CN113259810A

CN113259810A - Audio module and terminal equipment

Info

Publication number: CN113259810A
Application number: CN202010087453.8A
Authority: CN
Inventors: 李小明
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-02-11
Filing date: 2020-02-11
Publication date: 2021-08-13

Abstract

The present disclosure relates to an audio module and a terminal device, the audio module at least includes: the outer surface of the first audio component is provided with a groove and is used for outputting audio signals when the audio module is in a loudspeaker mode; the second audio component is arranged in the groove and used for outputting the audio signal when the audio module is in an earphone mode; wherein the power of the audio signal output by the first audio component is greater than the power of the audio signal output by the second audio component. Through this disclosed embodiment, can make audio frequency module output audio frequency effect better.

Description

Audio module and terminal equipment

Technical Field

The present disclosure relates to the field of audio processing technologies, and in particular, to an audio module and a terminal device.

Background

With the continuous development of terminal equipment, the functions of the terminal equipment such as a mobile phone are more and more abundant, and particularly, the function of outputting audio signals by an audio module in the mobile phone brings convenience for communication and enjoyment in hearing for the daily life of people. However, the existing mobile phone adopts the same audio component to realize audio signal output in a speaker mode and an earphone mode, and has the problem of poor audio output effect.

Disclosure of Invention

The utility model provides an audio frequency module and terminal equipment.

In a first aspect of the embodiments of the present disclosure, an audio module is provided, which is applied to a terminal device, and the audio module at least includes:

the outer surface of the first audio component is provided with a groove and is used for outputting audio signals when the audio module is in a loudspeaker mode;

the second audio component is arranged in the groove and used for outputting the audio signal when the audio module is in an earphone mode;

wherein the power of the audio signal output by the first audio component is greater than the power of the audio signal output by the second audio component.

In some embodiments, the recess is located on a first surface of the first audio component;

a first connecting interface and a second connecting interface are arranged on the second surface of the first audio component; the second surface is opposite to the first surface; the first connection interface is used for transmitting the audio signal to the first audio component;

a first conductive contact is arranged in the groove, and the first conductive contact is electrically connected with the second connecting interface;

the second audio component comprises:

the second conductive contact is positioned on the outer surface of the second audio component contacted with the groove, when the second audio component is positioned in the groove, the first conductive contact is contacted with the second conductive contact to form electric connection, and the electric connection is used for transmitting the audio signal provided by the second connection interface to the second audio component.

In some embodiments, the audio module further comprises:

and the third audio component and the first audio component are arranged at intervals and used for outputting the same audio signal with the first audio component when the audio module is in the loudspeaker mode.

In some embodiments, the audio module further comprises:

and the adhesive assembly is positioned at the bottom of the groove and used for fixing the second audio assembly in the groove.

In a second aspect of the embodiments of the present disclosure, a terminal device is provided, including:

an equipment housing;

the audio module comprises the audio module in any embodiment and is positioned in the equipment shell;

the processing module is positioned in the equipment shell, is connected with the audio module and is used for providing audio signals for the audio module when the audio module is in a loudspeaker mode; providing the audio signal to the audio module when the audio module is in an earpiece mode.

In some embodiments, the second audio component of the audio module comprises: a first sound outlet hole located on an outer surface of the second audio component;

the terminal device further includes:

a second sound outlet hole located on the device housing;

the audio transmission channel is respectively communicated with the first sound outlet hole and the second sound outlet hole;

the first sound outlet is used for outputting the audio signal output by the second audio component to the audio transmission channel, and the second sound outlet is used for transmitting the audio signal in the audio transmission channel to the outside of the equipment shell.

In some embodiments, the terminal device further comprises:

the printed circuit board is positioned in the equipment shell and is provided with a first through hole, and the first through hole is aligned with and communicated with the first sound outlet hole;

the middle frame is positioned in the equipment shell and is provided with a second through hole, and the second through hole is aligned with and communicated with the first through hole;

the connecting channel is respectively communicated with the second through hole and the second sound outlet hole;

wherein the first through hole, the second through hole and the connecting channel together constitute the audio transmission channel.

In some embodiments, the first through hole occupies an area of the printed circuit board that is smaller than a projected area of the second audio component projected onto the printed circuit board.

In some embodiments, the terminal device further comprises:

and the first sealing module is positioned between the second audio component and the printed circuit board and used for sealing a first connecting part between the first through hole and the first sound outlet hole and preventing the audio signal from being transmitted to the outside of the terminal equipment from the first connecting part.

In some embodiments, the terminal device further comprises:

and the second sealing module is positioned between the middle frame and the printed circuit board and used for sealing a second connecting part between the second through hole and the first through hole and preventing the audio signal from being transmitted to the outside of the terminal equipment from the second connecting part.

In some embodiments, the terminal device further comprises:

the transmitting module is positioned between the second audio component and the equipment shell and used for transmitting infrared signals outwards;

and the infrared hole and the second sound outlet hole are both positioned on the first surface of the equipment shell and used for transmitting the infrared signal to the outside of the terminal equipment.

In some embodiments, the first surface comprises a first side edge and a second side edge disposed opposite the first side edge;

the second sound outlet hole is positioned on the first side edge;

the infrared hole is located between the first side edge and the second side edge.

In some embodiments, the terminal device further comprises:

and the third sound outlet hole is positioned between the first side edge and the second side edge, is arranged at an interval with the infrared hole, and is used for transmitting the audio signal of the first audio component in the audio module to the outside of the equipment shell.

In some embodiments, the terminal device further comprises:

the fourth sound outlet hole is positioned on the second surface of the equipment shell and used for transmitting the audio signal of the third audio component in the audio module to the outside of the equipment shell; wherein the second surface and the first surface are two surfaces oppositely arranged in the equipment shell.

In some embodiments, the processing module is connected to the first connection interface and the second connection interface of the first audio component in the audio module, and is specifically configured to provide an audio signal to the audio module through the first connection interface when the audio module is in the speaker mode; and when the audio module is in the earphone mode, the audio signal is provided for the audio module through the second connecting interface.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the audio module comprises a first audio component and a second audio component, wherein the first audio component outputs audio signals in a loudspeaker mode, and the second audio component outputs audio signals in a receiver mode. The first audio component and the second audio component are two audio components independent of each other. That is to say, the audio frequency module utilizes the audio frequency subassembly output audio signal of different power under the mode of difference, for adopting same audio frequency subassembly output audio signal under the mode of difference, can make audio frequency subassembly and output mode phase-match, satisfies the characteristics of output audio frequency under the different modes for audio frequency module output audio frequency effect is better.

The mobile terminal aims to reduce the phenomena of large occupied area of the mobile terminal, complex installation and the like caused by separated independent audio components. The embodiment of the disclosure adopts the integrated design of the first audio component and the second audio component, the second audio component is arranged in the groove on the outer surface of the first audio component, and the second audio component and the first audio component are not arranged on the printed circuit board of the terminal device in parallel, so that on one hand, the space occupied by the second audio component on the printed circuit board can be reduced, on the other hand, a single audio component is assembled relatively, the size of the audio component can be increased, and the audio module can be installed and positioned more conveniently.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a first schematic diagram of an audio module according to an exemplary embodiment.

Fig. 2 is a second schematic diagram of an audio module according to an exemplary embodiment.

Fig. 3 is a first schematic structural diagram of a terminal device according to an exemplary embodiment.

Fig. 4 is a schematic structural diagram ii of a terminal device according to an exemplary embodiment.

Fig. 5 is a schematic structural diagram three of a terminal device according to an exemplary embodiment.

Fig. 6 is a fourth schematic structural diagram of a terminal device according to an exemplary embodiment.

Fig. 7 is a schematic structural diagram five of a terminal device according to an exemplary embodiment.

Fig. 8 is a sixth schematic structural diagram of a terminal device according to an exemplary embodiment.

Fig. 9 is a seventh structural diagram illustrating a terminal device according to an exemplary embodiment.

Fig. 10 is a block diagram illustrating a terminal device according to an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

Fig. 1 is a first schematic structural diagram of an audio module according to an exemplary embodiment. As shown in fig. 1, the audio module at least comprises:

a first audio component 101 having a groove on an outer surface thereof, for outputting an audio signal when the audio module is in a speaker mode;

the second audio component 102 is installed in the groove and used for outputting the audio signal when the audio module is in an earphone mode;

In the embodiment of the disclosure, the audio module is used for outputting an audio signal, so that a user can hear sound. For example, when music needs to be listened to, an audio module can be adopted to output audio signals; when a call is made or a voice is heard, the audio module can be used for outputting an audio signal.

The first audio frequency component and the second audio frequency component are energy conversion devices for converting electric signals into audio signals, the energy conversion devices can generate driving force under the action of a magnetic field for the magnet to enable the vibration film to vibrate and sound, or piezoelectric materials are utilized to generate piezoelectric effect under the action of an electric field to enable the vibration film to vibrate and sound.

Illustratively, the first audio component and the second audio component each include, but are not limited to, an electrodynamic audio component, an electromagnetic audio component, or a piezoelectric audio component.

In the embodiment of the present disclosure, the size of the first audio component is larger than that of the second audio component, and a groove for accommodating the second audio component may be disposed on an outer surface of the first audio component. The groove may be provided at an outer surface of the first audio component where a magnetic or electric field is generated. So, for the surface department with the recess setting sound chamber in first audio frequency subassembly, can reduce the influence of the interior vibrating diaphragm vibration of first audio frequency subassembly to second audio frequency subassembly in the recess for the second audio frequency subassembly can reduce the condition that produces the noise.

It should be noted that the shape of the recess may be arranged according to the shape of the second audio component. For example, when the shape of the second audio component is rectangular, the shape of the recess may be set to be rectangular; when the shape of the second audio component is a circle, the shape of the groove may be set to be a circle, and the embodiment of the present disclosure is not limited.

Of course, the size of the recess may also be set according to the size of the second audio component, so that the second audio component can be better placed in the recess. For example, the size of the recess may be set to be greater than or equal to the size of the second audio component.

The earphone mode and the loudspeaker mode are different output modes of the audio module for outputting audio signals, and when the distance between the user and the terminal equipment is within a first distance range, the audio module can output the audio signals in the earphone mode; when the distance between the user and the terminal equipment is within a second distance range, the audio module can output audio signals in a loudspeaker mode; wherein the distance within the first distance range is smaller than the distance within the second distance range.

In the embodiment of the disclosure, the power of the audio signal output by the first audio component is greater than the power of the audio signal output by the second audio component. That is, the loudness of the audio signal output by the first audio component in the speaker mode is greater than the loudness of the audio signal output by the second audio component in the earpiece mode. In this manner, a user can acquire audio signals within a first range in the speaker mode and can hear audio signals acquired within a second range of distances in the earpiece mode.

It should be noted that, in the process of using the audio module, the first audio component may be applied in a scene that requires a high loudness of the output audio signal. For example, in a scene such as a ringing sound of a terminal device, an incoming music sound of a terminal device, or a video or music played by a terminal device.

The second audio component can be applied to a scene that the loudness of the audio signal needs to be output is small, for example, in a scene that the terminal device uses social software such as WeChat and QQ to play voice or answer an incoming call.

In an embodiment of the present disclosure, the audio module includes a first audio component and a second audio component, the first audio component outputs an audio signal in a speaker mode, and the second audio component outputs an audio signal in a headphone mode. That is to say, the audio frequency module utilizes the audio frequency subassembly output audio signal of different power under the mode of difference, for adopting same audio frequency subassembly output audio signal under the mode of difference, can make audio frequency subassembly and output mode phase-match, satisfies the characteristics of output audio frequency under the different modes for audio frequency module output audio frequency effect is better. Simultaneously, this disclosed embodiment adopts the integrated design of first audio frequency subassembly and second audio frequency subassembly, sets up the second audio frequency subassembly in the recess of first audio frequency subassembly surface, and not set up second audio frequency subassembly and first audio frequency subassembly on terminal equipment's printed circuit board side by side, on the one hand, can reduce the space that the second audio frequency subassembly took printed circuit board, and on the other hand, assembles single audio frequency subassembly relatively, can increase the size of assembling the audio frequency subassembly for the installation location of audio frequency module is more convenient.

In some embodiments, the audio module further comprises:

and the third audio component is arranged at an interval with the first audio component and is used for outputting the same audio signal with the first audio component when the terminal equipment is in the loudspeaker mode.

In the embodiment of the present disclosure, the third audio component and the first audio component both output audio signals in the speaker mode. Therefore, the two audio components which are arranged at intervals output audio signals simultaneously, on one hand, the loudness of the audio signals output by the audio module can be increased, the requirement for listening to sound remotely by a user is improved, on the other hand, the user can perceive the sound in two directions, and the effect of stereo is achieved.

In other embodiments, the audio output direction of the first audio component is opposite to the audio output direction of the third audio component. For example, when the audio module is applied to a terminal device such as a mobile phone, the audio output direction of the first audio component may face the top of the mobile phone, and the audio output direction of the third audio component may face the bottom of the mobile phone. Therefore, in the process that the user outputs the audio signals by using the mobile phone, the audio signals output by the first audio component and the third audio component on the mobile phone can be transmitted to the user from two different directions, and the user can perceive a better stereo effect.

In some embodiments, as shown in fig. 2, the audio module further comprises:

and the adhesive component 103 is positioned at the bottom of the groove 104 and used for fixing the second audio component 102 in the groove 104.

In the embodiment of the disclosure, the second audio component is fixed in the groove by the adhesive component, so that the second audio component can be reliably fixed on the first audio component, and the situation that the second audio component falls off from the groove on the first audio component is reduced.

Illustratively, the adhesive component includes, but is not limited to, double-sided tape.

the second audio component comprises:

That is, the second audio component captures audio signals through the electrical loop formed by the connection between the second connection interface, the first conductive contact, and the second conductive contact. When the audio module is in a loudspeaker mode, the first connecting interface transmits an audio signal to the first audio component; when the audio module is in the earphone mode, the second connecting interface transmits audio signals to the second audio component. In this way, it is possible to realize that the second audio component outputs an audio signal when the second audio component is superimposed on the first audio component.

In the embodiment of the present disclosure, the first surface is provided with a groove, the second surface is provided with a second connection interface, the second connection interface is electrically connected to the first conductive contact in the groove, and the first surface and the second surface are opposite. Therefore, the length of signal transmission between the second connecting interface and the first conductive contact can be shortened, and the signal transmission efficiency is improved.

It should be noted that the first conductive contact may be disposed on the sidewall inside the groove or on the area outside the adhesive component in the bottom of the groove, and the embodiments of the disclosure are not limited thereto.

In the embodiment of the present disclosure, the first conductive contact and the second conductive contact are both conductive contacts formed of a material such as a metal or an alloy.

Illustratively, the first and second conductive contacts may each be mounted on the first and second audio components by a Laser-Direct-structuring (LDS) process.

The embodiment of the present disclosure also provides a terminal device, and fig. 3 is a schematic structural diagram of a terminal device shown according to an exemplary embodiment. As shown in fig. 3, the terminal device includes at least:

an apparatus casing 11;

the audio module 12, including the audio module in any of the above embodiments, is located in the device housing;

The terminal device can be a wearable electronic device and a mobile terminal, the mobile terminal includes a mobile phone, a notebook and a tablet computer, the wearable electronic device includes a smart watch, and the embodiment of the disclosure is not limited.

The above-mentioned equipment casing can enclose into an accommodation space, and this accommodation space not only can be used to the holding audio frequency module, can also hold other modules in the terminal equipment, like processing module, image acquisition module or be used for the transmission module of transmission infrared ray, and this disclosed embodiment does not do the restriction.

Illustratively, the material of the device housing includes, but is not limited to, a plastic, a metallic material, or an alloy material.

In the embodiment of the disclosure, the audio module in the terminal device outputs the audio signal by using the audio components with different powers in different modes, and compared with the case that the same audio component outputs the audio signal in different modes, the audio module in the terminal device can be matched with the output modes, so that the characteristics of outputting audio in different modes are met, and the audio module outputs the audio signal with better effect. Simultaneously, in order to reduce the independent audio frequency subassembly of separation and lead to occupy the area of mobile terminal big, and phenomenon such as the installation is loaded down with trivial details, the embodiment of this disclosure adopts the integrated design of first audio frequency subassembly and second audio frequency subassembly, set up the second audio frequency subassembly in the recess of first audio frequency subassembly surface, be not with second audio frequency subassembly and first audio frequency subassembly set up side by side on terminal equipment's printed circuit board, on the one hand, can reduce the space that the second audio frequency subassembly occupies printed circuit board, on the other hand, assemble single audio frequency subassembly relatively, can increase the size of assembling audio frequency subassembly, make the installation location of audio frequency module more convenient.

In some embodiments, as shown in fig. 4, the second audio component of the audio module comprises: a first sound outlet 14 located on an outer surface of said second audio component;

the terminal device further includes:

a second sound outlet hole 15 located on the device housing;

the audio transmission channel 16 is respectively communicated with the first sound outlet hole and the second sound outlet hole;

In the embodiment of the present disclosure, the first sound outlet outputs the audio signal generated by the second audio component to the outside of the second audio component, and the second sound outlet transmits the audio signal in the audio transmission channel to the outside of the device housing. Therefore, the audio signal generated by the second audio component can be output to the outside of the terminal equipment through the first sound outlet, the audio transmission channel and the second sound outlet, so that a user can obtain the audio signal generated by the second audio component when the user is close to the equipment shell.

The audio transmission channel is respectively communicated with the first sound outlet hole and the second sound outlet hole, so that the audio signal can be transmitted to the second sound outlet hole through the audio transmission channel. It should be noted that the audio transmission channel may be a straight-through channel or a bent channel, and the embodiments of the present disclosure are not limited thereto.

Of course, the length of the audio transmission channel may be set according to actual needs, for example, 10 mm, 12 mm, or 14 mm may be set, and the embodiment of the disclosure is not limited.

In some embodiments, as shown in fig. 5 and 6, the terminal device further includes:

a printed circuit board 17 located in the device housing and provided with a first through hole 18, wherein the first through hole 18 is aligned with and communicated with the first sound outlet hole 14;

a middle frame 19 located in the device housing and provided with a second through hole 20, wherein the second through hole 20 is aligned with and communicated with the first through hole 18;

wherein the first through hole, the second through hole and the connection channel together constitute the audio transmission channel 14.

The printed circuit board is a bearing plate for various devices in the terminal equipment, and various devices on the printed circuit board can be connected through wires which can be arranged in the printed circuit board.

In the embodiment of the disclosure, the first sound outlet hole is connected with the first through hole, the first through hole is connected with the second through hole, the second through hole is connected with the connecting channel, and the connecting channel is connected with the second sound outlet hole.

It should be noted that the shape and size of the first through hole need to be adapted to the first sound outlet hole and the second through hole, the size and shape of the second through hole need to be matched to the first through hole and the connecting channel, and the connecting channel needs to be matched to the second sound outlet hole, so that the audio transmission channel can transmit the audio signal better.

In the embodiment of the disclosure, the audio signal generated by the second audio component needs to be transmitted to the first through hole on the printed circuit board through the first sound outlet hole; then transmitting the audio signal to a second through hole of the middle frame through the first through hole; then transmitted to the connecting channel through the second through hole, and finally transmitted to the second sound outlet hole on the equipment shell through the connecting channel. It can be seen that the first sound outlet in the disclosed embodiment faces the printed circuit board and does not face the device housing directly.

That is to say, the audio signal of the embodiment of the present disclosure needs to be transmitted to the outside of the device housing through the first through hole of the printed circuit board and the second through hole of the middle frame, and the bent audio transmission channel is adopted instead of the straight audio transmission channel, so that the audio transmission channel of the embodiment of the present disclosure is longer. Therefore, the attenuation length of noise caused by vibration of the device of the terminal equipment can be increased, the noise in the terminal equipment can be attenuated more, and the audio output effect of the terminal equipment is improved.

In other embodiments, the terminal device further comprises: and the first sealing module is positioned between the second audio component and the printed circuit board and used for sealing a first connecting position between the first through hole and the first sound outlet so as to prevent the audio signal from being transmitted to the outside of the terminal equipment from the first connecting position.

In other embodiments, the terminal device further comprises: and the second sealing module is positioned between the middle frame and the printed circuit board and used for sealing a second connecting part between the second through hole and the first through hole and preventing the audio signal from being transmitted to the outside of the terminal equipment from the second connecting part.

Illustratively, the first and second sealing modules each include, but are not limited to, sealing modules formed of foam.

That is, the area of the printed circuit board occupied by the first through hole required for the second audio component to transmit the audio signal is smaller than the area of the printed circuit board directly on which the second audio component is disposed. As shown in fig. 7, the prior art directly arranges the second audio component at the position of the printed circuit board 17 at 01, and has a problem of occupying a large area of the printed circuit board. Based on this, this disclosure proposes to set up the second audio frequency subassembly on first audio frequency subassembly, only need set up first through-hole alright realize the output of audio frequency on printed circuit board, so, can reduce the printed circuit board large tracts of land fretwork condition that leads to because of setting up the second audio frequency subassembly, can guarantee printed circuit board's integrality, also keep more wiring spaces for printed circuit board and provide probably.

For example, the area of the printed circuit board occupied by the first through hole may be set according to actual needs, for example, the area of the printed circuit board occupied by the first through hole may be set to be half or a quarter of the projected area, and embodiments of the present disclosure are not limited.

In some embodiments, the terminal device further comprises:

The infrared signal emitted by the emitting module is used for remotely controlling external equipment, including but not limited to air conditioners and televisions. For example, the air conditioner may be turned on and off by emitting an infrared signal to the air conditioner; the switching of different playing channels of the television can be realized by transmitting infrared signals to the television.

In the embodiment of the present disclosure, the terminal device further includes an infrared transmission channel, and the transmitting module transmits the infrared signal to the infrared hole through the infrared transmission channel, so that the infrared hole outputs the infrared signal to the outside of the device housing as an output channel. The shape of the infrared hole may be set according to actual requirements, for example, the shape of the infrared hole may be set to be circular or elliptical, and the embodiments of the present disclosure are not limited.

As shown in fig. 8, the infrared transmission channel 22 of the transmitting module in the terminal device can directly transmit the infrared signal to the infrared hole, and the audio transmission channel 21 in the embodiment of the disclosure is located at the front and rear ends of the infrared transmission channel, and it cannot directly transmit the audio signal to the outside of the device housing 11 by using a straight-through channel, but uses a bent channel to transmit the audio signal to the outside of the device housing 11 by bypassing the infrared transmission channel 22.

Therefore, compared with a straight-through channel, the bending channel is adopted in the embodiment of the disclosure, so that the length of the audio transmission channel is longer, the attenuation length of noise caused by vibration of a device of the terminal equipment can be increased, the noise in the terminal equipment can be further attenuated more, and the audio output effect of the terminal equipment is improved.

In some embodiments, as shown in fig. 9, the first surface 11a includes a first side edge and a second side edge disposed opposite the first side edge;

the second sound outlet hole 15 is located on the first side;

the infrared aperture 24 is located between the first side edge and the second side edge.

In other embodiments, as shown in fig. 9, the terminal device further includes:

and a third sound outlet 23 located between the first side and the second side, spaced from the infrared hole, and configured to transmit an audio signal of the first audio component in the audio module to the outside of the device case.

It should be noted that, in the embodiment of the present disclosure, the third sound emitting hole, the second sound emitting hole, and the infrared hole are all located on the first surface of the device housing. Illustratively, the first surface may be a surface on which a top of the terminal device is located, and the infrared hole may be disposed at a central position of the first surface.

In this embodiment, the first side may be a side where the user is close to the terminal device. In this way, the second sound outlet hole through the first side enables the user to hear the sound more clearly in the earpiece mode.

In some embodiments, the terminal device further comprises:

The first surface may be a surface where a top of the terminal device is located, and the second surface may be a surface where a bottom of the terminal device is located.

In the embodiment of the present disclosure, the second sound emitting hole of the first audio component and the fourth sound emitting hole of the third audio component are respectively located on two oppositely disposed surfaces in the device housing. So, be in under the speaker mode at terminal equipment's audio frequency module, two surfaces that terminal equipment's equipment casing set up relatively outwards output audio signal simultaneously can make audio signal propagate to the user from two different directions, and then make the user can perceive better stereo effect.

That is to say, under different audio output modes, the processing module respectively to the different connection interface output audio signal of audio frequency module to make terminal equipment can output different audio signal under different audio output modes, satisfy the demand of the different scenes of terminal equipment.

It should be noted that "first", "second", "third" and "fourth" in the embodiments of the present disclosure are merely for convenience of description and distinction, and have no other specific meaning.

Fig. 10 is a block diagram illustrating a terminal device according to an example embodiment. For example, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.

Referring to fig. 10, the terminal device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.

The processing component 802 generally controls overall operation of the terminal device, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the terminal device. Examples of such data include instructions for any application or method operating on the terminal device, contact data, phonebook data, messages, pictures, videos, etc. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.

The power component 806 provides power to various components of the terminal device. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the terminal device.

The multimedia component 808 includes a screen that provides an output interface between the terminal device and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. When the terminal device is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the terminal device is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.

The sensor component 814 includes one or more sensors for providing various aspects of state assessment for the terminal device. For example, sensor assembly 814 may detect the open/closed status of the terminal device, the relative positioning of components, such as a display and keypad of the terminal device, the change in position of the terminal device or a component of the terminal device, the presence or absence of user contact with the terminal device, the orientation or acceleration/deceleration of the terminal device, and the change in temperature of the terminal device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 816 is configured to facilitate communication between the terminal device and other devices in a wired or wireless manner. The terminal device may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, communications component 816 further includes a Near Field Communications (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the terminal device may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. The utility model provides an audio frequency module which characterized in that, is applied to terminal equipment, the audio frequency module includes at least:

2. The audio module of claim 1, further comprising:

3. The audio module of claim 1 or 2, further comprising:

4. The audio module of claim 1 or 2, wherein the recess is located on the first surface of the first audio component;

the second audio component comprises:

5. A terminal device, characterized in that the terminal device comprises:

an equipment housing;

an audio module comprising the audio module of any of claims 1 to 4, located within the equipment housing;

6. The terminal device of claim 5, wherein the second audio component of the audio module comprises: a first sound outlet hole located on an outer surface of the second audio component;

the terminal device further includes:

a second sound outlet hole located on the device housing;

7. The terminal device according to claim 6, wherein the terminal device further comprises:

8. The terminal device of claim 7, wherein the first via occupies an area of the printed circuit board that is smaller than a projected area of the second audio component projected onto the printed circuit board.

9. The terminal device according to claim 7, wherein the terminal device further comprises:

10. The terminal device according to claim 7, wherein the terminal device further comprises:

11. The terminal device according to claim 6, wherein the terminal device further comprises:

12. The terminal device of claim 11, wherein the first surface includes a first side and a second side disposed opposite the first side;

the second sound outlet hole is positioned on the first side edge;

13. The terminal device according to claim 12, wherein the terminal device further comprises:

and the third sound outlet hole is positioned between the first side edge and the second side edge, is arranged at an interval with the infrared hole, and is used for outputting the audio signal of the first audio component in the audio module to the outside of the equipment shell.

14. The terminal device according to claim 11, wherein the terminal device further comprises:

the fourth sound outlet hole is positioned on the second surface of the equipment shell and used for outputting an audio signal of a third audio component in the audio module to the outside of the equipment shell; wherein the second surface and the first surface are two surfaces oppositely arranged in the equipment shell.

15. The terminal device according to claim 5, wherein the processing module is connected to a first connection interface and a second connection interface of a first audio component in the audio module, respectively, and is specifically configured to provide an audio signal to the audio module through the first connection interface when the audio module is in the speaker mode; and when the audio module is in the earphone mode, the audio signal is provided for the audio module through the second connecting interface.