CN214687594U - A glue sealing mold for circuit board in pit - Google Patents
A glue sealing mold for circuit board in pit Download PDFInfo
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- CN214687594U CN214687594U CN202120889277.XU CN202120889277U CN214687594U CN 214687594 U CN214687594 U CN 214687594U CN 202120889277 U CN202120889277 U CN 202120889277U CN 214687594 U CN214687594 U CN 214687594U
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- circuit board
- die
- mold
- glue
- cover plate
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Abstract
The utility model relates to a glue mould that seals for circuit board in pit, it includes: the lower surface of the cover plate is provided with a plurality of element grooves, and the element grooves correspond to the elements on the circuit board one by one; when the cover plate and the back plate clamp the circuit board at the middle position of the cover plate and the back plate, the element groove covers the component, and a preset expansion gap is reserved between the inner wall of the element groove and the component. The utility model discloses leave predetermined expansion gap between the inner wall of component recess and components and parts, ensure high temperature, vibration, impact, certain degree deformation even all can not produce stress concentration phenomenon to the circuit board, effective protection circuit board.
Description
Technical Field
The utility model belongs to the technical field of the mould, in particular to a glue mould that seals for circuit board in pit.
Background
In the field of circuit board packaging, glue sealing is a relatively mature process technology, and the glue sealing process can protect the surface of a circuit board through a glue sealing mold and is widely applied to automotive electronics and industrial electrical appliances.
At present, the traditional glue sealing mould mainly comprises an upper mould and a lower mould, the glue sealing mode mainly comprises three steps, firstly, a circuit board is placed into a lower mould cavity, and then, an upper mould is closed to form a mould cavity; and finally, after the sealing glue is cooled and fixed, the circuit board is protected, and most sealing glue molds have the protection functions of dust prevention, water prevention, static prevention and the like. However, when the circuit board is located at a position for downhole operation, the circuit board is easily subjected to high temperature, strong vibration and strong impact, so that the circuit board is concentrated in stress, deformed to a certain extent and affected in use.
Therefore, there is a need for a molding compound for a downhole circuit board to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve above-mentioned technical problem and provide a glue mould that seals for circuit board in pit, when it can solve present circuit board and be in the position of work in the pit, stress concentration appears the technical problem of deformation easily.
The utility model provides an above-mentioned technical problem's technical scheme as follows:
a molding compound mold for a downhole circuit board, comprising: the lower surface of the cover plate is provided with a plurality of element grooves, and the element grooves correspond to the elements on the circuit board one by one; when the cover plate and the back plate clamp the circuit board at the middle position of the cover plate and the back plate, the element groove covers the upper part of the element of the circuit board, and a preset expansion gap is reserved between the inner wall of the element groove and the element.
The utility model has the advantages that:
(1) the cover plate and the back plate fix the circuit board in a magnitude compression mode, a traditional bolt fixing structure is replaced, the cost of a mechanical structure is reduced, and the safety and reliability of the circuit board are improved;
(2) this application leaves predetermined expansion gap between the inner wall of component recess and components and parts, ensures high temperature, vibration, impact, and even certain degree of deformation can not produce stress concentration phenomenon to the circuit board, effectively protects the circuit board.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
The lower surface of the upper die is provided with a first mounting groove for placing the cover plate; and a second mounting groove for placing the back plate is formed in the upper surface of the lower die.
The beneficial effect of adopting the further scheme is that: the utility model discloses set up apron, backplate between last mould and bed die, can effectively reduce the incorporation of debris for it is littleer to be heated, receive inflation or atress change under the condition of shaking, avoids the secondary damage of circuit board instrument etc..
Further, the upper die is arc-shaped or cuboid-shaped; the lower die is arc-shaped or cuboid.
The beneficial effect of adopting the further scheme is that: the arc-shaped mold is attractive in appearance; the rectangular mold is easy to manufacture and easy to process.
Furthermore, the surface of the upper die is provided with a plurality of axial shock absorption ribs and/or radial shock absorption ribs; the surface of the lower die is provided with a plurality of axial shock absorption ribs and/or radial shock absorption ribs.
The beneficial effect of adopting the further scheme is that: the shock absorption rib not only can help to increase the shock absorption effect on the surface of the die, but also can enhance the mechanical strength of the die, and is simple and effective.
Further, the glue feeding mechanism is arranged on the upper die and/or the lower die.
Further, the glue feeding mechanism comprises at least two first glue feeding holes which are arranged on the upper surface of the upper die at intervals.
The beneficial effect of adopting the further scheme is that: the upper die is convenient to form the first glue inlet hole, and meanwhile, the air exhaust piece is matched to improve the glue sealing uniformity and improve the glue sealing effect.
Further, the first glue inlet hole is in a cup shape or a round hole shape.
The beneficial effect of adopting the further scheme is that: the cup body is of a structure with a large upper opening and a small lower opening, which is beneficial to improving the smoothness of glue injection, relieving the overflow of glue liquor to a certain extent and keeping the sanitation of the working environment.
Further, advance gluey mechanism including offer in the second of last mould side advances gluey hole with offer in the third of last mould side advances gluey hole, when going up the mould with the bed die laminating, the second advance gluey hole with the third advances gluey hole concatenation to be cup-shaped structure.
The beneficial effect of adopting the further scheme is that: the side sealing glue has better visibility, and is beneficial to the sealing operation of personnel.
Further, the device also comprises an exhaust piece arranged on the upper die and/or the lower die.
The beneficial effect of adopting the further scheme is that: the exhaust member can exhaust the gas in the mould, helps to increase the flow of glue solution, and improves the uniformity of sealing glue.
Further, the exhaust part is an exhaust hole or an exhaust valve.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic diagram of the explosion structure of the present invention;
FIG. 3 is a schematic view of an internal structure with a first glue inlet hole;
fig. 4 is a schematic view of the internal structure of the second and third glue inlet holes.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a cover plate; 11. an element recess;
2. a back plate;
3. an upper die; 31. a first mounting groove;
4. a lower die; 41. a second mounting groove;
5. a glue feeding mechanism; 51. a first glue inlet hole; 52. a second glue inlet hole; 53. a third glue inlet hole;
6. an exhaust member;
7. an axial shock absorbing rib;
8. a radial shock absorbing rib;
100. a circuit board; 200. a gap.
Detailed Description
The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be further described with reference to the accompanying drawings 1-4:
in a first mode
The present invention provides a molding compound mold for an underground circuit board, which is combined with fig. 1 to 3, and includes: the device comprises an upper die 3, a lower die 4, a cover plate 1, a back plate 2, a glue feeding mechanism 5 and an exhaust member 6, wherein the lower surface of the cover plate 1 is provided with a plurality of element grooves 11, and the element grooves 11 correspond to components on a circuit board 100 one by one; when the cover plate 1 and the back plate 2 clamp the circuit board 100 at the middle position of the cover plate and the back plate, the element groove 11 covers the component of the circuit board 100, and an expansion gap 200 of 0.2mm is reserved between the inner wall of the element groove 11 and the component;
the lower surface of the upper die 3 is provided with a first mounting groove 31 for placing the cover plate 1; the upper surface of the lower mold 4 is provided with a second mounting groove 41 for placing the backboard 2.
This mode can solve present circuit board 100 when being in the position of work in the pit, stress concentration, the technical problem that appears deformation easily.
In the mode, the circuit board 100 is fixed by the cover plate 1 and the back plate 2 in a magnitude compression mode, a traditional bolt fixing structure is replaced, the cost of a mechanical structure is reduced, and the safety and reliability of the circuit board 100 are improved; meanwhile, a preset expansion gap 200 is reserved between the inner wall of the element groove 11 and the element, so that the stress concentration phenomenon of the circuit board 100 cannot be generated even if the element is deformed to a certain degree due to high temperature, vibration and impact, and the circuit board 100 is effectively protected.
In addition, the cover plate 1 and the back plate 2 are arranged between the upper die 3 and the lower die 4, so that the doping of impurities can be effectively reduced, the expansion or stress change is smaller under the conditions of heating and vibration, and the secondary damage of the circuit board 100 instruments and the like is avoided.
Specifically, the exhaust valve 6 of the present embodiment is an exhaust valve.
It can be understood that the mold of the present invention can be modified in some ways, specifically as follows:
mode two
As shown in fig. 1 to 3, the difference between the second embodiment and the first embodiment is: the upper die 3 and the lower die 4 are both arc-shaped. Set up apron 1, backplate 2 between upper die 3 and bed die 4, can effectively reduce the incorporation of debris for it is littleer to expand or atress change under the condition of being heated, receiving to vibrate, avoids the secondary damage of circuit board 100 instruments etc..
Further, the surface of the upper die 3 is provided with a plurality of axial shock absorption ribs 7 and/or radial shock absorption ribs 8; the surface of the lower die 4 is provided with a plurality of axial shock absorbing ribs 7 and/or radial shock absorbing ribs 8. The shock absorption rib not only can help to increase the shock absorption effect on the surface of the die, but also can enhance the mechanical strength of the die, and is simple and effective.
It will also be appreciated that the form of the glue feeding mechanism 5 of the present embodiment is versatile, and we provide several alternatives below:
further, the upper mold 3 and the lower mold 4 are each provided with an elastic layer on the surface. Specifically, the elastic layer is red glue. Of course, the upper mold 3 and the lower mold 4 may be made of an elastic material.
Mode III
As shown in fig. 3, the third embodiment differs from the first embodiment in that: the glue feeding mechanism 5 comprises two first glue feeding holes 51 which are arranged on the upper surface of the upper die 3 at intervals. Therefore, the upper die 3 is convenient to form the first glue inlet hole 51, and the matching of the air exhaust member 6 can improve the uniformity of the glue sealing and improve the glue sealing effect.
Further, the first glue inlet hole 51 is in a cup shape. The cup body is of a structure with a large upper opening and a small lower opening, which is beneficial to improving the smoothness of glue injection, relieving the overflow of glue liquor to a certain extent and keeping the sanitation of the working environment.
Mode IV
As shown in fig. 4, the fourth embodiment differs from the first embodiment in that: the glue feeding mechanism 5 comprises a second glue feeding hole 52 formed in the side face of the upper die 3 and a third glue feeding hole 53 formed in the side face of the upper die 3, and when the upper die 3 is attached to the lower die 4, the second glue feeding hole 52 and the third glue feeding hole 53 are spliced to form a cup-shaped structure. Therefore, the side sealing glue has better visibility, and is beneficial to the sealing operation of personnel.
The working principle and the steps are as follows:
s1, manufacturing a cover plate 1 and a back plate 2 according to 3D printing, combining the cover plate 1 and the back plate 2, positioning a circuit board 100 between the cover plate 1 and the back plate 2, correspondingly covering components on the circuit board 100 by an element groove 11 of the cover plate 1, and then bonding the edges of the cover plate 1 and the back plate 2 to form a first structure body;
and S2, closing the upper die 3 and the lower die 4, positioning the circuit board 100 between the upper die 3 and the lower die 4, injecting glue through the glue inlet mechanism 5, and baking, solidifying and finishing.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. The utility model provides a glue sealing mold for circuit board in pit which characterized in that, it includes: the circuit board comprises a cover plate (1) and a back plate (2), wherein a plurality of element grooves (11) are formed in the lower surface of the cover plate (1), and the element grooves (11) correspond to elements on the circuit board (100) one by one; when the cover plate (1) and the back plate (2) clamp the circuit board (100) at the middle position of the cover plate and the back plate, the element groove (11) covers the upper part of the element of the circuit board (100), and a preset expansion gap (200) is reserved between the inner wall of the element groove (11) and the element.
2. The sealing compound mold for the downhole circuit board according to claim 1, further comprising an upper mold (3) and a lower mold (4), wherein a first mounting groove (31) for placing the cover plate (1) is formed on the lower surface of the upper mold (3); and a second mounting groove (41) for placing the back plate (2) is formed in the upper surface of the lower die (4).
3. The molding compound mold for downhole circuit board according to claim 2, wherein the upper mold (3) is arc-shaped or rectangular; the lower die (4) is arc-shaped or cuboid-shaped.
4. The molding compound die for downhole circuit boards according to claim 3, wherein the surface of the upper die (3) is provided with a plurality of axial shock absorbing ribs (7) and/or radial shock absorbing ribs (8); the surface of the lower die (4) is provided with a plurality of axial shock absorption ribs (7) and/or radial shock absorption ribs (8).
5. The molding die for sealing an underground circuit board according to any one of claims 1 to 4, further comprising a glue feeding mechanism (5) provided on the upper die (3) and/or the lower die (4).
6. The molding die for sealing a downhole circuit board according to claim 5, wherein the glue feeding mechanism (5) comprises at least two first glue feeding holes (51) spaced apart from each other and arranged on the upper surface of the upper die (3).
7. The molding compound mold for an underground circuit board as claimed in claim 6, wherein the first glue inlet hole (51) is cup-shaped or circular-hole-shaped.
8. The molding compound mold for the downhole circuit board as claimed in claim 5, wherein the glue feeding mechanism (5) comprises a second glue feeding hole (52) formed in a side surface of the upper mold (3) and a third glue feeding hole (53) formed in a side surface of the upper mold (3), and when the upper mold (3) is attached to the lower mold (4), the second glue feeding hole (52) and the third glue feeding hole (53) are spliced to form a cup-shaped structure.
9. The molding die for a downhole circuit board according to any one of claims 1 to 4, further comprising a vent (6) disposed on the upper die (3) and/or the lower die (4).
10. The molding die for an underground circuit board according to claim 9, wherein the vent member (6) is a vent hole or a vent valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120889277.XU CN214687594U (en) | 2021-04-22 | 2021-04-22 | A glue sealing mold for circuit board in pit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120889277.XU CN214687594U (en) | 2021-04-22 | 2021-04-22 | A glue sealing mold for circuit board in pit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214687594U true CN214687594U (en) | 2021-11-12 |
Family
ID=78534296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120889277.XU Active CN214687594U (en) | 2021-04-22 | 2021-04-22 | A glue sealing mold for circuit board in pit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214687594U (en) |
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2021
- 2021-04-22 CN CN202120889277.XU patent/CN214687594U/en active Active
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