CN214591697U - Electronic equipment - Google Patents

Abstract

The present application relates to an electronic device. The electronic equipment comprises a heating part and a loudspeaker assembly arranged at an interval with the heating part, the loudspeaker assembly comprises a loudspeaker shell and a loudspeaker, an inner cavity is formed in the loudspeaker shell, the loudspeaker is arranged in the inner cavity, an air guide pipeline is arranged in the inner cavity, an air outlet of the air guide pipeline is arranged on one side, close to the heating part, of the loudspeaker shell, and an air inlet of the air guide pipeline is communicated with the inner cavity. According to the electronic equipment, the air outlet of the air guide pipeline in the loudspeaker component is arranged on one side, close to the heating part, of the loudspeaker shell, and the air inlet of the air guide pipeline is communicated with the inner cavity, so that air flow generated in the inner cavity can blow towards the heating part along the air guide pipeline under the working state of the loudspeaker, the air flow at the heating part is increased, and the heat dissipation of the heating part is facilitated.

Description

Electronic equipment

Technical Field

The present application relates to the field of electronic technology, and in particular, to an electronic device.

Background

With the development of the electronic industry, various electronic products, such as televisions, mobile phones, tablet computers, and the like, appear in the market. When an electronic component (such as a power panel) arranged in an electronic product works, heat is generated, and the temperature of the electronic component rises along with the heat. In the related art, some electronic components are cooled by natural heat dissipation after working, and the heat dissipation is slow.

SUMMERY OF THE UTILITY MODEL

To overcome the problems in the related art, the present application provides an electronic device.

According to a first aspect of an embodiment of the present application, an electronic device is provided, which includes a heat generating member and a speaker assembly spaced apart from the heat generating member; the loudspeaker assembly comprises a loudspeaker shell and a loudspeaker, an inner cavity is formed in the loudspeaker shell, the loudspeaker is arranged in the inner cavity, an air guide pipeline is arranged in the inner cavity, an air outlet of the air guide pipeline is arranged on one side, close to the heating part, of the loudspeaker shell, and an air inlet of the air guide pipeline is communicated with the inner cavity.

In some embodiments, the distance between the air outlet of the air guide pipeline and the heat generating member ranges from 30mm to 50 mm.

In some embodiments, the air guide duct is located on one side of the internal cavity.

In some embodiments, the speaker housing includes a first cover plate and a second cover plate opposite to the first cover plate, a sidewall extending to the second cover plate is disposed on an outer periphery of the first cover plate, and the second cover plate covers the sidewall to form the inner cavity together with the sidewall and the first cover plate.

In some embodiments, the side wall includes a first side wall close to one side of the heat generating element, a second side wall opposite to the first side wall, and a third side wall and a fourth side wall disposed at two ends of the first side wall and the second side wall, the first side wall is provided with an opening, the first cover plate is provided with a vertical wall extending inward from the opening, an inner end of the vertical wall extends to one side of the speaker, the vertical wall, the first side wall, the first cover plate, and the second cover plate are partially enclosed to form the air guiding duct, and an air outlet of the air guiding duct is formed at the opening.

In some embodiments, at least a portion of the standing wall is arcuate.

In some embodiments, the heat generating member includes a power supply plate.

In some embodiments, the electronic device includes a housing, the housing has a receiving space therein, and the heat generating member and the speaker assembly are spaced apart from each other in the receiving space.

In some embodiments, the heat generating member is disposed above the speaker assembly.

In some embodiments, the electronic device comprises a television.

According to the embodiment, the electronic device has the advantages that the air outlet of the air guide pipeline in the loudspeaker assembly is arranged on one side, close to the heating part, of the loudspeaker shell, the air inlet of the air guide pipeline is communicated with the inner cavity, so that air flow generated in the inner cavity can blow towards the heating part along the air guide pipeline under the working state of the loudspeaker, air flow at the heating part is increased, and heat dissipation of the heating part is facilitated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram illustrating a partial structure of an electronic device according to an exemplary embodiment of the present disclosure;

FIG. 2 is a schematic view of the structure of FIG. 1 with the second cover removed;

FIG. 3 is a schematic illustration of a partial structure of a speaker assembly shown in accordance with an exemplary embodiment of the present disclosure;

fig. 4 is a block diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

The application provides an electronic device. The electronic device has a backplane structure. The backplane structure may be understood as a back cover structure or back shell of an electronic device. The electronic device may be a mobile phone (cell phone), a computer, digital broadcast electronics, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like. The electronic device herein is provided with a power supply structure. The power supply structure may be a battery.

The back plate structure may include a transparent cover plate and a light emitting layer disposed inside the transparent cover plate, wherein light emitted from the light emitting layer can be emitted from the transparent cover plate. The luminous layer is arranged on the inner side of the transparent cover plate, so that the backboard structure can display a preset bright effect at night or in dark light, the electronic equipment is more attractive and personalized, and the use experience of a user is improved.

The backplate structure will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic diagram illustrating a partial structure of an electronic device 100 according to an exemplary embodiment. The electronic device may be a television, a mobile phone (cell phone), a computer, digital broadcast electronics, a tablet device, a personal digital assistant, or the like.

Referring to fig. 1, and as necessary with reference to fig. 2 and 3, the electronic device 100 includes a heat generating component 10 and a speaker assembly 20 spaced apart from the heat generating component 10, the speaker assembly 20 includes a speaker housing and a speaker 24, an inner cavity 201 is formed in the speaker housing, at least a portion of the speaker 24 is disposed in the inner cavity 201, an air guiding duct 202 is disposed in the inner cavity 201, an air outlet of the air guiding duct 202 is disposed at a side of the speaker housing close to the heat generating component 10, and an air inlet of the air guiding duct 202 is communicated with the inner cavity 201.

The loudspeaker 24 here may be a woofer, i.e. a woofer. The opening 242 of the speaker 24 faces outward. The speaker 24 has an eardrum 241 capable of vibrating. When the speaker 24 is in operation, the eardrum 241 vibrates, so that an air flow can be generated in the inner cavity 201.

In the electronic device 100, the air outlet of the air guide duct in the speaker assembly is disposed at one side of the speaker housing close to the heating element, and the air inlet of the air guide duct is communicated with the inner cavity, so that the air flow generated in the inner cavity can blow towards the heating element along the air guide duct when the speaker is in a working state, thereby increasing the air flow at the heating element, and facilitating the heat dissipation of the heating element.

In some embodiments, the distance L between the air outlet of the air guiding duct 202 and the heating element 10 is in the range of 30mm to 50mm, so that the air outlet is closer to the heating element 10, which is beneficial to blowing stronger air to the heating element 10, and improving the heat dissipation effect of the heating element 10.

In some embodiments, the heat generating element 10 is disposed above the speaker assembly 20, which is more favorable for the heat generated by the heat generating element 10 to flow upwards, and is more favorable for heat dissipation. For example, when the heating element and the speaker assembly are arranged and assembled, the heating element 10 can be arranged right above the air outlet, so that the air flow blown out from the air outlet can be better utilized, and a better heat dissipation effect can be achieved.

It should be noted that, in some other embodiments, the heating element may not be disposed directly above the air outlet, and in addition, the heating element may also be disposed on a side of the speaker assembly.

In some embodiments, the air guiding duct 202 is located at one side of the inner cavity 201, so that a main body region of the inner cavity 201 except for the air guiding duct is an integral region, and is not separated into different regions by the air guiding duct, which is beneficial to ensuring the quality of sound generated by the speaker.

It should be noted that the air guiding duct described in the present application may be a separately arranged duct structure, or may be a duct structure that is isolated in the original area of the inner cavity 201 by arranging an isolation structure in the inner cavity, such as the air guiding duct 202 formed in fig. 2 and 3.

With reference to fig. 2 and fig. 3, the speaker housing includes a first cover plate 21 and a second cover plate 22 opposite to each other, a side wall of the second cover plate 22 extending to the second cover plate 22 is disposed on the periphery of the first cover plate 21, and the second cover plate 22 covers the side wall to form an inner cavity 201 together with the side wall and the first cover plate 21.

In some embodiments, the sidewalls include a first sidewall 231 adjacent to one side of the heat generating member 10, a second sidewall 232 opposite to the first sidewall 231, and third and fourth sidewalls 233 and 234 provided at both ends of the first and second sidewalls 231 and 232, and the first sidewall 231 is provided with an opening 2021. The speaker 24 is mounted on the second sidewall 232, and the main body is located inside the second sidewall 232, and the speaker 24 has its bell-mouth facing outward.

The first cover 21 is provided with a vertical wall 25 extending inward from the opening 2021, and an inner end 251 of the vertical wall 25 extends to a side of the speaker 24 close to the first side wall 231 and the fourth side wall 234 without being connected to the speaker 24. An opening 2022 is formed between the inner end of the upright wall 25 and the fourth side wall 234. The air duct 202 is formed by surrounding the vertical wall 25 and the first side wall 231, the first cover plate 21 and the second cover plate 22, the air outlet of the air duct 202 is formed at the opening 2021, and the air inlet of the air duct 202 is formed at the opening 2022.

The height of the vertical wall 25 is the same as that of the side wall, so as to prevent the middle part of the air guide pipeline 202 from being communicated with the inner cavity 201 to influence the air guide effect.

In addition, in the embodiment of forming the air guide duct 202 together with the side wall and the two cover plates by using the vertical wall 25, compared with the embodiment of arranging the duct structure in the inner cavity 201, the air guide duct is simple in arrangement, convenient to produce, and space-saving, and is beneficial to improving the effective space in the loudspeaker assembly.

In addition, the vertical wall 25 and the side wall are arranged on the same cover plate, so that the production and the processing are convenient.

In some embodiments, at least a portion of the upright wall 25 is curved such that a partial area of the air guide duct forms an arcuate air guide section to facilitate airflow. For example, as shown in fig. 3, the vertical wall 25 has an arc-shaped structure in the vicinity of both end portions.

In some embodiments, the electronic device includes a housing 30, and the housing 30 has a receiving space therein, and the heat generating member 10 and the speaker assembly 20 are spaced apart from each other in the receiving space.

The electronic device 100 may include functional devices such as a power board, a main board, and a display device. The power panel can be electrically connected with the mainboard, the display device, the loudspeaker assembly and the like so as to respectively supply power to the mainboard, the display device, the loudspeaker assembly and the like.

In some embodiments, the heat generating member 10 is a power panel. Of course, in other embodiments, the heat generating component may also be a main board or a gas heating element or a heat generating structure.

Furthermore, in some embodiments, the electronic device may further be provided with a heat dissipation device, such as a heat dissipation fan.

Fig. 4 is a block diagram illustrating an electronic device 2000 in accordance with an example embodiment. For example, the electronic device 2000 may be the electronic device shown in fig. 1 to 3, and the electronic device may be a television, a mobile phone (mobile phone), a computer, a digital broadcast electronic device, a tablet device, a personal digital assistant, and the like.

Referring to fig. 4, electronic device 2000 may include one or more of the following components: a processing component 2002, a memory 2004, a power component 2006, a multimedia component 2008, an audio component 2010, an input/output (I/O) interface 2012, a sensor component 2014, and a communication component 2016.

The processing component 2002 generally controls the overall operation of the electronic device 2000, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 2002 may include one or more processors 2020 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 2002 can include one or more modules that facilitate interaction between the processing component 2002 and other components. For example, the processing component 2002 may include a multimedia module to facilitate interaction between the multimedia component 2008 and the processing component 2002.

The memory 2004 is configured to store various types of data to support operations at the electronic device 2000. Examples of such data include instructions for any application or method operating on the electronic device 2000, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 2004 may be implemented by any type or combination of volatile or non-volatile memory devices, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.

The power supply component 2006 provides power to the various components of the electronic device 2000. The power supply components 2006 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 2000.

The multimedia assembly 2008 includes a screen providing an output interface between the electronic device 2000 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 2008 includes a front camera and/or a rear camera. The front camera and/or the rear camera may receive external multimedia data when the electronic device 2000 is in an operation mode, such as a photographing mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

Audio component 2010 is configured to output and/or input audio signals. For example, the audio component 2010 includes a Microphone (MIC) configured to receive external audio signals when the electronic device 2000 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 2004 or transmitted via the communication component 2016. In some embodiments, audio assembly 2010 also includes a speaker for outputting audio signals.

The I/O interface 2012 provides an interface between the processing component 2002 and peripheral interface modules, which can be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.

Sensor assembly 2014 includes one or more sensors for providing various aspects of status assessment for electronic device 2000. For example, sensor assembly 2014 may detect an open/closed state of electronic device 2000, a relative positioning of components, such as a display and a keypad of electronic device 2000, a change in position of electronic device 2000 or a component of electronic device 2000, a presence or absence of user contact with electronic device 2000, an orientation or acceleration/deceleration of electronic device 2000, and a change in temperature of electronic device 2000. The sensor assembly 2014 may include a proximity sensor configured to detect the presence of a nearby object in the absence of any physical contact. The sensor assembly 2014 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 2014 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 2016 is configured to facilitate wired or wireless communication between the electronic device 2000 and other devices. The electronic device 2000 may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, 4GLTE, 5G NR, or a combination thereof. In an exemplary embodiment, the communication component 2016 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 2016 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the electronic device 2000 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.

In an exemplary embodiment, a non-transitory computer readable storage medium including instructions, such as the memory 2004 including instructions, executable by the processor 2020 of the electronic device 2000 to perform the above-described method is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. An electronic device is characterized by comprising a heating piece and a loudspeaker component arranged at an interval with the heating piece;

the loudspeaker assembly comprises a loudspeaker shell and a loudspeaker, an inner cavity is formed in the loudspeaker shell, the loudspeaker is arranged in the inner cavity, an air guide pipeline is arranged in the inner cavity, an air outlet of the air guide pipeline is arranged on one side, close to the heating part, of the loudspeaker shell, and an air inlet of the air guide pipeline is communicated with the inner cavity.

2. The electronic device of claim 1, wherein a distance between the air outlet of the air duct and the heat generating member is in a range of 30mm to 50 mm.

3. The electronic device of claim 1, wherein the air-guide duct is located on one side of the internal cavity.

4. The electronic device of claim 1, wherein the speaker housing includes a first cover plate and a second cover plate disposed opposite to each other, a sidewall extending toward the second cover plate is disposed on an outer periphery of the first cover plate, and the second cover plate covers the sidewall to form the inner cavity together with the sidewall and the first cover plate.

5. The electronic device according to claim 4, wherein the side wall includes a first side wall close to one side of the heat generating element, a second side wall opposite to the first side wall, and a third side wall and a fourth side wall disposed at two ends of the first side wall and the second side wall, the first side wall has an opening, the first cover plate has a vertical wall extending inward from the opening, an inner end of the vertical wall extends to one side of the speaker, and the vertical wall, the first side wall, the first cover plate, and the second cover plate partially enclose the vertical wall to form the air duct, and an air outlet of the air duct is formed at the opening.

6. The electronic device of claim 5, wherein at least a portion of the standing wall is arcuate.

7. The electronic device of claim 1, wherein the heat generating member includes a power supply board.

8. The electronic device of claim 1, wherein the electronic device comprises a housing, the housing has a receiving space therein, and the heat generating member and the speaker assembly are spaced apart from each other in the receiving space.

9. The electronic device of claim 8, wherein the heat generating member is disposed above the speaker assembly.

10. The electronic device of claim 1, wherein the electronic device comprises a television.

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