CN214664302U - High-power water-cooled semiconductor light-emitting lighting device lamp holder - Google Patents
High-power water-cooled semiconductor light-emitting lighting device lamp holder Download PDFInfo
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- CN214664302U CN214664302U CN202121186979.8U CN202121186979U CN214664302U CN 214664302 U CN214664302 U CN 214664302U CN 202121186979 U CN202121186979 U CN 202121186979U CN 214664302 U CN214664302 U CN 214664302U
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Abstract
The utility model provides a high power water-cooled semiconductor light emitting lighting device lamp holder. The high power water-cooled semiconductor light-emitting lighting device lamp cap comprises: the base is internally provided with a mounting groove; the bottom of the protective outer cover is fixed on the top of the base; the surface of the semiconductor lamp panel is fixedly installed at the top of the base. The utility model provides a high power water-cooled semiconductor lighting device lamp holder has the surface of heat conduction piece and communicates each other with the inside of protective housing, on the one hand can directly transmit the heat on semiconductor lamp plate surface, can absorb the inside heat of protective housing and transmit simultaneously, the heat conduction piece is when carrying out heat transfer, the heat conduction piece passes through the inside of connecting piece and heat exchange piece with heat transmission to circulating pipe, the water-cooling heat dissipation is carried out to the heat of heat exchange piece surface transmission through the water source of circulation flow, accelerate the heat dissipation of high power semiconductor lighting device lamp holder portion.
Description
Technical Field
The utility model relates to a semiconductor lighting technology field especially relates to a high power water-cooled semiconductor lighting device lamp holder that gives out light.
Background
Semiconductor lighting is a new lighting technology, the basic device of the semiconductor lighting is a light emitting diode, the semiconductor solid light emitting device is a semiconductor solid light emitting device, a solid semiconductor chip is used as a light emitting material, excess energy is released through carrier recombination in a semiconductor to cause photon emission, and red, yellow, blue, green, cyan, orange, purple and white light is directly emitted.
When the semiconductor lighting device is used, the lamp cap part is divided into main light-emitting light sources, and the temperature generated in the lamp cap during working is gradually increased, so that the lamp cap part needs to be subjected to timely heat dissipation treatment.
When the existing semiconductor lighting lamp holder radiates heat, the heat radiating metal sheet is mostly adopted for conducting heat, the heat radiating efficiency is determined by natural heat radiation after heat conduction, the heat radiating speed is slow, and the influence of the external environment is easy to influence, so that the heat radiation of the semiconductor lighting lamp holder needs to be improved.
Therefore, it is necessary to provide a high power water-cooled semiconductor light emitting lighting device lamp cap to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high power water-cooled semiconductor lighting device lamp holder has solved the heat dissipation of semiconductor lamp holder and has had the problem that further improves.
In order to solve the above technical problem, the utility model provides a high power water-cooled semiconductor light emitting lighting device lamp holder includes: the base is internally provided with a mounting groove; the bottom of the protective outer cover is fixed on the top of the base; the surface of the semiconductor lamp panel is fixedly arranged at the top of the base; the top end of the heat conducting piece is fixedly arranged on the outer surface of the semiconductor lamp panel, the outer surface of the heat conducting piece is fixedly connected with a connecting piece, and one end of the connecting piece is fixedly connected with a heat exchange piece for water cooling heat exchange; the water tank, the water tank fixed mounting in the inside of mounting groove, the inner wall fixedly connected with drainage pump of water tank, be provided with the circulating pipe on the water tank for the circulation heat transfer at water source.
Preferably, the bottom of heat-conducting piece runs through the surface of base and extends to the inside of mounting groove for the thermal transmission of semiconductor lamp plate.
Preferably, one end of the connector penetrates through the outer surface of the circulation tube and extends to the inside of the circulation tube, and the heat exchange member is located inside the circulation tube.
Preferably, the heat exchange member is a semicircular ring structure, and the outer diameter of the heat exchange member is one half of the inner diameter of the circulation pipe.
Preferably, the output end of the drainage pump is communicated with the input end of the circulating pipe, and the output end of the circulating pipe is communicated with the inside of the water tank and used for circulating flow of a water source.
Preferably, the auxiliary tank has been seted up to the bottom of base, the inner wall fixedly connected with baffle of water tank, the bottom of water tank is provided with the delivery port, the output fixedly connected with cooling tubule of delivery port, the output fixedly connected with backward flow mouth of cooling tubule.
Preferably, the inside of the water tank is divided into a backflow area and a storage area by the partition plate, the input end of the water outlet is communicated with the inside of the backflow area, and the output end of the backflow port is communicated with the inside of the storage area.
Preferably, the cooling tubule is located inside the auxiliary groove, and the surface of the cooling tubule is the same as the outside for natural cooling.
Compared with the prior art, the utility model provides a high power water-cooled semiconductor light emitting lighting device lamp holder has following beneficial effect:
the utility model provides a high power water-cooled semiconductor lighting device lamp holder that gives out light, the surface of heat conduction piece and the inside of protective housing communicate each other, can directly transmit the heat on semiconductor lamp plate surface on the one hand, can absorb the inside heat of protective housing and transmit simultaneously, the heat conduction piece is when carrying out heat transfer, the heat conduction piece passes through the inside of connecting piece and heat exchange piece with heat transmission to circulating pipe, the water-cooling heat dissipation is carried out to the heat of heat exchange piece surface transmission through the water source of circulation flow, accelerate the heat dissipation of high power semiconductor lighting device lamp holder portion.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of a lamp cap of a high power water-cooled semiconductor light-emitting lighting device according to the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is a bottom plan view of the ensemble shown in FIG. 1;
FIG. 4 is a three-dimensional view of the portion of the thermal conductor member shown in FIG. 1;
fig. 5 is a schematic view showing the structure of the outside of the circulation tube shown in fig. 1.
Reference numbers in the figures:
1. a base 11, a mounting groove 12 and an auxiliary groove;
2. a protective outer cover;
3. a semiconductor lamp panel;
4. heat conducting piece, 41, connecting piece, 42, heat exchanging piece;
5. a water tank 51, a drainage pump 52 and a circulating pipe;
6. a partition plate;
7. water outlet, 71, cooling tubule, 72 and reflux port.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5 in combination, wherein fig. 1 is a schematic structural diagram of a preferred embodiment of a lamp cap of a high power water-cooled semiconductor light emitting lighting device according to the present invention; FIG. 2 is an enlarged view of portion A of FIG. 1; FIG. 3 is a bottom plan view of the ensemble shown in FIG. 1; FIG. 4 is a three-dimensional view of the portion of the thermal conductor member shown in FIG. 1; fig. 5 is a schematic view showing the structure of the outside of the circulation tube shown in fig. 1.
Example 1:
a high power water cooled semiconductor light emitting lighting fixture lamp cap comprising: the device comprises a base 1, wherein a mounting groove 11 is formed in the base 1;
the bottom of the protective outer cover 2 is fixed on the top of the base 1;
the surface of the semiconductor lamp panel 3 is fixedly arranged at the top of the base 1;
the top end of the heat conducting piece 4 is fixedly arranged on the outer surface of the semiconductor lamp panel 3, the outer surface of the heat conducting piece 4 is fixedly connected with a connecting piece 41, and one end of the connecting piece 41 is fixedly connected with a heat exchange piece 42 for water cooling heat exchange;
the water tank 5 is fixedly installed inside the installation groove 11, a drainage pump 51 is fixedly connected to the inner wall of the water tank 5, and a circulating pipe 52 is arranged on the water tank 5 and used for circulating heat exchange of a water source.
The protective outer cover 2 is a lampshade with a transparent structure and is used for semiconductor light-emitting illumination.
The surface of the heat conducting piece 4 is communicated with the inside of the protective outer cover 2, so that on one hand, heat on the surface of the semiconductor lamp panel 3 can be directly transferred, and on the other hand, heat in the protective outer cover 2 can be absorbed for transfer;
when the heat conduction member 4 conducts heat transfer, the heat conduction member 4 transmits heat to the inside of the circulation pipe 52 through the connection member 41 and the heat exchange member 42;
a cooling water source is arranged in the water tank 5 in advance, the cooling water source in the water tank 5 is pumped by the drainage pump 51, and the pumped water source is input into the circulating pipe 52 for circulating flow;
when the cooling water source circularly flows in the circulating pipe 52, and when the water source flows through the inside of the circulating pipe 52, the water source contacts with the outer surface of the heat exchanging member 42 and exchanges heat, and the heat exchanged water source flows back to the inside of the water tank 5, thereby ensuring the recycling of the water source.
The bottom of heat-conducting piece 4 runs through the surface of base 1 and extends to the inside of mounting groove 11 for the thermal transmission of semiconductor lamp plate 3.
The surface of the heat-conducting member 4 is located between the inside of the protective cover 2 and the inside of the mounting groove 11, and the heat inside the protective cover 2 is conveniently conveyed to the inside of the mounting groove 11.
One end of the connector 41 penetrates the outer surface of the circulation tube 52 and extends to the inside of the circulation tube 52, and the heat exchange member 42 is located inside the circulation tube 52.
The connecting piece 41 is provided with two layers, each layer has the same structure and is connected to the surface of the heat conducting piece 4, and each layer of the connecting piece 41 corresponds to one heat exchange piece 42.
The heat-conducting member 4, the connecting member 41, and the heat exchanging member 42 are all heat-conducting metals, and are turned over to transmit heat.
The heat exchange member 42 has a semicircular ring structure, and the outer diameter of the heat exchange member 42 is one-half of the inner diameter of the circulation pipe 52.
The surface of the heat exchange member 42 is uniformly distributed inside the circulation pipe 52, and the contact surface of the cooling water source with the surface of the heat exchange member 42 is ensured, thereby facilitating the water-cooling heat exchange of the heat exchange member 42.
The output end of the drainage pump 51 is communicated with the input end of the circulation pipe 52, and the output end of the circulation pipe 52 is communicated with the inside of the water tank 5 for circulating flow of water source.
The drain pump 51 is connected to an external power source when in use.
The utility model provides a theory of operation of high power water-cooled semiconductor luminous lighting device lamp holder as follows:
when the semiconductor lamp panel 3 is used, the drainage pump 51 is started, the drainage pump 51 pumps cooling water in the water tank 5 and conveys the cooling water to the inside of the circulating pipe 52, and the water can flow back to the inside of the water tank 5 after passing through the inside of the circulating pipe 52;
when cooling water source flowed in the inside of circulating pipe 52, heat conduction piece 4 will protect the heat on dustcoat 2 and the surface of semiconductor lamp plate 3 and transmit, and heat conduction piece 4 passes through connecting piece 41 with heat transfer to the inside of heat transfer piece 42, and the heat contacts with cooling water source after passing through heat transfer piece 42, realizes the water-cooling heat transfer for the cooling efficiency of protection dustcoat 2 internal environment.
Compared with the prior art, the utility model provides a high power water-cooled semiconductor light emitting lighting device lamp holder has following beneficial effect:
the surface of heat conduction piece 4 and the inside of protection dustcoat 2 communicate each other, can directly transmit the heat on semiconductor lamp plate 3 surface on the one hand, can absorb the inside heat of protection dustcoat 2 simultaneously and transmit, heat conduction piece 4 is when carrying out heat transfer, heat conduction piece 4 passes through connecting piece 41 and heat transfer 42 with heat transmission to the inside of circulating pipe 52, the water-cooling heat dissipation is carried out to the heat of heat transfer 42 surface transmission through the water source of circulation flow, accelerate the heat dissipation of high power semiconductor luminous lighting device lamp holder portion.
Example 2:
The inside of the water tank 5 is divided into a return area and a storage area by the partition plate 6, the input end of the water outlet 7 is communicated with the inside of the return area, and the output end of the return port 72 is communicated with the inside of the storage area.
The drainage pump 51 is positioned inside the storage area, and the output end of the drainage pump 51 can pump the cooling water source inside the storage area to be conveyed to the inside of the circulating pipe 52;
the output end of the circulating pipe 52 is communicated with the inside of the reflux area, so that a water source after heat exchange conveniently flows back to the inside of the reflux area, the inside of the reflux area is separated from the inside of the storage area through the partition plate 6, and the water temperatures on two sides are not interfered with each other.
The cooling narrow pipe 71 is located inside the auxiliary tank 12, and the surface of the cooling narrow pipe 71 is the same as the outside for natural cooling.
The inside heat transfer water source that flows into the backward flow district flows in the inside of cooling tubule 71 through delivery port 7, and the inside and external intercommunication of auxiliary tank 12 are passed through to the surface of cooling tubule 71 for cooling tubule 71 carries out natural cooling to the heat transfer water source of input and external environment, accelerates the cooling efficiency at heat transfer back water source, and water when for the heat transfer of cooling water source steadily provides stable guarantee, thereby ensures water-cooling continuation.
Has the advantages that:
adopt baffle 6 to separate the inside space of water tank 5, avoid heat transfer and rising cooling water source's temperature between cooling water source and the backward flow water source, the backward flow water source passes through cooling tubule 71 and external air heat transfer simultaneously for can flow the natural cooling of water source after the heat transfer, provide the guarantee for the continuation operation of equipment.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (8)
1. A high-power water-cooled semiconductor light-emitting lighting device lamp cap is characterized by comprising:
the base is internally provided with a mounting groove;
the bottom of the protective outer cover is fixed on the top of the base;
the surface of the semiconductor lamp panel is fixedly arranged at the top of the base;
the top end of the heat conducting piece is fixedly arranged on the outer surface of the semiconductor lamp panel, the outer surface of the heat conducting piece is fixedly connected with a connecting piece, and one end of the connecting piece is fixedly connected with a heat exchange piece for water cooling heat exchange;
the water tank, the water tank fixed mounting in the inside of mounting groove, the inner wall fixedly connected with drainage pump of water tank, be provided with the circulating pipe on the water tank for the circulation heat transfer at water source.
2. The high power water-cooled semiconductor light emitting lighting device lamp holder according to claim 1, wherein the bottom end of the heat conducting member penetrates through the surface of the base and extends to the inside of the mounting groove for heat transfer of the semiconductor lamp panel.
3. The high power water-cooled semiconductor light emitting lighting device lamp holder according to claim 1, wherein one end of the connecting member penetrates through the outer surface of the circulation tube and extends to the inside of the circulation tube, and the heat exchanging member is located inside the circulation tube.
4. The high power water-cooled semiconductor light emitting lighting device lamp holder according to claim 1, wherein the heat exchanging member is a semicircular ring structure, and an outer diameter of the heat exchanging member is one half of an inner diameter of the circulation pipe.
5. The high power water-cooled semiconductor light emitting lighting device lamp holder according to claim 1, wherein an output end of the drainage pump is communicated with an input end of the circulation pipe, and an output end of the circulation pipe is communicated with the inside of the water tank for circulating flow of a water source.
6. The lamp holder of the high power water-cooled semiconductor light-emitting lighting device according to claim 1, wherein an auxiliary groove is formed at the bottom of the base, a partition plate is fixedly connected to the inner wall of the water tank, a water outlet is formed at the bottom of the water tank, a cooling tubule is fixedly connected to the output end of the water outlet, and a backflow port is fixedly connected to the output end of the cooling tubule.
7. The high power water-cooled semiconductor light emitting lighting device lamp holder according to claim 6, wherein the partition plate partitions the inside of the water tank into a backflow region and a storage region, the input end of the water outlet is communicated with the inside of the backflow region, and the output end of the backflow port is communicated with the inside of the storage region.
8. The high power water-cooled semiconductor light emitting lighting device lamp holder according to claim 6, wherein the cooling tubule is located inside the auxiliary groove, and the surface of the cooling tubule is the same as the outside for natural cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121186979.8U CN214664302U (en) | 2021-05-31 | 2021-05-31 | High-power water-cooled semiconductor light-emitting lighting device lamp holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121186979.8U CN214664302U (en) | 2021-05-31 | 2021-05-31 | High-power water-cooled semiconductor light-emitting lighting device lamp holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214664302U true CN214664302U (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121186979.8U Active CN214664302U (en) | 2021-05-31 | 2021-05-31 | High-power water-cooled semiconductor light-emitting lighting device lamp holder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214664302U (en) |
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2021
- 2021-05-31 CN CN202121186979.8U patent/CN214664302U/en active Active
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