CN214588832U

CN214588832U - IGBT chip heat dissipation surrounds module

Info

Publication number: CN214588832U
Application number: CN202120812459.7U
Authority: CN
Inventors: 姜季均; 郭韶龙; 侯善桤
Original assignee: Henan Lijing Mei Energy Electronic Technology Co ltd
Current assignee: Henan Lijing Mei Energy Electronic Technology Co ltd
Priority date: 2021-04-20
Filing date: 2021-04-20
Publication date: 2021-11-02
Anticipated expiration: 2031-04-20

Abstract

The utility model discloses a module is surrounded in IGBT chip heat dissipation relates to electronic equipment technical field. The utility model discloses a chip, the top and the below of chip all are provided with the rectangle box, and the detachable fixedly connected with wavy pipe of inner chamber of rectangle box, and two rectangle boxes deviate from the detachable fixedly connected with water tank of one end of a lateral wall each other, the equal detachable fixedly connected with bar plate in both sides between two rectangle boxes. The utility model discloses a two wave pipes communicate two water tanks, the flow of coolant liquid has been guaranteed, thereby reach the purpose of cooling chip with reducing rectangle box temperature, five fans, for the chip provides the forced air cooling heat dissipation, and connect into a whole with two rectangle boxes through utilizing four bolts, rectangle array fixedly connected with has four connector links simultaneously on the lateral wall that two rectangle boxes deviate from each other, the installation of simple and convenient whole device and chip, the problem of current IGBT chip heat dissipation technique radiating efficiency low and installation inconvenience has been solved.

Description

IGBT chip heat dissipation surrounds module

Technical Field

The utility model belongs to the technical field of electronic equipment, especially, relate to a module is surrounded in IGBT chip heat dissipation.

Background

An Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device consisting of a Bipolar Junction Transistor (BJT) and an insulated Gate field effect transistor (MOS), and has the advantages of high input impedance of the MOSFET and low conduction voltage drop of the GTR. The GTR saturation voltage is reduced, the current carrying density is high, but the driving current is large; the MOSFET has small driving power, high switching speed, large conduction voltage drop and small current carrying density. The IGBT integrates the advantages of the two devices, and has small driving power and reduced saturation voltage. The IGBT packaging material is required to have excellent mechanical property, electrical insulation property, flame retardant property, aging resistance property and heat resistance property, and the IGBT packaging material is not required to have heat conduction and heat dissipation property, so that the IGBT module basically depends on a radiator at the bottom for heat dissipation, and therefore the heat dissipation efficiency is very low.

Therefore, the existing IGBT chip heat dissipation technology cannot meet the requirements in practical use, so that an improved technology is urgently needed in the market to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a IGBT chip heat dissipation surrounds module, through being provided with two rectangle boxes, equal detachable fixedly connected with wavy pipe in the inside of two rectangle boxes, the one end that deviates from one side mutually at two rectangle boxes can be dismantled and be fixed water tank, and pass through two wavy union couplings with two water tanks, the flow of coolant liquid has been guaranteed, thereby reach the purpose of cooling the chip in order to reduce rectangle box temperature, simultaneously through being provided with the bar board, and five fans of embedding fixedly connected with on the bar board, provide the forced air cooling heat dissipation for the chip, and connect into a whole with two rectangle boxes through utilizing four bolts, rectangle array fixedly connected with has four connector links on the lateral wall that two rectangle boxes deviate from each other simultaneously, the problem that current IGBT chip heat dissipation technology radiating efficiency is low and the installation is inconvenient is solved.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a module is surrounded in IGBT chip heat dissipation, which comprises a chip, the top and the below of chip all are provided with the rectangle box, the installation of the wave pipe of being convenient for, and the detachable fixedly connected with wave pipe of inner chamber of rectangle box, two water tanks of being convenient for communicate, two the rectangle box deviates from the detachable fixedly connected with water tank of one end of a lateral wall each other, the storage of the coolant liquid of being convenient for, two equal detachable fixedly connected with bar plate in both sides between the rectangle box, the installation of the fan of being convenient for.

Furthermore, four connecting buckles are fixedly connected with the rectangular array on one side wall of the rectangular box, which deviates from the chip, so that the whole device is connected with an external unit conveniently, and connecting lugs are highly connected at two ends of two corresponding side walls of the rectangular box, so that the bolts can be conveniently installed.

Furthermore, two threaded connection has the bolt between two engaging lugs of arbitrary one end in one arbitrary side of rectangle box, is convenient for connect two rectangle boxes, and the screw thread has cup jointed the nut on the outer peripheral face of bolt one end, is convenient for cooperate with the bolt, accomplishes the fastening of two rectangle boxes.

Further, the both ends of wave pipe are fixedly connected with first connecting pipe and second connecting pipe respectively, are convenient for the connection between two wave pipes respectively and the connection of wave pipe and water tank, two through bushing between the first connecting pipe on the wave pipe.

Further, the middle part of a water tank lateral wall runs through fixedly connected with L venturi tube, the water tank of being convenient for is connected with the second connecting pipe, and the L venturi tube on two water tanks respectively with two wave pipe on the second connecting pipe threaded connection, the water tank of being convenient for and the intercommunication of wave pipe.

Further, the length and the height of strip shaped plate equal the length and the thickness of chip respectively, five fans of fixedly connected with are embedded into to the other end equidistance by one end to strip shaped plate, are convenient for provide the forced air cooling for the heat dissipation of chip.

The utility model discloses following beneficial effect has:

1. the utility model discloses a be provided with two rectangle boxes, at the equal detachable fixedly connected with wave pipe in the inside of two rectangle boxes, the one end that deviates from one side mutually can be dismantled to be fixed water tank at two rectangle boxes, and pass through two wave union couplings with two water tanks, the flow of coolant liquid has been guaranteed, thereby reach the purpose of cooling chip with reducing rectangle box temperature, simultaneously through being provided with the bar shaped plate, and imbed five fans of fixedly connected with on the bar shaped plate, for the chip provides the forced air cooling heat dissipation, the radiating efficiency has further been strengthened.

2. The utility model discloses an utilize four bolts to connect into a whole with two rectangle boxes, rectangular array fixedly connected with four connector links on the lateral wall that two rectangle boxes deviate from each other simultaneously, have portably installed of whole device and chip, have improved efficiency.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the present invention from different angles;

FIG. 3 is an exploded view of the overall structure of the present invention;

figure 4 is the utility model discloses the explosion schematic diagram of well rectangle box, bolt, wave pipe, water tank and strip shaped plate junction.

In the drawings, the components represented by the respective reference numerals are listed below:

110. a chip; 120. a rectangular box; 121. a connecting buckle; 122. connecting lugs; 130. a bolt; 131. a nut; 140. a wave tube; 141. a first connecting pipe; 142. a second connecting pipe; 150. a water tank; 151. an L-shaped tube; 160. a sleeve; 170. a strip plate; 171. a fan.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-4, the present invention relates to an IGBT chip heat dissipation enclosure module, including a chip 110, rectangular boxes 120 are disposed above and below the chip 110 for installing wave tubes 140, wave tubes 140 are fixedly connected to detachable inner cavities of the rectangular boxes 120 for communicating two water tanks 150, one end of each rectangular box 120 facing away from a side wall is detachably fixedly connected to the water tank 150 for storing cooling liquid, two sides of each rectangular box 120 are detachably fixedly connected to strip plates 170 for installing a fan 171, four connecting buttons 121 are fixedly connected to rectangular arrays on a side wall of the rectangular box 120 facing away from the chip 110, two ends of the corresponding side walls of the rectangular box 120 are highly connected to connecting lugs 122, the connecting buttons 121 on the two rectangular boxes 120 are connected to female buttons of an external unit, thereby fixing the whole device, the screw thread is connected with the bolt 130 between two engaging lugs 122 of any one end of any one side of two rectangular boxes 120, and the screw thread is sleeved with the nut 131 on the peripheral surface of one end of the bolt 130, when the rectangular box 120 needs to be installed or dismantled, the nut 131 is rotated to be connected with or separated from the bolt 130, thereby completing the installation or the dismantling of the rectangular box 120, the two ends of the wave pipe 140 are respectively fixedly connected with the first connecting pipe 141 and the second connecting pipe 142, which are respectively used for the connection between the two wave pipes 140 and the connection between the wave pipe 140 and the water tank 150, the first connecting pipes 141 on the two wave pipes 140 are connected through the sleeve 160, the middle part of one side wall of the water tank 150 is fixedly connected with the L-shaped pipe 151 in a penetrating way, and the L-shaped pipes 151 on the two water tanks 150 are respectively in threaded connection with the second connecting pipes 142 on the two wave pipes 140, the two water tanks 150 are connected with an external power device, so that the cooling liquids in the two water tanks 150 can mutually circulate, thereby make the coolant liquid constantly flow in wave tube 140, and then reduce the temperature of rectangle box 120, the reduction of rectangle box 120 temperature further leads to the temperature reduction of chip 110, thereby guarantee the heat dissipation of chip 110, the length and the height of strip 170 equal the length and the thickness of chip 110 respectively, strip 170 is by five fans 171 of one end to the equidistant fixedly connected with of other end embedding, be connected fan 171 on two strip 170 with outside power device, utilize fan 171's effect, provide the forced air cooling for the cooling of chip 110, the heat dissipation of chip 110 has further been accelerated.

The working principle is as follows: connect buckle 121 on two rectangle boxes 120 with the box of external unit is connected, thereby it is fixed with the overall device, fan 171 on two water tanks 150 and two strip shaped plate 170 is connected with outside power device simultaneously, make the coolant liquid in two water tanks 150 circulate each other, thereby make the coolant liquid constantly flow in wave tube 140, and then reduce the temperature of rectangle box 120, the reduction of rectangle box 120 temperature further leads to the temperature reduction of chip 110, thereby guarantee the heat dissipation of chip 110, simultaneously because the effect of fan 171, provide the forced air cooling for the cooling of chip 110, the heat dissipation of chip 110 has further been accelerated.

The above is only the preferred embodiment of the present invention, and the present invention is not limited thereto, any technical solutions recorded in the foregoing embodiments are modified, and some technical features thereof are replaced with equivalent ones, and any modification, equivalent replacement, and improvement made thereby all belong to the protection scope of the present invention.

Claims

1. An IGBT chip heat dissipation surrounds module, includes chip (110), its characterized in that: the top and the below of chip (110) all are provided with rectangle box (120), and the detachable fixedly connected with wave pipe (140) of inner chamber of rectangle box (120), two the detachable fixedly connected with water tank (150) of one end that rectangle box (120) deviates from a lateral wall each other, two equal detachable fixedly connected with bar shaped plate (170) in both sides between rectangle box (120).

2. The IGBT chip heat dissipation surrounding module as claimed in claim 1, wherein four connecting buckles (121) are fixedly connected to a rectangular array on one side wall of the rectangular box (120) away from the chip (110), and two ends of the corresponding two side walls of the rectangular box (120) are highly connected with connecting lugs (122).

3. The IGBT chip heat dissipation surrounding module as claimed in claim 2, wherein a bolt (130) is connected between the two connecting lugs (122) at any end of any side of the two rectangular boxes (120) in a threaded manner, and a nut (131) is sleeved on the outer peripheral surface of one end of the bolt (130) in a threaded manner.

4. The IGBT chip heat dissipation surrounding module according to claim 1, wherein a first connecting pipe (141) and a second connecting pipe (142) are fixedly connected to two ends of the corrugated pipe (140), and the first connecting pipes (141) on the two corrugated pipes (140) are connected through a sleeve (160).

5. The IGBT chip heat dissipation surrounding module as claimed in claim 1, wherein an L-shaped pipe (151) is fixedly connected to the middle of one side wall of the water tank (150) in a penetrating manner, and the L-shaped pipes (151) on the two water tanks (150) are respectively in threaded connection with the second connecting pipes (142) on the two corrugated pipes (140).

6. The IGBT chip heat dissipation surrounding module as claimed in claim 1, wherein the strip-shaped plate (170) has a length and a height equal to the length and the thickness of the chip (110), and five fans (171) are fixedly embedded in the strip-shaped plate (170) from one end to the other end at equal intervals.