CN214600917U - Silicon chip washs and throws control system - Google Patents
Silicon chip washs and throws control system Download PDFInfo
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- CN214600917U CN214600917U CN202022870810.6U CN202022870810U CN214600917U CN 214600917 U CN214600917 U CN 214600917U CN 202022870810 U CN202022870810 U CN 202022870810U CN 214600917 U CN214600917 U CN 214600917U
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- speed reducer
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Abstract
The utility model provides a silicon chip washs and throws control system has: a driving part for providing power; a driven part for driving the tray for placing the sheet basket to throw; and a connecting portion for connecting the driving portion and the driven portion; the driving part and the connecting part are arranged on the same side, and the driving part is arranged on the same side of the machine body or respectively arranged on two sides of the machine body; the drive portion includes a driving source at least, the drive portion passes through connecting portion drive driven portion drives the tray is thrown and is moved. The throwing control system designed by the utility model has simple structure, few matching parts, small installation occupied area, stable operation of throwing control and high equipment utilization rate; the stability of silicon wafer cleaning is ensured, and the silicon wafer cleaning quality is improved.
Description
Technical Field
The utility model belongs to the technical field of solar energy silicon chip cleaning equipment, especially, relate to a silicon chip washs throws control system.
Background
In the silicon chip cleaning process, outside the washing tank, the structure of the existing throwing control system for controlling the cleaning of the wafer basket is complex, connecting plates are arranged at the end part and the tail part of the cleaning equipment, and then the throwing control of the wafer basket is completed jointly through the matching of other groups of parts spanning the two sides of the whole unit, so that the control process is complex, the matching requirement on each part of installation assemblies is high, the service life cycle of a bearing is shortened, the fault is easy to occur, the equipment is unstable in operation, the cleaning quality of the silicon chip is influenced, and the consumption of spare parts is increased. Meanwhile, the control system installed on both sides needs to be maintained in time, and because the space inside the machine table is limited, the double-side installation not only occupies a large space, but also consumes long time when fault maintenance or maintenance is performed each time, and the use efficiency of production equipment is seriously affected.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon chip washs throws and controls control system, is particularly useful for cleaning equipment's throwing control, has solved the throwing control system among the prior art and has leaded to cleaning equipment operation unstable, cleaning quality poor, the technical problem that equipment utilization is low easily.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a silicon wafer cleaning and polishing control system comprises:
a driving part for providing power;
a driven part for driving the tray for placing the sheet basket to throw;
and a connecting portion for connecting the driving portion and the driven portion;
the driving part and the connecting part are arranged on the same side, and the driving part is arranged on the same side of the machine body or respectively arranged on two sides of the machine body; the drive portion includes a driving source at least, the drive portion passes through connecting portion drive driven portion drives the tray is thrown and is moved.
Further, the driven part is arranged along the width direction of the machine body, and comprises:
the driven shafts I and II are arranged in parallel;
the eccentric devices are arranged at two ends of the first driven shaft and the second driven shaft and are symmetrically arranged;
the axis of the eccentric device is arranged in the same direction as the axes of the first driven shaft and the second driven shaft, and the eccentric device is arranged under the tray and is in contact with the lower end face of the tray.
Further, the height of the eccentric device connected with the first driven shaft is the same as that of the eccentric device connected with the second driven shaft, and the eccentric devices synchronously deflect in the same direction.
Furthermore, the connecting part at least comprises a first speed reducer and a second speed reducer, and the first speed reducer is arranged at any end part of the first driven shaft and is connected with the first driven shaft; and the second speed reducer is arranged at any end part of the second driven shaft and is connected with the second driven shaft.
Further, the driving part includes one driving source, and the driving source is disposed in a height direction of the body.
Further, the driving source, the first speed reducer and the second speed reducer are both arranged on the same side of the machine body, and the driving source is arranged between the first speed reducer and the second speed reducer.
Furthermore, the driving part further comprises a driving shaft and couplers arranged at two ends of the driving shaft, and the driving shaft is connected with the first speed reducer and the second speed reducer through the couplers respectively.
Furthermore, connecting portion still include speed reducer three, speed reducer three with the output of driving source is connected, and by the driving shaft runs through the setting and will the power of driving source is exported in the driven shaft one and the driven shaft two in step.
Further, the driving part comprises two driving sources, and the driving sources are directly connected with the first speed reducer and the second speed reducer respectively.
Further, the driving source connected with the first speed reducer and the driving source connected with the second speed reducer are arranged on the same side of the machine body or on two sides of the machine body respectively.
Compared with the prior art, the throwing control system designed by the utility model has simple structure, few matching parts, small installation occupied area, stable operation of throwing control and low fault operation rate, thereby improving the service cycle of the bearing, being convenient for maintenance, saving resources and having high equipment utilization rate; further, the stability of silicon wafer cleaning is ensured, and the silicon wafer cleaning quality is improved.
Drawings
Fig. 1 is a schematic structural diagram of a projectile control system according to a first embodiment of the present invention;
fig. 2 is a side view of a projectile control system in accordance with a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a projectile control system according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of another projectile control system according to a second embodiment of the present invention.
In the figure:
10. body 20, drive unit 21, and drive source
22. Drive shaft 23, drive source 24, and coupling
30. Driven part 31, driven shaft one 32 and driven shaft two
33. Eccentric device 40, connecting part 41 and first speed reducer
42. Speed reducer II 43, speed reducer III 50 and tray
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The first embodiment is as follows:
the embodiment proposes a silicon wafer cleaning and polishing control system, as shown in fig. 1 and fig. 2, comprising a driving part 20 for providing power, a driven part 30 for driving a tray 50 for placing a wafer basket to perform polishing, and a connecting part 40 for connecting the driving part 20 and the driven part 30; wherein, the driving part 20 and the connecting part 40 are both arranged at any side of the length direction of the machine body 10 at the same side; the driven part 30 is arranged along the width direction of the machine body 10 and penetrates the width of the machine body 10, and the driven part 30 is positioned below the tray 50 and is in contact with the lower end surface of the tray 50; in operation, the driving portion 20 drives the driven portion 22 via the connecting portion 40 to vertically throw the tray 50 up and down.
Specifically, in the present embodiment, the driving part 20 includes a driving source 21 and a driving shaft 22, and the driving source 21 simultaneously transmits kinetic energy to the driven shafts one 31 and two 32 in the driven part 30, so that, in order to save space, the driving source 21 is particularly disposed at a position between the driven shafts one 31 and two 32, preferably, at a position intermediate between the driven shafts one 31 and two 32 and perpendicular to the height direction of the machine body 10. Because the kinetic energy of the driving source 21 is large, the kinetic energy required by the transmission to the driven shafts one 31 and two 32 needs to be changed in speed, the three speed reducers 43 in the connecting part 40 are connected with the output end of the driving source 21, and the three speed reducers 43 are arranged by the driving shaft 22 in a penetrating way and transmit the power output by the driving source 21 to the driven shafts one 31 and two 32 synchronously through the driving shaft 22. Preferably, the driving source 21 is a motor, and the type of the motor may be determined according to practical situations, and is not particularly limited herein.
Further, the driven part 30 includes a first driven shaft 31 and a second driven shaft 32 which are arranged in parallel in the width direction of the machine body 10, and eccentric devices 33 which are symmetrically arranged and are disposed at both ends of the first driven shaft 31 and the second driven shaft 32. That is, the driven part 30 includes four eccentric devices 33, the first driven shaft 31 and the second driven shaft 32 are respectively provided with two eccentric devices 33, the heights of the eccentric devices 33 on each driven shaft are the same, and the eccentric devices are deflected synchronously in the same direction, and the two eccentric devices 33 arranged on the same driven shaft are symmetrically arranged relative to the length direction of the tray 50; the axes of all the eccentric devices 33 are arranged in the same direction as the axes of the first driven shafts 31 and the second driven shafts 32, and the eccentric devices 33 are disposed right below the tray 50 and are in contact with the lower end surface of the tray 50. Preferably, the eccentric device 33 is an eccentric bearing, such as a deep groove ball bearing with 6024-2RS type seal rings on both sides, and this type of eccentric bearing is provided to ensure mounting accuracy and improve mechanical accuracy, and to prevent deterioration of mechanical properties due to characteristic deviation thereof.
Further, the connecting portion 40 further includes a first speed reducer 41 and a second speed reducer 42, the first speed reducer 41 is disposed at an end portion of the first driven shaft 31 in a direction close to the driving source 21, and is connected to the first driven shaft 31; the second speed reducer 42 is disposed at an end portion of the second driven shaft 32 in a direction close to the driving source 21, and is connected to the second driven shaft 32. The first speed reducer 41 and the second speed reducer 42 are both fixedly arranged on the outer side wall of the machine body 10 and are respectively connected with the two ends of the driving shaft 22 through the couplers 24. In order to ensure that the rotational speed of the first driven shaft 31 and the eccentric 33 arranged on the first driven shaft 31 is the same as the rotational speed of the second driven shaft 32 and the eccentric 33 arranged on the second driven shaft 32, the first speed reducer 41 and the second speed reducer 42 are required to be of the same type.
Further, due to the limitation of the installation space of the machine body 10 in the device, and in order to ensure that the connection area occupied by the connection portion 40 with the driving portion 20 and the driven portion 30 is smaller, it is preferable that the first speed reducer 41, the second speed reducer 42, the third speed reducer 43 and the driving source 21 are all disposed along the height direction of the machine body 10 and are all disposed on the same side of the machine body 10.
When the device works, the driving source 21 changes the output power through the speed reducer III 43 to drive the driving shaft 22 to rotate; the driving shaft 22 transmits kinetic energy to a first speed reducer 41 and a second speed reducer 42 synchronously through couplings 24 arranged at two end parts of the driving shaft respectively; the first speed reducer 41 drives the first driven shaft 31 to rotate and drives the eccentric device 33 arranged on the first driven shaft 31 to rotate together; meanwhile, the second speed reducer 42 drives the second driven shaft 32 to rotate and drives the eccentric device 33 arranged on the second driven shaft 32 to rotate together; therefore, all the eccentric devices 33 synchronously rotate in the same direction, and further drive the tray 50 to move up and down in a throwing manner, so that the silicon wafers placed in the wafer basket are cleaned.
The throwing control system with the structure only needs one driving source 21 to provide kinetic energy for the first driven shaft 31 and the second driven shaft 32, and the first driven shaft 41, the second driven shaft 42 and the third driven shaft 43 are respectively connected to adjust the change of the installation relative position between the driving shaft 22 and the driven shaft, and the driving part 20 and the connecting part 40 are located on the same side except the driven part 30, so that the structure is simple, the number of matched components is small, and meanwhile, the maintenance is convenient.
The driving source 21, the first speed reducer 41, the second speed reducer 42 and the third speed reducer 43 which are vertically arranged enable the installation occupied area to be small, and the utilization rate of space is improved. The throwing control of the structure has stable integral operation and low fault operation rate, thereby improving the service cycle of the bearing, being convenient to maintain, saving resources and having high equipment utilization rate; further, the stability of silicon wafer cleaning is ensured, and the silicon wafer cleaning quality is improved.
Example two:
compared with the first embodiment, the biggest difference of the present embodiment is that: the driving part 20 comprises two driving sources, namely a driving source 21 and a driving source 23, and does not need a driving shaft 22 and a coupling 24; meanwhile, the connecting part 40 does not need the third speed reducer 43. In the embodiment, the driving source 21 is connected with the first speed reducer 41 connected with the first driven shaft 31 and provides power for the first driven shaft 31 independently; the driving source 23 is connected to the second speed reducer 42 connected to the second driven shaft 32, and supplies power to the second driven shaft 32 alone. In order to ensure that the driven shafts 21 and 32 synchronously and synchronously drive the eccentric device 33 to rotate in the same direction at the same frequency, the driving source 21 and the driving source 23 are preferably motors of the same type; and are all fixedly disposed on the side wall of the machine body 10.
As shown in fig. 3, the driving source 21 and the driving source 23 are both disposed on the same side of the machine body 10, that is, the driving source 21, the driving source 23, the first speed reducer 41 and the second speed reducer 42 are all disposed on the same side, and the driving source 21 is disposed right below the first speed reducer 41; the driving source 22 is arranged right below the second speed reducer 42; and all driving sources and speed reducers are vertically arranged on the outer wall of the machine body 10.
As shown in fig. 4, the driving source 21 and the driving source 23 are separately disposed on both sides of the machine body 10, and accordingly, the first speed reducer 41 and the second speed reducer 42 are also separately disposed on both sides of the machine body 10 along with the driving source 21 and the driving source 23.
In the embodiment, the driving source 21 controls the first driven shaft 31 through the first speed reducer 41, and the driving source 23 controls the second driven shaft 32 through the second speed reducer 42, so that the tray 50 is thrown through the eccentric device 33 independently and synchronously in the same direction and the same frequency. The throwing control system with the structure has the advantages that fewer parts are adopted, the installation position is relatively free, too much installation space is not occupied, meanwhile, the stability of throwing operation can be ensured, and the maintenance is convenient; the first driven shaft 31 and the second driven shaft 32 are not interfered with each other, the service life is further prolonged, and the production cost is reduced.
Compared with the prior art, the throwing control system designed by the utility model has simple structure, few matching parts, small installation occupied area, stable operation of throwing control and low fault operation rate, thereby improving the service cycle of the bearing, being convenient for maintenance, saving resources and having high equipment utilization rate; further, the stability of silicon wafer cleaning is ensured, and the silicon wafer cleaning quality is improved.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. A silicon wafer cleaning and polishing control system is characterized by comprising:
a driving part for providing power;
a driven part for driving the tray for placing the sheet basket to throw;
and a connecting portion for connecting the driving portion and the driven portion;
the driving part and the connecting part are arranged on the same side, and the driving part is arranged on the same side of the machine body or respectively arranged on two sides of the machine body; the drive portion includes a driving source at least, the drive portion passes through connecting portion drive driven portion drives the tray is thrown and is moved.
2. The silicon wafer cleaning and polishing control system as claimed in claim 1, wherein the driven part is arranged along the width direction of the machine body, and comprises:
the driven shafts I and II are arranged in parallel;
the eccentric devices are arranged at two ends of the first driven shaft and the second driven shaft and are symmetrically arranged;
the axis of the eccentric device is arranged in the same direction as the axes of the first driven shaft and the second driven shaft, and the eccentric device is arranged under the tray and is in contact with the lower end face of the tray.
3. The silicon wafer cleaning and polishing control system as claimed in claim 2, wherein the height of the eccentric device connected with the first driven shaft is the same as the height of the eccentric device connected with the second driven shaft, and the eccentric devices are synchronously deflected in the same direction.
4. The silicon wafer cleaning and polishing control system as claimed in claim 2 or 3, wherein the connecting portion at least comprises a first speed reducer and a second speed reducer, the first speed reducer is disposed at any end of the first driven shaft and connected with the first driven shaft; and the second speed reducer is arranged at any end part of the second driven shaft and is connected with the second driven shaft.
5. The silicon wafer cleaning and polishing control system as claimed in claim 4, wherein the driving part includes one of the driving sources, and the driving source is disposed along a height direction of the body.
6. The silicon wafer cleaning and polishing control system as claimed in claim 5, wherein the driving source and the first speed reducer and the second speed reducer are disposed on the same side of the body, and the driving source is disposed between the first speed reducer and the second speed reducer.
7. The silicon wafer cleaning and polishing control system according to claim 5 or 6, characterized in that the driving part further comprises a driving shaft and couplers arranged at two ends of the driving shaft, and the driving shaft is connected with the first speed reducer and the second speed reducer through the couplers respectively.
8. The silicon wafer cleaning and polishing control system as claimed in claim 7, wherein the connecting portion further comprises a third speed reducer, the third speed reducer is connected with the output end of the driving source and is penetrated by the driving shaft to synchronously output the power of the driving source to the first driven shaft and the second driven shaft.
9. The silicon wafer cleaning and polishing control system as claimed in claim 4, wherein the driving part comprises two driving sources, and the driving sources are directly connected with the first speed reducer and the second speed reducer respectively.
10. The silicon wafer cleaning and polishing control system as claimed in claim 9, wherein the driving source connected to the first speed reducer and the driving source connected to the second speed reducer are disposed on the same side of the body or on both sides of the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022870810.6U CN214600917U (en) | 2020-12-03 | 2020-12-03 | Silicon chip washs and throws control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022870810.6U CN214600917U (en) | 2020-12-03 | 2020-12-03 | Silicon chip washs and throws control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214600917U true CN214600917U (en) | 2021-11-05 |
Family
ID=78428992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022870810.6U Active CN214600917U (en) | 2020-12-03 | 2020-12-03 | Silicon chip washs and throws control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214600917U (en) |
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2020
- 2020-12-03 CN CN202022870810.6U patent/CN214600917U/en active Active
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