CN214702155U - Three-dimensional imaging device and terminal equipment - Google Patents
Three-dimensional imaging device and terminal equipment Download PDFInfo
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- CN214702155U CN214702155U CN202120890275.2U CN202120890275U CN214702155U CN 214702155 U CN214702155 U CN 214702155U CN 202120890275 U CN202120890275 U CN 202120890275U CN 214702155 U CN214702155 U CN 214702155U
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Abstract
The application provides a three-dimensional imaging device and terminal equipment, includes: a main board; the projector comprises a light source for projecting structured light to an imaging target, wherein the cathode of the light source is bonded on the mainboard by adopting conductive adhesive, the anode of the light source is connected with a first gold wire, and the first gold wire is connected with the mainboard; the imaging module is attached to the main board and used for acquiring imaging information of an imaging target; and the processing chip is attached to the mainboard and is respectively and electrically connected to the light source and the imaging module through the mainboard. The terminal device includes a three-dimensional imaging apparatus. In the embodiment, the structural complexity of the three-dimensional imaging device is simplified, the integration level of the three-dimensional imaging device is improved, and the volume of the three-dimensional imaging device is reduced, so that the miniaturization design of the terminal equipment using the three-dimensional imaging device is facilitated.
Description
Technical Field
The application belongs to the technical field of imaging equipment, and particularly relates to a three-dimensional imaging device and terminal equipment.
Background
The three-dimensional imaging device is mainly used for acquiring three-dimensional imaging information of an imaging target, so that the three-dimensional imaging device is widely applied to industrial measurement and face recognition work, and the living standard of people is greatly improved.
Generally, a three-dimensional imaging device includes a plurality of optoelectronic modules, such as a projector, an imaging module, and a processing chip, and these optoelectronic modules are independent modules, and they are usually fastened to a motherboard through a connector to achieve conduction.
SUMMERY OF THE UTILITY MODEL
One of the purposes of the embodiment of the application is as follows: the utility model provides a three-dimensional imaging device, aims at solving among the prior art, three-dimensional imaging device's integrated level is low, bulky technical problem.
In order to solve the technical problem, the embodiment of the application adopts the following technical scheme:
there is provided a three-dimensional imaging apparatus including:
a main board;
the projector comprises a light source for projecting structured light to an imaging target, wherein the cathode of the light source is bonded on the mainboard by adopting conductive adhesive, the anode of the light source is connected with a first gold wire, and the first gold wire is connected to the mainboard;
the imaging module is attached to the main board and used for acquiring imaging information of an imaging target;
and the processing chip is attached to the mainboard and is respectively and electrically connected with the light source and the imaging module through the mainboard.
In one embodiment, the projector further includes a first barrel, a collimating lens and a diffractive optical element, the first barrel surrounds the light source, and the collimating lens and the diffractive optical element are disposed on the first barrel and sequentially distributed along a light exit direction of the light source.
In one embodiment, a first fixing adhesive is adhered between one end of the first lens barrel close to the main board and the main board.
In one embodiment, the imaging module comprises a first imaging chip, and a second fixing adhesive is pasted between the first imaging chip and the main board; and the pins of the first imaging chip are connected with second gold wires, the second gold wires are connected to the mainboard, and the first imaging chip is electrically connected to the processing chip through the mainboard.
In one embodiment, the imaging module further includes a second lens barrel surrounding the first imaging chip and a first lens disposed on the second lens barrel, the first lens faces the first imaging chip, and a third fixing adhesive is adhered between one end of the second lens barrel close to the main board and the main board.
In one embodiment, the light source is configured to project an infrared spot; the imaging module is set as an infrared camera and further comprises an optical filter arranged in the second lens barrel, and the optical filter is arranged between the first imaging chip and the first lens.
In one embodiment, the three-dimensional imaging device further comprises a color camera comprising:
the second imaging chip is adhered to the main board, a third gold wire is connected between the second imaging chip and the main board, and the processing chip is electrically connected to the second imaging chip through the main board;
the third lens cone is adhered to the main board and is arranged around the second imaging chip;
and the second lens is arranged on the third lens barrel and is opposite to the second imaging chip.
In one embodiment, the three-dimensional imaging device further comprises an illuminator for emitting infrared laser or infrared LED light, wherein the illuminator is attached to the main board and electrically connected to the processing chip.
In one embodiment, the three-dimensional imaging device further comprises a proximity sensor attached to the main board, and the proximity sensor is electrically connected to the processing chip.
The embodiment of the application also provides terminal equipment which comprises the three-dimensional imaging device.
The three-dimensional imaging device and the terminal equipment provided by the embodiment of the application have the beneficial effects that: compared with the prior art, in the application, the three-dimensional imaging device comprises a main board, a projector, an imaging module and a processing chip, when the three-dimensional imaging device works, a light source of the projector projects structured light to an imaging target, and the imaging module acquires imaging information of the imaging target, so that the three-dimensional imaging information of the imaging target is acquired; the negative pole of the light source is bonded on the mainboard through the conductive adhesive, and the positive pole of the light source is communicated with the mainboard through the first gold thread, so that the fixation and the communication between the projector and the mainboard are realized, the structural complexity of the three-dimensional imaging device is simplified, the integration level of the three-dimensional imaging device is improved, the volume of the three-dimensional imaging device is reduced, and the miniaturization design of the terminal equipment using the three-dimensional imaging device is facilitated; and, imaging module and processing chip all laminate on the mainboard, have further reduced three-dimensional imaging device's volume.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic perspective view of a three-dimensional imaging device according to an embodiment of the present application;
fig. 2 is a cross-sectional view of fig. 1.
Wherein, in the figures, the respective reference numerals:
10-a main board; 20-a projector; 21-a light source; 22-conductive glue; 23-a first gold wire; 24-a first barrel; 25-a collimating lens; 26-a diffractive optical element; 27-first fixing glue; 30-an imaging module; 31-a first imaging chip; 32-second fixing glue; 33-second gold wire; 34-a second barrel; 35-a first lens; 36-third fixing glue; 37-a first filter; 40-processing the chip; 50-a color camera; 51-a second imaging chip; 52-third gold wire; 53-third barrel; 54-a second lens; 55-fourth fixing glue; 56-fifth fixing glue; 57-a second filter; 60-an illuminator; 70-proximity sensor.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The following detailed description is made with reference to the accompanying drawings and examples:
referring to fig. 1 and fig. 2, the three-dimensional imaging device according to the embodiment of the present disclosure includes a main board 10, a projector 20, an imaging module 30, and a processing chip 40.
The projector 20 includes a light source 21, the light source 21 for projecting structured light toward an imaging target; the negative pole of light source 21 adopts conducting resin 22 to bond on mainboard 10, and the positive pole of light source 21 forms the switch-on through the technology of routing and mainboard 10, specifically is that the positive pole of light source 21 is connected with first gold thread 23, and first gold thread 23 is connected in mainboard 10, and like this, light source 21 realizes the switch-on with mainboard 10 through first gold thread 23 and conducting resin 22. It should be noted that in the present embodiment, the conductive adhesive 22 is understood as a conductive glue, the conductive adhesive 22 attaches the light source 21 to the motherboard 10, and the conductive property of the conductive adhesive 22 makes the negative electrode of the light source 21 and the motherboard 10 form conduction; the conductive adhesive 22 can be a conductive silver adhesive, a copper powder conductive adhesive 22, a nickel-carbon conductive adhesive 22, a silver-copper conductive adhesive 22, or other adhesive having a bonding property and a conductive property. Here, in the present embodiment, the first gold wire 23 is a metal wire, and can be a conductive wire such as a copper wire or an aluminum wire.
The imaging module 30 is attached to the motherboard 10 and is in conduction with the motherboard 10; the imaging module 30 is used for acquiring imaging information of the imaging target when the light source 21 projects the structured light to the imaging target. The imaging modules 30 are spaced apart from the light source 21.
The processing chip 40 is attached to the motherboard 10 and is electrically connected to the motherboard 10, so that the processing chip 40 is electrically connected to the light source 21 and the imaging module 30 through the motherboard 10. In this embodiment, in order to facilitate the rational distribution of the projector 20, the imaging module 30 and the processing chip 40 to reduce the volume of the three-dimensional imaging device, the light source 21 of the projector 20 and the imaging module 30 are distributed on one side of the motherboard 10 at intervals, and the processing chip 40 is disposed on the other side of the motherboard 10; of course, in the present embodiment, the processing chip 40 may be disposed on the same side of the main board 10 at a distance from the projector 20 and the imaging module 30, and the specific distribution positions of the projector 20, the imaging module 30 and the processing chip 40 may be set according to the actual use requirement.
It should be noted here that the working principle of the three-dimensional imaging module 30 is as follows: when a user sends an imaging instruction to the three-dimensional imaging device, the processing chip 40 receives the imaging instruction and sends the imaging instruction to the light source 21, and the light source 21 projects structured light to an imaging target after receiving the imaging instruction; at this time, the processing chip 40 also sends an imaging instruction to the imaging module 30, the imaging module 30 receives the imaging instruction and obtains imaging information of the imaging target, and the imaging module 30 sends the imaging information to the processing chip 40; the processing chip 40 receives the imaging information and processes the imaging information, thereby acquiring data required by people, such as ranging data.
In the embodiment of the application, the three-dimensional imaging device includes a main board 10, a projector 20, an imaging module 30 and a processing chip 40, when the three-dimensional imaging device works, a light source 21 of the projector 20 projects structured light to an imaging target, and the imaging module 30 acquires imaging information of the imaging target, so that the acquisition of the three-dimensional imaging information of the imaging target is realized; the cathode of the light source 21 is bonded on the main board 10 through the conductive adhesive 22, and the anode of the light source 21 is connected with the main board 10 through the first gold wire 23, so that the projector 20 and the main board 10 are fixed and connected, so that the projector 20 is a device bonded on the main board 10, an independent circuit board does not need to be designed on the light source 21, the projector 20 forms an independently designed module, and a connector does not need to be used for realizing the connection between the main board 10 and the projector 20, thereby reducing the use of the device, simplifying the structural complexity of the three-dimensional imaging device, enabling the three-dimensional imaging device to be manufactured and produced more easily, improving the integration level of the three-dimensional imaging device, reducing the volume of the three-dimensional imaging device, and being beneficial to realizing the miniaturization design of a terminal device using the three-dimensional imaging device; moreover, the imaging module 30 and the processing chip 40 are both attached to the main board 10, so that the volume of the three-dimensional imaging device is further reduced.
Referring to fig. 2, in the present embodiment, the projector 20 further includes a first lens barrel 24, a collimating lens 25 and a diffractive optical element 26. The first barrel 24 is disposed around the periphery of the light source 21, the collimating lens 25 is disposed in the first barrel 24, the diffractive optical element 26 is disposed on the first barrel 24, and the collimating lens 25 and the diffractive optical element 26 are sequentially distributed along the light emitting direction of the light source 21. Thus, in operation, the light source 21 of the projector 20 projects the structured light, and the structured light sequentially passes through the collimating lens 25 and the diffractive optical element 26, specifically, the structured light firstly passes through the collimating function of the collimating lens 25 and then is incident on the diffractive optical element 26, and then is projected to the outside through the diffractive function of the diffractive optical element 26, so as to illuminate the imaging target.
Referring to fig. 2, in the embodiment, the first lens barrel 24 is disposed around the periphery of the light source 21, one end of the first lens barrel 24 is close to the main board 10, and a first fixing adhesive 27 is adhered between one end of the first lens barrel 24 close to the main board 10 and the main board 10, so that the first fixing adhesive 27 realizes adhesion and fixation of the first lens barrel 24 and the main board 10, and no additional connector is required, thereby simplifying the structural complexity of the three-dimensional imaging device, making the three-dimensional imaging device easier to manufacture and produce, improving the integration of the three-dimensional imaging device, reducing the volume of the three-dimensional imaging device, and facilitating the implementation of the miniaturized design of the terminal device using the three-dimensional imaging device. In this embodiment, the first fixing glue 27 is AA glue, and certainly, AB glue or other glue capable of adhering the first lens barrel 24 and the main board 10 may also be used.
Referring to fig. 2, in the present embodiment, the imaging module 30 includes a first imaging chip 31, and a second fixing adhesive 32 is adhered between the first imaging chip 31 and the motherboard 10, so that the second fixing adhesive 32 realizes adhesion and fixation of the first imaging chip 31 and the motherboard 10, and no additional connector or circuit board is needed, thereby simplifying the structural complexity of the three-dimensional imaging device, improving the integration level of the three-dimensional imaging device, and reducing the volume of the three-dimensional imaging device; the second fixing glue 32 is red glue, and of course, other glue capable of adhering the first imaging chip 31 to the main board 10 may be used.
The first imaging chip 31 is electrically connected to the motherboard 10 through a wire bonding process, specifically, the pins of the first imaging chip 31 are connected to the second gold wires 33, the second gold wires 33 are connected to the motherboard 10, the first imaging chip 31 is electrically connected to the motherboard 10 through the second gold wires 33, and the first imaging chip 31 is electrically connected to the processing chip 40 through the motherboard 10. In this embodiment, the design of the second fixing glue 32 and the second gold wire 33 simplifies the fixing and conducting between the first imaging chip 31 and the motherboard 10, simplifies the manufacturing process of the three-dimensional imaging device, and is helpful to improve the integration level of the three-dimensional imaging device and reduce the volume of the three-dimensional imaging device. The second gold wire 33 is a metal wire, and can be a conductive wire such as a copper wire or an aluminum wire.
Referring to fig. 2, in the present embodiment, the imaging module 30 further includes a second barrel 34 and a first lens 35. The second barrel 34 surrounds the first imaging chip 31, the first lens 35 is disposed in the second barrel 34, and the first lens 35 is disposed on the light incident side of the first imaging chip 31 and faces the first imaging chip 31. In this way, in operation, the light source 21 of the projector 20 projects the structured light to the imaging target, and the first imaging chip 31 receives the structured light reflected from the imaging target, wherein the structured light is received by the first imaging chip 31 after passing through the first lens 35, so that the first imaging chip 31 realizes the acquisition of the imaging information of the imaging target.
It should be noted here that one end of the second lens barrel 34 is close to the main board 10, and a third fixing glue 36 is pasted between one end of the second lens barrel 34 close to the main board 10 and the main board 10, so that the third fixing glue 36 realizes pasting and fixing of the second lens barrel 34 and the main board 10, and no additional connector is needed, which simplifies the connection between the second lens barrel 34 and the main board 10, i.e. simplifies the structural complexity of the three-dimensional imaging apparatus, makes the three-dimensional imaging apparatus easier to manufacture and produce, and reduces the volume of the three-dimensional imaging apparatus, thereby facilitating the realization of the miniaturized design of the terminal device using the three-dimensional imaging apparatus. In this embodiment, the third fixing glue 36 is AA glue, and certainly, AB glue or other glue capable of adhering the second lens barrel 34 and the main board 10 may also be used.
Referring to fig. 2, in the present embodiment, the projector 20 is configured as an infrared speckle projector 20, wherein the light source 21 is configured as a light source 21 for projecting infrared laser speckles. Correspondingly, the imaging module 30 is configured as an infrared camera, the imaging module 30 further includes a filter disposed in the second barrel 34, the filter is a first filter 37, and the first filter 37 is disposed between the first imaging chip 31 and the first lens 35. It should be noted here that, during operation, the light source 21 of the projector 20 projects infrared laser speckles to an imaging target, the infrared laser speckles on the imaging target are reflected, and are received by the first imaging chip 31 after passing through the first lens 35 and the first optical filter 37 in sequence, and an infrared speckle image is formed on the first imaging chip 31, and the processing chip 40 receives the infrared speckle image, performs calculation and processing, and thereby obtains distance measurement data.
In this embodiment, the light source 21 of the projector 20 may also be set as a normal light, and then the imaging module 30 is set as a normal camera, and during operation, the light source 21 of the projector 20 emits a normal light to the imaging target to achieve the effects of light supplement and illumination, so that the first imaging chip 31 of the imaging module 30 can more clearly obtain the imaging information of the imaging target.
Referring to fig. 2, in the present embodiment, the three-dimensional imaging device further includes a color camera 50, and the color camera 50 includes a second imaging chip 51, a third lens barrel 53 and a second lens 54.
In this embodiment, the second imaging chip 51 is used to obtain the color imaging information of the imaging target, and is helpful for the processing chip 40 to process the imaging information, thereby being helpful for realizing the function of recognizing the imaging target by the three-dimensional imaging device. The second imaging chip 51 is pasted on the main board 10, wherein a fourth fixing adhesive 55 is pasted between the second imaging chip 51 and the main board 10, the fourth fixing adhesive 55 realizes the pasting and fixing of the second imaging chip 51 and the main board 10, and no extra connector or circuit board is needed, so that the integration level of the three-dimensional imaging device is improved, and the volume of the three-dimensional imaging device is reduced; the fourth fixing glue 55 is red glue, and of course, other glue capable of adhering the second imaging chip 51 to the main board 10 may be used. The second imaging chip 51 is electrically connected with the motherboard 10 through a routing process, specifically, a third gold wire 52 is connected between the second imaging chip 51 and the motherboard 10, the third gold wire 52 is respectively connected to pins of the motherboard 10 and the second imaging chip 51, the second imaging chip 51 is electrically connected with the motherboard 10 through the third gold wire 52, and the processing chip 40 is electrically connected to the second imaging chip 51 through the motherboard 10; the third gold wire 52 is a metal wire, and can be a conductive wire such as a copper wire or an aluminum wire. Thus, the design of the fourth fixing glue 55 and the third gold wire 52 simplifies the fixing and conducting of the second imaging chip 51 and the main board 10, simplifies the manufacturing process of the three-dimensional imaging device, and is helpful for improving the integration level of the three-dimensional imaging device and reducing the volume of the three-dimensional imaging device. In addition, in the present embodiment, the second imaging chips 51 are respectively spaced apart from the light source 21 and the first imaging chip 31.
The third barrel 53 is disposed around the outer periphery of the second imaging chip 51, and the third barrel 53 is attached to the main board 10. It should be noted here that one end of the third lens barrel 53 is close to the main board 10, and a fifth fixing glue 56 is pasted between one end of the third lens barrel 53 close to the main board 10 and the main board 10, so that the fifth fixing glue 56 realizes pasting and fixing of the third lens barrel 53 and the main board 10, and no additional connector is needed, which simplifies the connection between the third lens barrel 53 and the main board 10, and reduces the volume of the three-dimensional imaging device. In this embodiment, the fifth fixing glue 56 is AA glue, and certainly, AB glue or other glue capable of adhering the third lens barrel 53 and the main board 10 may also be used.
The second lens 54 is disposed in the third barrel 53, and the second lens 54 is disposed on the light incident side of the second imaging chip 51 and faces the second imaging chip 51. Thus, during operation, the second imaging chip 51 receives the light reflected from the imaging target, and the light passes through the second lens 54 and is then received by the second imaging chip 51, so that the second imaging chip 51 realizes the operation of acquiring the color imaging information of the imaging target.
In a specific embodiment, the color camera 50 further includes a second filter 57, the second filter 57 is disposed in the third barrel 53 and between the second lens 54 and the second imaging chip 51, and the second filter 57 is used for filtering light received by the second imaging chip 51 when the second imaging chip 51 performs an imaging operation.
Referring to fig. 2, in the present embodiment, the three-dimensional imaging device further includes an illuminator 60, the illuminator 60 is used for emitting infrared laser or infrared LED light, and the illuminator 60 is attached to the motherboard 10 and electrically connected to the processing chip 40; the illuminator 60 is attached to the main board 10, so that the integration level of the three-dimensional imaging device is improved, and the volume of the three-dimensional imaging device is reduced; the illuminator 60 is attached to and soldered on the motherboard 10, or the illuminator 60 is attached to the motherboard 10 and electrically connected to the motherboard 10 by gold wires. It should be noted that, in operation, the illuminator 60 projects infrared laser light or infrared LED light to the imaging target, the infrared laser light or infrared LED light is reflected on the imaging target, and is received by the first imaging chip 31 after passing through the first lens 35 and the first filter 37 in sequence, and an infrared image is formed on the first imaging chip 31.
It should be further noted that in this embodiment, in operation, the light source 21 of the projector 20 projects infrared laser speckle to the imaging target, the first imaging chip 31 acquires an infrared speckle image of the imaging chip, and at this time, the processing and calculating operations of the processing chip 40 can acquire distance measurement data; the illuminator 60 projects infrared laser or infrared LED light to the imaging target, and the first imaging chip 31 acquires an infrared image of the imaging chip; the second imaging chip 51 of the color camera 50 acquires a color image of the imaging target. In this way, the processing chip 40 can realize the function of face recognition by processing the infrared speckle images, the infrared images and the color images, thereby facilitating the application of the three-dimensional imaging device in the field of face recognition and the field of secure payment.
Referring to fig. 2, in the present embodiment, the three-dimensional imaging device further includes a proximity sensor 70, and the proximity sensor 70 is attached to the main board 10, so as to improve the integration of the three-dimensional imaging device and reduce the volume of the three-dimensional imaging device; the proximity sensor 70 is attached to and soldered on the motherboard 10, or the proximity sensor 70 is attached to the motherboard 10 and is electrically connected to the motherboard 10 by gold wires. And, the proximity sensor 70 is electrically connected to the processing chip 40, so that, in operation, when the proximity sensor 70 detects that the imaging target is within the preset range, the processing chip 40 controls the light source 21 of the projector 20, the first imaging chip 31, the second imaging chip 51 and the illuminator to operate, thereby greatly improving the imaging operation of the three-dimensional imaging apparatus.
The embodiment of the present application further provides a terminal device, which includes a three-dimensional imaging device, where the three-dimensional imaging device in this embodiment is the same as the three-dimensional imaging device in the previous embodiment, and please refer to the description related to the three-dimensional imaging device in the previous embodiment, which is not described herein again.
In the embodiment of the application, by adopting the improved scheme of the three-dimensional imaging device, the structural complexity of the three-dimensional imaging device is simplified, the integration level of the three-dimensional imaging device is improved, and the volume of the three-dimensional imaging device is reduced, so that the miniaturized design of the terminal equipment is facilitated.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A three-dimensional imaging apparatus, comprising:
a main board;
the projector comprises a light source for projecting structured light to an imaging target, wherein the cathode of the light source is bonded on the mainboard by adopting conductive adhesive, the anode of the light source is connected with a first gold wire, and the first gold wire is connected to the mainboard;
the imaging module is attached to the main board and used for acquiring imaging information of an imaging target;
and the processing chip is attached to the mainboard and is respectively and electrically connected with the light source and the imaging module through the mainboard.
2. The three-dimensional imaging device according to claim 1, wherein the projector further comprises a first barrel, a collimating lens and a diffractive optical element, the first barrel surrounds the light source, and the collimating lens and the diffractive optical element are disposed on the first barrel and sequentially distributed along a light-emitting direction of the light source.
3. The three-dimensional imaging apparatus according to claim 2, wherein a first fixing glue is pasted between one end of the first barrel close to the main board and the main board.
4. The three-dimensional imaging device according to claim 1, wherein the imaging module comprises a first imaging chip, and a second fixing adhesive is adhered between the first imaging chip and the main board; and the pins of the first imaging chip are connected with second gold wires, the second gold wires are connected to the mainboard, and the first imaging chip is electrically connected to the processing chip through the mainboard.
5. The three-dimensional imaging device according to claim 4, wherein the imaging module further comprises a second lens barrel surrounding the first imaging chip and a first lens arranged on the second lens barrel, the first lens is opposite to the first imaging chip, and a third fixing glue is adhered between one end of the second lens barrel close to the main board and the main board.
6. The three-dimensional imaging apparatus according to claim 5, wherein the light source is configured to project an infrared spot; the imaging module is set as an infrared camera and further comprises an optical filter arranged in the second lens barrel, and the optical filter is arranged between the first imaging chip and the first lens.
7. The three-dimensional imaging apparatus according to any one of claims 1 to 6, wherein the three-dimensional imaging apparatus further comprises a color camera, the color camera comprising:
the second imaging chip is adhered to the main board, a third gold wire is connected between the second imaging chip and the main board, and the processing chip is electrically connected to the second imaging chip through the main board;
the third lens cone is adhered to the main board and is arranged around the second imaging chip;
and the second lens is arranged on the third lens barrel and is opposite to the second imaging chip.
8. The three-dimensional imaging device according to any one of claims 1 to 6, further comprising an illuminator for emitting infrared laser light or infrared LED light, wherein the illuminator is attached to the motherboard and electrically connected to the processing chip.
9. The three-dimensional imaging device according to any one of claims 1 to 6, further comprising a proximity sensor attached to the motherboard, the proximity sensor being electrically connected to the processing chip.
10. A terminal device characterized by comprising the three-dimensional imaging apparatus according to any one of claims 1 to 9.
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| CN202120890275.2U CN214702155U (en) | 2021-04-23 | 2021-04-23 | Three-dimensional imaging device and terminal equipment |
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| CN202120890275.2U CN214702155U (en) | 2021-04-23 | 2021-04-23 | Three-dimensional imaging device and terminal equipment |
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| CN214702155U true CN214702155U (en) | 2021-11-12 |
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