CN214588797U - Chip suction nozzle and chip packaging equipment - Google Patents
Chip suction nozzle and chip packaging equipment Download PDFInfo
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- CN214588797U CN214588797U CN202121093339.2U CN202121093339U CN214588797U CN 214588797 U CN214588797 U CN 214588797U CN 202121093339 U CN202121093339 U CN 202121093339U CN 214588797 U CN214588797 U CN 214588797U
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- suction nozzle
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- pipe
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Abstract
The utility model discloses a chip suction nozzle, include: the suction nozzle comprises a suction nozzle pipe and a suction nozzle part arranged on the suction nozzle pipe, wherein a first air passage is arranged in the suction nozzle pipe; be equipped with the second air flue that is linked together with first air flue in the suction nozzle portion, the top surface of suction nozzle portion forms the adsorption plane, is equipped with three pyramid-shaped card limit on the adsorption plane, and three card limit encloses into the absorption chamber that is used for adsorbing the chip, is equipped with the gas pocket on the adsorption plane, and gas pocket intercommunication absorption chamber and second air flue. The utility model also discloses a chip packaging equipment, including equipment principal and chip suction nozzle, equipment principal is connected with the chip suction nozzle. The utility model discloses the suction nozzle contacts the tube inner wall when can effectively solve chip on-chip operation process among the prior art, can't satisfy the problem of piece demand to be applicable to the chip of multiple size, stronger flexibility has.
Description
Technical Field
The utility model relates to a chip technical field especially relates to a chip suction nozzle and chip packaging equipment.
Background
In the radio frequency power amplifier chip of the gallium nitride high electron mobility transistor, the silicon-based high-voltage power integrated radio frequency amplifier chip and the common silicon chip packaging and chip fixing process, a suction nozzle is used for sucking and placing the chip. At present, the following problems still exist in the practical use process of the suction nozzle: firstly, due to the special design of the gallium nitride high electron mobility transistor radio frequency power amplifier chip and the silicon-based high voltage power integrated radio frequency amplifier chip, the chip surface has sensitive designs such as air bridges, and the performance of the chip can be affected by touching the chip surface. Secondly, for this part of product, because the special requirement of piece position, the pipe edge is pressed close to the piece position, and the suction nozzle edge will touch the pipe inner wall, can't satisfy the piece demand. Thirdly, the appearance size of the chip cannot be guaranteed to be completely consistent due to cutting reasons, so that part of the chip cannot be normally sucked due to larger or smaller size. Therefore, the related art suction nozzle structure is inconvenient to perform a chip mounting operation and may damage a chip.
Disclosure of Invention
The embodiment of the utility model provides a chip suction nozzle and chip packaging equipment has realized absorbing the chip and has not touched the chip surface, can effectively solve prior art and contact the tube inner wall in last piece operation process, can't satisfy the problem of piece demand to be applicable to the chip of multiple size, stronger flexibility has.
In order to achieve the above object, an embodiment of the present invention provides a chip suction nozzle, including: the suction nozzle comprises a suction nozzle pipe and a suction nozzle part arranged on the suction nozzle pipe, wherein a first air passage is arranged inside the suction nozzle pipe, a second air passage communicated with the first air passage is arranged inside the suction nozzle part, the top of the suction nozzle part forms an adsorption surface, three pyramid-shaped clamping edges are arranged on the adsorption surface, an adsorption cavity used for adsorbing a chip is formed by the three clamping edges in a surrounding mode, an air hole is formed in the adsorption surface, and the air hole is communicated with the adsorption cavity and the second air passage.
As an improvement of the scheme, the three clamping edges are mutually independent, and a gap is formed between every two adjacent clamping edges.
As an improvement of the scheme, the three clamping edges are connected with each other to form an integrated structure, a groove is arranged between every two adjacent clamping edges, and the bottom of the groove is arranged on the adsorption surface.
As an improvement of the scheme, the groove is arranged in a circular arc shape.
As an improvement of the above scheme, the mouthpiece portion further includes a limiting portion, and the limiting portion is disposed at the bottom of the side of the mouthpiece portion where the clamping edge is not disposed and is connected to the mouthpiece portion and the mouthpiece pipe.
As an improvement of the above scheme, the oblique edge of the card edge is obliquely arranged relative to the adsorption surface, and the included angle between the oblique edge and the adsorption surface is 120 degrees, 135 degrees or 150 degrees.
As an improvement of the above scheme, the first air passage comprises a first nozzle pipe air passage, a second nozzle pipe air passage and a transition part connecting the first nozzle pipe air passage and the second nozzle pipe air passage, and the second nozzle pipe air passage is communicated with the second air passage.
As an improvement of the above scheme, the first nozzle pipe air passage and the second nozzle pipe air passage are coaxially arranged, and the diameter of the first nozzle pipe air passage is larger than that of the second nozzle pipe air passage.
The embodiment of the utility model provides a chip packaging equipment is still provided, including equipment principal and foretell chip suction nozzle, equipment principal with the chip suction nozzle is connected.
As an improvement of the scheme, the equipment main body is provided with an air exhaust pipe, and the air exhaust pipe is communicated with a first air passage in the chip suction nozzle.
Compared with the prior art, the utility model discloses a chip suction nozzle and chip packaging equipment, chip suction nozzle include the suction nozzle pipe and locate the mouth of inhaling on the suction nozzle pipe is equipped with first air flue in the suction nozzle pipe, and inside the second air flue that is linked together with first air flue that is provided with of suction nozzle portion forms the adsorption plane, is equipped with three pyramid's card limit on the adsorption plane, and is three the card limit encloses into the absorption chamber, and the chip card connects in the absorption intracavity, be equipped with the gas pocket on the adsorption plane, the gas pocket intercommunication the absorption chamber with the second air flue. Through above-mentioned structure, combine the absorption chamber that is the pyramid at suction nozzle portion top and form, realized absorbing the chip and do not touch the chip surface, can prevent effectively that the chip from collapsing scarce or scratch to adjust the absorption position of chip according to the chip size is nimble, the utility model discloses a chip suction nozzle is applicable to the chip of multiple size, has stronger flexibility. And simultaneously, the utility model discloses well chip suction nozzle sets up to three pyramid card limit, will be close to one side of tube and leak the sky, can effectively solve prior art and contact the tube inner wall in last piece operation process, can't satisfy the problem of piece demand.
Drawings
FIG. 1 is a schematic structural diagram of a chip suction nozzle according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the chip suction nozzle of the embodiment of the present invention when it is placed horizontally;
FIG. 3 is a left side view of the chip suction nozzle according to the embodiment of the present invention when it is horizontally placed;
FIG. 4 is a right side view of the chip suction nozzle of the embodiment of the present invention when it is placed horizontally;
FIG. 5 is a schematic structural view of the embodiment of the present invention when the nozzle portion is separated from the edge;
FIG. 6 is a schematic view of the structure of the embodiment of the present invention when the nozzle part is clamped;
fig. 7 is a top view of a mouthpiece portion according to an embodiment of the present invention;
fig. 8 is an operation diagram of the chip suction nozzle according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 8, an embodiment of the present invention provides a chip suction nozzle 10, where the chip suction nozzle 10 includes: the suction nozzle comprises a suction nozzle pipe 11 and a suction nozzle part 12 arranged on the suction nozzle pipe 11, wherein a first air passage 110 is arranged inside the suction nozzle pipe 11, a second air passage 121 communicated with the first air passage 110 is arranged inside the suction nozzle part 12, an adsorption surface 122 is formed at the top of the suction nozzle part 12, three pyramidal clamping edges 123 are arranged on the adsorption surface 122, an adsorption cavity is defined by the three clamping edges 123, a chip 20 is clamped on the clamping edges 123, an air hole 124 communicated with the second air passage 121 is arranged on the adsorption surface 122, the clamping edges 123 are arranged on the adsorption surface 122, and the air hole 124 is communicated with the adsorption cavity and the second air passage 121.
In the embodiment of the present invention, refer to fig. 2 to fig. 4, which are the specific structural schematic diagrams of the chip suction nozzle in the embodiment of the present invention, wherein fig. 2 is a cross-sectional view of the chip suction nozzle when the chip suction nozzle is horizontally placed, fig. 3 is a left side view of the chip suction nozzle when the chip suction nozzle is horizontally placed, fig. 4 is a right side view of the chip suction nozzle when the chip suction nozzle is horizontally placed, a first air duct 110 is arranged in the suction nozzle pipe 11, the first air duct 110 includes a first suction nozzle pipe air duct 111, a second suction nozzle pipe air duct 112 and a transition portion 113 connecting the first suction nozzle pipe air duct and the second suction nozzle pipe air duct 112, the second suction nozzle pipe air duct 112 is communicated with the second air duct 121, and the diameter of the second suction nozzle pipe air duct 112 is consistent with the diameter of the second air duct 121.
In one embodiment, referring to fig. 2, the transition portion 113 is in the shape of a circular truncated cone. Optionally, the first end of the transition portion 113 is connected to the first nozzle duct 111, the second end of the transition portion 113 is connected to the second nozzle duct 112, and whether the diameter of the first end is the same as the diameter of the first nozzle duct 111 and the diameter of the second end is the same as the diameter of the second nozzle duct 112 is not limited.
Further, the first nozzle air passage 111 and the second nozzle air passage 112 are coaxially arranged, and the diameter of the first nozzle air passage 111 is larger than that of the second nozzle air passage 112. It should be noted that, in the present invention, the shape of the transition portion 113 between the first nozzle pipe air passage 111 and the second nozzle pipe air passage 112 is not limited, and may be a circular truncated cone or a plane.
In the present invention, referring to fig. 5 and 6, the structure of the mouthpiece portion of the chip in the embodiment of the present invention is schematically illustrated, the mouthpiece portion 12 is a boss, and the bottom of the mouthpiece portion 12 is disposed above the side of the second mouthpiece air passage 112 in the mouthpiece 11, i.e. the second mouthpiece air passage 112 is communicated with the second air passage 121. The suction surface 122 is provided on the top of the mouthpiece portion 12, and the suction surface 122 is provided with air holes 124, and the diameter of the air holes 124 is not smaller than the diameter of the second air path 121. Still be equipped with three card limit 123 that is the pyramid on the top, utilize card limit 123 and chip 20 contact, chip 20 joint promptly on card limit 123, chip 20 surface lid closes the absorption chamber to when the suction nozzle breathes in through second air flue 121 and the cooperation of gas pocket 124, make and adsorb intracavity formation negative pressure, thereby realize firmly adsorbing chip 20. The clamping edge 123 is pyramid-shaped and has a bevel edge structure, and when the chip 20 is larger, the sucking position is closer to the outer point; when the chip 20 is smaller than a little, the sucking position is close to the inner point, so that the chip can be normally sucked when the chip is larger or smaller due to the cutting reason, meanwhile, the size of the clamping edge 123 does not need to be fixed, the corresponding chip size does not need to be fixed, and the flexibility is strong. In addition, refer to fig. 4, which is an operation diagram of the chip suction nozzle in the embodiment of the present invention, the number of the clamping edges 123 is three, and one edge of the clamping edge, which is close to the tube, is exposed to avoid contacting the inner wall of the tube. And, because the last piece position is pressed close to the tube edge, reduced the degree of difficulty that chip 20 absorbs through this structure for chip 20 covers in adsorbing the chamber easily and completely, and the operation of being convenient for has improved operating efficiency.
Preferably, the oblique side of the clamping edge 123 is obliquely arranged relative to the suction surface 122, and the included angle between the oblique side and the suction surface 122 is 120 °, 135 ° or 150 °. It should be noted that, the included angle between the clamping edge 123 and the adsorption surface is set to 120 °, 135 ° or 150 °, the larger the included angle between the clamping edge 123 and the adsorption surface is, the easier the chip 20 is to be absorbed, the stronger the capability of overcoming the unevenness of the size of the chip 20 is, but the larger the inclination angle is, the larger the outer size of the mouthpiece portion 12 is, the larger the external influence is, the easier other objects are touched, therefore, the inclination angle is determined according to the specific situation, and the above three angles are not necessarily designed, and the utility model discloses do not limit this.
Illustratively, referring to fig. 2, the total length of the chip suction nozzle is 16mm, the diameter of the nozzle tube 11 is 3.175mm, and the inclination angle of the three clamping edges 123 is designed to be 120 °. The chip 20 can be sucked when the length of the long side has a deviation of about +/-50 um. The length and width of the nozzle card edge 123 are designed to be generally 0.1mm larger than the length and width of the chip 20; the pore diameter of the adsorption surface 122 is 0.3mm, which is generally half of the narrow side of the chip 20. Use chip 20 thickness 0.1mm, the inclination of suction nozzle is 120, and chip 20 size is 2mm 1mm for example, and two shorter card limits of suction nozzle can be designed into 1mm, and longer card limit can be designed into 2.1mm, and the hypotenuse bottom size on card limit is less than the chip, has guaranteed that the suction nozzle can not touch the chip surface.
Referring to fig. 5, in an embodiment, each of the clamping edges 123 is independently disposed, and a gap 127 is disposed between two adjacent clamping edges 123.
Of course, similarly, the clamping edges may be connected to each other to form an integrated connection structure, and in particular, referring to fig. 6 and 7, in an embodiment of the present application, the clamping edges 123 are connected to each other to form an integrated structure, a groove 125 is disposed between two adjacent clamping edges 123, and a bottom of the groove 125 is disposed on the suction surface 122.
Preferably, the groove 125 is configured in a circular arc shape.
In this embodiment, by providing the groove 125, the problems of chipping and scratching caused by wafer fragments and burrs left at four corners due to the cutting of the chip 20 are avoided. For example, referring to fig. 2, a circular groove with a diameter of about 0.1mm is respectively formed between two short sides and a long side of the chip suction nozzle, so that the chip can be prevented from being scratched and chipped.
In an embodiment, referring to fig. 5 to 8, the nozzle portion 12 further includes a limiting portion 126, the limiting portion 126 is disposed at a bottom of a side of the nozzle portion 12 where the clamping edge 123 is not disposed, and the limiting portion 126 is convexly disposed at a connection position of the nozzle portion 12 and the nozzle pipe 11. Wherein, this spacing portion 126 is a terrace with edge, and spacing portion 126 is for avoiding the suction nozzle to touch the part of pipe shell inner wall machining process excision, according to the shape of pipe shell, leaks the vacancy and gives way, and the excision partly can avoid partly, and the terrace with edge that remains is the part that need not the excision, but also can excise during practical application.
For example, referring to fig. 5-7, the longer edge of the nozzle portion 12 is 2.2mm, and the shorter edge is 1.35 mm; the length of the aperture is 1mm, and the diameter of the semicircle is 0.6 mm; the height of the mouthpiece portion is 1.5 mm.
Preferably, the suction nozzle is a tungsten steel suction nozzle, so that high temperature resistance is realized, and the requirement of high-temperature welding flux welding is met.
The utility model discloses a chip suction nozzle, chip suction nozzle include suction nozzle pipe and suction nozzle portion, and the suction nozzle pipe is inside to be provided with first air flue, and suction nozzle portion bottom is arranged in on the suction nozzle pipe, the inside second air flue that is provided with of suction nozzle portion, the second air flue with first air flue intercommunication, suction nozzle portion top are equipped with adsorption plane and the three card limit that is the pyramid, and the chip card connects on the card limit, be equipped with the intercommunication on the adsorption plane the gas pocket of second air flue, the card limit is located on the adsorption plane, and three the card limit encloses into the absorption chamber, the gas pocket intercommunication the absorption chamber with the second air flue. Through above-mentioned structure, combine the absorption chamber that is the pyramid at suction nozzle portion top and form, realized absorbing the chip and do not touch the chip surface, can prevent effectively that the chip from collapsing scarce or scratch to adjust the absorption position of chip according to the chip size is nimble, the utility model discloses a chip suction nozzle is applicable to the chip of multiple size, has stronger flexibility. And simultaneously, the utility model discloses well chip suction nozzle sets up to three pyramid card limit, will be close to one side of tube and leak the sky, can effectively solve prior art and contact the tube inner wall in last piece operation process, can't satisfy the problem of piece demand.
The embodiment of the utility model provides a still disclose a chip packaging equipment, this chip packaging equipment include equipment principal and foretell chip suction nozzle 10, equipment principal with chip suction nozzle 10 connects.
In this embodiment, the chip suction nozzle 10 is configured to be mounted on a chip packaging apparatus, so that when the chip packaging apparatus is in operation, the suction pipe of the chip packaging apparatus is communicated with the first air passage 110 of the chip suction nozzle 10, so that the suction surface 122 of the chip suction nozzle 10 sucks the chip 20 through the cooperation of the air hole 124, the first air passage 110 and the second air passage 121, thereby completing a chip loading operation.
Specifically, the apparatus main body is provided with an air suction pipe, and the air suction pipe is communicated with the first air passage 110 in the chip suction nozzle 10.
The utility model discloses a chip packaging equipment, this chip packaging equipment include equipment principal and foretell chip suction nozzle, equipment principal with the chip suction nozzle is connected. Through above-mentioned structure, combine the absorption chamber that is the pyramid at suction nozzle portion top and form, realized absorbing the chip and do not touch the chip surface, can prevent effectively that the chip from collapsing scarce or scratch to adjust the absorption position of chip according to the chip size is nimble, the utility model discloses a chip suction nozzle is applicable to the chip of multiple size, has stronger flexibility. And simultaneously, the utility model discloses set up to the structure on three pyramid card limit in combining the chip suction nozzle, will be close to one side of tube and leak the sky, can effectively solve prior art and contact the tube inner wall in last piece operation process, can't satisfy the problem of piece demand.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A chip suction nozzle, comprising: the suction nozzle comprises a suction nozzle pipe and a suction nozzle part arranged on the suction nozzle pipe, wherein a first air passage is arranged inside the suction nozzle pipe, a second air passage communicated with the first air passage is arranged inside the suction nozzle part, the top of the suction nozzle part forms an adsorption surface, three pyramid-shaped clamping edges are arranged on the adsorption surface, an adsorption cavity used for adsorbing a chip is formed by the three clamping edges in a surrounding mode, an air hole is formed in the adsorption surface, and the air hole is communicated with the adsorption cavity and the second air passage.
2. The chip suction nozzle as set forth in claim 1, wherein three of said clamping edges are independent of each other, and a gap is formed between two adjacent clamping edges.
3. The chip suction nozzle as claimed in claim 1, wherein three of said clamping edges are connected to each other to form an integral structure, a groove is provided between two adjacent clamping edges, and the bottom of said groove is disposed on said suction surface.
4. The chip suction nozzle as set forth in claim 3, wherein the groove is formed in a circular arc shape.
5. The chip suction nozzle as set forth in claim 1, wherein the nozzle part further comprises a stopper part provided at a bottom of the nozzle part on a side where the clamping edge is not provided and connected to both the nozzle part and the nozzle tube.
6. The chip suction nozzle as claimed in claim 1, wherein the oblique edge of the card edge is disposed obliquely with respect to the suction surface, and the oblique edge forms an angle of 120 °, 135 ° or 150 ° with the suction surface.
7. The chip mouthpiece of claim 1, wherein the first air passage comprises a first mouthpiece air passage, a second mouthpiece air passage, and a transition connecting the two, the second mouthpiece air passage being in communication with the second air passage.
8. The chip mouthpiece of claim 7, wherein the first mouthpiece air path is coaxially disposed with the second mouthpiece air path, the first mouthpiece air path having a diameter greater than a diameter of the second mouthpiece air path.
9. A chip packaging apparatus, comprising an apparatus main body and the chip suction nozzle according to any one of claims 1 to 8, wherein the apparatus main body is connected to the chip suction nozzle.
10. The chip packaging apparatus according to claim 9, wherein the apparatus body is provided with a suction pipe, the suction pipe communicating with the first air passage in the chip suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121093339.2U CN214588797U (en) | 2021-05-20 | 2021-05-20 | Chip suction nozzle and chip packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121093339.2U CN214588797U (en) | 2021-05-20 | 2021-05-20 | Chip suction nozzle and chip packaging equipment |
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| Publication Number | Publication Date |
|---|---|
| CN214588797U true CN214588797U (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121093339.2U Active CN214588797U (en) | 2021-05-20 | 2021-05-20 | Chip suction nozzle and chip packaging equipment |
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| CN (1) | CN214588797U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115849011A (en) * | 2023-01-04 | 2023-03-28 | 西安策士测试技术有限公司 | IC chip suction mechanism and suction method |
-
2021
- 2021-05-20 CN CN202121093339.2U patent/CN214588797U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115849011A (en) * | 2023-01-04 | 2023-03-28 | 西安策士测试技术有限公司 | IC chip suction mechanism and suction method |
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