CN218163384U

CN218163384U - Exchanger core with embedded heat radiation structure

Info

Publication number: CN218163384U
Application number: CN202221934364.3U
Authority: CN
Inventors: 蔡小林; 陈锦泉; 肖艺伟
Original assignee: Zhangzhou Shanzhong Machinery Equipment Co ltd
Current assignee: Zhangzhou Shanzhong Machinery Equipment Co ltd
Priority date: 2022-07-26
Filing date: 2022-07-26
Publication date: 2022-12-27
Anticipated expiration: 2032-07-26

Abstract

The utility model discloses an interchanger core with embedded heat radiation structure, which comprises a housing and a base plate fixedly connected with the bolt, the bolt fastening has the circuit board on the bottom plate, be provided with the chip on the circuit board, the ventilation hole has been seted up to the even ventilation hole of having seted up of casing both sides outer wall, the even through-hole of having seted up of casing roof, casing both sides inner wall and the sealed laminating in heat dissipation box both ends, and the heat dissipation box both ends all align with the ventilation hole, logical groove has been seted up to heat dissipation box bottom surface, and the top surface and the cooling tube bottom of heat dissipation box are sealed to bond and are linked together, insert in the through-hole on the top of cooling tube, insert rather than the fixed heating panel that bonds in leading to the inslot, the heating panel bottom surface is laminated with the chip top surface mutually, and laminating department coating between them has the silicone grease, heating panel top surface welded connection has the heat conduction post. This interchanger core with embedded heat radiation structure can be continuous take away the heat through producing air cycle, has effectively improved the radiating effect, and the practicality is strong.

Description

Exchanger core with embedded heat radiation structure

Technical Field

The utility model relates to an interchanger technical field specifically is an interchanger core with embedded heat radiation structure.

Background

The exchanger is in long-time operation, the chip on the inside circuit board can generate heat seriously, in order to guarantee the normal operating of exchanger, need dispel the heat to the chip, prior art (CN 212992844U) discloses a chip heat dissipation type ethernet switch, it installs heat-absorbing tube and radiator additional on the chip, come to dispel the heat to the chip, nevertheless because heat-absorbing tube and radiator are located inside the switch, when dispelling the heat, can make the inside temperature of switch rise, and then heat-absorbing tube and radiator heat-conduction effect have been reduced, be unfavorable for the chip to dispel the heat, the practicality is not strong, can not satisfy people's user demand, in view of the defect that exists among the above prior art, it is necessary to improve it further, make it more possess the practicality, just can accord with the in-service use condition.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an interchanger core with embedded heat radiation structure to solve the problem that above-mentioned background art provided.

In order to achieve the above object, the utility model provides a following technical scheme: an exchanger core with an embedded heat dissipation structure comprises a shell and a bottom plate fixedly connected with the shell through bolts, wherein a circuit board is fixed on the bottom plate through bolts, a chip is arranged on the circuit board, ventilation holes are uniformly formed in the outer walls of two sides of the shell, and through holes are uniformly formed in the top wall of the shell;

the inner walls of the two sides of the shell are hermetically attached to the two ends of the heat dissipation box, and the two ends of the heat dissipation box are aligned with the ventilation holes;

the bottom surface of the heat dissipation box is provided with a through groove, the top surface of the heat dissipation box is hermetically bonded and communicated with the bottom end of the heat dissipation pipe, and the top end of the heat dissipation pipe is inserted into the through hole;

a heat dissipation plate fixedly bonded with the through groove is inserted into the through groove, the bottom surface of the heat dissipation plate is attached to the top surface of the chip, and silicone grease is coated at the attachment part of the heat dissipation plate and the chip;

the top surface of the heat dissipation plate is connected with a heat conduction column in a welding mode, the heat conduction column and the heat dissipation plate are both made of copper materials, and the heat conduction column is inserted into the heat dissipation box.

Furthermore, the heat dissipation plate is of a rectangular plate-shaped structure, the side length of the heat dissipation plate is larger than that of the chip, and the heat dissipation plate is located right below the heat dissipation pipe.

Furthermore, heat conduction post length is less than the heat dissipation box height, and heat conduction post and cooling tube are vertical form.

Furthermore, the heat dissipation box is a hollow square structure with two open ends, and is made of plastic material.

Furthermore, the outer diameter of the radiating pipe is consistent with the inner diameter of the through hole, and the radiating pipe is attached to and unfixed with the through hole.

Furthermore, the radiating pipe is sleeved with a fixing ring fixedly bonded with the radiating pipe, the top surface of the fixing ring is fixedly bonded with the inner wall of the casing through a rubber pad, and the rubber pad is in a circular ring shape.

Compared with the prior art, the beneficial effects of the utility model are that: the heat dissipation plate and the heat conduction column can be separated from the interior of the shell through the heat dissipation box, so that the heat of the heat dissipation plate and the heat conduction column can be prevented from being conducted to the interior of the shell, and the heat dissipation effect of the heat dissipation plate and the heat conduction column on the chip is ensured;

the heat on the heat dissipation plate is conducted to the air in the heat dissipation box through the heat conduction column, the air is upwards discharged through the heat dissipation pipe after being heated and expanded, meanwhile, the external air can be fed in through the openings at the two ends of the heat dissipation box, so that air circulation is formed, the heat can be continuously taken away, the heat dissipation effect is effectively improved, and the practicability is high;

meanwhile, the whole heat dissipation structure is arranged in the casing in a built-in mode, so that the size of the equipment cannot be increased, and the use is convenient.

Drawings

FIG. 1 is a schematic view of the interior of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure of the casing and the heat dissipation tube of the present invention;

FIG. 3 is a schematic view of the three-dimensional structure of the heat dissipation case and the heat dissipation plate of the present invention;

fig. 4 is the schematic view of the sectional structure of the heat dissipation tube and the housing of the present invention.

In the figure: 1. a housing; 2. a base plate; 3. a circuit board; 4. a heat dissipation plate; 5. a heat-conducting column; 6. a heat dissipation box; 7. a through groove; 8. a radiating pipe; 9. a vent hole; 10. a through hole; 11. a fixing ring; 12. and (7) a rubber pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: an exchanger core with an embedded heat dissipation structure comprises a machine shell 1 and a bottom plate 2 fixedly connected with the machine shell through bolts, wherein a circuit board 3 is fixed on the bottom plate 2 through bolts, a chip is arranged on the circuit board 3, the inner walls of two sides of the machine shell 1 are in sealing fit with two ends of a heat dissipation box 6, a through groove 7 is formed in the bottom surface of the heat dissipation box 6, a heat dissipation plate 4 fixedly bonded with the through groove 7 is inserted into the through groove 7, the bottom surface of the heat dissipation plate 4 is in fit with the top surface of the chip, silicone grease is coated on the fit position of the heat dissipation plate 4, a heat conduction column 5 is welded to the top surface of the heat dissipation plate 4 and is made of copper materials, the heat dissipation plate 4 is in a rectangular plate-shaped structure, the side length of the heat dissipation plate 4 is larger than that of the chip, the heat dissipation plate 4 is located right below the heat dissipation plate 8, the heat dissipation plate 4 is designed in size, the heat dissipation plate can completely cover the chip, heat on the heat dissipation plate can be quickly conducted to the heat dissipation plate 4, and the heat dissipation plate 4 and the heat dissipation column 5 is designed in material, so that the heat dissipation plate and the heat can be quickly conducted;

the top wall of the casing 1 is uniformly provided with through holes 10, the top surface of the heat dissipation box 6 is hermetically bonded and communicated with the bottom end of the heat dissipation tube 8, the top end of the heat dissipation tube 8 is inserted into the through holes 10, the length of the heat conduction column 5 is smaller than the height of the heat dissipation box 6, the heat conduction column 5 and the heat dissipation tube 8 are vertical, heat on the heat conduction column 5 can be conducted into the heat dissipation box 6, the temperature of air inside the heat dissipation box 6 rises, the air expands after being heated and then flows upwards, so that the air is discharged to the outside through the heat dissipation tube 8, and the heat is guided out;

the outer walls of the two sides of the casing 1 are uniformly provided with the ventilation holes 9, the two ends of the heat dissipation box 6 are aligned with the ventilation holes 9, the heat dissipation box 6 is of a hollow square structure with the two open ends, the heat dissipation box 6 is made of plastic, and the two open ends of the heat dissipation box 6 are designed, so that after hot air in the middle of the heat dissipation box is exhausted, outside air can enter the two ends of the heat dissipation box 6 through the ventilation holes 9 and enter the heat dissipation box 6, and thus the cold and hot air can flow circularly and can continuously exhaust heat, so that the heat dissipation effect is realized, and meanwhile, the heat dissipation box 6 can wrap the heat dissipation plate 4 and the heat conduction column 5, and the heat dissipation effect is prevented from being influenced by dust accumulated on the heat dissipation plate 4 and the heat conduction column 5;

the external diameter of the radiating pipe 8 is consistent with the internal diameter of the through hole 10, and the radiating pipe 8 is not fixed with the through hole 10, the radiating pipe 8 is sleeved with a fixing ring 11 fixedly bonded with the radiating pipe 8, the top surface of the fixing ring 11 is fixedly bonded with the inner wall of the casing 1 through a rubber pad 12, the rubber pad 12 is in a ring shape, because the radiating box 6 is not fixed on the casing 1, the radiating pipe can slide along the inner wall of the casing 1, and further the radiating pipe 8 can vertically move in the through hole 10, and through the rubber pad 12, an elastic movable structure is formed between the radiating pipe 8 and the casing 1, when the radiating pipe is installed, firstly, silicone grease is coated on the surface of the chip, the casing 1 and the bottom plate 2 are clamped and fixed through bolts, when the fixing is performed, the chip is abutted to the radiating plate 4, the radiating plate 4 can be extruded by the chip, the radiating plate 4 and the radiating box 6 are forced to vertically move upwards, the radiating box 6 can drive the radiating pipe 8 to move, the radiating pipe 8 can compress the rubber pad 12 through the fixing ring 11, and further through the elasticity of the rubber pad 12, thereby ensuring that the chip and the radiating plate 4 can be tightly attached to improve the radiating effect.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides an interchanger core with embedded heat radiation structure, includes casing (1) to and rather than bolt fixed connection's bottom plate (2), the bolt fastening has circuit board (3) on bottom plate (2), is provided with chip, its characterized in that on circuit board (3): the outer walls of the two sides of the shell (1) are uniformly provided with vent holes (9), and the top wall of the shell (1) is uniformly provided with through holes (10);

the inner walls of the two sides of the machine shell (1) are hermetically attached to the two ends of the heat dissipation box (6), and the two ends of the heat dissipation box (6) are aligned to the ventilation holes (9);

a through groove (7) is formed in the bottom surface of the heat dissipation box (6), the top surface of the heat dissipation box (6) is hermetically bonded and communicated with the bottom end of the heat dissipation pipe (8), and the top end of the heat dissipation pipe (8) is inserted into the through hole (10);

a heat dissipation plate (4) fixedly bonded with the through groove (7) is inserted into the through groove, the bottom surface of the heat dissipation plate (4) is jointed with the top surface of the chip, and the joint of the heat dissipation plate and the chip is coated with silicone grease;

the top surface of the heat dissipation plate (4) is connected with a heat conduction column (5) in a welding mode, the heat conduction column and the heat dissipation plate are both made of copper materials, and the heat conduction column (5) is inserted into the heat dissipation box (6).

2. The exchanger core with embedded heat dissipation structure of claim 1, wherein: the radiating plate (4) is of a rectangular plate-shaped structure, the side length of the radiating plate is larger than that of the chip, and the radiating plate (4) is located right below the radiating pipe (8).

3. The exchanger core with embedded heat dissipation structure of claim 2, wherein: the length of the heat conduction column (5) is smaller than the height of the heat dissipation box (6), and the heat conduction column (5) and the heat dissipation pipe (8) are vertical.

4. The exchanger core with embedded heat dissipation structure of claim 3, wherein: the heat dissipation box (6) is of a hollow square structure with two open ends, and the heat dissipation box (6) is made of plastic materials.

5. The exchanger core with embedded heat dissipation structure of claim 1, wherein: the outer diameter of the radiating pipe (8) is consistent with the inner diameter of the through hole (10), and the radiating pipe (8) is attached to the through hole (10) and is not fixed.

6. The exchanger core with embedded heat dissipation structure of claim 5, wherein: the radiating pipe (8) is sleeved with a fixing ring (11) fixedly bonded with the radiating pipe, the top surface of the fixing ring (11) is fixedly bonded with the inner wall of the machine shell (1) through a rubber pad (12), and the rubber pad (12) is in a circular ring shape.