 2 into the housing 1 from the opening at the bottom of the housing 1, and at the same time make the heat sink 9 on the top of the mounting frame 2 pass through the through hole 8 on the top of the housing 1, and then insert the mounting frame 2 into the housing 1. 2 is welded together with the housing 1 (this step is completed on the production line). After production, when assembling the semiconductor lighting module, insert the LED light panel 5 into the lower part of the mounting frame 2 from the opening on the left side of the housing 1 At the same time, insert the heat conduction plate 6 on the top of the power supply assembly 7 into the slot two 4 in the upper part of the installation frame 2, and then pass the wiring of the power supply assembly 7 through the wiring hole 14 of the cover 10, and then The cover plate 10 is tightened on the left end of the housing 1 through bolts, so that the semiconductor lighting module is assembled;

Therefore, the utility model directly inserts the LED light panel 5 and the power supply assembly 7 into the installation frame 2, and then seals the cover 10. In this way, the semiconductor lighting module is installed. The installation process is simpler, and it is convenient for subsequent disassembly and maintenance, and improves Improve the installation and maintenance efficiency of semiconductor lighting modules;

At the same time, the heat in the installation frame 2 is dissipated to the top of the housing 1 through the heat dissipation holes 11, and then dissipated by the heat dissipation plate 9. At the same time, the heat conduction plate 6 guides the heat generated by the power supply component 7 to the heat dissipation plate 9, and then dissipates it. Double heat dissipation measures are adopted to improve the heat dissipation performance of the semiconductor lighting module, thereby increasing the service life of the semiconductor lighting module.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment.

Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art , it is still possible to modify the technical solutions recorded in the foregoing embodiments, or to make equivalent replacements for some of the technical features. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (6)

1. The utility model provides a high-efficient energy-saving semiconductor lighting module, includes casing (1), its characterized in that: the LED lamp is characterized in that an inverted T-shaped mounting frame (2) is fixedly connected in the shell (1), slots I (3) are formed in the left side and the right side in the lower portion of the mounting frame (2), slots II (4) are formed in the left side and the right side in the upper portion of the mounting frame (2), LED lamp panels (5) are inserted in the slots I (3), heat conducting plates (6) are inserted in the slots II (4), power supply assemblies (7) are fixedly connected on the bottom surface of the heat conducting plates (6), a plurality of through holes (8) are uniformly formed in the top of the shell (1), a plurality of heat radiating plates (9) are uniformly arranged on the top end of the mounting frame (2), and the heat radiating plates (9) penetrate out of the through holes (8) upwards, and cover plates (10) are connected with the left end of the shell (1) in a threaded mode.

2. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: and a plurality of radiating holes (11) are uniformly arranged at the upper ends of the left side and the right side of the mounting frame (2).

3. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the bottom end of the shell (1) is clamped with a lampshade (12), and mounting feet (13) are arranged on the left side and the right side of the lower portion.

4. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the center of the cover plate (10) is penetrated with a threading hole (14), and the threading hole (14) is used for enabling a circuit of the power supply assembly (7) to penetrate out.

5. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the cover plate (10) is screwed on the left end of the shell (1) through bolts.

6. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the bottom and the left side of the shell (1) are both of an opening structure.