CN214620285U - Compound cooling device of plate belt behind zinc pot - Google Patents
Compound cooling device of plate belt behind zinc pot Download PDFInfo
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- CN214620285U CN214620285U CN202120554692.XU CN202120554692U CN214620285U CN 214620285 U CN214620285 U CN 214620285U CN 202120554692 U CN202120554692 U CN 202120554692U CN 214620285 U CN214620285 U CN 214620285U
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Abstract
The utility model discloses a composite cooling device for a zinc pot rear plate belt, which comprises a fan, wherein an air outlet port of the fan is connected with an air outlet through a cooling device to discharge cooling air, the cooling device is respectively provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are respectively connected into a cooling liquid tower and are correspondingly matched with the cooling device to form cooling liquid circulation, and the liquid cooling effect on the air discharged from the air outlet port is realized; the utility model discloses obviously promoted the cooling efficiency to the plate band behind the zinc pot, need not increase the amount of wind or increase the quick cooling effect that cooling segment length can satisfy plate band behind the zinc pot, especially adapted carries out scale popularization and application in current galvanized sheet material production line.
Description
Technical Field
The utility model belongs to the production field of galvanized sheet material, concretely relates to compound cooling device of plate band behind zinc pot.
Background
In a galvanized sheet production factory, it is extremely important to cool the sheet strip after the zinc pot (also called as the sheet strip after the zinc pot), and the sheet strip after the zinc pot needs to be cooled to a proper temperature before reaching a steering roller of a high tower. The conventional method in the prior art is to cool the air by using a traditional air cooling device. However, in order to achieve the purpose of rapid cooling, the conventional air cooling device inevitably increases the air volume or the length of the cooling section, and the increase of the air volume can cause the galvanized sheet to shake, thereby affecting the stable operation of the air knife; the increased length of the cooling section undoubtedly results in the overhigh height of the high tower of the subsequent station, and the process structure cost is increased.
After the production line of the galvanized sheet is constructed completely, a high tower is formed, the galvanized sheet is difficult to cool by increasing the height of the high tower, and if the air volume is increased, the vibration of the sheet strips is caused, and the problem that the cooling of the sheet strips is insufficient is caused undoubtedly by reducing the air speed.
The applicant therefore wishes to find a solution that improves on the above technical problem.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at a compound cooling device of slab band behind zinc pot has obviously promoted the cooling efficiency to slab band behind the zinc pot, need not increase the amount of wind or increase the cooling section length and can satisfy the quick cooling effect of slab band behind the zinc pot, especially adapted carries out the scale popularization and application in current galvanized sheet production line.
The utility model adopts the technical scheme as follows:
the utility model provides a compound cooling device of zinc pot back slab band, includes the fan, the air-out port of fan passes through cooling device and connects air outlet exhaust cooling air, wherein, cooling device is equipped with inlet and liquid outlet respectively, inlet and liquid outlet insert the coolant liquid tower respectively, with cooling device corresponds the cooperation and forms the coolant liquid circulation, realizes the liquid cooling effect to the air-out port exhaust air.
Preferably, the liquid inlet is connected with the cooling liquid tower through a liquid inlet pipeline, and the liquid outlet is connected with the cooling liquid tower through a liquid outlet pipeline.
Preferably, the liquid inlet pipeline is connected with the lower end of the cooling liquid tower, and the liquid outlet pipeline is connected with the upper end of the cooling liquid tower.
Preferably, the cooling device comprises a cooling pipeline connected with the air outlet port, the cooling pipeline is provided with a liquid inlet and a liquid outlet respectively, the cooling pipeline is connected with a cooling air pipeline in a sealing manner, and the cooling air pipeline is connected with the air outlet port and the air outlet respectively.
Preferably, fin-shaped cooling metal pieces located on the periphery of the cooling air pipeline are arranged inside the cooling air pipeline and used for increasing the contact area of cooling air and cooling liquid.
Preferably, the cooling air pipeline is in sealed connection with the fin-shaped cooling metal piece, so that cooling air is prevented from being polluted by cooling liquid.
Preferably, a semiconductor cooling device is arranged between the liquid inlet and the cooling liquid tower.
Preferably, the semiconductor cooling device comprises a water storage tank, and the semiconductor refrigeration sheet is arranged on the inner wall and/or the outer wall of the water storage tank.
Preferably, the cooling liquid is water.
Preferably, the fan is a centrifugal fan.
The utility model creatively provides that the cooling liquid circulation mainly formed by a cooling device and a cooling liquid tower is connected to the port of the fan on the basis of adopting fan air cooling, thereby forming the combined type liquid cooling effect of air outlet of the fan, finally realizing high-efficiency cooling air discharge, obviously improving the cooling efficiency of the rear plate strip of the zinc pot, meeting the quick cooling effect of the rear plate strip of the zinc pot without increasing the air quantity or increasing the length of the cooling section, and being very suitable for scale popularization and application in the existing galvanized plate production line; the utility model discloses still further provide and set up fin-shaped cooling metalwork inside cooling tube, can effectively increase inside the cooling tube, the area of contact of cooling air and coolant liquid can take away the heat of air more and reduce the problem of air promptly, further promote the cooling level.
Drawings
FIG. 1 is a schematic structural view of a composite cooling device for a rear plate belt of a zinc pot in the embodiment of the invention;
fig. 2 is a schematic view of a sectional structure in the cooling pipe of fig. 1.
Detailed Description
The embodiment of the utility model discloses compound cooling device of plate band behind zinc pot, including the fan, the air-out port of fan passes through cooling device and connects air outlet exhaust cooling air, and wherein, cooling device is equipped with inlet and liquid outlet respectively, and inlet and liquid outlet insert the coolant liquid tower respectively, correspond the cooperation with cooling device and form the coolant liquid circulation, realize the liquid cooling effect to by air-out port exhaust air.
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Referring to fig. 1 and 2, a composite cooling device 20 for a rear plate strip of a zinc pot comprises a fan 10, an air outlet port of the fan 10 is connected with an air outlet 13 through the cooling device 20 to discharge cooling air, wherein the cooling device 20 is respectively provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are respectively connected to a cooling liquid tower 30 and are correspondingly matched with the cooling device 20 to form cooling liquid circulation, so that a liquid cooling effect on the air discharged from the air outlet port is realized; particularly preferably, in the present embodiment, the cooling liquid is water, and the fan 10 is a centrifugal fan 10, which includes an air inlet port 11 and an air outlet port 12.
Preferably, in the present embodiment, the liquid inlet is connected to the cooling liquid tower 30 through a liquid inlet pipe 23, and the liquid outlet is connected to the cooling liquid tower 30 through a liquid outlet pipe 22; specifically, the liquid inlet pipe 23 is connected to the lower end of the cooling liquid tower 30, and the liquid outlet pipe 22 is connected to the upper end of the cooling liquid tower 30.
Preferably, in this embodiment, the cooling device 20 includes a cooling duct 24 connected to the air outlet port, the cooling duct 24 is respectively provided with a liquid inlet and a liquid outlet, and the interior of the cooling duct 24 is hermetically connected to a cooling air duct 25, and the cooling air duct 25 is respectively connected to the air outlet port 12 and the air outlet 13; further preferably, in the present embodiment, the cooling duct 24 is internally provided with fin-shaped cooling metal fittings 21 located on the outer periphery of the cooling air duct 25 for increasing the contact area between the cooling air and the cooling liquid; the cooling air pipeline 25 is hermetically connected with the fin-shaped cooling metal piece 21, so that the cooling air is prevented from being polluted by the cooling liquid.
Preferably, in the present embodiment, a semiconductor cooling device is further disposed between the liquid inlet and the cooling liquid tower 30; wherein, the semiconductor cooling device comprises a water storage tank 40, and semiconductor refrigeration sheets (not shown) are arranged on the inner wall and the outer wall of the water storage tank 40.
The fin-shaped cooling metal piece and the semiconductor cooling piece related to the embodiment of the present application are commercially available, and therefore, detailed descriptions of these parts are not provided in this embodiment.
On the basis of adopting the air cooling of the fan 10, the cooling liquid circulation mainly formed by the cooling device 20 and the cooling liquid tower 30 is creatively provided to be connected to the port of the fan 10, so that the combined type liquid cooling effect of air outlet of the fan 10 is formed, and finally, high-efficiency cooling air discharge is realized, the cooling efficiency of the rear plate strip of the zinc pot is obviously improved, the quick cooling effect of the rear plate strip of the zinc pot can be met without increasing the air volume or increasing the cooling section length, and the method is very suitable for scale popularization and application in the existing galvanized plate production line; the present embodiment further provides that the fin-shaped cooling metal member is disposed inside the cooling pipeline, so that the contact area between the cooling air and the cooling liquid inside the cooling pipeline can be effectively increased, and the problem that the heat of the air is taken away more, that is, the air is reduced, thereby further improving the cooling level.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The utility model provides a compound cooling device of zinc pot backplate area, includes the fan, its characterized in that, the air-out port of fan passes through cooling device and connects air outlet exhaust cooling air, wherein, cooling device is equipped with inlet and liquid outlet respectively, inlet and liquid outlet insert the coolant liquid tower respectively, with cooling device corresponds the cooperation and forms the coolant liquid circulation, realizes the liquid cooling effect to the air-out port exhaust air.
2. The compound cooling device of claim 1, wherein the liquid inlet is connected to the cooling liquid tower through a liquid inlet pipeline, and the liquid outlet is connected to the cooling liquid tower through a liquid outlet pipeline.
3. The compound cooling device as defined in claim 2, wherein the liquid inlet pipe is connected to the lower end of the cooling liquid tower, and the liquid outlet pipe is connected to the upper end of the cooling liquid tower.
4. The composite cooling device according to claim 1, wherein the cooling device comprises a cooling duct connected to the air outlet port, the cooling duct is provided with a liquid inlet and a liquid outlet, and is internally and hermetically connected with a cooling air duct, and the cooling air duct is connected to the air outlet port and the air outlet.
5. The compound cooling device according to claim 4, wherein the cooling duct is internally provided with fin-shaped cooling metal members located on the periphery of the cooling duct for increasing the contact area of the cooling air and the cooling liquid.
6. The composite cooling device of claim 5, wherein the cooling air duct is hermetically connected with the fin-shaped cooling metal member, so that the cooling air is prevented from being polluted by the cooling liquid.
7. The compound cooling device of claim 1, wherein a semiconductor cooling device is arranged between the liquid inlet and the cooling liquid tower.
8. The compound cooling device according to claim 7, wherein the semiconductor cooling device comprises a water storage tank, and a semiconductor refrigeration sheet is arranged on the inner wall and/or the outer wall of the water storage tank.
9. The compound cooling device of claim 1, wherein the cooling fluid is water.
10. The compound cooling device of claim 1, wherein the fan is a centrifugal fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120554692.XU CN214620285U (en) | 2021-03-18 | 2021-03-18 | Compound cooling device of plate belt behind zinc pot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120554692.XU CN214620285U (en) | 2021-03-18 | 2021-03-18 | Compound cooling device of plate belt behind zinc pot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214620285U true CN214620285U (en) | 2021-11-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120554692.XU Active CN214620285U (en) | 2021-03-18 | 2021-03-18 | Compound cooling device of plate belt behind zinc pot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214620285U (en) |
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2021
- 2021-03-18 CN CN202120554692.XU patent/CN214620285U/en active Active
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