CN214627476U

CN214627476U - PTFE buries resistance multilayer printing board

Info

Publication number: CN214627476U
Application number: CN202120727440.2U
Authority: CN
Inventors: 赖通
Original assignee: Shenzhen Fusheng Electronics Co ltd
Current assignee: Shenzhen Fusheng Electronics Co ltd
Priority date: 2021-04-12
Filing date: 2021-04-12
Publication date: 2021-11-05
Anticipated expiration: 2031-04-12

Abstract

The utility model relates to a printed circuit board technical field, specifically speaking relates to a PTFE buries resistance multilayer printed board, including multilayer printed board main part, the bottom of multilayer printed board main part is provided with the welding and separates the temperature device, the welding separates the temperature device including being the heat-conducting plate that the level form set up, be provided with a plurality of fin that are linear equidistant range on the heat-conducting plate, four bight position departments in the bottom surface of heat-conducting plate all are provided with the heat-insulating plate, be provided with the welding support on the bottom surface of heat-insulating plate, one side of multilayer printed board main part still is provided with welding heat abstractor, welding heat abstractor includes the mount, be provided with micro motor on the mount, micro motor's output shaft end is provided with the fan. The utility model discloses can reduce the adverse effect that causes multilayer printing board main part among the welding process, facilitate the operation and use, facilitate for the user.

Description

PTFE buries resistance multilayer printing board

Technical Field

The utility model relates to a printed circuit board technical field, specifically speaking relates to a PTFE buries resistance multilayer printing board.

Background

Bury resistance multilayer printed board is with special resistance material pressfitting on insulating substrate, then through technologies such as printing, etching, form the material of the required resistance value of design, then the pressfitting forms a plate body of plane resistance layer on the PCB board, at present, the resistance multilayer printed board is buried to majority PTFE, all need pass through welding operation when the installation, but conventional PTFE buries and lacks corresponding heat-proof device on the resistance multilayer printed board, high temperature causes the damage to the printed board in the welding process appears easily, bring inconvenience for the user.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a resistance multilayer printing board is buried to PTFE to solve the defect that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a PTFE buries resistance multilayer printing board, includes multilayer printing board main part, the bottom of multilayer printing board main part is provided with the welding and separates the temperature device, the welding separates the temperature device including being the heat-conducting plate that the level form set up, be provided with a plurality of fin that are linear equidistant range on the heat-conducting plate, four bight positions in the bottom surface of heat-conducting plate department all is provided with the heat-insulating plate, be provided with the welding support on the bottom surface of heat-insulating plate.

Preferably, multilayer printed board main part comprises the ground plate that sets up at the bottommost, the solidification board of setting in intermediate position department and the component mounting panel of setting at the top, multilayer printed board main part with be provided with first inner plate between the solidification board, the solidification board with be provided with the second inner plate between the component mounting panel, the second inner plate with be provided with the power layer between the component mounting panel, can utilize first inner plate, second inner plate and solidification board to play the effect of separation and protection.

Preferably, one side of multilayer printed board main part still is provided with the welding heat abstractor, the welding heat abstractor includes the mount, be provided with micro motor on the mount, micro motor's output shaft end is provided with the fan, is convenient for utilize micro motor work, drives the fan and rotates, carries out the radiating operation.

Preferably, the welding heat abstractor is still including setting up conical duct on the mount, the fan orientation one side of conical duct, the bottom of conical duct is provided with the ventilation pipe, guarantees when using, can utilize fan work, and wind blows off from the ventilation pipe, adjusts the terminal orificial position of ventilation pipe, makes to cool down the operation more smoothly to the welding position.

Preferably, the top of toper pipe is provided with the support frame, support frame fixed mounting be in on the bottom surface of mount, conveniently carry out fixed mounting and dismantlement operation to the toper pipe, bring the facility for the user.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a welding that sets up separates the temperature device, guarantees when using, can utilize the heat insulating board to play and carry out certain temperature effect that separates to welding support position, avoids the high temperature in the welding process to cause adverse effect to multilayer printing board main part, facilitates the use, has solved conventional PTFE and has buried the heat insulating device that lacks correspondence on the resistance multilayer printing board, appears welding process medium and high temperature easily and causes the damage to the printing board, brings inconvenient problem for the user.

2. The utility model discloses a welding heat abstractor who sets up guarantees when using, can utilize micro motor work to drive the fan and rotate, realizes carrying out the heat dissipation operation to the welding position, and after the welding, also can carry out the heat dissipation operation to multilayer printing board main part, facilitates the use.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged view of the point A in FIG. 1 according to the present invention;

FIG. 3 is a schematic view of the explosion structure of the welding thermal insulation device of the present invention;

fig. 4 is an explosion structure diagram of the welding heat dissipation device of the present invention.

In the figure: 1. a multilayer printed board main body; 10. a ground plate; 11. a first inner-layer board; 12. curing the plate; 13. a second inner-layer board; 14. a power layer; 15. an element mounting plate; 2. welding a heat insulation device; 20. a heat conducting plate; 21. a heat sink; 22. a thermal insulation plate; 23. welding a bracket; 3. welding a heat dissipation device; 30. a fixed mount; 31. a micro motor; 32. a fan; 33. a tapered tube; 34. a support frame; 35. and a vent pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-4, the present invention provides a technical solution:

a PTFE buries resistance multilayer printed board, including multilayer printed board main part 1, multilayer printed board main part 1 is by setting up in the bottommost stratum board 10, set up in the solidification board 12 of the middle position department and setting up the component mounting panel 15 at the top and making up, there is the first inner layer board 11 between multilayer printed board main part 1 and the solidification board 12, there is the second inner layer board 13 between the solidification board 12 and the component mounting panel 15, there is the power layer 14 between the second inner layer board 13 and the component mounting panel 15, stratum board 10, the first inner layer board 11, solidification board 12, the second inner layer board 13, the power layer 14 and the component mounting panel 15 are the integral structure, guarantee its structure is more firm and stable, meanwhile, when the power supply is used, the first inner layer plate 11, the second inner layer plate 13 and the curing plate 12 can be used for separating and protecting the power supply layer 14 and the element mounting plate 15, and the use is convenient;

specifically, the bottom of the multilayer printed board main body 1 is provided with the welding heat insulation device 2, the welding heat insulation device 2 comprises a heat conduction plate 20 which is horizontally arranged, a plurality of radiating fins 21 which are linearly arranged at equal intervals are integrally formed on the heat conduction plate 20, and the radiating fins 21 are fixedly arranged on the bottom surface of the ground layer board 10, so that when the multilayer printed board is used, the heat conduction plate 20 and the radiating fins 21 also have a certain heat conduction effect, and the multilayer printed board is convenient to use; the heat insulation plates 22 are integrally formed at four corner positions of the bottom surface of the heat conduction plate 20, and the welding supports 23 are integrally formed on the bottom surface of the heat insulation plates 22, so that when the welding supports 23 are welded, the heat insulation plates 22 can be utilized to play a certain heat insulation effect, and the multilayer printed board main body 1 is prevented from being damaged by high temperature in the welding process.

In this embodiment, one side of multilayer printed board main part 1 still is provided with welding heat abstractor 3, and welding heat abstractor 3 includes mount 30, is provided with micro motor 31 on the mount 30, and the unable adjustment base on micro motor 31 passes through a plurality of fastening screw fixed mounting on mount 30, and micro motor 31's output shaft end is provided with fan 32, is convenient for utilize micro motor 31 work, drives fan 32 and rotates, carries out the radiating operation.

Further, welding heat abstractor 3 is still including setting up conical duct 33 on mount 30, and fan 32 is towards one side of conical duct 33, and conical duct 33's bottom integrated into one piece has ventilation pipe 35, and ventilation pipe 35 is the hose, guarantees when using, can utilize fan 32 to rotate, and wind blows out from ventilation pipe 35, adjusts the orificial position in ventilation pipe 35 terminal, makes to cool down the operation more smooth to the welding position.

In addition, the top of conical tube 33 is provided with support frame 34, and support frame 34 is through a plurality of fastening screw fixed mounting on the bottom surface of mount 30, conveniently carries out fixed mounting and dismantlement operation to conical tube 33, and it is convenient for the user, and after welding operation, takes off support frame 34 and conical tube 33, again with mount 30 fixed mounting on external chassis casing, can utilize micro motor 31 and fan 32 to realize carrying out the radiating operation to multilayer printed board main part 1.

It should be noted that the micro motor 31 in the present embodiment is a conventional technology, and is not described herein again.

The utility model discloses a PTFE buries resistance multilayer printed board when using, place welding stent 23 in corresponding box welding position department, weld welding stent 23 on external box again, simultaneously, switch on external power and make its work with micro motor 31, micro motor 31 works, output shaft rotation on it drives fan 32 and rotates, when fan 32 rotates, wind can blow off from the end of ventilation pipe 35, adjust the terminal mouth of pipe of ventilation pipe 35 towards the welding position, can carry out the heat dissipation treatment to the welding position, avoid high temperature in the welding process to cause adverse effect to multilayer printed board main part 1;

after the welding, can dismantle support frame 34, and install mount 30 on external quick-witted case, make micro motor 31 be located multilayer printed board main part 1 directly over, reuse micro motor 31 work, can play and carry out radiating effect to multilayer printed board main part 1, facilitate the use, it lacks corresponding heat-proof device to have solved conventional PTFE and buried on the resistance multilayer printed board, high temperature causes the damage to the printed board in the welding process to appear easily, the problem of inconvenience is brought for the user.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a resistance multilayer printing board is buried to PTFE, includes multilayer printing board main part (1), its characterized in that: the bottom of multilayer printing board main part (1) is provided with welding heat-insulating device (2), welding heat-insulating device (2) is including heat-conducting plate (20) that is the level form setting, be provided with a plurality of fin (21) that are linear equidistant range on heat-conducting plate (20), four bight positions in the bottom surface of heat-conducting plate (20) all are provided with heat-insulating plate (22), be provided with welding support (23) on the bottom surface of heat-insulating plate (22).

2. The PTFE buried resistance multilayer printed board according to claim 1, characterized in that: multilayer printed board main part (1) comprises floor board (10), the solidification board (12) of setting in intermediate position department and the component mounting panel (15) of setting at the top of setting in the bottommost, multilayer printed board main part (1) with be provided with first inner plate (11) between solidification board (12), solidification board (12) with be provided with second inner plate (13) between component mounting panel (15), second inner plate (13) with be provided with power layer (14) between component mounting panel (15).

3. The PTFE buried resistance multilayer printed board according to claim 1, characterized in that: one side of the multilayer printed board main body (1) is further provided with a welding heat dissipation device (3), the welding heat dissipation device (3) comprises a fixing frame (30), a micro motor (31) is arranged on the fixing frame (30), and the tail end of an output shaft of the micro motor (31) is provided with a fan (32).

4. The PTFE buried resistor multilayer printed board according to claim 3, characterized in that: welding heat abstractor (3) still including setting up conical tube (33) on mount (30), fan (32) orientation one side of conical tube (33), the bottom of conical tube (33) is provided with ventilation pipe (35).

5. The PTFE buried resistor multilayer printed board according to claim 4, characterized in that: the top end of the conical tube (33) is provided with a support frame (34), and the support frame (34) is fixedly arranged on the bottom surface of the fixing frame (30).