CN219809838U - High-efficiency energy-saving semiconductor lighting module - Google Patents
High-efficiency energy-saving semiconductor lighting module Download PDFInfo
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- CN219809838U CN219809838U CN202320236148.XU CN202320236148U CN219809838U CN 219809838 U CN219809838 U CN 219809838U CN 202320236148 U CN202320236148 U CN 202320236148U CN 219809838 U CN219809838 U CN 219809838U
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- lighting module
- semiconductor lighting
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- heat
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 19
- 238000012423 maintenance Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000009977 dual effect Effects 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Abstract
The utility model discloses a high-efficiency energy-saving semiconductor lighting module, which comprises a shell, wherein an installation frame with an inverted T-shaped structure is fixedly connected in the shell, slots I are formed in the left side and the right side of the lower part of the installation frame, slots II are formed in the left side and the right side of the upper part of the installation frame, an LED lamp panel is inserted into the slots I, a heat-conducting plate is inserted into the slots II, a power supply assembly is fixedly connected on the bottom surface of the heat-conducting plate, a plurality of through holes uniformly penetrate through the top of the shell, a plurality of heat dissipation plates are uniformly arranged on the top end of the installation frame, the heat dissipation plates upwards penetrate out of the through holes, and a cover plate is connected at the left end of the shell in a threaded manner. The utility model discloses the installation of semiconductor lighting module is more simple and convenient, and convenient follow-up dismantlement maintenance has improved semiconductor lighting module's installation and maintenance efficiency, adopts dual radiating measure simultaneously to improve semiconductor lighting module's heat dispersion, and then improved semiconductor lighting module's life.
Description
Technical Field
The utility model relates to the technical field of semiconductor lighting modules, in particular to a high-efficiency energy-saving semiconductor lighting module.
Background
The semiconductor lighting is an emerging lighting technology, the basic device is a light-emitting diode (LED for short), and the semiconductor solid light-emitting device is a semiconductor solid light-emitting device, which uses a solid semiconductor chip as a light-emitting material, and photon emission is caused by the fact that excessive energy is emitted through carrier recombination in the semiconductor, so that red, yellow, blue, green, cyan, orange, purple and white light is directly emitted. The energy-saving semiconductor lighting module is a lighting fixture manufactured by using LEDs as light sources, has the remarkable characteristics of high efficiency, energy conservation, environmental protection, easiness in maintenance and the like, and is an effective way for realizing energy conservation and emission reduction. But current semiconductor lighting module equipment takes place, needs to use a large amount of screws to install power supply module and light board respectively in the casing, and the installation is more loaded down with trivial details, inconvenient dismantlement maintenance moreover, leads to installation and maintenance efficiency lower.
Disclosure of Invention
The utility model aims to provide an efficient and energy-saving semiconductor lighting module, which is used for solving the problem of lower installation and maintenance efficiency of the semiconductor lighting module in the background technology.
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model provides a high-efficient energy-saving semiconductor lighting module, includes the casing, the rigid coupling has the installing frame of reverse T type structure in the casing, slot one has all been opened on the left and right sides in the installing frame lower part, slot two has all been opened on the left and right sides in the installing frame upper portion, insert the LED lamp plate in the slot one, insert the heat-conducting plate in the slot two, the rigid coupling has power supply unit on the heat-conducting plate bottom surface, evenly run through on the casing top has a plurality of through-hole, evenly arrange has a plurality of heating panel on the installing frame top, the heating panel upwards wears out outside the through-hole, casing left end threaded connection has the apron.
Further, a plurality of heat dissipation holes are uniformly arranged at the upper ends of the left side and the right side of the mounting frame.
Further, the bottom end of the shell is clamped with a lampshade, and mounting feet are arranged on the left side and the right side of the lower portion.
Further, a threading hole is formed in the center of the cover plate in a penetrating mode, and the threading hole is used for enabling a circuit of the power supply assembly to penetrate out.
Further, the cover plate is screwed on the left end of the shell through bolts.
Further, the bottom and the left side of the shell are both of an opening structure.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the LED lamp panel and the power supply assembly are directly inserted into the mounting frame, and then the cover plate is sealed, so that the semiconductor lighting module is mounted, the mounting process is simpler and more convenient, the subsequent disassembly and maintenance are convenient, and the mounting and maintenance efficiency of the semiconductor lighting module is improved;
2. according to the utility model, the heat in the mounting frame is radiated to the inner top of the shell through the radiating holes and then radiated by the radiating plate, and meanwhile, the heat generated by the power supply assembly is guided to the radiating plate by the heat conducting plate and then radiated, and the dual radiating measure is adopted, so that the radiating performance of the semiconductor lighting module is improved, and the service life of the semiconductor lighting module is prolonged.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a front cross-sectional view of the present utility model;
fig. 2 is a left cross-sectional view taken along section line a in fig. 1.
In the figure: 1. a housing; 2. a mounting frame; 3. a first slot; 4. a second slot; 5. an LED lamp panel; 6. a heat conductive plate; 7. a power supply assembly; 8. a through hole; 9. a heat dissipation plate; 10. a cover plate; 11. a heat radiation hole; 12. a lamp shade; 13. mounting feet; 14. and a threading hole.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the utility model, an efficient and energy-saving semiconductor lighting module is provided.
Embodiment one:
as shown in fig. 1-2, an efficient energy-saving semiconductor lighting module comprises a shell 1, wherein an installation frame 2 with an inverted-T structure is fixedly connected in the shell 1, a first slot 3 is formed on the left side and the right side in the lower part of the installation frame 2, a second slot 4 is formed on the left side and the right side in the upper part of the installation frame 2, an LED lamp panel 5 is inserted in the first slot 3, a heat conducting plate 6 is inserted in the second slot 4, a power supply assembly 7 is fixedly connected on the bottom surface of the heat conducting plate 6, a plurality of through holes 8 uniformly penetrate through the top of the shell 1, a plurality of heat radiating plates 9 are uniformly arranged on the top end of the installation frame 2, the heat radiating plates 9 penetrate out of the through holes 8 upwards, and a cover plate 10 is connected at the left end of the shell 1 in a threaded manner;
embodiment two:
a plurality of heat dissipation holes 11 are uniformly arranged at the upper ends of the left side and the right side of the mounting frame 2, heat in the mounting frame 2 is dissipated to the inner top of the shell 1 through the heat dissipation holes 11, and then the heat is dissipated from the heat dissipation plate 9;
the bottom end of the shell 1 is clamped with a lampshade 12, and the left side and the right side of the lower part are provided with mounting feet 13;
a threading hole 14 is penetrated in the center of the cover plate 10, and the threading hole 14 is used for the line of the power supply assembly 7 to penetrate out;
the cover plate 10 is screwed on the left end of the shell 1 through bolts;
the bottom and the left side of the shell 1 are both of an opening structure;
the working principle of the utility model is as follows:
when the semiconductor lighting module is installed, the installation frame 2 is inserted into the shell 1 from the opening at the bottom of the shell 1, meanwhile, the heat dissipation plate 9 at the top end of the installation frame 2 penetrates through the through hole 8 at the top of the shell 1, then the installation frame 2 and the shell 1 are welded together (this step is completed on a production line), when the semiconductor lighting module is produced, the LED lamp panel 5 is inserted into the slot I3 in the lower part of the installation frame 2 from the opening at the left side of the shell 1, meanwhile, the heat conduction plate 6 at the top of the power supply assembly 7 is inserted into the slot II 4 in the upper part of the installation frame 2, then the circuit of the power supply assembly 7 penetrates out of the threading hole 14 of the cover plate 10, and then the cover plate 10 is screwed on the left end of the shell 1 through bolts, so that the semiconductor lighting module is assembled;
therefore, the LED lamp panel 5 and the power supply assembly 7 are directly inserted into the mounting frame 2, and then the cover plate 10 is sealed, so that the semiconductor lighting module is mounted, the mounting process is simpler and more convenient, the subsequent disassembly and maintenance are convenient, and the mounting and maintenance efficiency of the semiconductor lighting module is improved;
simultaneously through the heat dissipation of louvre 11 with the heat in the installation frame 2 to the inside top of casing 1, then by heating panel 9 give off, simultaneously heat-conducting plate 6 with the heat guide that power module 7 produced to the heating panel 9 on, then give off, adopt dual radiating measure to improve the heat dispersion of semiconductor lighting module, and then improved semiconductor lighting module's life.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides a high-efficient energy-saving semiconductor lighting module, includes casing (1), its characterized in that: the LED lamp is characterized in that an inverted T-shaped mounting frame (2) is fixedly connected in the shell (1), slots I (3) are formed in the left side and the right side in the lower portion of the mounting frame (2), slots II (4) are formed in the left side and the right side in the upper portion of the mounting frame (2), LED lamp panels (5) are inserted in the slots I (3), heat conducting plates (6) are inserted in the slots II (4), power supply assemblies (7) are fixedly connected on the bottom surface of the heat conducting plates (6), a plurality of through holes (8) are uniformly formed in the top of the shell (1), a plurality of heat radiating plates (9) are uniformly arranged on the top end of the mounting frame (2), and the heat radiating plates (9) penetrate out of the through holes (8) upwards, and cover plates (10) are connected with the left end of the shell (1) in a threaded mode.
2. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: and a plurality of radiating holes (11) are uniformly arranged at the upper ends of the left side and the right side of the mounting frame (2).
3. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the bottom end of the shell (1) is clamped with a lampshade (12), and mounting feet (13) are arranged on the left side and the right side of the lower portion.
4. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the center of the cover plate (10) is penetrated with a threading hole (14), and the threading hole (14) is used for enabling a circuit of the power supply assembly (7) to penetrate out.
5. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the cover plate (10) is screwed on the left end of the shell (1) through bolts.
6. The efficient and energy-saving semiconductor lighting module of claim 1, wherein: the bottom and the left side of the shell (1) are both of an opening structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320236148.XU CN219809838U (en) | 2023-02-16 | 2023-02-16 | High-efficiency energy-saving semiconductor lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320236148.XU CN219809838U (en) | 2023-02-16 | 2023-02-16 | High-efficiency energy-saving semiconductor lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219809838U true CN219809838U (en) | 2023-10-10 |
Family
ID=88209522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320236148.XU Active CN219809838U (en) | 2023-02-16 | 2023-02-16 | High-efficiency energy-saving semiconductor lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219809838U (en) |
-
2023
- 2023-02-16 CN CN202320236148.XU patent/CN219809838U/en active Active
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