CN214703349U - Semiconductor chip edge shape observation device - Google Patents
Semiconductor chip edge shape observation device Download PDFInfo
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- CN214703349U CN214703349U CN202120643338.4U CN202120643338U CN214703349U CN 214703349 U CN214703349 U CN 214703349U CN 202120643338 U CN202120643338 U CN 202120643338U CN 214703349 U CN214703349 U CN 214703349U
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Abstract
The utility model relates to a semiconductor wafer limit shape viewing device, include: the microscope comprises a parallel light source, an observation base, a reflector and a microscope, wherein the parallel light source is arranged to emit horizontal parallel light; the viewing base is disposed between the mirror and the collimated light source and has a base plane parallel to the horizontal collimated light, the viewing base being configured to cause the horizontal collimated light to illuminate at least one point of an edge of a semiconductor wafer when the semiconductor wafer is placed on the base plane of the viewing base; the microscope comprises an objective lens which is vertically arranged and is positioned above the reflector; the mirror is configured to reflect the horizontal parallel light and direct the horizontal parallel light to an objective lens of the microscope. The semiconductor wafer edge observation device can be integrated on the existing microscope, and has the characteristics of cost saving, high efficiency and no waste of semiconductor wafers.
Description
Technical Field
The present invention relates to a semiconductor wafer edge shape observation device, and more particularly to a semiconductor wafer edge shape observation device integrated on a microscope, so that the microscope has a function of observing the edge shape of a semiconductor wafer.
Background
Observing the edge shape of the semiconductor wafer is one of the necessary links to ensure that the semiconductor wafer meets the quality requirements. Methods of observing the edges of a semiconductor wafer that are common in the prior art include: the edge shape of the semiconductor wafer is observed by using a special machine such as a wafer edge shape meter, a roller groove shape meter, or the like, or the semiconductor wafer is cleaved and placed under a microscope to directly observe the cross section. However, the price of the special machines such as the wafer edge shape instrument, the roller groove shape instrument, etc. is high, and the price of the single machine can reach more than 20 ten thousand yuan. In addition, if the edges of the semiconductor wafer are observed by microscopic observation, the cleaved semiconductor wafer is discarded. This makes the overall efficiency of microscopy less efficient and does not allow for semiconductor wafer-by-wafer viewing.
Therefore, it is necessary to develop a semiconductor wafer edge shape observation device. The semiconductor wafer edge shape observation device can be integrated on the existing microscope, thereby greatly saving the cost. In addition, the semiconductor wafer edge shape observation device can observe the edge shape of the semiconductor wafer without cleaving the semiconductor wafer, and has the characteristics of no waste of the semiconductor wafer and high efficiency. Meanwhile, the semiconductor wafer edge observation device can also be used for observing the groove shapes of various wheels and has the characteristic of wide application range.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a semiconductor wafer limit shape viewing device to overcome prior art's problem.
Therefore, the utility model provides a semiconductor wafer limit shape viewing device, include:
the light source is parallel to the light source,
the observation base is arranged on the base seat,
a mirror, and
a microscope;
wherein the collimated light source is arranged to emit horizontal collimated light; the viewing base is disposed between the mirror and the collimated light source and has a base plane parallel to the horizontal collimated light, the viewing base being configured to cause the horizontal collimated light to illuminate at least one point of an edge of a semiconductor wafer when the semiconductor wafer is placed on the base plane of the viewing base; the microscope comprises an objective lens which is vertically arranged and is positioned above the reflector; the mirror is configured to reflect the horizontal parallel light and direct the horizontal parallel light to an objective lens of the microscope.
It should be understood that the terms "horizontal, vertical, above, below" as used herein are divided by the orientation of the semiconductor wafer edge viewing device shown in fig. 1, i.e., oriented according to the orientation of the device when in use.
In use, the semiconductor wafer edge-shaped observation device firstly places a semiconductor wafer to be observed on the observation base, then turns on the parallel light source, horizontal parallel light firstly emits from the parallel light source and illuminates at least one point on the edge of the semiconductor wafer, and then the parallel light is guided into an objective lens of a microscope under the reflection action of a reflector. Due to the reflective action of the mirror, the field of view of the microscope is translated into a vertically disposed imaging area, and the edge of the semiconductor wafer can be viewed under the microscope when the illuminated edge of the semiconductor wafer is within the imaging area. The semiconductor wafer edge can be observed without cleaving the semiconductor wafer in the whole process, and the method has the characteristics of no waste of the semiconductor wafer and high efficiency. In addition, the semiconductor wafer edge observation device can be integrated on the existing microscope, so that the cost is greatly saved.
Drawings
The advantages, features of the present invention will now be described in detail with reference to the accompanying drawings, in which the components are not necessarily drawn to scale, and wherein:
fig. 1 shows a front view of one embodiment of a semiconductor wafer edge viewing device 100.
Fig. 2 shows a top view of the semiconductor wafer edge view apparatus 100 shown in fig. 1.
Fig. 3 shows a front view of another embodiment of the semiconductor wafer edge inspection device 100 in which the positioning plate 111 is planed open along a horizontal plane passing through the axis of the rotatable base 103 to show the internal structure of the positioning plate 111.
Fig. 4 shows a top view of the semiconductor wafer edge view apparatus 100 shown in fig. 3.
Fig. 5 shows a top view of the rotatable base 103, the adjustable positioning members 112, the positioning plate 111, and the semiconductor wafer 104 of the semiconductor wafer edge-shaped viewing apparatus 100 shown in fig. 4. It is to be understood that the drawings are drawn for purposes of illustration only and are not to be construed as limiting the invention.
Detailed Description
The utility model discloses a semiconductor wafer limit shape viewing device (hereinafter also simply called "limit shape viewing device") includes:
the light source is parallel to the light source,
the observation base is arranged on the base seat,
a mirror, and
a microscope;
wherein the collimated light source is arranged to emit horizontal collimated light; the viewing base is disposed between the mirror and the collimated light source and has a base plane parallel to the horizontal collimated light, the viewing base being configured to cause the horizontal collimated light to illuminate at least one point of an edge of a semiconductor wafer when the semiconductor wafer is placed on the base plane of the viewing base; the microscope comprises an objective lens which is vertically arranged and is positioned above the reflector; the mirror is configured to reflect the horizontal parallel light and direct the horizontal parallel light to an objective lens of the microscope. Due to the reflection of the mirror, the field of view of the microscope is converted into a vertically disposed imaging field. In order to enable smooth imaging under a microscope, it is necessary to ensure that at least one point of the edge of the illuminated semiconductor wafer is within the imaging area throughout the observation.
In the present invention, "polygonal" is to be understood in a broad sense, i.e. including the shape of the edge of a semiconductor wafer, and also including the shape of the two surfaces of the semiconductor wafer having the largest area; thus, "edge observation" includes observation of all surface shapes of the semiconductor wafer, including observation of the edge of the semiconductor wafer and the shapes of the two surfaces of the semiconductor wafer having the largest areas.
The utility model discloses not only be applicable to semiconductor wafer, also be applicable to the detection of any other sheet materials.
According to the utility model discloses an edge-shaped viewing device, preferably, the reflector is a 45-degree angle plane mirror with an isosceles right triangle-shaped cross section; and one vertical edge of the 45-degree angle plane mirror is parallel to the axis of the objective lens of the microscope. Thus, image distortion due to reflection by the mirror can be minimized.
The edge-shaped viewing device of the present invention, preferably, the viewing base is a rotatable base. Like this, alright come the rotatory semiconductor wafer that is located this base through rotatory observation base in the in-process of work, make the whole edge of semiconductor wafer pass through the formation of image region to it is in to change the polygon observed position on the semiconductor wafer, and then make the polygon viewing device can observe through once observing the polygon of the whole edge of semiconductor wafer. Preferably, the rotatable susceptor is provided with an adjustable positioning member for keeping the semiconductor wafer positioned on the rotatable susceptor concentric with the rotatable susceptor during rotation; and the adjustable positioning piece can adjust the positioning distance thereof, thereby being suitable for the semiconductor wafers with different sizes. More preferably, the rotatable base is provided on a horizontally positioned positioning plate for adjusting the position of the rotatable base in a direction parallel to the base surface of the rotatable base and perpendicular to the horizontal parallel light. Thus, when the size of the semiconductor wafer is changed, the edge of the semiconductor wafer can be secured within the imaging area by adjusting the position of the rotatable susceptor on the positioning plate. The adjustable positioning piece and the positioning plate are matched for use, so that the edge-shaped observation device is suitable for semiconductor wafers of various sizes, and the application range is expanded. Still more preferably, the positioning plate is provided with 2 or more positioning holes arranged perpendicularly to the horizontal parallel light, the positioning holes being matched with the rotatable base. And the positioning holes correspond to the size of the semiconductor wafer, for example, a first positioning hole corresponds to a semiconductor wafer having a diameter of 2 inches, and a second positioning hole corresponds to a semiconductor wafer having a diameter of 8 inches. Therefore, the distance between the semiconductor wafer and the imaging area can be changed rapidly and accurately in the working process, the edge of the semiconductor wafer is always in the imaging area, and the operation is simplified.
According to limit shape viewing device, preferably, rotatable base passes through step motor or servo motor drive, and viewing device still include with step motor or the motor control unit that servo motor links to each other.
The polygonal observation device according to the present invention is preferably such that the microscope is an electron microscope. More preferably, the electron microscope includes an image receiving and converting unit provided in an optical path thereof for converting the received optical signal into an electric signal.
The polygonal viewing device according to the present invention preferably further comprises an image storage and processing unit; the image storage and processing unit is connected at one end to the image receiving and converting unit and at the other end to the motor control unit. During use, the image storage and processing unit first receives and stores an image of the observed polygon from the image receiving and converting unit. Subsequently, an instruction is issued to the motor control unit to control the rotatable base to rotate. In this way, the edge observation device can observe the edge of the entire edge of the semiconductor wafer in a scanning manner, and then construct the edge of the entire edge of the semiconductor wafer based on the observed information.
When the edge-shaped observation device works, the operation process is as follows:
1. a semiconductor wafer to be observed is placed on the observation susceptor.
2. The collimated light source is turned on to illuminate at least one point on the edge of the semiconductor wafer.
3. And adjusting the focal length of the microscope to make the image clear.
4. The semiconductor wafer edge was observed under a microscope for edge formation.
The specific principle of the edge-shaped observation device is as follows: the horizontal parallel light is first emitted from a parallel light source and illuminates at least one point on the edge of the semiconductor wafer, and then the parallel light is directed into the objective lens of the microscope under the reflection action of a mirror. Due to the reflective action of the mirror, the field of view of the microscope is translated into a vertically disposed imaging area, and the edge of the semiconductor wafer can be viewed under the microscope when the illuminated edge of the semiconductor wafer is within the imaging area. It should be understood that the edge shape observation device of the present invention can be used not only for observing the edge shape of the semiconductor wafer but also for observing the groove shape of each wheel.
In the simplest case, the edge-shaped viewing device comprises a non-rotatable fixed viewing base. In this case, the edge shape observation device can observe only the edge shape of one point on the edge of the semiconductor wafer at a time, and if a complete edge shape of the edge of the semiconductor wafer is to be obtained, it may be necessary to manually adjust the position of the semiconductor wafer and repeat the observation. This has not only improved the degree of difficulty of observing, has still reduced the efficiency of polygon viewing device simultaneously. In addition, since the fixed observation base does not have a positioning member for ensuring the concentricity of the semiconductor wafer and the fixed observation base, a positional deviation is likely to occur in the process of manually adjusting the semiconductor wafer, thereby greatly affecting the accuracy of observation. In addition, the fixed vision base prevents the semiconductor wafer from adjusting its distance from the imaging area. Thus, when the semiconductor wafer is oversized or undersized, the polygons run the risk of exceeding or failing to reach the imaging area, which further limits the range of use of the polygon viewing device.
In order to overcome the technical problem, the utility model discloses a preferred embodiment provides the following improvement: first, the observation base is changed to a rotatable base which is driven by a servo motor connected to a motor control unit. An image storage and processing unit and an image receiving and converting unit are added. An adjustable positioning piece is additionally arranged on the rotatable pedestal and used for keeping the semiconductor wafer concentric with the rotatable pedestal in the rotating process. And finally, a positioning plate for horizontal positioning is additionally arranged, 2 or more positioning holes which are vertical to the horizontal parallel light arrangement are arranged on the positioning plate, the positioning holes are matched with the rotatable base, and the rotatable base is positioned in any one positioning hole of the positioning plate. Thus, during operation, the image storage and processing unit may instruct the motor to rotate, based on image information obtained from the image receiving and converting unit, to thereby rotate the semiconductor wafer positioned on the susceptor, while the adjustable positioning member maintains the semiconductor wafer concentric with the rotatable susceptor during such rotation. This rotation will change the observed position of the edge on the edge of the semiconductor wafer, and thus the edge observation device of the present invention can observe the edge of the entire edge of the semiconductor wafer by one observation. In addition, if the size of the semiconductor wafer to be observed is to be changed, the size change of the semiconductor wafer can be accommodated by adjusting the positioning pitch of the adjustable positioning members and positioning the rotatable susceptor in the different positioning holes of the positioning plate. This adjustment changes the distance between the semiconductor wafer and the imaging area so that the edge of the semiconductor wafer is always within the imaging area. This makes the edge-shaped observation device suitable for semiconductor wafers of different sizes, and enlarges the application range.
The invention is described below by way of example with reference to the accompanying drawings.
Fig. 1 shows a front view of one embodiment of a semiconductor wafer edge shape viewing device 100, generally designated by the reference numeral 100. In which the polygon viewing apparatus 100 includes an electron microscope 101, only the objective lens of the electron microscope 101 is shown in fig. 1, and other parts are omitted for the sake of simplifying the view. The edge-form viewing apparatus 100 further includes a 45 ° angle mirror 102, a viewing base 103, and a collimated light source 105. In which the collimated light source 105 is vertically disposed so as to emit horizontal collimated light. The observation base 103 is a fixed observation base which is disposed between the collimated light source 105 and the 45 ° angle flat mirror 102 and has a basal plane parallel to the horizontal collimated light. The 45-degree angle plane mirror is a plane mirror with a cross section in a 45-degree isosceles right triangle shape. The 45 ° angle flat mirror 102 is located below the objective lens of the electron microscope 101, and one of its vertical sides is parallel to the axis of the objective lens of the electron microscope 101. In operation, the semiconductor wafer 104 is first placed on the base surface of the vision base 103 and the collimated light source 105 is turned on. The collimated light source 105 emits horizontal collimated light that first passes through the semiconductor wafer 104 and illuminates at least one point of the edge of the semiconductor wafer 104. Subsequently, the parallel light is reflected to the electron microscope 101 by the reflection action of the 45 ° angle plane mirror 102. Fig. 2 shows a top view of the semiconductor wafer edge view apparatus 100 shown in fig. 1. As shown in fig. 2, due to the reflection of the 45 ° angle plane mirror 102, the field of view of the electron microscope 101 is converted into an imaging area 106 that is vertically disposed, and when the edge of the illuminated semiconductor wafer 104 is within the imaging area 106, the edge shape of the edge of the semiconductor wafer 104 can be observed under the electron microscope 101.
Fig. 3 shows a front view of another embodiment of the semiconductor wafer edge inspection device 100 in which the positioning plate 111 is planed along a horizontal plane passing through the axis of the rotatable base 103 to show the internal structure of the positioning plate 111. It should be understood that the technical features of this embodiment that are the same as those of the embodiment shown in fig. 1 are not described in detail. The embodiment shown in fig. 3 differs from the embodiment shown in fig. 1 mainly in that: the viewing base 103 is a rotatable base, the rotatable base 103 being provided with an adjustable positioning member 112 and being driven by a servo motor 107. The rotatable base 103 is disposed in one positioning hole 111A of the horizontally positioned positioning plate 111. Further, the polygon viewing apparatus 100 includes a servo motor control unit 108, an image storage and processing unit 109, and an image receiving and converting unit 110. Wherein, the servo motor control unit 108 is connected with the servo motor 107, thereby controlling the rotation of the servo motor 107. The image receiving and converting unit 110 is disposed in the optical path of the electron microscope 101, thereby converting the received optical signal into an electrical signal. The image storage and processing unit 109 is connected at one end to an image receiving and converting unit 110 and at the other end to a servo motor control unit 108. In use, the image storage and processing unit 109 first receives and stores the image of the observed polygon from the image receiving and converting unit 110. Subsequently, an instruction is issued to the servo motor control unit 108, thereby controlling the rotatable base 103 to rotate. In this way, the edge-shape observation apparatus 100 can scan the entire edge of the semiconductor wafer 104 through the imaging region 106 (as shown in fig. 4), thereby performing edge-shape observation of the entire edge of the semiconductor wafer 104, and then construct an edge-shape of the entire edge of the semiconductor wafer 104 based on the observed information.
Fig. 5 shows a top view of the rotatable base 103, the adjustable positioning members 112, the positioning plate 111, and the semiconductor wafer 104 of the semiconductor wafer edge-shape viewing apparatus 100 of fig. 4. This figure 5 details the structure and function of the adjustable positioning member 112 and the positioning plate 111. An adjustable positioning member 112 is disposed below the base surface of the rotatable base 103, and the adjustable positioning member 112 includes 2 arc-shaped positioning edges 112A which engage with the semiconductor wafer 104 and are used for positioning the semiconductor wafer 104. The distance between the two locating edges 112A can be adjusted (shown by arrows in fig. 5) to accommodate different sizes of semiconductor wafers 104. Furthermore, the adjustable positioning element 112 maintains its circumferential position during rotation of the rotatable base 103, i.e. does not rotate with the rotation of the rotatable base 103. Further, as shown in fig. 5, a plurality of positioning holes 111A aligned in a vertical optical path are provided in the horizontally positioned positioning plate 111 to match the rotatable base 103, and the rotatable base 103 is positioned in one of the positioning holes 111A of the positioning plate 111. The plurality of positioning holes 111A are used to adjust the distance between the semiconductor wafer 104 and the imaging area 106, and each of the plurality of positioning holes 111A corresponds to a specific size of the semiconductor wafer 104. To change the size of the semiconductor wafer 104 to be observed, the rotatable susceptor 103 is simply repositioned to the corresponding positioning hole 111A, and the arc-shaped positioning edge 112A of the adjustable positioning member 112 is adjusted. The adjustable positioning member 112 and the positioning plate 111 cooperate such that the edge of the semiconductor wafer 104 is always within the imaging region 106 regardless of the change in size of the wafer. This makes the semiconductor wafer edge observation device 100 suitable for semiconductor wafers 104 of various sizes, and enlarges the range of use.
Claims (10)
1. A semiconductor wafer edge view apparatus, comprising:
the light source is parallel to the light source,
the observation base is arranged on the base seat,
a mirror, and
a microscope;
the parallel light source is arranged to emit horizontal parallel light; the viewing base is disposed between the mirror and the collimated light source and has a base plane parallel to the horizontal collimated light, the viewing base being configured to cause the horizontal collimated light to illuminate at least one point of an edge of a semiconductor wafer when the semiconductor wafer is placed on the base plane of the viewing base; the microscope comprises an objective lens which is vertically arranged and is positioned above the reflector; the mirror is configured to reflect the horizontal parallel light and direct the horizontal parallel light to an objective lens of the microscope.
2. The semiconductor wafer edge observation apparatus of claim 1, wherein the mirror is a 45 ° angle flat mirror having a cross-section in the form of an isosceles right triangle; and one vertical edge of the 45-degree angle plane mirror is parallel to the axis of the objective lens of the microscope.
3. The semiconductor wafer edge viewing device of either one of claims 1 or 2, wherein the viewing base is a rotatable base.
4. A semiconductor wafer edge viewing apparatus as defined in claim 3, wherein said rotatable base is provided with adjustable positioning means for maintaining said semiconductor wafer on said rotatable base concentric with said rotatable base during rotation; and the positioning pitch of the adjustable positioning member is adjustable.
5. The semiconductor wafer edge viewing apparatus of claim 4, wherein said rotatable pedestal is disposed on a horizontally positioned positioning plate for adjusting the position of said rotatable pedestal in a direction parallel to the base plane of said rotatable pedestal and perpendicular to said horizontal parallel light.
6. The semiconductor wafer edge inspection device of claim 5 wherein said alignment plate has 2 or more alignment holes disposed therein that are aligned perpendicular to said horizontal parallel light, said alignment holes being aligned with said rotatable base.
7. The semiconductor wafer edge inspection apparatus of claim 6 wherein the rotatable pedestal is driven by a stepper motor or a servo motor, and further comprising a motor control unit connected to the stepper motor or servo motor.
8. The semiconductor wafer edge observation device of claim 7, wherein the microscope is an electron microscope.
9. The semiconductor wafer edge observation device of claim 8, wherein the electron microscope includes an image receiving and converting unit disposed in an optical path thereof.
10. The semiconductor wafer edge inspection device of claim 9 further comprising an image storage and processing unit; the image storage and processing unit is connected at one end to the image receiving and converting unit and at the other end to the motor control unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120643338.4U CN214703349U (en) | 2021-03-30 | 2021-03-30 | Semiconductor chip edge shape observation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120643338.4U CN214703349U (en) | 2021-03-30 | 2021-03-30 | Semiconductor chip edge shape observation device |
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| Publication Number | Publication Date |
|---|---|
| CN214703349U true CN214703349U (en) | 2021-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120643338.4U Active CN214703349U (en) | 2021-03-30 | 2021-03-30 | Semiconductor chip edge shape observation device |
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| CN (1) | CN214703349U (en) |
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2021
- 2021-03-30 CN CN202120643338.4U patent/CN214703349U/en active Active
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