CN113215644A

CN113215644A - Equipment for electroplating nickel, device for electroplating noble metal and electroplating system

Info

Publication number: CN113215644A
Application number: CN202110326333.3A
Authority: CN
Inventors: 韩海亚; 吴志鹏
Original assignee: Guangde Dongwei Technology Co ltd
Current assignee: Guangde Dongwei Technology Co ltd
Priority date: 2021-03-26
Filing date: 2021-03-26
Publication date: 2021-08-06

Abstract

The invention discloses nickel electroplating equipment, a noble metal electroplating device and an electroplating system, wherein the nickel electroplating equipment comprises a first electroplating bath and a pumping mechanism, and the first electroplating bath comprises a first upper bath; the inflating mechanism comprises a first fan and a first air supply pipe arranged on an air outlet of the first fan, and the first air supply pipe is communicated with the first upper groove and used for providing oxygen-containing gas into the first upper groove. Through setting up the mechanism of inflating, at the electroplating nickel in-process, first fan is opened, and the gas suction that contains oxygen with the external world is to the blast pipe in, through the blast pipe with the gas delivery that contains oxygen in first upper trough, increase the oxygen content of liquid medicine, make the organic matter in the liquid medicine can decompose, guarantee the activity of liquid medicine to electroplate the nickel layer of required thickness on the panel. And then electroplate the noble metal layer on the nickel layer, separate the noble metal layer with the inside copper layer of nickel layer through electroplating nickel, the noble metal layer can not be to the copper layer corruption, improves the electric conductivity of circuit board.

Description

Equipment for electroplating nickel, device for electroplating noble metal and electroplating system

Technical Field

The invention belongs to the technical field of electroplating, and particularly relates to nickel electroplating equipment, a precious metal electroplating device and an electroplating system.

Background

The structure of the current circuit board generally includes a substrate, a copper layer is plated on the substrate, the copper layer is used as an internal conductive structure of the circuit board, a noble metal layer needs to be plated outside the copper layer, for example, the noble metal is silver, gold, etc., a protective layer is formed on the surface of the copper layer, and the protective layer is used as a plug-in component of an electrical component subsequently fixed on the circuit board for mounting the electrical component. For example, the circuit board is an LED light bar board, the electrical element is a lamp bead, and the lamp bead is inserted on the plug-in.

However, since copper is more reactive than silver or gold, when silver or gold is directly plated on a copper layer, the copper layer is corroded, and therefore nickel is plated on the copper layer, and then a noble metal layer such as silver or gold is plated on the nickel layer. At present, most of electroplating equipment is an electroplating copper structure, which mainly comprises an electroplating bath and a driving mechanism for driving a circuit board to move. Wherein, the plating bath includes the upper tank, goes up the inslot and is equipped with the liquid medicine, and panel moves in the upper tank along vertical extension and level to the both sides surface electroplating copperplate of panel. If the electroplating structure is adopted to carry out nickel plating, a nickel solution is filled into the upper tank, in the nickel plating process, organic matters in the nickel solution are continuously decomposed to supplement new substances in the liquid medicine so as to form new liquid medicine, the oxygen content in the liquid medicine is reduced along with the decomposition of the organic matters, the organic matters are difficult to decompose and cannot form active liquid medicine, a nickel layer with required thickness is difficult to electroplate on a copper layer of a circuit board, precious metals plated on the nickel layer are further influenced, a part of the copper layer can still be corroded, and further the conductivity of the circuit board is influenced.

Disclosure of Invention

Therefore, the technical problem to be solved in the practice of the present invention is that the existing electroplating structure is difficult to meet the requirement of nickel plating, and a nickel layer with a required thickness cannot be formed on the copper plating layer.

To this end, the present invention provides an apparatus for electroplating nickel, comprising

The first electroplating bath comprises a first upper bath, and a chemical liquid is supplied to the first upper bath and placed in the first upper bath; the inflating mechanism comprises a first fan and a first air supply pipe arranged on an air outlet of the first fan, and the first air supply pipe is communicated with the first upper groove and used for providing oxygen-containing gas into the first upper groove.

Optionally, in the above nickel electroplating apparatus, the first air supply pipe includes a first pipeline connected to an air outlet of the first blower; the second pipelines are distributed on the bottom of the first upper groove, and all the second pipelines are connected with the first pipeline; and the second pipe is provided with at least one air outlet hole.

Optionally, in the above nickel electroplating apparatus, the pumping mechanism further includes a first cooler disposed on the first air supply pipe, and configured to cool the gas entering the first air supply pipe.

Optionally, in the above apparatus for electroplating nickel, the first electroplating bath further includes a first lower bath disposed below the first upper bath, and at least an outlet end of the first upper bath is provided with a first return flow tank, one end of the first return flow tank is communicated with the first upper bath, and the other end of the first return flow tank is communicated with the first lower bath;

the first lower tank is connected with the first upper tank through a first spraying mechanism and is used for conveying the liquid medicine in the first lower tank into the first upper tank;

the inflating mechanism is arranged in the first lower groove.

Optionally, in the above apparatus for electroplating nickel, the first electroplating bath further includes a sub-bath communicated with the first upper bath;

the nickel electroplating equipment also comprises a first filter and a heat exchanger which are sequentially arranged between the first lower tank and the auxiliary tank;

the first filter is connected with the first lower tank through a third pipeline, the first filter is connected with the heat exchanger through a fourth pipeline, and the heat exchanger is connected with the auxiliary tank through a fifth pipeline.

Optionally, in the above apparatus for electroplating nickel, the first filter is further connected to the secondary tank through a pipeline; and/or the heat exchanger is also communicated with the first lower groove through a pipeline.

Alternatively, in the above apparatus for nickel electroplating, the pumping mechanism is indirectly disposed in the first lower tank by being disposed in the sub tank.

Optionally, the above nickel electroplating apparatus further includes a top-drawing mechanism disposed above the top opening of the first upper tank; the top pumping mechanism comprises a second fan and is used for pumping away gas evaporated by the liquid medicine in the first upper tank.

Optionally, in the above nickel electroplating apparatus, the top pumping mechanism further includes a pumping box disposed above the first upper tank, and a surface of the pumping box facing one side of the top of the first upper tank is provided with at least one pumping hole; the air suction box is communicated with the second fan.

Optionally, in the above nickel electroplating apparatus, a side wall of the air pumping box facing the top of the first upper tank is a plate inclined from top to bottom, and the air pumping box serves as an air pumping plate; the air suction opening is formed in the air suction plate;

the top pumping mechanism further comprises a drain pipe arranged at the bottom of the air draft plate, and an inlet of the drain pipe is used for receiving liquid drops falling down from the air draft plate.

Optionally, in the above nickel electroplating apparatus, at least two of the air suction ports are vertically distributed on the air suction plate in at least two rows; and/or

And a first projection of the bottom of the air draft plate on the horizontal plane is positioned outside the edge of a second projection of the first upper groove on the horizontal plane.

Optionally, in the above nickel electroplating apparatus, side baffles and a top plate disposed on the tops of all the side baffles are disposed around the opening at the top of the first upper tank, and a sealed cavity is defined between the side baffles and the top plate; the air extracting box is arranged in the sealed cavity, and the second fan is positioned outside the sealed cavity; one of the side baffles is provided with a mounting port, and the mounting port is provided with a slidable sliding door.

The invention also provides a device for plating noble metal, which comprises

An apparatus for electroplating nickel according to any of the above;

and the inlet end of the second upper groove is horizontally communicated with the outlet end of the first upper groove of the nickel electroplating equipment, so that the plate can vertically extend and horizontally sequentially pass through the first upper groove and the second upper groove.

Optionally, in the apparatus for plating a noble metal described above, the second plating tank further includes a second lower tank located below the second upper tank; a second reflux groove is arranged at least at the outlet end of the second upper groove, one end of the second reflux groove is communicated with the second upper groove, and the other end of the second reflux groove is communicated with the second lower groove; the second lower groove is communicated with the second upper groove through a second spraying mechanism.

Optionally, in the apparatus for plating a noble metal, the second lower tank horizontally extends out of the sidewall of the second upper tank to form an extended portion, and a detachable first cover is disposed on an opening at the top of the extended portion;

the first sensor is arranged on the top opening of the second lower groove, and the second sensor is arranged on the first cover body; the first sensor and the second sensor are arranged oppositely, and at least one of the two sensors is used for detecting the actual distance between the two sensors;

an alarm and a controller;

and the controller controls the alarm to be started according to the actual distance signal detected by the sensor.

Optionally, in the apparatus for plating a noble metal, at least one mechanical lock is further disposed between the first cover and the top opening of the second lower tank; and/or

At least one of the first sensor and the second sensor is a displacement sensor.

Optionally, in the above apparatus for plating a noble metal, a filler is disposed on an inner cavity of the second upper tank and/or the second lower tank, so as to reduce a volume of the inner cavity of the tank where the filler is disposed.

Optionally, in the precious metal plating device, at least the outlet end of the second upper tank is provided with a water blocking mechanism, the water blocking mechanism comprises two first water blocking rollers which are vertically arranged oppositely, and a plate passing gap is formed between the two first water blocking rollers;

and the correlation type photoelectric sensor is arranged in the second reflow groove and used for detecting whether the board is clamped or not at the board passing gap.

Optionally, in the precious metal plating apparatus, an air cutting mechanism is further disposed in a second reflow groove adjacent to an outlet of the second upper groove, the air cutting mechanism includes a third fan, at least two second air supply pipes communicated with an air outlet of the third fan, and a plate passing channel is formed between the two opposite second air supply pipes;

and at least one air nozzle is arranged on any one second air supply pipe, and the air outlet direction of the air nozzle is inclined downwards from the outlet end of the second reflux groove to the inlet end of the second reflux groove.

Optionally, in the precious metal plating device, the tuyere is arranged on the second blast pipe in an inclined manner, so that the air outlet direction of the tuyere is inclined downwards; and/or

The tuyere is flat.

Optionally, in the apparatus for plating a noble metal, there are at least two second plating tanks, at least two of the second plating tanks are sequentially disposed, and the second upper tank of the previous second plating tank is communicated with the second upper tank of the next second plating tank;

the former second upper tank is used for placing silver-plated liquid medicine, and the latter second upper tank is used for placing gold-plated liquid medicine.

Optionally, in the apparatus for plating a noble metal, a first anode part is disposed in the first upper tank and/or the first lower tank, and the first anode part is a nickel cake; and/or

A second anode part is arranged in one second upper tank and/or one second lower tank, and the second anode part is a silver plate and is used for supplementing silver ions into the liquid medicine; and/or

And a titanium mesh is arranged in one second upper tank and/or one second lower tank and is used for guiding the gold ions in the liquid medicine to move towards the plate serving as the negative electrode when the plate is electrified.

The invention provides an electroplating system, comprising

A copper electroplating mechanism;

the noble metal plating apparatus of any one of the above;

the electro-coppering mechanism comprises a third electro-coppering tank, the third electro-coppering tank comprises a third upper tank, and the outlet end of the third upper tank is communicated with the inlet end of the first upper tank of the precious metal plating device in a sealing manner so that the plate can vertically extend and horizontally pass through the third upper tank, the first upper tank and the second upper tank in sequence.

Optionally, the electroplating system further comprises a conveying mechanism arranged above the first upper tank, the second upper tank and the third upper tank, and the conveying mechanism is used for driving the plate to vertically extend and horizontally move.

The technical scheme of the invention has the following advantages:

1. the invention provides nickel electroplating equipment, which comprises a first electroplating bath and an inflating mechanism, wherein the first electroplating bath comprises a first upper bath, and a chemical liquid is supplied to the first upper bath for placement; the inflating mechanism comprises a first fan and a first air supply pipe arranged on an air outlet of the first fan, and the first air supply pipe is communicated with the first upper groove and used for providing oxygen-containing gas into the first upper groove.

This equipment of electroplated nickel, through setting up the mechanism of inflating, the mechanism of inflating includes first fan and first blast pipe, and at the electroplated nickel in-process, first fan is opened, and the gas suction that contains oxygen with the external world is to the blast pipe in, and the blast pipe will contain the gaseous gas input of oxygen in the first upper trough, increase the oxygen content of liquid medicine, make the organic matter in the liquid medicine can decompose, guarantee the activity of liquid medicine to electroplate the nickel layer of required thickness on the panel.

2. The device for plating the noble metal comprises the nickel electroplating equipment and at least one second electroplating bath, wherein the second electroplating bath comprises a second upper bath, and the inlet end of the second upper bath is horizontally communicated with the outlet end of the first upper bath of the nickel electroplating equipment, so that a plate can vertically extend and horizontally and sequentially pass through the first upper bath and the second upper bath.

This device of plating noble metal, owing to including foretell electronickelling equipment, can electroplate the nickel layer of required thickness on panel, and then electroplate the noble metal layer on the nickel layer, keep apart the inside of noble metal layer and nickel layer through electronickelling, the noble metal layer can not be to the structure influence of the inboard panel of nickel layer.

3. The electroplating system provided by the invention comprises an electroplating copper mechanism and the precious metal electroplating device; the electro-coppering mechanism comprises a third electro-coppering tank, the third electro-coppering tank comprises a third upper tank, and the outlet end of the third upper tank is communicated with the inlet end of the first upper tank of the precious metal plating device in a sealing manner so that the plate can vertically extend and horizontally pass through the third upper tank, the first upper tank and the second upper tank in sequence.

The electroplating system with the structure has the advantages that the plate moves in the horizontal direction, sequentially passes through the upper groove of the copper electroplating mechanism, the nickel electroplating equipment and the noble metal plating device, the copper plating layer, the nickel plating layer and the noble metal plating layer are sequentially formed on the plate, the noble metal plating layer with the required thickness can be formed on the copper layer by adopting the noble metal plating device, the noble metal layer is isolated from the copper layer, the copper layer cannot be corroded by the noble metal layer, the internal conductivity of the circuit board is ensured, and the quality of the circuit board is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic view of a first plating bath according to example 1 of the present invention in a front view;

FIG. 2 is a schematic side view of the first plating cell of FIG. 1;

FIG. 3 is a schematic top view of the first plating cell of FIG. 1;

FIG. 4 is a schematic view (top view) of the first plating tank, the first spraying mechanism and the second filter shown in FIG. 1;

FIG. 5 is a schematic view (top view) illustrating the first plating tank and the pumping mechanism in example 1;

FIG. 6 is a schematic view of the first plating tank, the auxiliary tank, the first filter, and the heat exchanger;

FIG. 7 is a schematic view of the first plating tank and the top pulling mechanism in a matching manner (in a front view);

FIG. 8 is a schematic view of a detailed structure of the first plating tank of FIG. 3;

FIG. 9 is a schematic view of a titanium basket in the nickel electroplating apparatus in example 1;

fig. 10 is a schematic structural view of the first cover, the first sensor, and the second sensor in embodiment 2 of the present invention;

FIG. 11 is a side view schematic of FIG. 10;

FIG. 12 is a schematic front view of the second plating tank according to example 2;

FIG. 13a is a schematic side view of the second plating cell of FIG. 12;

FIG. 13b is a schematic view of the second plating tank of FIG. 13a in cooperation with a vertical pump;

FIG. 14 is a schematic view of the wind-cutting mechanism of FIG. 12;

FIG. 15 is a schematic view of the structure of the titanium mesh of the second plating tank in example 2;

FIG. 16 is a schematic structural view of a water retaining mechanism disposed in the second plating tank;

FIG. 17 is a partially enlarged view of the area where the water stop mechanism of FIG. 16 is located;

FIG. 18a is a schematic view showing a partial structure of the interior of the second plating tank;

FIG. 18b is a schematic side view of the second plating cell;

FIG. 19 is a schematic view (in a plan view) of the second plating tank in cooperation with a disk cooler;

FIG. 20 is a schematic view of a correlation type photoelectric sensor disposed in a second reflow vessel of the second plating vessel;

description of reference numerals:

1-a first plating bath; 11-a first upper tank; 12-a first backwash trough; 13-a first lower trough; 14-a secondary tank; 15-a heat exchanger; 16-a first filter; 17-a first spraying mechanism; 18-a second filter; 19-a drain pipe; 21-a first fan; 22-a first air supply duct; 23-a first conduit; 24-a second conduit; 25-a first cooler; 31-a top plate; 32-an air extraction box; 321-an air draft plate; 322-an air suction opening; 33-main air pipe; 34-a drain pipe; 35-side baffle; 36-a sliding door; 4-a second electroplating bath; 41-a second upper tank; 42-a second reflux tank; 43-a second lower trough; 44-a vertical pump; 45-a filler; 46-a first cover; 471-a first sensor; 472-a second sensor; 49-correlation type photoelectric sensor; 51-a tuyere; 52-second blast pipe; 61-a first titanium basket; 62-platinum titanium mesh; 7-a water retaining mechanism; 8-coil cooler.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

Example 1

The present embodiment provides an apparatus for electroplating nickel, as shown in fig. 1 to 9, including a first electroplating tank 1 and an inflating mechanism, wherein the first electroplating tank 1 includes a first upper tank 11, and a chemical solution is disposed in the first upper tank 11; as shown in fig. 5, the pumping mechanism includes a first blower 21 and a first air supply pipe 22 disposed at an air outlet of the first blower 21, and the first air supply pipe 22 is communicated with the first upper tank 11 and is configured to provide oxygen-containing gas into the first upper tank 11.

This equipment of electroplated nickel, through setting up the mechanism of inflating, the mechanism of inflating includes first fan 21 and first blast pipe 22, and at the electroplated nickel in-process, first fan 21 is opened, and the gas suction that contains oxygen with the external world is to the blast pipe in, and in the gas delivery that will contain oxygen through the blast pipe goes into first upper tank 11, increases the oxygen content of liquid medicine, makes the organic matter in the liquid medicine can decompose, guarantees the activity of liquid medicine to the nickel layer of required thickness of electroplating on the panel.

Preferably, as shown in fig. 5, the first blast duct 22 includes a first duct 23 connected to an air outlet of the first fan 21; and at least one second pipe 24 distributed on the bottom of the first upper tank 11, all the second pipes 24 being connected to the first pipe 23; the second pipeline 24 is provided with at least one air outlet hole.

For example, two second pipelines 24 are provided, the two second pipelines 24 are parallel and horizontally distributed at the bottom of the inner cavity of the first upper tank 11, one or more air outlets are provided on the top wall surface of the second pipeline 24, and air blown out from the air outlets is directly supplied into the liquid medicine from the bottom of the first upper tank 11. When there are a plurality of outlets, for example, two, three, four, five or more outlets, it is preferable that the outlets are uniformly distributed on the top wall of the second pipeline 24, and a plurality of outlets may also be distributed on the side wall of the second pipeline 24.

The second pipelines 24 can be one, three, four, five or more, and the gas is injected into the liquid medicine in the first upper tank 11 through the plurality of second pipelines 24, so that the liquid medicine at different positions can have the required oxygen content.

Of course, as a variant, the second pipes 24 may be distributed vertically and distributed so as to avoid the path of the plate, and gas may be injected into the liquid medicine at different height positions to increase the oxygen content. Further, the first air supply pipe 22 may only include a second pipeline 24, one end of the second pipeline 24 extends into the first upper groove 11, the other end extends out of the first upper groove 11 and is connected with the first fan 21, and a plurality of air outlets are arranged on the side wall of the portion of the second pipeline 24 located in the first upper groove 11.

After the first blower 21 is operated for a period of time, the motor of the first blower 21 generates heat, so that the air pumped into the first air supply pipe 22 by the first blower 21 is heated to form hot air, and when the hot air is directly blown into the first upper tank 11, the temperature of the liquid medicine is affected, so that the temperature of the liquid medicine is increased, but actually, the liquid medicine is required to be kept in a required temperature range in the nickel plating process. In order to avoid the influence of the hot air blown into the first upper tank 11 on the temperature of the chemical solution, it is further preferable that the pumping mechanism further includes a first cooler 25 provided in the first blowing pipe 22, as shown in fig. 5, for cooling the gas entering the first blowing pipe 22 so that the temperature of the gas entering the chemical solution becomes normal temperature, thereby forming natural air.

For the first cooler 25, a plate heat exchanger, a coil cooler, or other existing coolers can be used, and the specific structure is not further limited.

Preferably, as shown in fig. 5, the first blowing pipe 22 may be further provided in the first upper tank 11 so that natural wind blows into the chemical liquid in the first upper tank to adjust the oxygen content of the chemical liquid in the first upper tank.

As for the first plating tank 1, it is further preferable that, as shown in fig. 2 and 3, the first plating tank 1 further includes a first lower tank 13 provided below the first upper tank 11, a first return tank 12 is provided at least at an outlet end of the first upper tank 11, one end of the first return tank 12 communicates with the first upper tank 11, the other end communicates with the first lower tank 13, and the first lower tank 13 and the first upper tank 11 are connected by a first spraying mechanism 17. The above-described pumping mechanism is provided in the first lower tank 13 so as to be indirectly provided in the first upper tank 11.

The inflating mechanism is used for driving gas containing oxygen into the first lower tank, supplementing oxygen content to the liquid medicine in the first lower tank to adjust the activity of the liquid medicine, and when the activity of the liquid medicine meets the requirement, conveying new liquid medicine to the first upper tank through the first spraying mechanism.

Specifically, one end of the first backflow groove 12 is communicated with the first upper groove 11 through the first overflow port, and when the liquid level of the liquid medicine in the first upper groove 11 is higher than the first overflow port, the solution in the first liquid medicine enters the first backflow groove 12 through the first overflow port, and then directly flows into the first lower groove 13 below through the first backflow groove 12.

As shown in fig. 4, the first lower tank 13 is connected to the first spraying mechanism 17 through a pipeline, the pipeline is provided with a second filter 18, the liquid medicine in the first lower tank 13 is pumped into the second filter 18 by the pump body to be filtered, and then enters the first spraying mechanism 17 to be sprayed into the first upper tank 11 again, so that the liquid medicine is in a flowing state between the first upper tank 11 and the first lower tank 13, the activity and the component difference of the liquid medicine at different heights are ensured to be small, and the nickel layer electroplated on the copper layer is more uniform.

Preferably, as shown in fig. 4, there may be a plurality of second filters 18, and the plurality of second filters 18 simultaneously filter the chemical liquid in the first lower tank 13 and then transfer the chemical liquid to the first spraying mechanism 17 of the first upper tank 11.

As for the first spraying mechanism 17, as shown in fig. 4, the first spraying mechanism 17 includes two rows of first spraying pipes disposed in the first upper tank 11, and a plate passing passage for a plate to pass through is formed between the two rows of first spraying pipes; every first shower is vertical to be extended, is equipped with a plurality of first spouts on its lateral wall to filter the impurity of the liquid medicine in the first lower tank 13 and afterwards first spray tube can directly spout on panel. Of course, each row of shower pipes may include two shower pipes arranged side by side.

The first plating tank 1 shown in fig. 6 further includes a sub-tank 14 communicating with the first upper tank 11; the apparatus for electroplating nickel further comprises a first filter 16 and a heat exchanger 15 which are sequentially disposed between the first lower tank 13 and the sub-tank 14; the first filter 16 is connected with the first lower tank 13 through a third pipeline, the first filter 16 is connected with the heat exchanger 15 through a fourth pipeline, and the heat exchanger 15 is connected with the auxiliary tank 14 through a fifth pipeline.

Preferably, the pump-up mechanism may be indirectly provided in the first lower tank by being provided in the sub tank 14.

When the liquid medicine in the first lower tank 13 needs to be replaced, the liquid medicine is pumped into the first filter 16 from the first lower tank 13 for filtering, the filtered liquid medicine is heated by the heat exchanger 15 to form the liquid medicine with the required temperature, the liquid medicine is conveyed into the auxiliary tank 14, gas is pumped into the auxiliary tank 14 to promote the decomposition of organic matters so as to adjust the activity of the liquid medicine, and after the liquid medicine is adjusted in place, the liquid medicine is conveyed into the first lower tank 13 and then conveyed into the first upper tank 11 through the first spraying mechanism 17.

The auxiliary tank is inflated, the direct inflation in the first upper tank 11 or the first lower tank can be avoided, and the phenomenon that the formed bubbles are electroplated on the plate due to the continuous gas entering of the liquid medicine to influence the quality of the electroplated nickel on the plate is avoided. Of course, the pumping mechanism may be provided in the first lower groove instead of the sub groove.

For the heat exchanger 15, a floor-type heat exchanger 15 is preferred; or other forms of existing heat exchangers for heating liquids.

Further preferably, as shown in fig. 6, the first filter 16 is further connected to the sub tank 14 through a pipe, and when the chemical liquid in the sub tank 14 contains impurities, the chemical liquid in the sub tank 14 may be transferred into the first filter 16 for filtering, heated by the heat exchanger 15, and then transferred into the sub tank 14, thereby further ensuring that the chemical liquid transferred from the sub tank 14 into the first lower tank 13 meets the required requirements.

More preferably, the heat exchanger 15 is also communicated with the first lower tank 13 through a pipeline, and the chemical liquid heated in the heat exchanger 15 may be directly transferred into the first lower tank 13 and not returned to the auxiliary tank 14.

The first plating vessel 1 may be a plurality of first plating vessels 1, and when the first plating vessel 1 is a plurality of first plating vessels 1, the first upper vessel 11 of the former first plating vessel 1 communicates with the first upper vessel 11 of the latter first plating vessel 1 in two adjacent first plating vessels 1. Specifically, of the two adjacent first upper grooves 11, the former first upper groove 11 and the latter first upper groove may share one first backflow groove 12 for communication, or the first backflow grooves 12 may be provided respectively, and the two first backflow grooves 12 are communicated.

The inlet end and the outlet end of the first upper groove 11 are respectively provided with a water retaining mechanism, or the outlet end is only provided with a water retaining mechanism, the water retaining mechanism comprises two water retaining rollers which are oppositely arranged, and a plate passing gap is formed between the two water retaining rollers so that the plate can pass through the gap. The arrangement of the water retaining mechanism avoids the mixing of the liquid medicines in the two adjacent first upper grooves 11.

In the desired working temperature range, for example, 50-60 deg.c, part of the liquid medicine in the first upper tank 11 is vaporized to form gas with pungent odor, so as to avoid the concentration of the odor gas at the top opening of the first upper tank 11. Preferably, as shown in fig. 7, the apparatus for electroplating nickel further includes a top drawing mechanism provided above the top opening of the first upper tank 11; the top pumping mechanism comprises a second fan and is used for pumping away the peculiar smell gas evaporated from the liquid medicine in the first upper groove 11, the peculiar smell gas is pumped away from the top through the second fan and is treated in a centralized manner, and the pollution to the environment is avoided.

Preferably, the top suction mechanism further comprises a suction box 32 disposed above the first upper tank 11, and at least one suction opening 322 is disposed on a surface of the suction box 32 facing a top side of the first upper tank 11; the suction box 32 communicates with the second fan through a main duct 33. The second fan pumps the odor gas into the inner cavity of the air pumping box 32 through the air pumping port 322, and then transfers the odor gas to other positions for processing.

Further preferably, the side wall of the air pumping box 32 facing the top of the first upper tank 11 is a plate inclined from top to bottom, and is used as an air pumping plate 321, and the air pumping opening 322 is arranged on the air pumping plate 321; the top-suction mechanism further comprises a drain pipe 34 arranged at the bottom of the suction plate 321, and an inlet of the drain pipe 34 is used for receiving liquid drops falling on the suction plate 321. Preferably, the longitudinal cross-sectional shape of the suction box 32 is a right triangle, and the suction plate 321 is located at the legs of the right triangle. Alternatively, other shapes are possible, such as a trapezoidal longitudinal cross-sectional shape for the pumping box 32.

In the air draft mechanism, when the odor rises to the air draft plate 321, the odor is pumped into the air draft box 32 through the air draft opening 322; meanwhile, when the odor gas is in contact with the air draft plate 321, part of the odor gas is changed into liquid drops, the liquid drops slide downwards along the inclined direction of the air draft plate 321, the drain pipe 34 is arranged at the bottom of the air draft plate 321, the liquid drops slide downwards along the surface of the air draft plate 321 and enter the drain pipe 34, the part of the liquid drops are conveyed away through the drain pipe 34, and the phenomenon that the part of the liquid drops fall back into the liquid medicine in the first upper groove 11 and water drops formed on the groove body to pollute and corrode the groove body framework and accessories is avoided.

Preferably, the drain pipe 34 is arranged on the bottom of the air draft plate 321 in a penetrating manner, an inlet of the drain pipe 34 is located on the front side wall of the air draft plate 321, and an outlet of the drain pipe 34 is located outside the rear side of the air draft plate 321, so that the drain pipe 34 is arranged in a region right above the top of the first upper groove 11 in a avoiding manner, and the movement of the plate driven by the conveying mechanism above the top opening of the first upper groove 11 is not influenced.

As for the air suction ports 322, it is preferable that the air suction ports 322 are plural, for example, two, three, four, five, six or more air suction ports 322, and the plural air suction ports 322 are distributed on the air suction plate 321 in at least two rows in the vertical direction. For example, the plurality of suction ports 322 are arranged in two, three, four, five or more rows, and the plurality of suction ports 322 are distributed in each row, so that the odor gas is sucked into the suction box 32 at different heights and different positions on the same height, thereby ensuring that more odor gas above the top opening of the first upper tank 11 can be sucked into the suction box 32. Optimally, the suction openings 322 of two adjacent rows are staggered in the horizontal direction, so that the suction openings 322 are distributed at different positions of the suction plate 321 as much as possible.

Further preferably, the first projection of the bottom of the exhausting plate 321 on the horizontal plane is located outside the edge of the second projection of the first upper groove 11 on the horizontal plane, so that even if the odor gas forms droplets when being cooled to slide down on the exhausting plate 321, the odor gas cannot drop back into the first upper groove 11.

Further preferably, side baffles 35 are arranged around the top opening of the first upper tank 11, top plates 31 are arranged on the tops of all the side baffles, and a sealed cavity is defined between all the side baffles and the top plates; the air pumping box 32 is arranged in the sealed cavity, and the second fan is positioned outside the sealed cavity; one of the side guards 35 is provided with a mounting opening, and the mounting opening is provided with a slidable sliding door 36. The sealed chamber further confines the odor gas discharged from the top opening of the first upper groove 11 in the sealed chamber, and then enters the suction box 32 through the suction plate 321.

Further, as shown in FIG. 8, a drain port is provided at the bottom of the first lower tank 13, and a drain pipe 19 is attached to the drain port, so that the entire amount of the chemical liquid in the first lower tank 13 can be discharged.

In addition, the top of each of the first upper tank 11 and the first return tank 12 has a top opening for the conveying mechanism to clamp the plate so that the plate extends vertically and passes through each of the first plating tanks 1 in turn as the conveying mechanism moves horizontally to form vertical nickel plating. For the conveying mechanism, an existing conveying mechanism is adopted, for example, steel belt conveying is adopted, the bottom of the steel belt is provided with an electroplating clamp, and the top of the plate is clamped on the electroplating clamp, so that the plate is driven to move during the horizontal moving process of the steel belt. The electroplating clip is electrified from the outside to charge the electroplating clip, and the electroplating clip transmits electricity to the plate, so that the plate is charged as a negative plate.

Of course, the method further includes a pretreatment step before the nickel electroplating and a post-treatment step after the nickel electroplating, and these treatment steps are the same as the conventional copper electroplating steps, and are not described herein again. For example, the pretreatment process may be cleaning or microetching; the post-treatment process can be cleaning, drying and the like.

Example 2

The present embodiment provides a noble metal plating apparatus, as shown in FIGS. 8 to 20, comprising

The apparatus for electroplating nickel of any of the embodiments provided in example 1;

at least one second plating tank 4, as shown in fig. 12, includes a second upper tank 41, and an inlet end of the second upper tank 41 is horizontally communicated with an outlet end of the first upper tank 11 of the nickel electroplating apparatus, so that the plate vertically extends and horizontally passes through the first upper tank 11 and the second upper tank 41 in sequence.

Preferably, as shown in fig. 12 and 13a, the second plating tank 4 further includes a second lower tank 43 located below the second upper tank 41; a second reflux groove 42 is arranged at least at the outlet end of the second upper groove 41, one end of the second reflux groove 42 is communicated with the second upper groove 41, and the other end is communicated with a second lower groove 43; the second lower groove 43 is communicated with the second upper groove 41 through a second spraying mechanism.

The structures of the second upper tank 41, the second lower tank 43, the second reflow tank 42, and the second spraying mechanism of the second plating tank 4 are respectively the same as those of the first upper tank 11, the first lower tank 13, the first reflow tank, and the first spraying mechanism 17 of the first plating tank 1 in embodiment 1, and thus, detailed description thereof is omitted. That is, the second plating vessel 4 has the same structure as the first plating vessel 1 except that: the second plating vessel 4 may be provided without the sub-vessel 14 in example 1, and the pumping mechanism, the first filter 16, and the heat exchanger 15 may be provided in none of them.

Of course, the second filter 18 is also disposed on the connecting pipe between the second lower tank 43 and the second spraying mechanism, preferably, the pump body of the second filter 18 in embodiment 1 is a horizontal pump, and since part of the precious metal in the liquid medicine is adsorbed on the horizontal pump body during use, as shown in fig. 13b, the second filter 18 in this embodiment is a vertical pump 44, the vertical pump 44 is connected with the filtering barrel, and the liquid medicine in the second lower tank 43 is pumped into the filtering barrel for filtering under the action of the vertical pump 44, so that the precious metal ions are left in the filtering barrel as much as possible for recycling. Of course, the second filter 18 in embodiment 1 may also have the structure in this embodiment.

If the second electroplating bath is used for electroplating silver, the second electroplating bath further comprises a second cooler arranged between the second filter and the second spraying mechanism and used for cooling the liquid medicine, for example, the second cooler is a coil cooler.

More preferably, as shown in fig. 10, 11 and 12, the inner cavities of the second upper tank 41 and the second lower tank 43 are respectively provided with a filling body 45 to reduce the volume of the inner cavities of the second upper tank 41 and the second lower tank 43 and reduce the possibility that too much chemical liquid is injected into the second upper tank 41 and the second lower tank 43 at one time during the electroplating process. For example, the filling body in the second lower groove is arranged on the bottom of the inner cavity of the second lower groove to lift the bottom of the second lower groove; the two filling bodies in the second upper groove are arranged oppositely, and an area for containing liquid medicine is formed between the two filling bodies.

For the second lower groove 43, preferably, as shown in fig. 13b, the second lower groove 43 horizontally extends out of the sidewall of the second upper groove to form a protruding portion, a detachable first cover 46 is provided on the top opening of the protruding portion, and a first sensor 471 and a second sensor 472 on the first cover 46 are respectively provided on the top opening of the second lower groove 43; the first sensor 471 is disposed opposite to the second sensor 472, at least one of which is used for detecting the actual distance between the two sensors; an alarm and a controller; and the controller controls the alarm to be started according to the actual distance detected by the sensor.

The second lower groove 43 is provided with the above structure, and when the first cover 46 and the top opening of the second lower groove 43 are kept locked, the actual distance between the first sensor 471 and the second sensor 472 is equal to the preset distance; when the first cover 46 is opened from the second lower groove 43, the actual distance between the second sensor 472 and the first sensor 471 is not equal to the preset distance, the first sensor 471 or the second sensor 472 monitors the actual distance between the two in real time on line, and uploads the detected distance to the controller, when the actual distance is not equal to the preset distance, the controller controls the alarm to be opened, and the alarm gives an alarm to remind that the first cover 46 is opened by mistake or precious metal in the second lower groove 43 is stolen, so that an anti-theft effect is achieved. If the first cover 46 needs to be opened, the alarm is manually closed, and then the first cover 46 is opened to prevent the alarm from giving an alarm.

The first sensor 471 and the second sensor 472 are preferably existing displacement sensors, and the distance between the two sensors can be monitored online at any time. As a variation, the first sensor 471 or the second sensor 472 is a displacement sensor, and both sensors are not required to be displacement sensors. As a variant, one sensor may be replaced by a microswitch and the other sensor by an actuator. Further preferably, a protective cover covering the two sensors is further included, as shown in fig. 11.

Further preferably, at least one mechanical lock is further disposed between the first cover 46 and the top opening of the second lower groove 43, further locking the first cover 46 on the top opening of the second lower groove 43 to form a second channel protection.

Preferably, the first cover can be directly covered on the top opening of the second lower groove 43, or can be rotatably arranged on the top opening of the second lower groove 43, and the first cover 46 can be covered on the top opening of the second lower groove 43 by rotating the first cover 46.

Similarly to the first upper tank 11 of embodiment 1, the water-blocking mechanism is provided, as shown in fig. 16 and 17, at least the outlet end of the second upper tank 41 is provided with the water-blocking mechanism 7, the water-blocking mechanism includes two first water-blocking rollers 71 which are vertically arranged oppositely, and a plate-passing gap is formed between the two first water-blocking rollers 71; and a correlation type photo sensor 49 provided in the second reflow groove 42 for detecting whether the board is stuck in the board passing gap, as shown in fig. 20.

The opposed-type photosensor 49 includes an emitter 491 and a receiver 492, which are provided on the opposite side walls of the second reflow groove 42, respectively. When the plate moves horizontally in the second upper groove 41, the plate enters the second backflow groove 42 through the plate passing gap of the water retaining mechanism at the outlet end, if the plate does not have the clamping plate phenomenon at the plate passing gap, the plate moves in the second backflow groove 42, the emitter and the receiver are distributed at two sides of the plate, the light emitted by the emitter is blocked by the plate, and the receiver cannot receive the light emitted by the emitter, which indicates that the plate does not have the clamping plate at the plate passing gap; on the contrary, if the light emitted from the emitter is received by the receiver, it indicates that the plate in the second upper groove 41 is jammed in the plate passing gap, and does not enter the second reflow groove 42, and the jamming phenomenon exists.

When the number of the second plating baths 4 is plural, the plural second plating baths 4 are horizontally arranged in sequence, the second upper grooves 41 of two adjacent second plating baths 4 are communicated, and two adjacent second upper grooves 41 may be communicated by one second reflow groove 42, or one second reflow groove 42 may be separately provided for communication. The above-described correlation type photosensor 49 may be provided in each second reflow groove 42. Similarly, the above-mentioned opposite-type photoelectric sensor 49 may be disposed in the first reflux tank 12 in the first plating tank 1 in example 1.

Alternatively, the bottom of the second lower tank 43 may not be provided with a drain port, so that the precious metal solution is not drained through the drain port, and the precious metal chemical solution in the second lower tank 43 can be replaced or discharged only by opening the first lid 46.

In order to prevent the precious metal solution from being remained on the surface of the plate material too much after the plate material slides out through the second reflow groove 42 at the outlet end of the second upper groove 41, it is further preferable that an air cutting mechanism 5 is further provided in the second reflow groove 42 adjacent to the outlet end of the second upper groove 41, as shown in fig. 12 and 14, the air cutting mechanism includes a third fan, at least two second air supply pipes 52 communicated with the air outlet of the third fan, a plate passing channel is formed between the two opposite second air supply pipes 52, and the plate material moves in the plate passing channel when moving in the second reflow groove 42.

The second air supply pipes can be two or three, four, five or more, and are distributed in two rows, and a plurality of second air supply pipes can be arranged on each row, so that the second air supply pipes are arranged at different heights. Any one of the second air supply pipes 52 is provided with at least one air nozzle 51, the air outlet direction of the air nozzle 51 is inclined downwards from the outlet end of the second reflow tank 42 to the inlet end thereof, so that the air nozzle 51 blows obliquely downwards air, the air nozzles 51 on the second air supply pipes 52 on both sides of the plate respectively blow obliquely downwards air to both surfaces of the plate, liquid drops on the surface of the plate are blown back into the second reflow tank 42, and the waste of precious metals caused by the fact that part of precious metal solution is taken away from the surface of the plate after the plate is output out of the second plating tank 4 is prevented.

A plurality of air nozzles 51 are provided to the second air blowing duct 52, respectively, for the air nozzles 51. Optimally, the plurality of tuyeres 51 are evenly distributed. The air nozzle 51 is provided to the second air supply duct 52 in an inclined manner such that the air outlet direction of the air nozzle 51 is inclined downward. As for the tuyere 51, it is preferable that the tuyere 51 is flat to increase the width of the air outlet; of course, the tuyere 51 may also have other shapes, such as a triangular shape or a conical shape.

Preferably, the noble metal is silver or gold or platinum or the like. The corresponding precious metal plating devices are a silver plating device, a gold plating device and a platinum plating device respectively.

Of course, if there are at least two second plating tanks 4, a plurality of second plating tanks 4 are sequentially disposed, and the second upper tank 41 of the former second plating tank 4 is communicated with the second upper tank 41 of the latter second plating tank 4; the silver plating solution is placed in the former second upper tank 41, and the gold plating solution is placed in the latter second upper tank 41, so as to form a silver and gold plating device. Namely, the nickel plating layer is plated with silver firstly and then plated with gold to form a nickel-gold-silver plating production line.

In addition, as shown in fig. 9, a first anode part is arranged in the first upper tank 11 of the nickel electroplating device, the first anode part is a nickel cake, correspondingly, a first titanium basket 61 is arranged in the first upper tank 11, the left side view in fig. 9 is a schematic view of the titanium basket in the front view direction, and the right side view in fig. 9 is a schematic view of the titanium basket in the side view direction; the nickel cake is arranged in the first titanium basket 61 and is positioned in the liquid medicine to continuously provide nickel ions for the liquid medicine. The first titanium basket 61 can be square or round, correspondingly, the nickel cake can be square or round, or the shape of the first titanium basket can not correspond to the shape of the nickel cake one by one, only the nickel cake can be put into the first titanium basket 61, and the specific shape is not limited. For example, nickel cakes may be replaced with nickel balls.

Similarly, when the second plating tank 4 is plated with silver, a second anode member is disposed in the second upper tank 41 of the corresponding second plating tank 4, the second anode member is a steel plate disposed in the second titanium basket, and the steel plate extends into the liquid medicine for guiding silver ions in the liquid medicine to move toward the plate serving as the negative electrode. The second titanium basket is a square titanium basket for the steel plate to be filled in. Or the titanium baskets with other shapes can be used, and the steel plate can be arranged in or hung on the steel plate.

When gold is electroplated in the second plating tank 4, a platinum-titanium mesh 62 is disposed in the second upper tank 41 of the corresponding second plating tank 4, as shown in fig. 15, the left side view in fig. 15 is a schematic view of the platinum-titanium mesh in a front view direction; the right side of fig. 15 is a schematic view of the platinum-titanium mesh in a side view, which guides the gold ions in the chemical solution to move toward the plate material as the negative electrode when the current is applied.

Of course, the anode members may be provided in the lower tank of the corresponding plating tank, or the anode members may be provided in both the lower tank and the upper tank.

In addition, when the silver plating is performed, the water blocking mechanism provided in the second upper tank 41 of the second plating tank 4 is adapted to the existing double-C-shaped tank water blocking mechanism as shown in fig. 17, mainly because the chemical liquid in the silver tank is alkaline, bubbles are easily generated in the chemical liquid, and the buffer capacity of the chemical liquid can be reduced and the generation of bubbles can be reduced by using the existing double-C-shaped tank water blocking device. When the nickel plating or the gold plating is carried out, the water retaining mechanism can adopt a common water retaining roller because the liquid medicine is acidic and does not generate bubbles.

The first inslot 11 of nickel plating can also set up kickboard elevating system in to the distance between the kickboard among the electroplating clamp and the kickboard elevating system on the steel band that changes conveying mechanism, in order to adapt to the centre gripping of not co-altitude panel, the top centre gripping of panel is on the electroplating clamp promptly, the bottom card of panel is on the kickboard, do elevating movement through actuating mechanism drive kickboard, change the distance between kickboard and the electroplating clamp, in order to realize that not co-altitude panel removes in last inslot, there is the kickboard support bottom of panel. The second upper tank 41 plated with the noble metal may not have a floating plate elevating mechanism.

Example 3

This example 1 provides an electroplating system comprising

A copper electroplating mechanism;

the noble metal-plated device of any one of embodiments 2;

the electro-coppering mechanism comprises a third electroplating bath, the third electroplating bath comprises a third upper bath, the outlet end of the third upper bath is communicated with the inlet end of the first upper bath 11 of the precious metal plating device in a sealing manner, so that the plate can vertically extend and horizontally pass through the third upper bath, the first upper bath 11 and the second upper bath 41 in sequence.

In the copper electroplating mechanism in this embodiment, the third electroplating tank has the same structure as the second electroplating tank 4 in example 1; comprises an upper tank, a lower tank, an auxiliary tank 14, a spraying mechanism, a filter and the like, and is not provided with an inflating mechanism so as to form a plating tank for vertical plating.

The inlet end of the first upper tank 11 of the first plating tank 1 is communicated with the third upper tank, the outlet end of the first upper tank 11 is communicated with the second upper tank 41, a backflow tank can be arranged between two adjacent upper tanks for communication, or a backflow tank is arranged at the inlet end and the outlet end of each upper tank respectively, so that the two adjacent upper tanks are communicated.

Further, the electroplating system further comprises a conveying mechanism arranged above the first upper tank 11, the second upper tank 41 and the third upper tank, and the conveying mechanism is used for driving the plate to horizontally move. The conveying mechanism has the same structure as the conveying mechanism in the embodiment 1, and comprises a steel belt and an electroplating clamp arranged at the bottom of the steel belt, wherein the electroplating clamp clamps the top of a plate, the horizontal movement of the steel belt drives the plate to sequentially pass through the third electroplating tank, the first electroplating tank 1 and the upper tank of the second electroplating tank 4 from a feeding end, and then the plate is sequentially electroplated with a copper layer, a nickel layer and a noble metal layer from the electroplating clamp through a falling end. Of course, the noble metal may be plated in one kind, or in sequence in a plurality, and correspondingly, the second plating bath 4 is a plurality, for example, a silver layer is plated on a nickel layer, and then a gold layer is plated on the silver layer.

Besides the above structure, the conveying mechanism can also be the existing conveying mechanism for vertical copper electroplating.

In addition, in the actual electroplating process, a pretreatment step is also included before each metal layer is electroplated, and a post-treatment step is included after electroplating. For example, the pretreatment structure before nickel plating includes a cleaning bath, a hot water washing bath, at least one water washing bath, a microetching bath, a water washing bath, an acid bath; the post-treatment structure after nickel electroplating comprises a nickel recovery tank and a rinsing tank. The silver or gold electroplating step is similar, and each treatment tank has the same structure as the plating tank described above, and the sub-tank described above may not be provided.

In addition, in the actual electroplating process, a blanking transition section is also arranged between two adjacent electroplating devices. For example, in the production line of electroplating nickel, silver and gold, a transition section is arranged between the equipment for electroplating nickel and the equipment for electroplating silver, so that part of the circuit board only needs to be electroplated with nickel, and the circuit board can be directly blanked through the transition section without entering the equipment for electroplating silver. Similarly, a transition section can be arranged between the silver electroplating equipment and the gold electroplating equipment, so that the nickel-silver plated product on the circuit board can be blanked. Of course, through the blanking of the transition section, the detection or spot check can be carried out on the previous electroplating product. The transition section can be an empty groove, the inlet end of the empty groove is communicated with the outlet of the previous electroplating device, and the outlet end of the empty groove is communicated with the inlet end of the next electroplating device.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims

1. The nickel electroplating equipment is characterized by comprising a first electroplating tank (1) and an inflating mechanism, wherein the first electroplating tank (1) comprises a first upper tank (11), and a chemical liquid is supplied to the first upper tank (11) for placement; the inflating mechanism comprises a first fan (21) and a first air supply pipe (22) arranged on an air outlet of the first fan (21), and the first air supply pipe (22) is communicated with the first upper groove (11) and is used for providing oxygen-containing gas into the first upper groove (11).

2. Equipment for nickel electroplating according to claim 1, characterized in that the first blast duct (22) comprises a first duct (23) connected to the outlet mouth of the first fan (21); and at least one second pipe (24) distributed on the bottom of the first upper tank (11), all the second pipes (24) being connected to the first pipe (23); and the second pipe is provided with at least one air outlet hole.

3. The apparatus for nickel electroplating according to claim 1 or 2, wherein the pumping mechanism further comprises a first cooler (25) provided on the first blast pipe (22) for cooling the gas entering the first blast pipe (22).

4. The apparatus for electroplating nickel according to any one of claims 1 to 3, characterized in that the first electroplating tank (1) further comprises a first lower tank (13) provided below the first upper tank (11), a first return tank (12) being provided at least at an outlet end of the first upper tank (11), one end of the first return tank (12) being in communication with the first upper tank (11) and the other end being in communication with the first lower tank (13);

the first lower tank (13) is connected with the first upper tank (11) through a first spraying mechanism and is used for conveying the liquid medicine in the first lower tank into the first upper tank;

the inflating mechanism is arranged in the first lower groove (13).

5. The apparatus for electroplating nickel according to claim 4, characterized in that the first electroplating tank (1) further comprises a sub-tank (14) communicating with the first upper tank (11);

the nickel electroplating equipment also comprises a first filter (16) and a heat exchanger (15) which are sequentially arranged between the first lower tank (13) and the auxiliary tank (14);

the first filter (16) is connected with the first lower tank (13) through a third pipeline, the first filter (16) is connected with the heat exchanger (15) through a fourth pipeline, and the heat exchanger (15) is connected with the auxiliary tank (14) through a fifth pipeline.

6. Equipment for the electrogalvanic nickel coating according to claim 5, characterized in that the first filter (16) is also connected to the secondary tank (14) by means of a pipe; and/or the heat exchanger (15) is also in communication with the first lower tank (13) by means of a conduit.

7. Equipment for nickel electroplating according to claim 5 or 6, characterized in that the pumping mechanism is provided indirectly in the first lower tank (13) by being provided in the auxiliary tank (14).

8. The apparatus for nickel electroplating according to any one of claims 1 to 7, further comprising a top-drawing mechanism provided above the top opening of the first upper tank (11); the top pumping mechanism comprises a second fan and is used for pumping away gas evaporated by the liquid medicine in the first upper groove (11).

9. The apparatus for nickel electroplating according to claim 8, wherein the top suction mechanism further comprises a suction box (32) provided above the first upper tank (11), and at least one suction port (322) is provided on a surface of the suction box (32) facing a top side of the first upper tank (11); the suction box (32) is in communication with the second fan.

10. The apparatus for nickel electroplating according to claim 9, wherein a side wall of the suction box (32) facing the top of the first upper tank (11) is a plate inclined from top to bottom as a suction plate (321); the air suction opening (322) is arranged on the air suction plate (321);

the top suction mechanism further comprises a drain pipe (34) arranged at the bottom of the air suction plate (321), and an inlet of the drain pipe (34) is used for receiving liquid drops falling on the air suction plate (321).

11. The apparatus for electronickelling according to claim 10, wherein said suction openings (322) are at least two, at least two said suction openings (322) being vertically distributed in at least two rows on said suction plate (321); and/or

The first projection of the bottom of the air draft plate (321) on the horizontal plane is positioned outside the edge of the second projection of the first upper groove (11) on the horizontal plane.

12. The apparatus for electroplating nickel according to any one of claims 9 to 11, wherein the periphery of the top opening of the first upper tank (11) is provided with a side baffle plate (35) and a top plate (31) arranged on the top of all the side baffle plates, and a sealed cavity is enclosed between the side baffle plates and the top plate; the air extracting box (32) is arranged in the sealed cavity, and the second fan is positioned outside the sealed cavity; one of the side baffles (35) is provided with a mounting opening, and the mounting opening is provided with a slidable sliding door (36).

13. A device for plating noble metal is characterized by comprising

An apparatus for electroplating nickel according to any of claims 1 to 12;

and the at least one second electroplating tank (4) comprises a second upper tank (41), the inlet end of the second upper tank (41) is horizontally communicated with the outlet end of the first upper tank (11) of the nickel electroplating equipment, and plates vertically extend and horizontally penetrate through the first upper tank (11) and the second upper tank (41) in sequence.

14. The noble metal plating apparatus according to claim 13, wherein the second plating tank (4) further includes a second lower tank (43) located below the second upper tank (41); a second reflux groove (42) is arranged at least at the outlet end of the second upper groove (41), one end of the second reflux groove (42) is communicated with the second upper groove (41), and the other end is communicated with the second lower groove (43); the second lower groove (43) is communicated with the second upper groove (41) through a second spraying mechanism.

15. Noble metal plating apparatus according to claim 14, characterized in that the second lower trough (43) horizontally protrudes outside the side wall of the second upper trough to form a protruding portion, the top opening of which is provided with a detachable first cover (46);

and a first sensor (471) and a second sensor (472) on the first cover (46) respectively provided on the top opening of the second lower groove (43); the first sensor (471) is arranged opposite to the second sensor (472), and at least one of the two sensors is used for detecting the actual distance between the two sensors;

an alarm and a controller;

16. Noble metal plating device according to claim 15, characterized in that at least one mechanical lock is also provided between the first cover (46) and the top opening of the second lower groove (43); and/or

At least one of the first sensor (471) and the second sensor (472) is a displacement sensor.

17. Noble metal plating apparatus according to any of claims 13-16, characterized in that the inner cavity of the second upper and/or lower bath is provided with a filling body (45) to reduce the volume of the inner cavity of the bath in which the filling body is located.

18. The noble metal plating apparatus according to any one of claims 13 to 17, wherein a water-retaining mechanism is provided at least on the outlet end of the second upper tank (41), the water-retaining mechanism comprising two first water-retaining rollers disposed vertically opposite to each other with a plate-passing gap formed therebetween;

and a correlation type photoelectric sensor (49) arranged in the second reflow groove (42) and used for detecting whether the plate material is clamped or not at the plate passing gap.

19. The precious metal plating apparatus according to any one of claims 13 to 18, wherein an air cutting mechanism is further provided in the second reflow tank (42) adjacent to the outlet of the second upper tank (41), the air cutting mechanism comprises a third fan, at least two second air supply pipes (52) communicated with the air outlet of the third fan, and a plate passage is formed between the two opposite second air supply pipes (52);

at least one air nozzle (51) is arranged on any one of the second air supply pipes (52), and the air outlet direction of the air nozzle (51) is inclined downwards from the outlet end of the second backflow groove (42) to the inlet end thereof.

20. The apparatus for plating with noble metal according to claim 19, wherein the tuyere (51) is provided on the second blast pipe (52) by being inclined such that the air outlet direction of the tuyere (51) is inclined downward; and/or

The air nozzle (51) is flat.

21. The noble metal plating apparatus according to any one of claims 13 to 20, wherein the second plating tank (4) is at least two, at least two of the second plating tanks (4) are arranged in sequence, and the second upper tank (41) of the former second plating tank (4) is communicated with the second upper tank (41) of the latter second plating tank (4);

the former second upper tank (41) is used for placing the liquid medicine for plating the first noble metal, and the latter second upper tank (41) is used for placing the liquid medicine for plating the second noble metal.

22. Noble metal plating apparatus according to claim 21, characterized in that a first anode part is provided in the first upper tank (11) and/or the first lower tank (13), the first anode part being a nickel cake; and/or

A second anode part is arranged in one second upper groove (41) and/or one second lower groove (43), and the second anode part is a silver plate and is used for supplementing silver ions into the liquid medicine; and/or

And a titanium mesh is arranged in one second upper groove (41) and/or one second lower groove (43) and is used for guiding gold ions in the liquid medicine to move towards a plate material serving as a negative electrode when power is supplied.

23. An electroplating system, comprising

A copper electroplating mechanism;

the noble metal-plated device of any one of claims 13-22;

the electro-coppering mechanism comprises a third electro-coppering tank, the third electro-coppering tank comprises a third upper tank, the outlet end of the third upper tank is communicated with the inlet end of the first upper tank (11) of the precious metal plating device in a sealing manner, so that the plate can vertically extend and horizontally pass through the third upper tank, the first upper tank (11) and the second upper tank (41) in sequence.

24. The plating system of claim 23, further comprising a conveying mechanism disposed above the first upper tank (11), the second upper tank (41), and the third upper tank, the conveying mechanism being configured to drive the plate to extend vertically and move horizontally.