CN213004651U

CN213004651U - Auxiliary device is used in production of hypervelocity semiconductor laser

Info

Publication number: CN213004651U
Application number: CN202021780675.XU
Authority: CN
Inventors: 孙欢
Original assignee: Wuhan Xinruichuanqi Technology Co ltd
Current assignee: Wuhan Xinruichuanqi Technology Co ltd
Priority date: 2020-08-24
Filing date: 2020-08-24
Publication date: 2021-04-20
Anticipated expiration: 2030-08-24

Abstract

The utility model discloses an auxiliary device is used in production of hypervelocity semiconductor laser, including bottom plate, driving motor, limiting plate, spacing ring, operation panel, supplementary pad and stop gear, driving motor is installed at the top of bottom plate, and driving motor's output shaft has the lead screw through the coupling joint, and the lead screw cover has been cup jointed on the surface of lead screw, and the side fixedly connected with diaphragm of lead screw cover, the right side of diaphragm set up quantity be two with the limiting plate, and fixedly connected with quantity is two soft strip between two limiting plates, two top and below swing joint that lie in soft strip between the limiting plate have the connecting plate, are provided with the spacing ring on the connecting plate, the operation panel is installed at the top of bottom plate. The utility model discloses a use of soft strip and spacing ring can carry out the adjustment type according to the semiconductor laser shape difference of production fixed, guarantees the stability of course of working, and the position of injecing, the production and processing of better supplementary semiconductor laser can be adjusted in the use of driving motor and lead screw cover.

Description

Auxiliary device is used in production of hypervelocity semiconductor laser

Technical Field

The utility model relates to a semiconductor laser technical field especially relates to an auxiliary device is used in production of hypervelocity semiconductor laser.

Background

Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as the working substance. Due to the difference of material structures, the specific processes of different types of laser generation are special, the excitation mode comprises three modes of electric injection, electron beam excitation and optical pumping, a semiconductor laser device can be divided into a homojunction, a single heterojunction, a double heterojunction and the like, the homojunction laser and the single heterojunction laser are mostly pulse devices at room temperature, and the double heterojunction laser can realize continuous work at room temperature.

The semiconductor diode laser is the most practical and important laser, the volume is small, the service life is long, the surface of the semiconductor laser needs to be polished and painted in the processing process, the processing operation is easily affected by shaking and some external factors, and the processing process is interrupted, so that an auxiliary device for producing the ultra-high-speed semiconductor laser is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

For overcoming the problem that exists among the correlation technique, the embodiment of the utility model provides an auxiliary device is used in production of hypervelocity semiconductor laser, has solved present semiconductor laser and has received external influence's problem easily.

The embodiment of the utility model provides an auxiliary device is used in production of hypervelocity semiconductor laser, including bottom plate, driving motor, limiting plate, spacing ring, operation panel, auxiliary pad and stop gear, driving motor is installed at the top of bottom plate, driving motor's output shaft has the lead screw through the coupling joint, the lead screw surface has cup jointed the lead screw cover, the side fixedly connected with diaphragm of lead screw cover, the right side of diaphragm sets up two limiting plates, fixedly connected with two soft strips between two limiting plates, two be located the top and the below swing joint connecting plate of soft strip between the limiting plate, be provided with the spacing ring on the connecting plate, the operation panel is installed at the top of bottom plate, the top of bottom plate is located operation panel right side fixedly connected with mounting panel, the left side of mounting panel is provided with the auxiliary pad, the auxiliary pad sets up on the operation panel, the top of bottom plate is located the left side of mounting panel and is provided with quantity be two stop gear.

Further, the top fixedly connected with spacing dish of lead screw, the diameter of spacing dish is greater than the diameter of lead screw.

Furthermore, the right side of diaphragm is seted up flutedly, is provided with two pivots on the inner wall of recess, and the opposite side of two pivots all rotates and is connected with the limiting plate.

Furthermore, a movable shaft is arranged at the joint of the side face of the limiting plate and the connecting plate, and the movable shaft is rotatably connected with the connecting plate.

Further, stop gear includes disc, circle axle and baffle, the top fixedly connected with circle axle of disc, the surface rotation of circle axle is connected with the baffle.

The embodiment of the utility model provides a technical scheme has following beneficial effect: through the use of soft strip and spacing ring, can carry out the adjustment type according to the semiconductor laser shape difference of production fixed, guarantee the stability of course of working, and the position of injecing can be adjusted in the use of driving motor and screw rod cover, the production and processing of better supplementary semiconductor laser, and the use of stop gear and supplementary pad can be further spacing fixed carrying on semiconductor laser, the process of the processing of messenger more smooth.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic structural diagram of an auxiliary device for producing an ultra-high speed semiconductor laser according to an embodiment of the present invention.

Fig. 2 is the embodiment of the utility model provides an auxiliary device limiting plate's for production of hypervelocity semiconductor laser structure schematic diagram.

Fig. 3 is a top view of the auxiliary device for producing an ultra-high speed semiconductor laser according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus, and associated applications, methods, consistent with certain aspects of the invention, as detailed in the following claims.

FIG. 1 is a schematic structural diagram of an auxiliary device for producing an ultra-high speed semiconductor laser in an embodiment of the present invention, FIG. 2 is a schematic structural diagram of a limiting plate of the auxiliary device for producing the ultra-high speed semiconductor laser in an embodiment of the present invention, FIG. 3 is a schematic structural diagram of the auxiliary device for producing the ultra-high speed semiconductor laser in an embodiment of the present invention, as shown in FIG. 1, FIG. 2 and FIG. 3, the auxiliary device for producing the ultra-high speed semiconductor laser in an embodiment of the present invention comprises a bottom plate 1, a driving motor 2, a limiting plate 6, a limiting ring 9, an operation plate 11, an auxiliary pad 13 and a limiting mechanism 14, the driving motor is installed on the top of the bottom plate, an output shaft of the driving motor is connected with a screw rod 3 through a coupling, the top of the screw rod is fixedly connected with a, the lead screw cover 4 has been cup jointed on the surface of lead screw, the lead screw cover drives the diaphragm and carries out the removal from top to bottom, the semiconductor laser's that can process as required difference in height is adjusted, adapt to different products, the side fixedly connected with diaphragm 5 of lead screw cover, the right side of diaphragm sets up quantity and is two limiting plate, the right side of diaphragm is seted up flutedly, be provided with two pivots 7 on the inner wall of recess, the opposite side of two pivots all rotates and is connected with the limiting plate, fixedly connected with quantity is two soft strip 10 between two limiting plates, inject semiconductor laser's production and processing position.

The upper part and the lower part of the soft strip between the two limiting plates are movably connected with a connecting plate 8, the connecting part of the side face of each limiting plate and the connecting plate is provided with a movable shaft, the movable shaft is rotatably connected with the connecting plate, a limiting ring 9 is arranged on the connecting plate, the semiconductor laser is further limited in position, the semiconductor laser is assisted to perform the next processing flow, an operating plate is arranged at the top of the bottom plate, the top of the bottom plate is positioned at the right side of the operating plate and is fixedly connected with a mounting plate 12, an auxiliary pad 13 is arranged at the left side of the mounting plate and is made of memory sponge, the memory sponge refers to polyether polyurethane foam sponge with slow rebound mechanical property and belongs to special sponge, the auxiliary limiting ring is limited and fixed, the auxiliary pad is arranged on the operating plate, two limiting mechanisms are arranged at the left side of the mounting, The top fixedly connected with circle axle 142 and baffle 143 of disc, the surface of circle axle rotates and is connected with the baffle, prescribes a limit to semiconductor laser's side, prevents that it from taking place the skew, influences normal processing.

The application method of the auxiliary device for producing the ultra-high-speed semiconductor laser comprises the steps of placing the semiconductor laser on an operation board, enabling the semiconductor laser to be in contact with an auxiliary pad, starting a driving motor, driving a screw rod sleeve to move up and down on a screw rod by the driving motor, rotating the using direction of a limiting plate according to the size and the shape of the semiconductor laser, binding a soft strip and the semiconductor laser when the semiconductor laser is square, rotating a rotating shaft to clamp the limiting ring on the semiconductor laser when the semiconductor laser is cylindrical, and limiting the semiconductor laser by the aid of rotating baffle plates according to different placing positions.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. An auxiliary device for producing an ultra-high-speed semiconductor laser is characterized by comprising a bottom plate, a driving motor, limiting plates, limiting rings, an operating plate, an auxiliary pad and a limiting mechanism, wherein the driving motor is installed at the top of the bottom plate, an output shaft of the driving motor is connected with a lead screw through a coupler, a lead screw sleeve is sleeved on the surface of the lead screw, a transverse plate is fixedly connected to the side surface of the lead screw sleeve, two limiting plates are arranged on the right side of the transverse plate, two soft strips are fixedly connected between the two limiting plates, connecting plates are movably connected above and below the soft strips between the two limiting plates, the limiting rings are arranged on the connecting plates, the operating plate is installed at the top of the bottom plate, a mounting plate is fixedly connected to the right side of the operating plate at the top of the bottom plate, the auxiliary pad is arranged on the left, the top of bottom plate is located the left side of mounting panel and is provided with quantity be two stop gear.

2. The auxiliary device for producing an ultra high speed semiconductor laser as claimed in claim 1, wherein a limiting disc is fixedly connected to the top of the lead screw, and the diameter of the limiting disc is larger than that of the lead screw.

3. The auxiliary device for producing the ultra-high speed semiconductor laser as claimed in claim 1, wherein a groove is formed on the right side of the transverse plate, two rotating shafts are arranged on the inner wall of the groove, and limiting plates are rotatably connected to the opposite sides of the two rotating shafts.

4. An auxiliary device for producing an ultra-high speed semiconductor laser as claimed in claim 1, wherein a movable shaft is provided at a connection position between the side surface of the limit plate and the connection plate, and the movable shaft is rotatably connected to the connection plate.

5. An auxiliary device for the production of an ultra high speed semiconductor laser as claimed in claim 1 wherein the limiting mechanism comprises a disc, a circular shaft and a baffle plate, the circular shaft is fixedly connected to the top of the disc, and the baffle plate is rotatably connected to the surface of the circular shaft.