CN115981075A - 3D structured light module, assembly method and three-dimensional imaging equipment - Google Patents
3D structured light module, assembly method and three-dimensional imaging equipment Download PDFInfo
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Abstract
The invention discloses a 3D structured light module, an assembly method and three-dimensional imaging equipment, wherein the 3D structured light module comprises: the bracket is provided with a first inner cavity and a second inner cavity; the projector module is arranged in the first inner cavity, the first laser light source is positioned on a focal plane of an optical element collimation phase surface, the second laser light source is fixed on the conductive elevating sheet and positioned on a virtual focal plane of the optical element collimation phase surface, the first laser light source and the second laser light source are connected with a control circuit, and the control circuit controls the first laser light source and the second laser light source to be alternately illuminated so that the optical element alternately outputs structural light and uniform infrared light; and the infrared camera module is arranged in the second inner cavity and is used for outputting uniform infrared images and infrared spot images with coding characteristics at intervals. The 3D structured light module provided by the technical scheme of the invention can reduce the volume of the structured light module so as to realize the miniaturization design of the imaging device.
Description
Technical Field
The invention relates to the technical field of face recognition, in particular to a 3D structured light module, an assembling method and three-dimensional imaging equipment.
Background
The face recognition technology is a key research project in the field of biological feature recognition, and compared with other identity verification technologies, the face recognition technology has the advantages of no contact, high speed, simultaneous recognition of multiple persons and the like, and is applied to various fields such as intelligent door locks, mobile payment, gate machines and the like; from the view of a face expression model, the face expression model is divided into 2D face recognition and 3D face recognition, the safety factor is not high enough due to the lack of depth data in the 2D recognition, the application scene is limited, the 3D face recognition can accurately recognize attack means such as photos, videos and masks through three-dimensional imaging of a 3D camera, and the face expression model has wider application scene; the 3D structured light becomes a mainstream scheme used by the existing 3D face recognition technology due to the advantages of high precision, simple algorithm and the like.
The existing 3D structured light module for face recognition comprises a structured light projector, a floodlight and an infrared camera. Generally, fix structured light projector, floodlight, infrared camera on the structure support respectively as three independent module to through three board to board connector respectively with mainboard connection, such structure equipment is complicated, material and assembly cost are high, and module baseline distance generally is greater than 25mm, lead to the module bulky, be unfavorable for imaging device's miniaturized design.
Disclosure of Invention
The invention mainly aims to provide a 3D structured light module, and aims to solve the technical problems that the existing 3D structured light module for face recognition is complex in assembly and large in baseline distance, so that the size of the module is large, and miniaturization design of an imaging device is not facilitated.
To achieve the above object, the present invention provides a 3D structured light module, including:
the bracket is provided with a first inner cavity and a second inner cavity;
the projector module is arranged in the first inner cavity and comprises a first laser source, a second laser source, a conductive heightening sheet and an optical element, wherein the first laser source is positioned on a focal plane of a collimation phase surface of the optical element, the second laser source is fixed on the conductive heightening sheet and positioned on a virtual focal plane of the collimation phase surface of the optical element, the first laser source and the second laser source are connected with a control circuit, and the control circuit controls the first laser source and the second laser source to be alternately lightened so that the optical element alternately outputs structured light and uniform infrared light; and
and the infrared camera module is arranged in the second inner cavity and is used for outputting an even infrared image and an infrared spot image with coding characteristics at intervals.
Optionally, a baseline distance B between an optical center of the projector module and an optical center of the infrared camera module is ≦ 10mm.
Optionally, the 3D structured light module further includes a circuit board module and a connection module, the first laser light source and the second laser light source are electrically connected to the circuit board module respectively, the bracket is fixedly connected to the circuit board module, and the connection module is used for externally connecting a motherboard.
Optionally, the infrared camera module includes an infrared imaging chip, an electronic device, an infrared lens, and an infrared filter, wherein the infrared imaging chip and the electronic device are respectively connected to the circuit board module, the infrared lens is connected to the bracket, and the infrared imaging chip is located on an imaging focal plane of the infrared lens.
Optionally, the infrared lens is a traditional lens, the infrared lens is in threaded connection with the bracket, and the infrared filter is fixedly arranged at one end of the infrared lens close to the circuit board module; or the like, or, alternatively,
the lens is a traditional lens, the infrared lens is bonded on the bracket, and the infrared filter is fixed at one end of the infrared lens close to the circuit board module; or the like, or, alternatively,
the camera lens adopts traditional lens, infrared camera lens bond in on the support, the second inner chamber is equipped with the second step face, infrared filter locates on the second step face.
Optionally, the infrared lens is an infrared super-surface lens, the second inner cavity is provided with a third step surface and a fourth step surface, the infrared lens is arranged on the third step surface, and the infrared filter is arranged on the fourth step surface.
Optionally, an isolation pillar is disposed between the first inner cavity and the second inner cavity, the first inner cavity is further provided with a first step surface, and the optical element is disposed on the first step surface.
Optionally, a distance D1 between the entrance pupil position of the infrared lens and the infrared imaging chip, a distance D2 between the microstructure surface of the optical element and the first laser light source, and a distance | D1-D2| ≦ 1mm between D1 and D2; and/or the presence of a gas in the gas,
the distance D3 between the top surface of the infrared camera module and the circuit board, the distance D4 between the top surface of the projector module and the circuit board, and the distance D3-D4 between the D3 and the D4 are less than or equal to 0.5mm.
The invention further provides three-dimensional imaging equipment, which comprises a 3D structured light module and a mainboard, wherein the 3D structured light module is the 3D structured light module, the 3D structured light module is arranged on the mainboard, the mainboard is also provided with a processing chip and a transmission interface, the processing chip is respectively in communication connection with the 3D structured light module and the transmission interface, and the transmission interface is used for connecting an upper computer.
The invention also provides an assembly method of the 3D structured light module, which is applied to the 3D structured light module and comprises the following steps:
the laser bonding method comprises the following steps of attaching a first laser source, a second laser source, a conductive heightening sheet, an infrared imaging chip, an electronic device and a connecting module to a circuit board module, wherein when the first laser source, the second laser source and the conductive heightening sheet are fixed to the circuit board module respectively, the first laser source, the second laser source and the conductive heightening sheet are firstly and respectively bonded to the circuit board module through conductive adhesives by means of quick pre-baking, the three need to meet certain thrust, and then the three and the circuit board module are baked together for a long time, so that the conductive adhesives achieve complete bonding force.
According to the technical scheme, the bracket is provided with the first inner cavity and the second inner cavity, the projector module is arranged in the first inner cavity, the infrared camera module is arranged in the second inner cavity, the baseline distance is small, the size of the structured light module can be reduced, and the projector and the infrared camera are integrated in one module, so that the size of the structured light module is further reduced. The projector module comprises a first laser light source, a second laser light source, a conductive heightening sheet and an optical element, wherein the first laser light source is positioned on a focal plane of an optical element collimation phase surface, the second laser light source is fixed on the conductive heightening sheet and positioned on a virtual focal plane of the optical element collimation phase surface, the first laser light source and the second laser light source are connected with a control circuit, the control circuit controls the first laser light source and the second laser light source to be alternately polished, so that laser outputs structural light and uniform infrared light at intervals through the optical element. Thus, the structured light projector and the floodlight are integrated in one projector, the volume of the structured light module is further reduced, and the miniaturized design of the imaging device is realized.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a typical conventional 3D structured light module;
fig. 2 is a schematic structural diagram of a 3D structured light module according to the present invention;
FIG. 3 is a schematic structural view of the stent of FIG. 2;
FIG. 4 is a schematic structural diagram of another 3D structured light module according to the present invention;
FIG. 5 is a schematic view of the structure of the stent of FIG. 4;
FIG. 6 is a schematic structural diagram of another 3D structured light module according to the present invention;
FIG. 7 is a schematic structural view of the stent of FIG. 6;
fig. 8 is a schematic structural diagram of a three-dimensional imaging device provided by the present invention.
The reference numbers indicate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 101 | |
2014、5014、7014 | |
| 102 | Floodlight |
2021、5021、7021 | |
| 103 | |
2022、5022、7022 | |
| 104 | |
2023、5023、7023 | |
| 105 | |
2024、5024、7024 | |
| 1011、1021、1031 | Board-to- |
2051、5051、7051 | |
| 201、401、501、701 | |
5052 | |
| 202、402、502、702 | |
2052 | |
| 203、503、703 | |
2053 | |
| 204、504、704 | |
7052 | |
| 205、505、705 | |
7053 | |
| 206、506、706 | |
403 | |
| 2011、5011、7011 | |
404 | |
| 2012、5012、7012 | |
405 | Resistance- |
| 2013、5013、7013 | Laser light source 2 | 406 | Transmission interface |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a 3D structured light module.
The existing 3D structured light module for face recognition comprises a structured light projector, a floodlight and an infrared camera. On one hand, the infrared camera receives uniform infrared light projected by the floodlight illuminator to obtain a uniform infrared image, and the uniform infrared image can perform face detection, face framing, face feature comparison, face recognition and other work in different scenes; on the other hand, after the face is detected, the structured light projector is started, the infrared camera receives structured light projected by the structured light projector to obtain a structured light spot map with structural characteristics, the structured light spot map with structural characteristics is solved through an algorithm to obtain a depth map, the depth map increases depth information of a target object, and plane attack means can be effectively responded.
Thus, in the field of face recognition, as shown in fig. 1, the conventional typical 3D structured light module is generally formed by fixing the structured light projector 103, the floodlight illuminator 102, and the infrared camera 101 as three independent modules on the structural bracket 104, and connecting the three independent modules with the first main board 105 through the board-to- board connectors 1011, 1021, and 1031 (three board-to-board connectors are required), which results in complex structural assembly, high material and assembly costs, and a module baseline distance generally greater than 25mm (the distance between the optical center of the infrared camera 101 and the optical center of the structured light projector 103 is called a baseline distance), resulting in a large module volume, which is not favorable for the miniaturization design of the imaging device.
In order to solve the technical problem, according to the technical scheme of the invention, the bracket is provided with the first inner cavity and the second inner cavity, the projector module is arranged in the first inner cavity, the infrared camera module is arranged in the second inner cavity, the baseline distance is small, the volume of the structured light module can be reduced, and the projector and the infrared camera are integrated in one module, so that the volume of the structured light module is further reduced. The projector module comprises a first laser light source, a second laser light source, a conductive heightening sheet and an optical element, wherein the first laser light source is positioned on a focal plane of an optical element collimation phase surface, the second laser light source is fixed on the conductive heightening sheet and positioned on a virtual focal plane of the optical element collimation phase surface, the first laser light source and the second laser light source are connected with a control circuit, the control circuit controls the first laser light source and the second laser light source to be alternately polished, so that laser outputs structural light and uniform infrared light at intervals through the optical element. Thus, the structured light projector and the floodlight are integrated in one projector, the volume of the structured light module is further reduced, and the miniaturized design of the imaging device is realized.
The above technical solution is described in detail with reference to the accompanying drawings.
The first embodiment is as follows:
in this embodiment, referring to fig. 2, a 3D structured light module provided in this embodiment is shown, wherein (a) is a front view of the 3D structured light module, and (b) is a cross-sectional view of the 3D structured light module. This 3D structure optical module includes:
a stent 205 having a first lumen and a second lumen;
the projector module 201 is arranged in the first inner cavity, the projector module 201 comprises a first laser light source 2011, a second laser light source 2013, a conductive padding sheet 2012 and an optical element 2014, wherein the first laser light source 2011 is positioned on a focal plane of a collimation phase surface of the optical element 2014, the second laser light source 2013 is fixed on the conductive padding sheet 2012 and is positioned on a virtual focal plane of the collimation phase surface of the optical element 2014, the first laser light source 2011 and the second laser light source 2013 are connected with a control circuit, the control circuit controls the first laser light source 2011 and the second laser light source to alternately irradiate light, and laser is enabled to alternately output structural light and uniform infrared light through the optical element 2014; and
and the infrared camera module 202 is arranged in the second inner cavity, and the infrared camera module 202 is used for outputting a uniform infrared image and an infrared speckle image with coding characteristics at intervals.
In a specific implementation process, the projector module 201 projects uniform infrared light (floodlight) and structured light with coding features at intervals to reach a measured object, reflected light of the measured object is imaged on the infrared camera module 202, the infrared camera module 202 outputs uniform infrared images and infrared spot images with coding features at intervals, the uniform infrared images are used for face detection, framing of a face and the like, and the infrared spot images with the coding features are calculated through an algorithm to obtain a depth map for face living body detection.
The projector module 201 comprises a first laser source 2011, a conductive heightening sheet 2012, a second laser source 2013 and an optical element 2014, wherein the first laser source 2011 can be an array of vcsel (vertical cavity surface laser emitter), hscel (horizontal cavity surface laser emitter) and the like and consists of a plurality of luminescent holes which are distributed pseudo-randomly, the second laser source 2013 can be an array of vcsel or LED, when the second laser source 2013 is the array of vcsel, the light spot arrangement on the second laser source can consist of a plurality of luminescent holes which are distributed pseudo-randomly or a plurality of luminescent holes which are distributed regularly, and the preferred luminescent holes are distributed regularly; optical element 2014 collects collimation diffraction function in an organic whole, can be collimation & diffraction optical element 2014, also can be super surface structure element, integrates the collimation function of traditional collimating lens and the replication diffraction function of diffraction optical element 2014 on a slice of optical element 2014, less one collimating mirror has practiced thrift material cost, equipment production degree of difficulty and cost. The projector module 201 and the infrared camera module 202 share one bracket 205, so that the projector and the infrared camera are integrated in one module, and the size of the structured light module is further reduced.
The 3D structured light module in this embodiment further includes a circuit board module 203 and a connection module 204, the first laser light source 2011 and the second laser light source 2013 are electrically connected to the circuit board module 203 respectively, the bracket 205 is fixedly connected to the circuit board module 203, and the connection module 204 is used for externally connecting a motherboard.
In a specific implementation process, a first laser light source 2011 is located on a focal plane of a collimation phase plane of an optical element 2014, a second laser light source 2013 is heightened through a conductive heightening sheet 2012 and is located on a virtual focal plane of the collimation phase plane of the optical element 2014, a lower surface, namely a cathode, of the first laser light source 2011 is electrically connected to a circuit board module 203 through conductive glue, the conductive glue is glue with pasting performance and conductive performance, high-concentration metal particles are generally doped in the glue and can be conductive silver glue, copper powder conductive glue, nickel-carbon conductive glue, silver-copper conductive glue and the like, an upper surface anode pad of the first laser light source 2011 is electrically connected to the circuit board module 203 through gold wire welding, the gold wire is a metal lead and can be a conductive copper wire, an aluminum wire, a gold wire and the like, a lower surface, namely the cathode, of the second laser light source 2013 is electrically connected to the conductive heightening sheet 2012 through the conductive glue, an upper surface, a lower surface, namely a copper block with nickel plating on the surface, a conductive gold plating surface, a lower surface, a conductive copper block with a conductive ceramics surface, and a lower surface, the conductive glue and the conductive glue are electrically connected to the circuit board module 203 through conductive heightening sheet and the conductive glue; after a first laser source 2011 comprising N light emitting points is distributed and passes through the optical element 2014, the first laser source 2011 is collimated, copied and diffused into M x N structural light spots, wherein M is the copying level of the optical element 2014, after light emitted by a second laser source 2013 passes through the optical element 2014, as the second laser source 2013 is positioned on the virtual focal plane of the optical element 2014, the copied light spots are mutually overlapped, output light is uniform infrared light, the first laser source 2011 and the second laser source 2013 can be controlled to be alternately illuminated through an external control circuit, and the projector module 201 can alternately output the structural light and the uniform infrared light. The structured light projector and the floodlight are integrated in one projector, so that the volume of the structured light module is further reduced.
The Circuit Board module 203 may be a PCB (Printed Circuit Board), a rigid-flex Board, a Flexible Printed Circuit (FPC) reinforced by a steel sheet, or a ceramic substrate with good heat dissipation capability; the connection module 204 may be a board-to-board connector or a gold finger, and the 3D structured light module may be electrically connected to the motherboard through the connection module 204.
In this embodiment, the first cavity further has a first step surface 2051, and the optical element 2014 is disposed on the first step surface 2051. Referring to fig. 2 and 3, optical element 2014 is fixed to first step surface 2051 of bracket 205 by low-flow glue, and bracket 205 is fixed to circuit board module 203 by AA glue 206. The AA glue 206 is a short name of glue used in the active focusing technology of the camera AA process, and is generally UV glue, and a UV + thermal curing dual curing method is adopted to achieve the expected adhesive strength. This is prior art and this embodiment will not be described in detail.
Further, the infrared camera module 202 includes an infrared imaging chip 2021, an electronic device 2022, an infrared lens 2024 and an infrared filter 2023, wherein the infrared imaging chip 2021 and the electronic device 2022 are respectively connected to the circuit board module 203, the infrared lens 2024 is connected to the bracket 205, and the infrared imaging chip 2021 is located on an imaging focal plane of the infrared lens 2024.
In this embodiment, the infrared imaging chip 2021 is electrically connected to the circuit board module 203 through solder or red glue and gold wires, the electronic device 2022 may be a capacitor, a diode, a resistor, or other electronic devices 2022, and is electrically connected to the circuit board module 203 through solder (for convenience of description, only one electronic device 2022 is shown, and an appropriate number is actually set according to imaging requirements of the infrared chip), and the infrared lens 2024 is composed of one or more lenses and a lens barrel; the infrared filter 2023 is directly integrated in the lens barrel of the lens, and the infrared filter 2023 adopts an infrared narrowband filter, the function of the infrared narrowband filter is to cut off the light beam which is inconsistent with the wavelength band emitted by the projector in the reflected light of the object to be measured; referring to fig. 2 and 3, the infrared lens 2024 is a conventional lens, the infrared filter 2023 is fixedly disposed at one end of the infrared lens 2024 close to the circuit board module 203, the infrared lens 2024 is in threaded connection with the bracket 205, specifically, the second inner cavity is provided with a screw thread 2052, the infrared lens 2024 is locked in the bracket 205 by the screw thread 2052, the distance between the infrared lens 2024 and the infrared imaging chip 2021 can be adjusted by rotating the infrared lens 2024, so as to realize clear imaging at different object distances, the infrared imaging chip 2021 is located on an imaging focal plane of the infrared lens 2024, and the bracket 205 is connected with the circuit board module 203 by an AA adhesive.
An isolating column 2053 is arranged between the first inner cavity and the second inner cavity and is used for isolating the first laser light source 2011 and the second laser light source 2013 from the infrared imaging chip 2021 so as to prevent light emitted by the first laser light source 2011 and the second laser light source 2013 from being reflected by the first inner cavity and the second inner cavity of the bracket 205 to directly image on the infrared imaging chip 2021 and form background noise.
Optionally, the baseline distance B between the optical center of the projector module 201 and the optical center of the infrared camera module 202 is ≦ 10mm. The baseline is short, and the volume of the whole structured light module can be made small.
The distance D1 between the entrance pupil position of the infrared lens 2024 and the infrared imaging chip, the distance D2 between the microstructure surface of the optical element 2014 and the first laser light source, and the distance D1-D2 between D1 and D2 is less than or equal to 1mm; and/or the presence of a gas in the atmosphere,
the distance D3 between the top surface of the infrared camera module 202 and the circuit board module 203, the distance D4 between the top surface of the projector module 201 and the circuit board module 203, and the distance D3-D4 between D3 and D4 is equal to or less than 0.5mm.
For fig. 2, because the baseline is smaller than the conventional structured light module, and the structured light realizes the calculation of the depth distance based on the principle of triangulation, the smaller the baseline distance, the lower the distance measurement accuracy, in order to ensure the measurement accuracy when the baseline distance is small, the present invention provides that the entrance pupil position of the infrared lens 2024 (the entrance pupil of the lens is the effective aperture for limiting the incident beam on the object plane, which is the image of the lens aperture stop on the front optical system, and if the aperture stop is the top surface of the first lens of the lens, the top surface position of the first lens is the entrance pupil position) is away from the distance D1 of the infrared imaging chip 2021 and the distance D2 between the microstructure plane of the optical element 2014 and the first laser source 2011 need to satisfy a certain condition, that | D1-D2| is equal to or less than 1mm, and satisfy a certain condition under the short baseline condition to ensure the measurement accuracy.
In addition, in order to facilitate the assembly and the matching of the subsequent 3D module and a terminal (such as a mobile terminal, a cabinet air conditioner or a robot) and facilitate the opening design of the subsequent terminal structure, the distance D3 between the top surface of the infrared camera module 202 and the circuit board module 203 and the distance D4 between the top surface of the projector module 201 and the circuit board module 203 also meet certain conditions, namely | D3-D4| is less than or equal to 0.5mm, so as to optimize the opening of the terminal structure.
The process for assembling the 3D structured light module provided in this embodiment can be briefly described as follows: namely, the invention also provides an assembling method of the 3D structured light module, which comprises the following steps:
the first laser source 2011, the second laser source 2013, the conductive heightening sheet 2012, the infrared imaging chip 2121, the electronic device 2022 and the connecting module 204 are attached to the circuit board module 203, wherein when the first laser source 2011, the second laser source 2013 and the conductive heightening sheet 2012 are respectively fixed to the circuit board module 203, the first laser source 2011, the second laser source 2013 and the conductive heightening sheet 2012 are respectively and quickly pre-baked to be adhered to the circuit board module through conductive adhesives, and the three need to satisfy a certain thrust force, and then the three and the circuit board module are baked together for a long time, so that the conductive adhesives reach complete adhesion force. The method comprises the following specific steps:
the first assembling step: attaching the first laser source 2011, the conductive heightening sheet 2012, the second laser source 2013, the electronic device 2022, the infrared imaging chip 2021 and the connecting module 204 to the circuit board module 203;
specific to step one is: if the infrared imaging chip 2021 is a CSP chip, 1) the electronic device 2022, the infrared imaging chip 2021 and the connection module 204 are soldered to the circuit board by solder paste through SMT process, 2) the lower surface of the first laser source 2011 is fixed to the circuit board module 203 by conductive paste through DB (Die bond) process in COB process, and the first laser source 2011 is preliminarily fixed to the circuit board module 203 by fast pre-baking to satisfy a certain thrust requirement (acting force required for pushing the laser source one time), and the general baking time is less than or equal to 10 minutes; 3) Fixing the lower surface of the conductive heightening sheet 2012 on the circuit board module 203 through a conductive adhesive by using a DB (Die bond) flow in a COB process, so that the conductive heightening sheet 2012 is preliminarily fixed on the circuit board module 203, thereby satisfying a certain thrust requirement (an acting force required for pushing the conductive heightening sheet 2012) and generally setting the baking time to be less than or equal to 10 minutes; 4) Fixing the lower surface of the second laser source 2013 on the conductive heightening sheet 2012 through a conductive adhesive by using a DB (Die bond) flow in a COB process, so that the second laser source 2013 is preliminarily fixed on the conductive heightening sheet 2012, a certain thrust requirement (acting force required when the second laser source 2013 is pushed) is met, and the general baking time is less than or equal to 10 minutes; 5) Baking the circuit board module 203 adhered with corresponding devices (a first laser source, a second laser source and a conductive heightening sheet) for 2-3h to enable the conductive adhesive to achieve complete bonding force; 6) Electrically connecting the anode pads on the upper surfaces of the first laser source 2011 and the second laser source 2013 to the circuit board module 203 through a WB (Wire bond) process in a COB (chip on board) process; in the DB in the traditional COB process, the devices are adhered to a circuit board through a silver conductive adhesive and then are directly baked for 2-3h to fully fix the devices on the circuit board, but the conductive adhesive plays roles in conduction, adhesion and heat transfer, the metal content in the adhesive is high, and the time for full curing is longer, so that if three devices including a first laser light source 2011, a conductive pad 2012 and a second laser light source 2013 are fixed, the DB process can be completed only after 6-9h, in the invention, after the devices are fixed on the circuit through the conductive adhesive each time, the devices are firstly baked and primarily fixed, and then the three devices are baked for 2-3h, so that the time required by the DB process is greatly shortened, and the production efficiency is greatly improved; after finishing the conductive adhesive, because the circuit board module needs to adjust the position to paste another device or transfer to other machine stations to execute other operations, and the conductive adhesive is liquid, if not through preliminary fixed very easily when moving the circuit board, the position of the device that pastes also can change, produces badly.
If the infrared imaging chip 2021 is a COB chip, the steps are slightly different: then 1) the electronic device 2022 and the connection module 204 are soldered to the circuit board module 203 by solder paste through SMT process; 2) The infrared imaging chip 2021 is fixed on the circuit board module 203 through a DB (Die bond) flow in a COB process, and is rapidly baked to enable glue to exert complete adhesion, wherein the red glue is different from a conductive glue, so that sufficient curing time is short and is generally within 6 minutes; 3) Respectively fixing a first laser source 2011, a conductive heightening sheet 2012 and a second laser source 2013 on the circuit board module 203 through a DB process in a COB process, and electrically connecting the anode bonding pads of the first laser source 2011 and the second laser source 2013 on the circuit board module 203 through a gold thread through a WB process (the processes are the same as above, and no further description is provided here);
and a second assembling step: aligning the geometric center of optical element 2014 with the windowed geometric center of first step face 2051, attaching optical element 2014 to holder 205 by low-flow glue;
and a third assembling step: by an AA process, aligning the optical center of the optical element 2014 with the optical center of the first laser source 2011, and making the first laser source 2011 be located on a focal plane of a collimation phase plane of the optical element 2014, performing slight deviation in the XY direction according to actual conditions (the 2011 and 2013 can be symmetrically distributed on the XY plane about the optical axis O), and fixing the bracket 205 on the circuit board module 203 through an AA glue layer 206; the AA process is a process using Adaptive Alignment technology, and obtains different field definition and resolution values by processing images of the first laser source 2011 at different positions relative to the optical element 2014, which are shot by a high-definition camera, and then automatically controls the 6-degree-of-freedom moving platform to align the optical element 2014 and the first laser source 2011 and apply AA glue and UV curing. Compared with the traditional Passive Alignment, the Active Alignment has the difference that the Alignment is performed by adopting an image shot by a high-definition camera instead of an external position or size, so that the Alignment precision is higher;
the fourth assembling step: locking the infrared lens 2024 in the bracket 205, adjusting the distance between the infrared lens 2024 and the infrared imaging chip 2021 by a screw thread, so that the infrared imaging chip 2021 is located on the focal plane of the infrared lens 2024, and fixing the infrared lens 2024 on the bracket 205 by dispensing;
the assembly production of the whole 3D structured light module is completed through the four steps.
The procedure for assembling the 3D structured light module can be briefly described as follows:
firstly, the method comprises the following steps: assembly of structured light projector modules
The first assembling step: the DB process of the COB process is to attach the lower surface of the laser light source to the first circuit board through the conductive adhesive, bake the lower surface of the laser light source for 2 to 3 hours, and electrically connect the anode bonding pad on the upper surface of the laser light source to the first circuit board through the WB process of the COB process through the gold wire;
and a second assembling step: attaching the diffractive optical element to a lens barrel of the collimating lens, namely a first structural support;
and a third assembling step: aligning the optical center of the diffraction optical element with the optical center of the laser light source through an AA process, and fixing the structure support on the circuit board through AA glue; completing the assembly of the structured light projector module;
II, secondly: assembling an infrared camera module:
the first assembling step: if the infrared receiving chip is a CSP chip, the infrared receiving chip and the electronic device are attached to the second circuit board through an SMT process; if the infrared receiving chip is a COB chip, the electronic device is attached to the second circuit board through an SMT process, the lower surface of the laser light source is attached to the second circuit board through a conductive adhesive through a DB process of the COB process and baked for 2-3h, and the anode bonding pad on the upper surface of the laser light source is electrically connected to the second circuit board through a gold thread through a WB process of the COB process
And a second assembling step: attaching the optical filter to a second structural support;
a third assembling step: aligning the windowing center of the structure support with the optical center of the infrared receiving chip, and fixing the structure support on a second circuit board through black glue;
the fourth assembling step: aligning the optical center of the infrared lens with the optical center of the infrared receiving chip through an AA process, and fixing the infrared lens on the structural support through AA glue; completing the assembly of the infrared camera module;
thirdly, the steps of: the floodlight source module:
the first assembling step: attaching a laser light source or an infrared light supplement lamp to the third circuit board through a COB process or an SMT process;
and a second assembling step: aligning the optical center of the diffuser with the windowing center of the third structural support, and fixing the diffuser on the third structural support by using low-folding glue;
a third assembling step: aligning the windowing center of the structural support with the light-emitting center of the laser light source or the infrared light supplement lamp, and fixing the structural support III on the circuit board III through black glue; completing the encapsulation of the floodlight source module;
fourthly, the method comprises the following steps: respectively fixing the structured light projector module, the infrared camera module and the floodlight source module on the fourth structural support (which also needs to be aligned and glued in three steps);
in contrast, the 3D structured light module provided by the present embodiment has many advantages:
1) The projector module combines the structured light projector module and the floodlight source module into one projection module, so that one floodlight illuminator is reduced (the use of a diffuser and a structural support is reduced), and the collimating mirror and the diffractive optical element are integrated on one optical element, so that one collimating mirror is reduced;
2) The infrared camera module integrates the infrared filter into the lens barrel of the infrared lens, so that the optical filter is reduced to be used as a single device and an independent structural support is required for attaching and fixing the optical filter;
3) The projector module and the infrared camera module share one structural support, so that the use of a plurality of structural supports is reduced, the material cost is greatly reduced, the assembly steps are greatly reduced, and the assembly time and the assembly cost are saved;
4) The projector module and the infrared camera module share one circuit board, so that the use of a plurality of circuit boards and connecting modules is reduced, the material cost is greatly reduced, and the assembly steps and the assembly cost are greatly reduced;
5) The module baseline is less than 10mm, and the whole 3D structure optical module is small in size, so that the application requirements of lighter and thinner or miniaturized mobile electronic equipment can be met.
Example two
In this embodiment, referring to fig. 4, another 3D structured light module provided in this embodiment is shown, where (a) is a front view of the 3D structured light module, and (b) is a cross-sectional view of the 3D structured light module. The 3D structured light module provided in this embodiment includes the projector module, the infrared camera module, the circuit board module, and the connection module, where the projector module and the infrared camera module share a bracket, and for distinguishing from fig. 2 and fig. 3 of the first embodiment, please refer to fig. 4 and fig. 5, and the reference numbers of the structures in this embodiment are as follows:
the projector module 501, the infrared camera module 502, the circuit board module 503, the connection module 504, the bracket 505, the aa glue 506, the first laser source 5011, the conductive pad 5012, the second laser source 5013, the optical element 5014, the infrared imaging chip 5021, the electronic device 5022, the infrared filter 5023, the infrared lens 5024, the first step face 5051 and the second step face 5052.
Optionally, the infrared lens 5024 is a conventional lens, the infrared lens 5024 is bonded to the bracket 505, and the infrared filter 5023 is fixed to one end of the infrared lens 5024 close to the circuit board module 503; or, the infrared lens 5024 is a conventional lens, the infrared lens 5024 is adhered to the bracket 505, the second inner cavity is provided with a second step surface 5052, and the infrared filter 5023 is arranged on the second step surface 5052. In this embodiment, the infrared lens 5024 adopts a traditional lens, which is different from the first embodiment: 1) The ir lens 5024 used in this embodiment is an integrated lens, and the ir lens 2024 in fig. 2 is a lens with a screw thread, 2) the ir filter 5023 can be integrated into a barrel of the ir lens 5024, or placed on the second step surface 5052 of the bracket 505 as shown by the dotted line in fig. 4 (b), and the ir camera module 502 uses an integrated lens and is attached to the ir lens 5024 by an AA process, which results in higher assembly accuracy.
The steps of assembling the 3D structured light module proposed in this embodiment are as follows:
the first assembling step: attaching the first laser source 5011, the conductive pad 5012, the second laser source 5013, the infrared imaging chip 5021, the electronic device 5022 and the connection module 504 to the circuit board 503; (the procedure is as described in the first embodiment, and will not be described here)
And a second assembling step: aligning the geometric center of the optical element 5014 with the windowed geometric center of the first step surface 5051, and attaching the optical element 5014 to the bracket 505 by low-fluidity glue;
and a third assembling step: through an AA process, aligning the optical center of the optical element 5014 with the optical center of the first laser source 5011, and making the optical axis aligned as shown in FIG. 4 (b) be an O axis marked by a dotted line, so that the first laser source 5011 is positioned on a focal plane of a collimation phase plane of the optical element 5014, and according to the actual situation, making a slight offset in the XY direction, so that the first laser source 5011 and the second laser source 5013 are symmetrically distributed on the XY plane about the optical axis O, and the bracket 505 is fixed on the circuit board module 503 through AA glue 506;
and a fourth assembling step: after aligning the optical center of the infrared lens 5024 with the optical center of the infrared imaging chip 5021 through an AA process, fixing the infrared lens 5024 on the circuit board module 503 by using AA glue 506; and finishing the assembly of the 3D structured light module.
The difference between this embodiment and fig. 2: in fig. 2, the lens of the infrared lens 2024 is connected to the bracket 205 by a screw, the bracket is attached to the circuit board by the alignment requirement of the projector module in the third assembling step, rather than the bracket attached by the alignment requirement of the infrared camera in the assembling step, the infrared lens can only adjust the distance between the chip and the bracket in the height direction, in order to achieve the better imaging effect of the infrared camera, it needs to ensure that the position size of the structural bracket in the X, Y direction attached to the infrared camera module meets a certain tolerance requirement, the precision of the bracket 205, the flatness of the circuit board, the consistency of the assembling machine and the assembling precision are all higher, and in fig. 4 in the second embodiment, after the projector module 501 is attached to the circuit board module 503, the AA process can be used again to adjust the relative positions of the infrared lens 5024 and the infrared imaging chip 5021, and the position of the infrared lens 5024 can be adjusted in six degrees of freedom, so that the infrared imaging chip 5021 is located at the best imaging plane of the infrared lens 5024, and the best imaging effect can be achieved; the appropriate scheme can be selected according to actual conditions.
EXAMPLE III
In this embodiment, referring to fig. 6, a 3D structured light module provided by the present invention is shown, wherein (a) is a front view of the 3D structured light module, and (b) is a cross-sectional view of the 3D structured light module. The 3D structured light module provided in this embodiment includes the projector module, the infrared camera module, the circuit board module, and the connection module, where the projector module and the infrared camera module share a bracket, and for distinguishing from fig. 2 and fig. 3 of the first embodiment, please refer to fig. 6 and fig. 7, and the reference numbers of the structures in this embodiment are as follows:
the infrared imaging device comprises a projector module 701, an infrared camera module 702, a circuit board module 703, a connecting module 704, a support 705, AA glue 706, a first laser light source 7011, a conductive heightening sheet 7012, a second laser light source 7013, an optical element 7014, an infrared imaging chip 7021, an electronic device 7022, an infrared filter 7023, an infrared lens 7024, a first step surface 7051, a third step surface 7052 and a fourth step surface 7053.
In this embodiment, the infrared lens 7024 is an infrared super-surface lens, the second inner cavity has a third step surface 7052 and a fourth step surface 7053, the infrared lens 7024 is disposed on the third step surface 7052, and the infrared filter 7023 is disposed on the fourth step surface 7053. Specifically, the difference from fig. 2 in the first embodiment is: 1) Here, the infrared lens 7024 is not a conventional lens, and is an infrared super-surface lens, and 2) the infrared filter 7023 is attached to the fourth step surface 7053 of the second inner cavity of the holder 705.
The super surface is based on the generalized Snell's law, through introducing the sub-wavelength scale unit structure of surface, produce the sudden change phase place, can regulate and control phase place, amplitude and polarization of the light field in the two-dimensional plane, the optical device designed based on the super surface has characteristics miniaturized, lightweight, integrated, the super surface is regarded as a revolutionary technology in the optical field, is expected to overturn loaded down with trivial details lens assembly in the traditional optical system completely, become the mainstream optical element of next generation. The super-surface lens is generally a microstructure surface formed by etching or depositing a plurality of sub-wavelength scale units arranged according to a certain rule on a substrate material with high transmittance, and the common substrate materials include: quartz, siO2, polymer materials, PC, etc., and commonly used microstructure materials include metals such as copper, aluminum, gold, titanium, etc., or dielectric materials such as silicon, silicon nitride, tiO2, aluminum arsenide, etc.
The assembly steps of the 3D structured light module in this embodiment are as follows:
the first assembling step: attaching the first laser source 7011, the conductive heightening sheet 7012, the second laser source 7013, the infrared imaging chip 7021, the electronic device 7022 and the connecting module 704 to the circuit board module 703; (the steps are as described in the first embodiment, and are not described herein again).
And a second assembling step: according to the alignment requirement of the geometric dimension, the optical element 7014, the infrared filter 7023 and the infrared lens 7024 are sequentially attached to the bracket 705;
and a third assembling step: by means of an AA process, aligning the optical center of the infrared lens 7024 with the optical center of the infrared imaging chip 7021, and fixing the bracket 705 on the circuit board module 703 by using an AA glue 706, where the optical axis aligned as shown in fig. 6 (b) is an O axis marked by a dotted line, and the relative position of the optical center of the optical element 7014 and the infrared imaging chip 7021 is ensured to be within a certain tolerance range;
the structured light module has higher integration level, smaller module volume and simpler assembly steps, and the optical center of the infrared camera is taken as the standard AA, so that the relative positions of the first laser source 7011 and the optical element 7014 are determined by the processing precision of the structural support, the flatness of the circuit board and the AA attachment tolerance, and the requirements on the processing precision of the structural support, the flatness of the circuit board and the assembly precision are higher;
with respect to fig. 6, the function of the ir filter 7023 and the function of the ir lens 7024 can also be integrated on a super-surface lens, which further reduces the material cost and assembly steps.
Example four
Referring to fig. 8, the present embodiment provides a three-dimensional imaging device, including a 3D structured light module and a motherboard, where the 3D structured light module is the 3D structured light module as described in the first, second, and third embodiments, the 3D structured light module is disposed on the motherboard 403, the motherboard 403 is further provided with a processing chip 404 and a transmission interface 406, the processing chip 404 is respectively in communication connection with the 3D structured light module and the transmission interface 406, and the transmission interface 406 is used for connecting an upper computer. In addition, a resistor-capacitor device 405 is also arranged on the main board.
In order to distinguish from fig. 2 and 3 of the first embodiment, please refer to fig. 8, in which the 3D structured light module includes the projector module and the infrared camera module described in the first, second, and third embodiments, the projector module and the infrared camera module share a bracket, and the reference numbers of the structures in this embodiment are as follows: a projector module 401, an infrared camera module 402.
Specifically, in this embodiment, when a user sends an imaging instruction to the three-dimensional imaging device, the processing chip 404 receives the imaging instruction and sends the imaging instruction to the projector module 401 of the 3D structured light module, and the projector module 401 projects structured light and uniform infrared light to an imaging target after receiving the imaging instruction; at this time, the processing chip 404 also sends an imaging instruction to the infrared camera module 402 of the 3D structured light module, the infrared camera module 402 receives the imaging instruction and obtains imaging information of an imaging target, and the infrared camera module 402 sends the imaging information to the processing chip 404; the processing chip 404 receives the imaging information and processes the imaging information, so as to obtain data required by people, such as ranging data, and the like, and transmits the data to the upper computer through the transmission interface 406; the processing chip 404 may be integrated with ISP and MCU modules, and the ISP and the MCU may also be attached to the motherboard 403 as separate modules; the transmission interface 406 may be an interface such as USB, UART, LVDS, or the like, and transmits the image data after being processed by the algorithm to the upper computer. The projector module 401 and the infrared camera module 402 are directly connected with the main board 403, and the connecting module in the first, second and third embodiments is not required to be electrically connected to the main board, so that the integration level of the whole 3D structure optical module is higher, the cost of one circuit board and one connecting module can be saved, the material cost is lower, and the assembling steps and the assembling cost are further reduced. Therefore, the projector, the infrared camera and the main board share the same substrate, and the integration level is higher.
In the three-dimensional imaging device provided by this embodiment, when the laser light source i, the laser light source ii, the conductive pad-up sheet, the infrared imaging chip, the electronic device, the processing chip, and the transmission interface are attached to the motherboard, as for the above-mentioned devices, referring to embodiments i, ii, and iii, in this embodiment, when the laser light source i, the laser light source ii, and the conductive pad-up sheet are respectively fixed to the motherboard, the related devices are respectively bonded to the motherboard by the conductive adhesive by fast pre-baking, and the related devices need to satisfy a certain thrust, and then the related devices and the motherboard are baked together for a long time, so that the conductive adhesive reaches a complete bonding force; please refer to the first, second, and third embodiments for the assembly process of other structures.
Therefore, the structured light projection function, the floodlighting function and the infrared camera function are integrated on one module, the module is connected with the mainboard through a board-to-board connector, or the module is directly attached to the mainboard in a substrate sharing mode, the number of used optical materials and the module assembling steps are greatly reduced, the module base line distance is smaller than 10mm, the whole 3D structured light module is small in size, and the application requirements of lighter, thinner or miniaturized mobile electronic equipment can be met on the basis of realizing ultralow cost.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A3D structured light module, comprising:
the bracket is provided with a first inner cavity and a second inner cavity;
the projector module is arranged in the first inner cavity and comprises a first laser source, a second laser source, a conductive heightening sheet and an optical element, wherein the first laser source is positioned on a focal plane of a collimation phase surface of the optical element, the second laser source is fixed on the conductive heightening sheet and positioned on a virtual focal plane of the collimation phase surface of the optical element, the first laser source and the second laser source are connected with a control circuit, and the control circuit controls the first laser source and the second laser source to be alternately lightened so that the optical element alternately outputs structured light and uniform infrared light; and
and the infrared camera module is arranged in the second inner cavity and is used for outputting uniform infrared images and infrared spot images with coding characteristics at intervals.
2. The 3D structured light module of claim 1, wherein a baseline distance B between an optical center of the projector module and an optical center of the infrared camera module is ≦ 10mm.
3. The 3D structured light module according to claim 1, wherein the 3D structured light module further comprises a circuit board module and a connection module, the first laser source and the second laser source are electrically connected to the circuit board module respectively, the bracket is fixedly connected to the circuit board module, and the connection module is configured to externally connect to a motherboard.
4. The 3D structured light module of claim 3, wherein the infrared camera module comprises an infrared imaging chip, electronics, an infrared lens, and an infrared filter, wherein the infrared imaging chip and the electronics are respectively coupled to the circuit board module, wherein the infrared lens is coupled to the bracket, and wherein the infrared imaging chip is located at an imaging focal plane of the infrared lens.
5. The 3D structured light module of claim 4, wherein the infrared lens is a conventional lens, the infrared lens is in threaded connection with the bracket, and the infrared filter is fixedly disposed at one end of the infrared lens close to the circuit board module; or the like, or a combination thereof,
the infrared lens is a traditional lens, the infrared lens is adhered to the bracket, and the infrared filter is fixed at one end of the infrared lens close to the circuit board module; or the like, or, alternatively,
the infrared lens is a traditional lens, the infrared lens is bonded on the support, a second step surface is arranged in the second inner cavity, and the infrared filter is arranged on the second step surface.
6. The 3D structured light module of claim 4, wherein the infrared lens is an infrared super-surface lens, the second cavity has a third step surface and a fourth step surface, the infrared lens is disposed on the third step surface, and the infrared filter is disposed on the fourth step surface.
7. The 3D structured light module of claim 1 wherein an isolation post is disposed between the first interior cavity and the second interior cavity, the first interior cavity further comprising a first step surface, the optical element disposed on the first step surface.
8. The 3D structured light module of claim 4, wherein a distance D1 between the entrance pupil position of the infrared lens and the infrared imaging chip, a distance D2 between the microstructure surface of the optical element and the first laser light source, and a distance D1-D2| ≦ 1mm between D1 and D2; and/or the presence of a gas in the gas,
the distance D3 between the top surface of the infrared camera module and the circuit board module, the distance D4 between the top surface of the projector module and the circuit board module, and the distance D3-D4 between D3 and D4 are less than or equal to 0.5mm.
9. The three-dimensional imaging device is characterized by comprising a 3D structured light module and a mainboard, wherein the 3D structured light module is the 3D structured light module as claimed in claim 1, the 3D structured light module is arranged on the mainboard, a processing chip and a transmission interface are further arranged on the mainboard, the processing chip is respectively in communication connection with the 3D structured light module and the transmission interface, and the transmission interface is used for connecting an upper computer.
10. An assembling method of a 3D structured light module, which is applied to the 3D structured light module according to any one of claims 1 to 8, the assembling method comprising:
the laser bonding method comprises the following steps that a first laser source, a second laser source, a conductive pad, an infrared imaging chip, an electronic device and a connecting module are attached to a circuit board module, wherein when the first laser source, the second laser source and the conductive pad are fixed to the circuit board module respectively, the first laser source, the second laser source and the conductive pad are firstly and respectively pre-baked to be bonded to the circuit board module through conductive adhesive, certain thrust is required to be met by the three, then the three and the circuit board module are baked together for a long time, and the conductive adhesive achieves complete bonding force.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116381957A (en) * | 2023-05-30 | 2023-07-04 | 深圳市安思疆科技有限公司 | Structured light module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116381957A (en) * | 2023-05-30 | 2023-07-04 | 深圳市安思疆科技有限公司 | Structured light module |
| CN116381957B (en) * | 2023-05-30 | 2023-09-01 | 深圳市安思疆科技有限公司 | Structured light module |
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