CN215998132U

CN215998132U - Cooling device is used in copper pipe processing that cooling effect is good

Info

Publication number: CN215998132U
Application number: CN202122216755.3U
Authority: CN
Inventors: 杨永敏; 杨柳; 李善乐; 贾蕾蕾; 马学盛; 方德涛
Original assignee: Qingdao Hongao Copper Pipe Co ltd
Current assignee: Qingdao Hongao Copper Pipe Co ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-03-11
Anticipated expiration: 2031-09-14

Abstract

The utility model discloses a cooling device is used in processing of copper pipe that cooling effect is good, including the cooling device body, the inside of cooling device body is provided with the structure that is used for cooling down to the copper pipe, the right side of cooling device body is provided with the structure that is used for cooling down to water for the structure that cools down to the copper pipe is including setting up the water tank on cooling device body right side, the left side fixedly connected with water pump one at water tank top, the output intercommunication of water pump one has the outlet pipe, the bottom of outlet pipe runs through to the inside of water tank, the input intercommunication of water pump one has the drain pipe. The utility model discloses a set up semiconductor refrigeration piece and a pair of water of fin and cool down, radiator fan dispels the heat through the fin to the semiconductor refrigeration piece, has solved current cooling device and has used the water to cool down the copper pipe usually, and the temperature of long-time back water that uses risees gradually, leads to the problem that cooling rate reduced.

Description

Cooling device is used in copper pipe processing that cooling effect is good

Technical Field

The utility model relates to a copper pipe processing technology field specifically is a cooling device is used in copper pipe processing that cooling effect is good.

Background

Copper pipe processing man-hour copper pipe temperature can rise gradually, need use cooling device to cool off the copper pipe, and current cooling device uses the water to cool off the copper pipe usually, and the temperature of long-time back water that uses rises gradually, leads to cooling speed to reduce.

SUMMERY OF THE UTILITY MODEL

For solving the problem that proposes among the above-mentioned background art, the utility model aims to provide a cooling device is used in copper pipe processing that cooling effect is good, possess cooling effect's advantage, solved current cooling device and used the water to cool down the copper pipe usually, the temperature of long-time back water that uses risees gradually, leads to the problem that cooling rate reduced.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cooling device is used in processing of copper pipe that cooling effect is good, includes the cooling device body, the inside of cooling device body is provided with and is used for carrying out the structure that cools down to the copper pipe, the right side of cooling device body is provided with and is used for carrying out the structure that cools down to water.

As the utility model discloses it is preferred for the structure for cooling down the copper pipe is including setting up the water tank on cooling device body right side, the left side fixedly connected with water pump one at water tank top, the output intercommunication of water pump one has the outlet pipe, the bottom of outlet pipe runs through to the inside of water tank, the input intercommunication of water pump one has the drain pipe, the drain pipe is kept away from the one end intercommunication of water pump one in the bottom of cooling device body, the left bottom intercommunication of water tank has inlet tube one, the top intercommunication of inlet tube one has water pump two, the output intercommunication of water pump two has inlet tube two, the inside intercommunication that runs through to the cooling device body in the bottom of inlet tube two has the spray pipe, the bottom intercommunication of spray pipe has the sprinkler bead.

As the utility model discloses preferred, a fin one for carrying out the structure that cools down to water includes fixed connection in water tank inner wall left side bottom, the bottom fixedly connected with semiconductor refrigeration piece on water tank right side, the right side fixedly connected with fin two of semiconductor refrigeration piece, the bottom fixedly connected with fixed plate on water tank right side, the inboard fixedly connected with of fixed plate is located the radiator fan on two right sides of fin.

As the utility model discloses it is preferred, the equal fixedly connected with supporting shoe in both sides of cooling device body inner wall, the top of supporting shoe is provided with the filter screen.

As the utility model discloses it is preferred, the fixed surface of filter screen is connected with the seal cover, the left side fixedly connected with of filter screen draws the piece.

As the utility model discloses it is preferred, the water inlet has been seted up on the right side at water tank top, the inside of water tank is provided with the corrosion-resistant layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up semiconductor refrigeration piece and a pair of water of fin and cool down, radiator fan dispels the heat through the fin to the semiconductor refrigeration piece, has solved current cooling device and has used the water to cool down the copper pipe usually, and the temperature of long-time back water that uses risees gradually, leads to the problem that cooling rate reduced.

2. The utility model discloses a set up water tank, water pump two, inlet tube one, spray pipe and sprinkler bead, can cool down the copper pipe through spraying the cooling water, improved the practicality of cooling device body.

3. The utility model discloses a set up fin one, fin two, semiconductor refrigeration piece and radiator fan, can cool down to the water of water tank inside, improved the cooling effect of cooling device body.

4. The utility model discloses a set up the filter screen, can filter the cooling water, improved the reuse rate of cooling water.

5. The utility model discloses a set up the seal cover, can seal the gap between filter screen and the cooling device body, prevent that water from flowing through the gap, improved the leakproofness of cooling device body.

6. The utility model discloses a set up corrosion-resistant layer, can prevent that the water tank from being corroded, improved the life of water tank.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the present invention at A in FIG. 1;

fig. 3 is a schematic view of the three-dimensional structure of the water tank of the present invention.

In the figure: 1. a cooling device body; 2. a water tank; 3. a first water pump; 4. a water outlet pipe; 5. a drain pipe; 6. a first water inlet pipe; 7. a second water pump; 8. a water inlet pipe II; 9. a water spray pipe; 10. a sprinkler head; 11. a first heat sink; 12. a semiconductor refrigeration sheet; 13. a second heat sink; 14. a fixing plate; 15. a heat radiation fan; 16. a support block; 17. a filter screen; 18. sealing sleeves; 19. pulling the block; 20. a water inlet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 to 3, the utility model provides a pair of cooling device is used in processing of copper pipe that cooling effect is good, including cooling device body 1, the inside of cooling device body 1 is provided with and is used for carrying out the structure that cools down to the copper pipe, and the right side of cooling device body 1 is provided with and is used for carrying out the structure that cools down to water.

Referring to fig. 1, a structure for cooling down copper pipe is including setting up water tank 2 on cooling device body 1 right side, left side fixedly connected with water pump 3 at 2 tops of water tank, the output intercommunication of water pump 3 has outlet pipe 4, the bottom of outlet pipe 4 runs through to the inside of water tank 2, the input intercommunication of water pump 3 has drain pipe 5, the one end intercommunication that water pump 3 was kept away from to drain pipe 5 is in the bottom of cooling device body 1, the left bottom intercommunication of water tank 2 has inlet tube one 6, the top intercommunication of inlet tube one 6 has water pump two 7, the output intercommunication of water pump two 7 has inlet tube two 8, the inside intercommunication that the bottom of inlet tube two 8 runs through to cooling device body 1 has spray pipe 9, the bottom intercommunication of spray pipe 9 has sprinkler bead 10.

As a technical optimization scheme of the utility model, through setting up water tank 2, two 7 of water pumps, inlet tube 6, spray pipe 9 and sprinkler bead 10, can cool down the copper pipe through spraying the cooling water, improved the practicality of cooling device body 1.

Referring to fig. 2, the structure for cooling water includes a first heat sink 11 fixedly connected to the bottom of the left side of the inner wall of the water tank 2, a semiconductor refrigeration plate 12 fixedly connected to the bottom of the right side of the water tank 2, a second heat sink 13 fixedly connected to the right side of the semiconductor refrigeration plate 12, a fixing plate 14 fixedly connected to the bottom of the right side of the water tank 2, and a heat dissipation fan 15 fixedly connected to the inner side of the fixing plate 14 and located on the right side of the second heat sink 13.

As a technical optimization scheme of the utility model, through setting up fin 11, two 13, semiconductor refrigeration pieces 12 and radiator fan 15, can cool down the water of 2 inside of water tanks, improved the cooling effect of cooling device body 1.

Referring to fig. 1, support blocks 16 are fixedly connected to both sides of the inner wall of the cooling device body 1, and a filter screen 17 is disposed on the top of each support block 16.

As a technical optimization scheme of the utility model, through setting up filter screen 17, can filter the cooling water, improved the reuse rate of cooling water.

Referring to fig. 1, a sealing sleeve 18 is fixedly connected to the surface of the filter screen 17, and a pull block 19 is fixedly connected to the left side of the filter screen 17.

As a technical optimization scheme of the utility model, through setting up seal cover 18, can seal the gap between filter screen 17 and the cooling device body 1, prevent that water from flowing through the gap, improved the leakproofness of cooling device body 1.

Referring to fig. 1, a water inlet 20 is opened at the right side of the top of the water tank 2, and a corrosion-resistant layer is provided inside the water tank 2.

As a technical optimization scheme of the utility model, through setting up corrosion-resistant layer, can prevent that water tank 2 from being corroded, improved water tank 2's life.

The utility model discloses a theory of operation and use flow: during the use, the user starts two 7 of water pumps, two 7 of water pumps are through inlet tube one 6, two 8 of inlet tube, spray pipe 9 and sprinkler bead 10 carry out water spray cooling to the copper pipe, the water after the cooling passes through filter screen 17, drain pipe 5, water pump one 3 and outlet pipe 4 entering water tank 2, semiconductor refrigeration piece 12 is cooled down through a 11 inside water of fin to water tank 2, radiator fan 15 dispels the heat through two 13 of fin to semiconductor refrigeration piece 12, can possess the good effect of cooling effect.

In summary, the following steps: this cooling device is used in copper pipe processing that cooling effect is good cools down water through semiconductor refrigeration piece 12 and fin 11, and radiator fan 15 dispels the heat through fin two 13 to semiconductor refrigeration piece 12, has solved current cooling device and has used the water to cool down the copper pipe usually, and the temperature of long-time back water that uses risees gradually, leads to the problem that cooling rate reduces.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A cooling device with good cooling effect for processing a copper pipe comprises a cooling device body (1);

the method is characterized in that: the structure that is used for carrying out the cooling to the copper pipe is provided with in the inside of cooling device body (1), the right side of cooling device body (1) is provided with the structure that is used for carrying out the cooling to water.

2. A cooling device for processing a copper pipe with good cooling effect according to claim 1, characterized in that: the structure for cooling the copper pipe comprises a water tank (2) arranged on the right side of a cooling device body (1), a first water pump (3) is fixedly connected to the left side of the top of the water tank (2), an output end of the first water pump (3) is communicated with a water outlet pipe (4), the bottom of the water outlet pipe (4) penetrates through the inside of the water tank (2), an input end of the first water pump (3) is communicated with a water outlet pipe (5), one end, far away from the first water pump (3), of the water outlet pipe (5) is communicated with the bottom of the cooling device body (1), the left bottom of the water tank (2) is communicated with a first water inlet pipe (6), the top of the first water inlet pipe (6) is communicated with a second water pump (7), an output end of the second water pump (7) is communicated with a second water inlet pipe (8), and the bottom of the second water inlet pipe (8) penetrates through the inside of the cooling device body (1) and is communicated with a water spray pipe (9), the bottom of the water spraying pipe (9) is communicated with a water spraying head (10).

3. A cooling device for processing a copper pipe with good cooling effect as claimed in claim 2, wherein: a structure for cooling down to water includes fixed connection at the fin one (11) of water tank (2) inner wall left side bottom, bottom fixedly connected with semiconductor refrigeration piece (12) on water tank (2) right side, the right side fixedly connected with fin two (13) of semiconductor refrigeration piece (12), bottom fixedly connected with fixed plate (14) on water tank (2) right side, the inboard fixedly connected with of fixed plate (14) is located radiator fan (15) on fin two (13) right side.

4. A cooling device for processing a copper pipe with good cooling effect according to claim 1, characterized in that: the cooling device is characterized in that supporting blocks (16) are fixedly connected to two sides of the inner wall of the cooling device body (1), and a filter screen (17) is arranged at the top of each supporting block (16).

5. A cooling device for processing a copper pipe with good cooling effect as claimed in claim 4, wherein: the surface of the filter screen (17) is fixedly connected with a sealing sleeve (18), and the left side of the filter screen (17) is fixedly connected with a pulling block (19).

6. A cooling device for processing a copper pipe with good cooling effect as claimed in claim 2, wherein: a water inlet (20) is formed in the right side of the top of the water tank (2), and a corrosion-resistant layer is arranged inside the water tank (2).