CN214655322U - Reflow tank, matching structure and electroplating production line - Google Patents

Abstract

The utility model relates to an electroplate technical field, specifically disclose a backwash tank, cooperation structure and electroplating production line, wherein the backwash tank includes: the device comprises a groove body, wherein a first plate is arranged in the groove body to divide an inner cavity of the groove body into a first backflow cavity and a plate passing channel which are arranged side by side, two ends of the plate passing channel along the length direction penetrate through two opposite side walls of the groove body, and a first inlet and a first outlet are correspondingly formed in the two side walls of the groove body respectively to allow a workpiece to pass through the plate passing channel. This first board separates the inner chamber of cell body into the first return flow chamber side by side and crosses the board passageway, and should cross two lateral walls that relative set up on the cell body are run through to first import and the first export of board passageway, when the work piece from last process entered into the board passageway, can enter into along first import and cross the board passageway in to export from first export and cross the board passageway, at the in-process of carrying, the work piece can be level and smooth crossing the interior transport of board passageway, has reduced the percentage of damage of work piece.

Description

Reflow tank, matching structure and electroplating production line

Technical Field

The utility model relates to an electroplate technical field, concretely relates to backward flow groove, cooperation structure and electroplating production line.

Background

Electroplating refers to the electrolytic reaction in a solution under the action of external direct current so as to deposit a metal or alloy layer on the surface of an electric conductor. In the plating, an anode of an electrode is electrically connected to a plating solution, and a cathode of the electrode is connected to a work piece having electrical conductivity. When the current is conducted, the positively charged cations in the solution move toward the cathode of the circuit, and are reduced on the surface of the workpiece to be processed, thereby forming a plating layer covering the surface of the workpiece to be processed.

In order to keep the liquid level in the plating bath in a height range among the electroplating production line among the prior art, can set up the backward flow groove in the export or import department of plating bath, this backward flow groove sets up with the sealed intercommunication of plating bath, the velocity of flow of solution entering into the backward flow groove in order to avoid the plating bath is too fast, lead to the liquid level decline in the plating bath fast, can not satisfy the condition that the liquid level requirement of plating solution, can set up two at least relative contact and rolling deflector roll relatively in the import department of the cell body of backward flow groove, because the deflector roll contact of two relative settings, the width of the flow path of solution has been reduced, make the velocity of flow that solution can enter into the backward flow groove slow down, and then can slow down the liquid level decline speed in the plating bath.

However, the workpiece needs to pass through between the two guide rollers to enter the next process, when the workpiece passes through between the two guide rollers, the workpiece is subjected to extrusion forces of the two guide rollers towards the workpiece, the extrusion forces can damage the workpiece, so that the workpiece is broken, especially when the electroplated workpiece is a silicon wafer, due to the fact that the silicon wafer is made of a thin material, after the silicon wafer enters between the two oppositely arranged guide rollers, the two guide rollers can extrude the silicon wafer, the silicon wafer is broken, the electroplating effect of the workpiece is affected, and the electroplating yield of an electroplating production line is reduced.

SUMMERY OF THE UTILITY MODEL

Therefore, the to-be-solved technical problem of the utility model lies in overcoming prior art, when electroplating the work piece, the work piece is extruded by the deflector roll in the backwash channel and is leaded to the breakage, influences the electroplating effect of work piece, has reduced electroplating production line's electroplating yield's defect to a backwash channel, cooperation structure and electroplating production line are provided.

A reflow tank, comprising: the device comprises a tank body, wherein a first plate is arranged in the tank body to divide an inner cavity of the tank body into a first backflow cavity and a plate passing channel which are arranged side by side, two ends of the plate passing channel along the length direction penetrate through two opposite side walls of the tank body, and a first inlet and a first outlet are formed in the two side walls of the tank body correspondingly and respectively for a workpiece to pass through the plate passing channel;

the first plate is provided with at least one first liquid passing port so as to communicate the plate passing channel with the first backflow cavity.

Optionally, the reflow tank further includes a second plate disposed in the tank body, the second plate and the first plate are distributed oppositely, the plate passing channel is formed between the first plate and the second plate, a second reflow chamber is defined between the second plate and the tank body, and the second reflow chamber and the first reflow chamber are distributed side by side on two sides of the plate passing channel;

and at least one second liquid passing port is formed in the second plate so as to communicate the plate passing channel with the second backflow cavity.

Optionally, in the backflow groove, at least one flow blocking element is disposed in the first backflow cavity and/or the second backflow cavity, the flow blocking element divides the backflow cavity into at least two branch cavities, the first plate or the second plate corresponding to the branch cavities is provided with at least two liquid passing ports, and each branch cavity corresponds to at least one liquid passing port.

Optionally, in the backflow groove, the liquid passing port close to the first inlet is higher than the liquid passing port close to the first outlet in two adjacent branch cavities.

Optionally, in the above-mentioned backflow groove, the flow blocking member is a plate.

Optionally, in the reflow groove, the board passing channel includes a first channel located below and a second channel located above, and a width of the first channel is smaller than a width of the second channel.

Optionally, in the backflow groove, the bottom of the first channel is connected to the top of the second channel through a transition channel inclined from top to bottom.

Optionally, in the reflux tank, a reflux port is arranged on a side wall where the first inlet or the first outlet of the reflux tank is located;

the backflow ports are located below the first inlet or the first outlet corresponding to the backflow ports.

A matching structure of a reflux groove and an electroplating groove comprises at least one electroplating groove and an electroplating cavity; at least one reflux groove is arranged at two ends of each electroplating bath, the reflux grooves are as above, and the plate passing channel of any reflux groove is communicated with the electroplating cavity of the electroplating bath in a sealing way.

Optionally, the above-mentioned matching structure of the reflow tank and the electroplating tank further includes a spraying mechanism provided in each of the electroplating tanks, where the spraying mechanism is configured to spray a solution into the respective corresponding tank, so that the solution in each tank is in a flowing state; and the two ends of the circulating mechanism are connected with the electroplating cavity and the spraying mechanism.

An electroplating production line comprises

At least one reflux groove and a matching structure of the electroplating bath; and the conveying mechanism is used for driving the workpiece to vertically extend and horizontally move so as to pass through the reflux groove and the electroplating groove in the matching structure.

Optionally, the electroplating production line further comprises a rack, the rack is provided with a feeding area, at least one electroplating area and a discharging area, and at least one matching structure is arranged in each electroplating area;

conveying mechanism establishes in the frame, and span material loading district, electroplating district and unloading district, conveying mechanism is unsettled in the top of electroplating district, and be used for the work piece that the drive is waited to electroplate along vertical through material loading district, pass in proper order at least electroplating district and unloading district.

Optionally, in the electroplating production line, the frame further has at least one processing area;

the processing area is positioned between the feeding area and the electroplating area, or the processing area is positioned between the electroplating area and the blanking area; or the processing area is positioned between two adjacent electroplating areas;

the device also comprises a processing structure correspondingly arranged in the processing area, wherein the processing structure comprises a processing groove communicated with the reflux groove in any matching structure.

Optionally, the electroplating production line further comprises at least one transition groove, and the reflow groove of any matching structure is in sealed communication with the treatment groove of the treatment structure through the transition groove, so that the workpiece can pass through the transition groove along with the driving of the conveying mechanism;

and the two ends of the transition groove are respectively provided with a first communicating port and a second communicating port, and the bottom of the first communicating port or the second communicating port close to the return groove is higher than the height of the return opening of the return groove.

Optionally, in the electroplating production line, at least one of the processing areas is a cleaning area, the processing structure is a cleaning structure, and the processing tank is a cleaning tank.

Optionally, in the electroplating production line, at least one processing area is disposed in the electroplating area and the blanking area, the processing structure is a drying structure, and the processing tank is a drying tank.

Optionally, in the electroplating production line, the conveying mechanism includes a driving wheel, a driven wheel, and a conveying belt wound around the driving wheel and the driven wheel in a closed loop; and the jig is fixed on the conveying belt and used for clamping a workpiece.

Optionally, in the electroplating production line, the conveying mechanism further includes a guide member disposed on the frame and extending horizontally between the feeding area and the discharging area;

a first roller and a second roller which can be arranged on the guide part in a rolling way are arranged on the inner wall of the conveying belt, and a first groove and a second groove for rolling in or out of any first roller and any second roller are arranged on the outer peripheral walls of the driving wheel and the driven wheel;

the first groove and the second groove are arc-shaped grooves with flaring.

Optionally, in the electroplating production line, the conveyor belt includes at least three layers of structures, namely an inner layer, an intermediate layer and an outer layer stacked from inside to outside, wherein the three layers of structures are fixedly connected by the first roller and the second roller, and the jig is located between the inner layer and the intermediate layer.

The utility model discloses technical scheme has following advantage:

1. the utility model provides a pair of reflux groove, include: the device comprises a tank body, wherein a first plate is arranged in the tank body to divide an inner cavity of the tank body into a first backflow cavity and a plate passing channel which are arranged side by side, two ends of the plate passing channel along the length direction penetrate through two opposite side walls of the tank body, and a first inlet and a first outlet are formed in the two side walls of the tank body correspondingly and respectively for a workpiece to pass through the plate passing channel; the first plate is provided with at least one first liquid passing port so as to communicate the plate passing channel with the first backflow cavity.

In the reflux groove with the structure, the first plate is arranged in the groove body, the inner cavity of the groove body is divided into the first reflux cavity and the plate passing channel which are arranged side by the first plate, the first inlet and the first outlet of the plate passing channel penetrate through the two side walls which are oppositely arranged on the groove body, when a workpiece enters the plate passing channel from the previous procedure, the workpiece can enter the plate passing channel along the first inlet and can be output from the first outlet to the plate passing channel, the workpiece can be smoothly conveyed in the plate passing channel in the conveying process, the reflux groove in the prior art is overcome, when the workpiece passes between the two oppositely arranged and contacted guide rollers in the reflux groove, the workpiece can be subjected to extrusion force of the two guide rollers towards the workpiece, the extrusion force can damage the workpiece, so that the workpiece is crushed, the crushing rate of the workpiece is reduced, particularly, certain relatively thin workpieces such as silicon wafers are particularly, and the effect that the workpiece can be stably and safely conveyed from the reflux groove is realized, the problem of the electroplating effect that influences the work piece because the work piece is broken is reduced, the electroplating yield of electroplating production line has been improved, and in electroplating process, the solution that flows into in the board passageway also can enter into first backward flow chamber along first liquid mouth of crossing, can not be detained in crossing the board passageway, and the solution in the first backward flow intracavity also can be circulated back simultaneously and flow back in the corresponding plating bath, has kept the liquid level in the plating bath to be in certain height all the time, can recycle to solution.

2. The utility model provides an among the backwash tank first reflux cavity and/or be equipped with at least one choked flow spare in the second reflux cavity, at least two branch cavitys are separated into with the reflux cavity at place separately to the choked flow spare, it corresponds to prop up the cavity be equipped with two at least liquid mouths, every of crossing on first board or the second board it passes the liquid mouth to prop up the cavity correspondence at least one. In the reflux groove with the structure, the flow blocking parts are correspondingly arranged in the first reflux cavity and the second reflux cavity, the flow blocking parts divide the corresponding reflux cavity into at least two branch cavities, at least one liquid passing port is correspondingly arranged in each branch cavity, when a solution flows into the branch cavity from the plate passing channel along the liquid passing port, the solution is poured into the corresponding branch cavity from the position of the liquid passing port in a semi-parabolic shape (or waterfall shape), when the solution collides with the flow blocking parts, the solution flows down along the plate surface of the flow blocking parts under the blocking of the flow blocking parts, according to the principle of the gravity acceleration of an object, the instantaneous speed of the fluid which is poured into the branch cavity under the blocking of the flow blocking parts is less than the instantaneous speed of the fluid which is directly poured into the bottom of the corresponding reflux cavity, so that the solution cannot generate sputtering when the solution is poured into the plate surface of the flow blocking parts and flows down into the corresponding branch cavities along the plate surface, and the impact force of the solution can be effectively reduced, and simultaneously reduces the amount of bubbles generated by the solution.

3. The utility model provides an among the backwash tank, cross the board passageway including the first passageway that is located the below and the second passageway that is located the top, the width of first passageway is less than the width of second passageway. In the reflow channel of this structure, through the width that is less than the second passageway with the width setting of first passageway, on the basis of guaranteeing that work piece and tool homoenergetic are stable to pass first passageway and second passageway, less with the setting of first passageway, can reduce the solution along with the work piece flow in the passageway width of crossing in the board passageway, and then can reduce along crossing the solution mouth from crossing the solution volume that the board passageway entered into the backward flow intracavity, realized reducing the effect of the high decline speed of solution in the plating bath.

4. The utility model provides a matching structure of a reflux tank and an electroplating bath, which comprises at least one electroplating bath and an electroplating cavity; at least one reflux groove is arranged at two ends of each electroplating bath, the reflux grooves are as above, and the plate passing channel of any reflux groove is communicated with the electroplating cavity of the electroplating bath in a sealing way. In the cooperation structure of this structure, through the sealed intercommunication setting of the board passageway of crossing with the electroplating chamber of plating bath and backwash tank, through setting up backwash tank and plating bath cooperation, can be with the solution recirculation in the backwash tank to the electroplating chamber of plating bath, keep the liquid level height of electroplating the intracavity.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of an overall structure of an electroplating line according to a third embodiment of the present invention;

FIG. 2 is a schematic view of a connecting structure between a driving wheel and a conveying belt in the conveying mechanism shown in FIG. 1;

FIG. 3 is a schematic view of the connection structure of the conveyor belt and the jig and the guiding member shown in FIG. 2;

fig. 4 is a schematic view of the overall position structure of the conveyor belt and the jig and the guiding component shown in fig. 3;

FIG. 5 is a schematic view of a connection structure of a transition tank and a reflux tank;

FIG. 6 is a schematic diagram of the position structure of the first channel and the second channel;

fig. 7 is a schematic structural view of the position of the spoiler and the first and second plates according to the first embodiment of the present invention;

FIG. 8 is a schematic structural diagram of the positions of the first liquid passing port and the second liquid passing port in FIG. 7;

FIG. 9 is a schematic view of the position structure of the first outlet;

fig. 10 is a schematic overall structure diagram of a fitting structure according to a second embodiment of the present invention.

Description of reference numerals:

1-a reflux tank; 2-a groove body; 3-a first plate; 4-a first reflow chamber; 5-passing plate channel; 6-a first inlet; 7-a first outlet; 8-a first liquid passing port; 9-a second plate; 10-a second reflow chamber; 11-a second liquid passing port; 12-a flow blocker; 13-a first channel; 14-a second channel; 15-reflux port; 16-an electroplating bath; 17-a frame; 18-a feeding zone; 19-a plating area; 20-a blanking area; 22-a transition groove; 23-a first communication port; 24-a second communication port; 25-a driving wheel; 26-a driven wheel; 27-a conveyor belt; 28-a jig; 29-a guide member; 30-a first roller; 31-a second roller; 32-a first groove; 33-a second groove; 34-a washing area; 35-drying zone.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Fig. 1 to 10 show an embodiment of a reflow tank, a matching structure and an electroplating production line provided by the present invention.

Example 1

The embodiment describes a reflow channel 1, and referring to fig. 5 to 9, the reflow channel 1 includes a channel body 2 and a first plate 3, the first plate 3 is disposed in the channel body 2, and divides an inner cavity of the channel body 2 into a first reflow chamber 4 and a through plate channel 5 which are parallel to each other, wherein two ends of the through half channel along a length direction thereof penetrate through two side walls of the channel body 2 which are oppositely disposed, and the through plate channel 5 correspondingly forms a first inlet 6 and a first outlet 7 after correspondingly connecting to the two side walls of the channel body 2, so that a workpiece passes through the through plate channel 5, that is, the workpiece enters the through plate channel 5 along the first inlet 6, and is conveyed to the first outlet 7 in the through plate channel 5, thereby completing an effect of passing through the reflow channel 1.

In the reflux groove 1 with the structure, the first plate 3 is arranged in the groove body 2, the inner cavity of the groove body 2 is divided into the first reflux cavity 4 and the plate passing channel 5 which are arranged side by the first plate 3, the first inlet 6 and the first outlet 7 of the plate passing channel 5 penetrate through the two side walls which are oppositely arranged on the groove body 2, when a workpiece enters the plate passing channel 5 from the previous process, the workpiece can enter the plate passing channel 5 along the first inlet 6 and is output from the first outlet 7 to the plate passing channel 5, the workpiece can be smoothly conveyed in the plate passing channel 5 in the conveying process, the defect that the workpiece is crushed due to the extrusion force of the two oppositely arranged and contacted guide rollers in the reflux groove 1 can be overcome by the reflux groove 1 in the prior art, the extrusion force of the two guide rollers towards the workpiece can be applied to damage the workpiece, and the crushing rate of the workpiece can be reduced, particularly, the relatively thin workpieces such as silicon wafers achieve the effect that the workpieces can be stably and safely conveyed from the reflow groove 1, the problem that the electroplating effect of the workpieces is influenced due to the broken workpieces is solved, and the electroplating yield of an electroplating production line is improved.

Specifically, in order to complete the communication between the plate passing channel 5 and the first reflow chamber 4, so as to achieve the purpose that when a workpiece is conveyed from the material passing channel, the workpiece brings a solution into the plate passing channel 5, and then the solution can be recirculated and returned into the corresponding electroplating bath 16 from the reflow tank 1, the first plate 3 is provided with the first liquid passing port 8, the number of the first liquid passing ports 8 is set to be at least one, and also can be set to be two, the specific number is set according to the actual application, in the electroplating process, the solution flowing into the plate passing channel 5 can enter the first reflow chamber 4 along the first liquid passing port 8, and cannot be retained in the plate passing channel 5, meanwhile, the solution in the first reflow chamber 4 can also be recirculated and returned into the corresponding electroplating bath 16, so that the liquid level in the electroplating bath 16 can be always at a certain height, and the solution can be recycled.

In this embodiment, the tank body 2 of the reflow tank 1 is further provided with a second plate 9, the second plate 9 is disposed opposite to the first plate 3, the plate passing channel 5 is formed between the first plate 3 and the second plate 9, so that a workpiece can pass through the plate passing channel 5 formed by the first plate 3 and the second plate 9, after the first plate 3 and the second plate 9 are disposed opposite, the first inlet 6 and the first outlet 7 are respectively located at two ends of the plate passing channel 5, wherein a second reflow chamber 10 is formed between the second plate 9 and the tank body 2, the second reflow chamber 10 and the first reflow chamber 4 are disposed side by side at two sides of the plate passing channel 5, the second plate 9 is provided with a second liquid passing port 11, the second liquid passing port 11 connects the plate passing channel 5 and the second reflow chamber 10, during electroplating, a solution flowing into the plate passing channel 5 can enter the second reflow chamber 10 along the second liquid passing port 11, can not detain in crossing board passageway 5, solution in the second backward flow chamber 10 also can recycle the backward flow in corresponding plating bath 16 simultaneously, has kept the liquid level in the plating bath 16 to be in certain height all the time, can recycle to solution, adds the second on the basis of first liquid mouth 8 of crossing and crosses liquid mouth 11, and two liquid mouths of crossing cooperate the use, can improve the speed that solution entered into corresponding backward flow intracavity.

In this embodiment, in order to prevent the solution from sputtering in the first reflow chamber 4 and the second reflow chamber 10 after the solution enters the corresponding first reflow chamber 4 and the corresponding second reflow chamber 10 along the first liquid passing port 8 and the second liquid passing port 11, at least one flow blocking member 12 may be disposed in at least one reflow chamber of the first reflow chamber 4 and the second reflow chamber 10, the flow blocking member 12 may divide the corresponding reflow chamber into at least two branch chambers, and at least two liquid passing ports are disposed on the first plate 3 and the second plate 9 corresponding to the branch chambers, so as to correspond to the at least one liquid passing port in each branch chamber.

Referring to fig. 7 and 8, two flow blocking elements 12 may be respectively and correspondingly disposed in the first backflow cavity 4 and the second backflow cavity 10, the first backflow cavity 4 and the second backflow cavity 10 are respectively and correspondingly divided into three branch cavities by the two flow blocking elements 12 corresponding to the first backflow cavity 4 and the second backflow cavity 10, a first liquid passing port 8 is disposed on the first plate 3 corresponding to each branch cavity, and a second liquid passing port 11 is disposed on the second plate 9, of course, two or three first liquid passing ports 8 and three second liquid passing ports 11 may be disposed on the first plate 3 and the second plate 9 corresponding to each branch cavity, the number of the first liquid passing ports 8 and the number of the second liquid passing ports 11 may be the same or different, the specific number may be set according to actual needs, and the flow blocking elements 12 may be set as plates.

By correspondingly arranging the choker 12 in the first backflow cavity 4 and the second backflow cavity 10, the choker 12 divides the corresponding backflow cavity into at least two branch cavities, at least one liquid passing port is correspondingly arranged in each branch cavity, when a solution flows into the branch cavity from the plate passing channel 5 along the liquid passing port, the solution is poured into the corresponding branch cavity from the liquid passing port in a semi-parabolic shape (or a waterfall shape), when the solution collides with the choker 12, the solution flows down along the plate surface of the choker 12 under the blocking of the choker 12, according to the principle of the gravity acceleration of an object, the instantaneous speed of the fluid which is poured into the branch cavity under the blocking of the choker 12 is less than the instantaneous speed which is directly poured into the bottom of the corresponding backflow cavity, so that sputtering cannot be generated when the solution is poured into the plate surface of the choker 12 and flows down into the corresponding branch cavity along the plate surface, and the impact force applied to the solution can be effectively reduced, and simultaneously reduces the amount of bubbles generated by the solution.

When the liquid passing ports are specifically arranged, the liquid passing ports of the two adjacent branch cavities are arranged higher than the liquid passing ports close to the first outlet 7, namely, in the embodiment, when the number of the flow blocking pieces 12 is two, the heights of the liquid passing ports arranged on the first plate 3 and the second plate 9 correspond to each other, and the heights of the liquid passing ports from the first inlet 6 to the first outlet 7 are arranged in a descending manner.

In this embodiment, the plate passing channel 5 includes a first channel 13 located below and a second channel 14 located above, wherein the width of the first channel 13 is set to be smaller than the width of the second channel 14, in the reflow tank 1 of this structure, the jig 28 passes through the second channel 14, the workpiece passes through the first channel 13, and the width of the first channel 13 is set to be smaller than the width of the second channel 14, on the basis of ensuring that both the workpiece and the jig 28 can stably pass through the first channel 13 and the second channel 14, the first channel 13 is set to be smaller, which can reduce the channel width of the solution flowing into the plate passing channel 5 along with the workpiece, and further can reduce the amount of the solution entering the reflow chamber from the plate passing channel 5 along the liquid passing port, thereby achieving the effect of reducing the descending speed of the height of the solution in the plating tank 16.

Specifically, the bottom of the first channel 13 is connected with the top of the second channel 14 through a transition channel inclined from top to bottom, and the first channel 13 is provided with a guide surface corresponding to the position of the first inlet 6, so that the workpiece can smoothly enter the through-plate channel 5 along the guide surface.

In this embodiment, in order to prevent the solution in the reflow tank 1 from flowing out from the first inlet 6 or the first outlet 7 and then entering the processing tank communicated with the reflow tank 1 when the workpiece enters or is output from the reflow tank 1, the reflow port 15 is provided on the side wall of the reflow tank 1 where the first inlet 6 is located or the side wall of the first outlet 7 is located, the reflow port 15 is located below the corresponding first outlet 7 or the corresponding first inlet 6, the reflow port 15 is provided in a shape of a long waist hole, and the solution flowing out from the first inlet 6 or the first outlet 7 can flow out along the reflow port 15 and cannot enter the processing tank.

Example 2:

the embodiment describes a matching structure with a reflux groove 1 and an electroplating bath 16, the matching structure comprises at least one electroplating bath 16, the electroplating bath 16 is provided with an electroplating cavity, at least one reflux groove 1 is arranged at two ends of each electroplating bath 16, the reflux groove 1 is the reflux groove 1 as described in the embodiment 1, the plate passing channel 5 of the reflux groove 1 can be in sealed communication with the electroplating cavity of the electroplating bath 16, the reflux groove 1 and the electroplating bath 16 are matched, the solution in the reflux groove 1 can be recycled to the electroplating cavity of the electroplating bath 16, the liquid level height in the electroplating cavity is maintained, and the electroplating effect of a workpiece in the electroplating bath 16 can be further ensured.

Referring to fig. 10, the number of the plating baths 16 may be two, one reflow bath 1 is disposed on each of two sides of each plating bath 16, the plate passing channel 5 of the reflow bath 1 is in sealed communication with the plating chamber, wherein the feed end of each plating bath 16 is in communication with the first outlet 7 of the reflow bath 1, and the discharge end of the plating bath 16 is in communication with the first inlet 6 of the reflow bath 1, so that the workpieces can be stably transported when entering and exiting the plating bath 16.

In this embodiment, each electroplating tank 16 is provided with a spraying mechanism (not shown in the drawings), and the spraying mechanism is configured to spray a solution into the respective electroplating tank 16, so that the solution in each electroplating tank 16 is in a flowing state, and a problem of poor electroplating effect of the workpiece due to a deposition phenomenon of the solution is avoided.

In order to be able to carry out the circulation flow to solution, still communicate circulation mechanism between every electroplating chamber and spraying mechanism, this circulation mechanism can be for conveying line, set up the pump body on conveying line, this conveying line's one end is connected with the bottom in electroplating chamber, the other end and the shower intercommunication that sprays the mechanism, spray on the work piece from the shower when solution, and flow down the electroplating intracavity back along the face of work piece, under the effect of the pump body, the solution of electroplating intracavity can enter into again along conveying line and spray the work piece in the shower that sprays the mechanism, can make solution be in the state that the circulation flows, avoid solution to take place the deposit and lead to electroplating the effect poor.

Specifically, can also set up the filter on circulation mechanism's the pipeline, can filter the impurity in the solution, avoid impurity to pollute the face of work piece.

Example 3:

the present embodiment describes an electroplating production line, referring to fig. 1 to 10, the electroplating production line comprises at least one reflow tank 1 and a plating tank 16 matching structure described in embodiment 2, and further comprises a frame 17 and a conveying mechanism arranged on the frame 17, the conveying mechanism is used for driving a workpiece to move in a vertical extending and horizontal direction to pass through the reflow tank 1 and the plating tank 16 in the matching structure, the frame 17 is provided with a loading area 18 and a blanking area 20 and at least one plating area 19 located between the loading area 18 and the blanking area 20, at least one matching structure is arranged in each plating area 19, the workpiece is completely loaded in the loading area 18, and then enters the plating area 19 to be subjected to a plating treatment under the driving of the conveying mechanism, and then is output from the plating area 19 to the blanking area 20.

Specifically, after the conveying mechanism is arranged on the frame 17, the conveying mechanism stretches across the feeding area 18, all the electroplating areas 19 and the blanking area 20, and is arranged above the electroplating areas 19 in a suspended manner, so that the workpiece to be electroplated is driven to vertically pass through the feeding area 18 and at least sequentially pass through the electroplating areas 19 and the blanking area 20.

Wherein the conveying mechanism comprises a driving wheel 25, a driven wheel 26 and a conveying belt 27 wound on the driving wheel 25 and the driven wheel 26 in a closed loop, the driving wheel 25 is connected with an output shaft of a driving motor to drive the driving wheel 25 to rotate, the inner wall surface of the conveying belt 27 can be jointed with the outer wall surfaces of the driving wheel 25 and the driven wheel 26, thereby realizing that the conveyer belt 27 can carry out reciprocating conveying motion under the self-rotation driving of the driving wheel 25 and the driven wheel 26, a jig 28 is fixed to the conveyor belt 27, and is used for holding a workpiece, and after the workpiece is held by the jig 28, the conveyer belt 27 performs reciprocating conveying movement between the driving wheel 25 and the driven wheel 26, drives the jigs 28 to move among the feeding area 18, all the electroplating areas 19 and the blanking area 20, this further achieves the effect of enabling the work to be conveyed between the loading zone 18, all of the plating zones 19, and the unloading zone 20.

Specifically, the distance of following the relative action wheel 25 of driving wheel 26 can be adjusted, the effect of adjusting the tensioning of conveyer belt 27 is realized, can be with following driving wheel 26 in frame 17 go on adjusting, with the effect of realizing action wheel 25 and the distance adjustment from driving wheel 26, for example, be connected hydraulic telescoping rod with follow driving wheel 26, the flexible end of telescopic link can be after stretching out can with frame 17 butt, the stiff end is fixed with from driving wheel 26, can adjust the distance of following the relative action wheel 25 of driving wheel 26 at the reciprocal flexible in-process of the flexible section of telescopic link.

In this embodiment, the conveying mechanism further includes a guiding member 29, the guiding member 29 is disposed on the frame 17 and horizontally extends between the feeding area 18 and the discharging area 20, the guiding member 29 may be a guiding plate vertically disposed between the feeding area 18 and the discharging area 20, a first roller 30 and a second roller 31 are disposed on an inner wall of the conveying belt 27 and rollably disposed on the guiding member 29, that is, the first roller 30 and the second roller 31 are mounted on upper and lower sides of the guiding plate, when the conveying belt 27 performs conveying motion between the feeding area 18 and the discharging area 20, the first roller 30 and the second roller 31 also move along the guiding plate, so as to avoid a situation that the whole structure of the conveying belt 27 is skewed when the conveying belt 27 carries the jig 28 and the workpiece;

specifically, referring to fig. 2, a first groove 32 and a second groove 33 for allowing any one of the first roller 30 and the second roller 31 to roll in or out may be further disposed on the outer peripheral wall of the driving wheel 25 and the driven wheel 26, the first groove 32 and the second groove 33 are arc-shaped grooves with flaring openings, when the first roller 30 and the second roller 31 on the conveying belt 27 move to the feeding area 18 and the discharging area 20 and turn, smooth turning transition can be performed, the first roller 30 is disposed corresponding to the first groove 32, and the second roller 31 is disposed corresponding to the second groove 33.

At least two guide blocks which are oppositely distributed are also arranged on the frame 17 between the feeding area 18 and the discharging area 20, a guide channel is formed between the two guide blocks, and the conveying belt 27 is conveyed along the guide channel to play a role in guiding.

The conveying belt 27 may be configured as at least three layers when specifically configured, and when configured as a three-layer structure, the conveying belt 27 is configured as an inner layer, an intermediate layer and an outer layer stacked from inside to outside, wherein the three layers may be fixedly connected by using the first roller 30 and the second roller 31, and then the fixture 28 is disposed between the inner layer and the intermediate layer, or of course, the conveying belt 27 of the three-layer structure may be fixedly connected by using a fastener.

In this embodiment, at least one processing area is further disposed on the rack 17, and the processing area is used for cleaning, drying or otherwise processing the workpiece, the cleaning realizes that the electroplating solution retained on the workpiece is cleaned, and then the next process is performed, so as to ensure the cleanness of the surface of the workpiece, when the processing area is specifically disposed, at least one processing area may be disposed between the feeding area 18 and the electroplating area 19, at least one processing area may be disposed between the electroplating area 19 and the discharging area 20, at least one processing area may be disposed between two adjacent electroplating areas 19, each processing area is correspondingly disposed with a processing structure, and the processing structure includes a processing tank communicated with the reflow tank 1 in any one of the matching structures.

Referring to fig. 1, the at least one processing area is set as a cleaning area 34, that is, the processing structure is a cleaning structure, the processing tank is a cleaning tank, the cleaning structure is a cleaning pipe, the cleaning pipe is communicated with an external water source, wherein, one cleaning area 34 can be set to be communicated with the feeding end of the feeding area 18 and the plating tank 16, and the cleaning tank is communicated with the first inlet 6 of the reflow tank 1 and is used for pre-cleaning the workpieces which do not enter the plating tank 16 to remove dust on the workpieces; or the cleaning tank is communicated with the reflux tank 1 communicated with the discharge end of the electroplating tank 16, and the cleaning tank is communicated with the first outlet 7 of the reflux tank 1, so that the workpiece output from the electroplating tank 16 can be cleaned with force, and the electroplating solution remained on the surface of the workpiece can be cleaned.

Referring to fig. 1, when two plating baths 16 are provided, a cleaning region 34 may be provided in two reflow baths 1 between the two plating baths 16, one end of a cleaning tank of a cleaning mechanism in the cleaning region 34 is respectively communicated with the first outlet 7 of one reflow bath 1, and the other end of the cleaning tank is communicated with the first inlet 6 of the other reflow bath 1, so that when a workpiece is output from different plating baths 16, a solution of the previous plating bath 16 remaining on the workpiece can be washed away, and the plating solutions in different plating baths 16 are prevented from being mixed on the surface of the same workpiece, thereby affecting the plating effect.

Of course, in this embodiment, referring to fig. 1, at least one processing area may be disposed in the electroplating area 19 and the blanking area 20, the processing area is a drying area 35, the processing structure in the drying area 35 is a drying structure, the processing tank is a drying tank, the drying tank may be communicated with the discharge end of the cleaning area 34 disposed between the electroplating area 19 and the blanking area 20, the workpiece output from the cleaning area 34 may be dried, and the drying piece may be dried by air drying, and the solution on the workpiece is dried by hot air.

In the electroplating production line in this embodiment, referring to fig. 1 and 5, at least one transition groove 22 is further included, the reflow groove 1 of any matching structure is in sealed communication with the processing groove of the processing structure through the transition groove 22, so that the workpiece passes through the processing groove, the reflow groove 1 and the transition groove 22 along with the driving of the conveying mechanism, a first communication port 23 and a second communication port 24 are respectively arranged at two ends of the transition groove 22, and the bottom of the first communication port 23 or the bottom of the second communication port 24 close to the reflow groove 1 is higher than the height of the reflow port 15 of the reflow groove 1, so that when the solution flows from one end of the reflow groove 1 to one side of the processing groove, the solution can flow out from the reflow port 15 of the transition groove 22, and the solution entering the processing groove along the transition groove 22 is prevented from mixing with the liquid in the processing groove, which causes the occurrence of liquid contamination.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims (19)

1. A reflow oven, comprising:

the device comprises a tank body (2), wherein a first plate (3) is arranged in the tank body (2) to divide an inner cavity of the tank body (2) into a first backflow cavity (4) and a plate passing channel (5) which are arranged side by side, two ends of the plate passing channel (5) along the length direction of the plate passing channel penetrate through two opposite side walls of the tank body (2), and a first inlet (6) and a first outlet (7) are formed in the two side walls of the tank body (2) correspondingly and respectively for a workpiece to pass through the plate passing channel (5);

the first plate (3) is provided with at least one first liquid passing port (8) so as to communicate the plate passing channel (5) with the first backflow cavity (4).

2. The reflow trough according to claim 1, further comprising a second plate (9) arranged in the trough body (2), wherein the second plate (9) is distributed opposite to the first plate (3), the plate passing channel (5) is formed between the first plate (3) and the second plate (9), a second reflow cavity (10) is defined between the second plate (9) and the trough body (2), and the second reflow cavity (10) and the first reflow cavity (4) are distributed side by side on two sides of the plate passing channel (5);

and at least one second liquid passing port (11) is formed in the second plate (9) so as to communicate the plate passing channel (5) with the second backflow cavity (10).

3. The reflow tank of claim 2,

at least one flow blocking piece (12) is arranged in the first backflow cavity (4) and/or the second backflow cavity (10), the flow blocking piece (12) divides the backflow cavity where the flow blocking piece is located into at least two branch cavities, the branch cavities correspond to the first plate (3) or the second plate (9) and are provided with at least two liquid passing ports, and each branch cavity corresponds to at least one liquid passing port.

4. The backwash tank as claimed in claim 3, wherein the liquid passing ports of two adjacent branch chambers are higher near the first inlet (6) than near the first outlet (7).

5. Reflow oven according to claim 3 or 4, characterized in, that the flow resistance element (12) is plate-shaped.

6. Reflow oven according to any of claims 1-4, characterized in that the plate passage (5) comprises a first passage (13) below and a second passage (14) above, the width of the first passage (13) being smaller than the width of the second passage (14).

7. The reflow channel of claim 6, wherein the bottom of the first channel (13) is connected with the top of the second channel (14) through a transition channel inclined from top to bottom.

8. A reflow oven according to any one of claims 1-4, wherein the reflow oven (1) is provided with a reflow opening (15) on the side wall where the first inlet (6) or the first outlet (7) is located;

the return opening (15) is located below the respective first inlet (6) or first outlet (7).

9. A matching structure of a reflux tank and an electroplating bath is characterized by comprising

At least one electroplating bath (16) having an electroplating chamber;

at least one reflux groove (1) is arranged at two ends of each electroplating bath (16), the reflux groove (1) is the reflux groove (1) as claimed in any one of claims 1-8, and the plate passing channel (5) of any reflux groove (1) is in sealed communication with an electroplating cavity of the electroplating bath (16).

10. The matching structure of the reflow groove and the electroplating bath as claimed in claim 9, further comprising a spraying mechanism arranged in each electroplating bath (16), wherein the spraying mechanism is used for spraying the solution into the corresponding groove so as to enable the solution in each groove to be in a flowing state; and the two ends of the circulating mechanism are connected with the electroplating cavity and the spraying mechanism.

11. An electroplating production line is characterized by comprising

At least one of the reflow vessel of claim 9 or 10 in combination with a plating vessel; and

and the conveying mechanism is used for driving the workpiece to move in a vertical extending and horizontal direction so as to pass through the reflux groove (1) and the electroplating groove (16) in the matching structure.

12. Electroplating line according to claim 11, further comprising a frame (17), said frame (17) having a loading zone (18), at least one electroplating zone (19) and a blanking zone (20), at least one said cooperating structure being provided in each said electroplating zone (19);

the conveying mechanism is arranged on the rack (17) and stretches across the feeding area (18), the electroplating area (19) and the discharging area (20), and the conveying mechanism is suspended above the electroplating area (19) and used for driving a workpiece to be electroplated to vertically pass through the feeding area (18) and at least sequentially pass through the electroplating area (19) and the discharging area (20).

13. Electroplating line according to claim 12, characterized in that the frame (17) is also provided with at least one treatment zone;

the treatment zone is located between the feeding zone (18) and the electroplating zone (19), or the treatment zone is located between the electroplating zone (19) and the blanking zone (20); or the processing area is positioned between two adjacent electroplating areas (19);

the device also comprises a processing structure correspondingly arranged in the processing area, wherein the processing structure comprises a processing groove communicated with the reflux groove (1) in any matching structure.

14. The electroplating production line according to claim 13, further comprising at least one transition groove (22), wherein the reflow groove (1) of any matching structure is in sealed communication with the processing groove of the processing structure through the transition groove (22) so as to allow the workpieces to pass through along with the driving of the conveying mechanism;

and a first communicating port (23) and a second communicating port (24) are respectively arranged at two ends of the transition groove (22), and the bottom of the first communicating port (23) or the second communicating port (24) close to the reflux groove (1) is higher than the height of the reflux port (15) of the reflux groove (1).

15. Electroplating line according to claim 13 or 14, wherein at least one of the treatment zones is a washing zone (34), the treatment structure is a washing structure and the treatment tank is a washing tank.

16. Electroplating line according to claim 13 or 14, characterized in that at least one treatment zone is provided in the electroplating zone (19) and the blanking zone (20), the treatment structure being a drying structure and the treatment tank being a drying tank.

17. Electroplating line according to claim 16, characterized in that the conveying means comprise a driving wheel (25) and a driven wheel (26), and a conveyor belt (27) wound in a closed loop around the driving wheel (25) and the driven wheel (26); and the jig (28) is fixed on the conveying belt (27), and the jig (28) is used for clamping a workpiece.

18. Electroplating line according to claim 17, wherein the conveying mechanism further comprises a guide member (29) provided on the frame (17) and extending horizontally between the loading zone (18) and the unloading zone (20);

a first roller (30) and a second roller (31) which are arranged on the guide part (29) in a rolling way are arranged on the inner wall of the conveying belt (27), and a first groove (32) and a second groove (33) for any one of the first roller (30) and the second roller (31) to roll in or out are arranged on the outer peripheral walls of the driving wheel (25) and the driven wheel (26);

the first groove (32) and the second groove (33) are flaring arc-shaped grooves.

19. Electroplating line according to claim 18, wherein the conveyor belt (27) comprises at least a three-layer structure, an inner layer, an intermediate layer and an outer layer arranged one above the other from the inside to the outside, wherein the first roller (30) and the second roller (31) fixedly connect the three-layer structure, and the jig (28) is located between the inner layer and the intermediate layer.

Images