CN211551187U

CN211551187U - High-light-condensation ultrathin LED hard lamp strip

Info

Publication number: CN211551187U
Application number: CN201922364200.6U
Authority: CN
Inventors: 肖志国
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2020-09-22
Anticipated expiration: 2029-12-25

Abstract

The utility model discloses an ultra-thin LED hard lamp strip of high spotlight, which comprises a substrate, the inner chamber that base plate inner chamber was equipped with installation cavity and installation cavity is the symmetry and is equipped with the support bar, and is two sets of the inner chamber that is equipped with worker type groove and worker type groove between the support bar is fixed with dirver circuit board, dirver circuit board's the left and right sides is the symmetry and is equipped with electrically conductive contact pin, and is two sets of the top that the upper end of support bar all was fixed with heat conduction silica gel strip and two sets of heat conduction silica gel strips is equipped with the mounting panel. A hard lamp strip of ultra-thin LED of high spotlight all is equipped with a wafer chip and converts a whole wafer chip strip into in every lamp pearl shell of original, the gluing fixed mounting of wafer chip strip of being convenient for improves work efficiency, electric connection has two sets of electrically conductive sockets on a whole wafer chip strip, through the grafting of two sets of electrically conductive sockets and two sets of electrically conductive contact pins to make the circuit can constitute return circuit, the quick grafting installation of the lamp pearl of being convenient for.

Description

High-light-condensation ultrathin LED hard lamp strip

Technical Field

The utility model relates to a lighting apparatus field, in particular to ultra-thin LED of high spotlight bar firmly.

Background

As a new generation of high-tech illumination products with high efficiency, energy conservation and environmental protection, LEDs have gradually advanced the production and life of thousands of households along with the great improvement of the technology, the maturity of various LED application technologies and the strong support of national policies in recent years, and particularly, the landscape illumination of municipal public infrastructures at various places is lightened, so that people can see the statues of various LED lamps, and a hard light bar is a common outdoor LED landscape lightening lamp which mainly has the length specifications of 0.3 meter, 0.6 meter, 1 meter and the like, has wide application and large consumption, but has diversified application environments and also puts higher requirements on the adaptability and reliability of the LED lamps.

The hard lamp strip of current LED is generally equipped with the even equidistant lamp pearl of distribution of multiunit on the driving circuit board, and the lamp pearl comprises base, wafer chip and lamp pearl shell, when installing, needs the less wafer chip of repeated multiple times and base to glue and glue fixedly, and is more troublesome, and wafer chip and driving circuit board welded fastening, the quick installation of inconvenient lamp pearl, so, we provide a hard lamp strip of ultra-thin LED of high spotlight.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a hard lamp strip of ultra-thin LED of high spotlight can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a hard lamp strip of ultra-thin LED of high spotlight, includes the base plate, the inner chamber that base plate inner chamber was equipped with installation cavity and installation cavity is the symmetry and is equipped with the support bar, and is two sets of the inner chamber that is equipped with worker type groove and worker type groove between the support bar is fixed with dirver circuit board, dirver circuit board's the left and right sides is the symmetry and is equipped with electrically conductive contact pin, and is two sets of the top that the upper end of support bar all was fixed with heat conduction silica gel strip and two sets of heat conduction silica gel strips is equipped with the mounting panel, the mounting panel is located the inner chamber of base plate, and the bottom of mounting.

Preferably, the mounting panel is including the mounting plate body, the fixed lamp body mechanism that glues of inner chamber that the upper end of mounting plate body was equipped with fixed recess and fixed recess, the bottom of mounting plate body is bilateral symmetry and is equipped with the grafting chamber.

Preferably, lamp body mechanism includes the wafer chip strip, the bottom of wafer chip strip is bilateral symmetry and is equipped with electrically conductive socket and wafer chip strip electric connection.

Preferably, the wafer chip strip is glued and is fixed in the inner chamber of fixed recess, and two sets of the lower extreme of electrically conductive socket all runs through the bottom of fixed recess and extends to the inner chamber in grafting chamber and electrically conductive contact pin grafting.

Preferably, the front end and the rear end of the substrate are provided with heat dissipation holes at uniform intervals, and the heat dissipation holes are communicated with the I-shaped groove.

Preferably, the upper surface and the lower surface of the heat conduction silica gel strip are provided with adhesive layers.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. all be equipped with a wafer chip and convert to a whole wafer chip strip in every lamp pearl shell originally, the glutinous fixed mounting of gluing of the wafer chip strip of being convenient for improves work efficiency.

2. Electrically connected has two sets of electrically conductive sockets on a whole wafer chip strip, through the grafting of two sets of electrically conductive sockets and two sets of electrically conductive contact pins to make the circuit can constitute the return circuit, can make the electric current flow through the wafer chip make its work luminous, the quick grafting installation of the lamp pearl of being convenient for.

Drawings

Fig. 1 is an overall structure diagram of a high-concentration ultrathin hard LED light bar of the present invention;

fig. 2 is a front sectional view of the high-concentration ultrathin hard LED light bar of the present invention;

fig. 3 is a top view partial cross section of the high-concentration ultrathin LED hard light bar of the present invention;

fig. 4 is the utility model relates to a heat conduction silica gel strip elevation of ultra-thin LED hard lamp strip of high spotlight.

In the figure: 1. a substrate; 2. mounting a plate; 21. installing a plate body; 22. fixing the groove; 23. an insertion cavity; 3. a lamp body mechanism; 31. a wafer chip bar; 32. a conductive socket; 4. a conductive pin; 5. a drive circuit board; 6. a mounting cavity; 7. a heat-conducting silica gel strip; 8. a supporting strip; 9. and (4) heat dissipation holes.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a hard lamp strip of ultra-thin LED of high spotlight, including base plate 1, the inner chamber of base plate 1 is equipped with installation cavity 6 and the inner chamber of installation cavity 6 is the symmetry and is equipped with support bar 8, the inner chamber that is equipped with worker's type groove and worker's type groove between two sets of support bars 8 is fixed with dirver circuit board 5, dirver circuit board 5 is the symmetry and is equipped with electrically conductive contact pin 4 about, the upper end of two sets of support bars 8 all is fixed with heat conduction silica gel strip 7 and the top of two sets of heat conduction silica gel strips 7 is equipped with mounting panel 2, mounting panel 2 is located the inner chamber of base plate 1, and the bottom of mounting panel 2 contacts and glues glutinous fixedly with the.

The mounting panel 2 includes the mounting panel body 21, and the fixed lamp body mechanism 3 that glues of inner chamber that the upper end of mounting panel body 21 was equipped with fixed recess 22 and fixed recess 22, and the bottom of mounting panel body 21 is bilateral symmetry and is equipped with grafting chamber 23, and the carrier of lamp body mechanism 3 is regarded as to mounting panel 2, is convenient for to the grafting installation of lamp body mechanism 3 and base plate 1.

Lamp body mechanism 3 includes wafer chip strip 31, and the bottom of wafer chip strip 31 is bilateral symmetry and is equipped with electrically conductive socket 32 and wafer chip strip 31 electric connection, and electrically conductive socket 32 can peg graft with electrically conductive contact pin 4 to make the circuit can constitute the return circuit, can make electric current flow through wafer chip strip 31 make its work luminous.

Wafer chip strip 31 glues the sticky inner chamber of fixing recess 22, and the lower extreme of two sets of electrically conductive sockets 32 all runs through the bottom of fixing recess 22 and extends to the inner chamber of grafting chamber 23 and peg graft with electrically conductive contact pin 4, and electrically conductive socket 32 pegs graft with electrically conductive contact pin 4, the electrically conductive installation of the lamp body mechanism 3 of being convenient for.

The radiating holes 9 are uniformly arranged at equal intervals on the front end and the rear end of the base plate 1, the radiating holes 9 are communicated with the I-shaped groove, heat generated on the driving circuit board 5 in the working process can be radiated out through the radiating holes 9, the temperature of the driving circuit board is reduced, and the performance of the driving circuit board is improved.

The upper and lower faces of heat conduction silica gel strip 7 all are equipped with glues glutinous layer, and the layer of gluing through heat conduction silica gel strip 7 not only can glue to self and glue fixedly still can glue to install plate body 21 and glue fixedly, and still have fine heat conduction effect.

It should be noted that the present invention is a high light-focusing ultra-thin LED hard light bar, which converts a wafer chip into a whole wafer chip strip 31 in the original each lamp bead shell, so as to facilitate the bonding and fixation of the wafer chip strip 31 and improve the working efficiency, and the whole wafer chip strip 31 is electrically connected with two sets of conductive sockets 32, and the two sets of conductive sockets 32 are inserted into two sets of conductive pins 4, so that the circuit can form a loop, so that the current flows through the wafer chip strip 31 to make it work and emit light, which facilitates the rapid installation of the lamp beads, and the installation plate 21 is installed on the installation plate 21, and the installation plate 21 is bonded with the heat-dissipating holes 7 through the heat-conducting silicon adhesive tape 7, so as to enhance the stability of the insertion of the conductive sockets 32 and the conductive pins 4, and is provided with 9, the heat generated on the driving circuit board 5 in the working process can be dissipated through the heat-dissipating holes 9, reduce the temperature and improve the performance.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a hard lamp strip of ultra-thin LED of high spotlight, includes base plate (1), its characterized in that: the inner chamber that base plate (1) inner chamber was equipped with installation cavity (6) and installation cavity (6) is the symmetry and is equipped with support bar (8), and is two sets of the inner chamber that is equipped with worker type groove and worker type groove between support bar (8) is fixed with dirver circuit board (5), dirver circuit board (5) is the symmetry and is equipped with electrically conductive contact pin (4), and is two sets of the top that the upper end of support bar (8) all was fixed with heat conduction silica gel strip (7) and two sets of heat conduction silica gel strip (7) is equipped with mounting panel (2), mounting panel (2) are located the inner chamber of base plate (1), and the bottom of mounting panel (2) and the upper end contact of two sets of heat conduction silica gel strip (7) and glue glutinous fixedly, be equipped with lamp body mechanism (.

2. The high-light-condensation ultrathin LED hard lamp bar of claim 1, characterized in that: the mounting panel (2) is including the mounting plate body (21), the inner chamber that the upper end of mounting plate body (21) was equipped with fixed recess (22) and fixed recess (22) is fixed to be glued there is lamp body mechanism (3), the bottom of mounting plate body (21) is bilateral symmetry and is equipped with grafting chamber (23).

3. The high-light-condensation ultrathin LED hard lamp bar of claim 1, characterized in that: lamp body mechanism (3) are including wafer chip strip (31), the bottom of wafer chip strip (31) is bilateral symmetry and is equipped with electrically conductive socket (32) and wafer chip strip (31) electric connection.

4. The high-concentration ultrathin LED hard lamp bar of claim 3, characterized in that: the die chip strip (31) is adhered and fixed in the inner cavity of the fixed groove (22), and the lower ends of the conductive sockets (32) penetrate through the bottom of the fixed groove (22) and extend to the inner cavity of the plug-in cavity (23) to be plugged with the conductive pins (4).

5. The high-light-condensation ultrathin LED hard lamp bar of claim 1, characterized in that: the front end and the rear end of the base plate (1) are provided with heat dissipation holes (9) at uniform equal intervals, and the heat dissipation holes (9) are communicated with the industrial groove.

6. The high-light-condensation ultrathin LED hard lamp bar of claim 1, characterized in that: and the upper surface and the lower surface of the heat-conducting silica gel strip (7) are provided with adhesive layers.