CN214568276U - Pipe-packed IC material feeding device - Google Patents
Pipe-packed IC material feeding device Download PDFInfo
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- CN214568276U CN214568276U CN202120743780.4U CN202120743780U CN214568276U CN 214568276 U CN214568276 U CN 214568276U CN 202120743780 U CN202120743780 U CN 202120743780U CN 214568276 U CN214568276 U CN 214568276U
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- guide groove
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Abstract
The embodiment of the utility model discloses a pipe dress IC material feedway is disclosed, including base, conveyer belt mechanism and 2 groups curb plate subassembly, form the guide way between the curb plate subassembly of the left and right sides, both ends are opened feed inlet and discharge gate respectively around the guide way, and the conveyer belt of conveyer belt mechanism is located the guide way bottom, is equipped with the guide block on the curb plate subassembly of guide way one side, and the inboard front end of guide block is the inclined plane that inclines towards the outside, and the medial surface rear end is perpendicular with the feed inlet; a guide block is arranged at the front section of the bottom of the guide groove along the feed inlet, a feed limiting piece is covered on the front end of the guide groove, and a discharge limiting piece is covered on the rear end of the guide groove; the two sides of the base, which correspond to the outside of the discharge port, are symmetrically provided with material placing platforms, and the material placing platforms are provided with limiting blocks. The utility model provides a feed stability, conveying speed is fast, and the fault rate is low, and then has reduced manufacturing cost, has improved work efficiency, has reduced the material loss, has improved the straight rate of production line yields.
Description
Technical Field
The utility model relates to a IC paster processing technology field especially relates to a pipe dress IC material feedway.
Background
When the tube-packed IC material is used, the IC material needs to be taken out from the material tube for feeding, and then the IC material is grabbed and installed on a PCB by a manipulator. At present, the existing IC material feeding device has poor feeding stability and low speed.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a technical problem that will solve lies in, provides a pipe dress IC material feedway to promote feed stability and speed.
In order to solve the technical problem, the embodiment of the utility model provides a tube IC material feedway, including base, conveyer belt mechanism and 2 groups of curb plate subassemblies, 2 groups of curb plate subassemblies relatively correspond about setting up on the base, form the guide way assorted with the IC material between the curb plate subassemblies of left and right sides, both ends are opened feed inlet and discharge gate respectively around the guide way, the conveyer belt of conveyer belt mechanism is located the guide way bottom, the conveyer belt width is less than the body width of IC material, the curb plate subassembly of guide way one side is equipped with the guide block corresponding to feed inlet one side; the front end of the inner side surface of the guide block is an inclined surface inclined towards the outer side, and the rear end of the inner side surface is vertical to the feed inlet; a guide block is arranged at the front section of the bottom of the guide groove along the feed inlet, a feed limiting piece is covered on the front end of the guide groove, and a discharge limiting piece is covered on the rear end of the guide groove; the base is provided with a limiting block corresponding to the discharge port.
Further, the width of the material guide block is smaller than the width of the IC material body; the height of the surface of the front end of the material guide block is matched with that of the IC material pipe, and the height of the surface of the rear end of the material guide block is equal to that of the surface of the conveying belt at the bottom of the guide groove; the surface height of the material placing table is higher than the surface height of the conveying belt by a preset distance; the front end of the material placing table is provided with a lifting inclined plane from the bottom of the discharge port to the surface of the material placing table.
Further, the distance between the rear end of the inner side surface of the guide block and the feed port is smaller than the thickness of the pipe wall of the IC material pipe.
Furthermore, the front end of the feeding limiting piece exceeds the guide groove, and the front end of the feeding limiting piece tilts upwards.
Further, the curb plate subassembly comprises upper side plate and lower side plate, and the distance between the upper side plate of guide way front end and rear end both sides all is greater than the distance between the upper side plate of guide way middle part both sides, and the distance between the upper side plate of guide way middle part both sides is greater than the body width of IC material and is less than the total width of IC material, and the distance between the lower side plate of guide way both sides is greater than the total width of IC material, and lower side plate thickness is greater than the pin thickness of IC material.
Furthermore, a plurality of waist-shaped holes corresponding to the same position are respectively formed in the upper side plate and the lower side plate, the waist-shaped holes are distributed along the left-right direction, and the upper side plate and the lower side plate are fixed on the base through screws penetrating through the waist-shaped holes.
Further, the width of the feed inlet is larger than and greater than the inner width of the IC material pipe and smaller than the total width of the IC material pipe; the guide groove is provided with guide inclined planes corresponding to the two sides of the feed inlet.
Further, the middle part of the guide groove is provided with a material buffer inductor.
Further, the distance between the limiting block and the discharge hole is larger than the length of 1 IC material, and the distance between the limiting block and the discharge limiting piece is smaller than the length of 2 IC materials.
Furthermore, one end of the limiting block, which faces the discharge hole, is wavy.
The utility model has the advantages that: the utility model provides a feed stability, conveying speed is fast, and the fault rate is low, and then has reduced manufacturing cost, has improved work efficiency, has reduced the material loss, has improved the straight rate of production line yields.
Drawings
Fig. 1 is a three-dimensional structure diagram of the tubular IC material feeding device according to the embodiment of the present invention.
Fig. 2 is an enlarged view at C in fig. 1.
Fig. 3 is a three-dimensional structure diagram of the tubular IC material feeding device according to the embodiment of the present invention.
Fig. 4 is a perspective view of a part of the structure of the tubular IC material supply device according to the embodiment of the present invention.
Fig. 5 is an enlarged view at a in fig. 4.
Fig. 6 is an enlarged view of the feeding opening of the tube IC material feeding device according to the embodiment of the present invention.
Fig. 7 is a three-dimensional structure diagram of the feeding limiting sheet of the embodiment of the present invention.
Fig. 8 is a three-dimensional structure diagram of the discharge limiting sheet of the embodiment of the present invention.
Fig. 9 is a perspective view of the tubular IC material supply device according to the embodiment of the present invention with a part of the structure removed.
Fig. 10 is an enlarged view at B in fig. 9.
Fig. 11 is a perspective view of another angle of the tubular IC material feeding device according to the embodiment of the present invention.
Detailed Description
It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.
In the embodiment of the present invention, if there is directional indication (such as upper, lower, left, right, front, and rear … …) only for explaining the relative position relationship between the components and the motion situation under a certain posture (as shown in the drawing), if the certain posture is changed, the directional indication is changed accordingly.
In addition, the descriptions of the first, second, etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
Referring to fig. 1 to 11, a tubular IC material feeding device according to an embodiment of the present invention includes a base 10, a conveying belt mechanism 20, and 2 sets of side plate assemblies 30. When specifically implementing, the utility model discloses pipe dress IC material feedway uses with pipe dress material feeding unit is supporting.
The 2 groups of side plate assemblies 30 are correspondingly arranged on the base 10 left and right, and guide grooves matched with the IC materials are formed between the side plate assemblies 30 on the left and right sides. The front end and the rear end of the guide groove are respectively provided with a feed inlet and a discharge outlet. The conveyer belt 21 of the conveyer belt mechanism 20 is arranged at the bottom of the guide groove, the width of the conveyer belt 21 is smaller than the width of the IC material body, and the conveying is carried out by utilizing the friction force between the conveyer belt 21 and the IC material body.
The side plate assembly 30 on one side of the guide groove corresponding to the feed inlet is provided with a guide block 33, the front half part of the inner side surface of the guide block 33 is an inclined surface inclined towards the outer side, the rear half part of the inner side surface is vertical to the feed inlet, and the guide block 33 and the corresponding part of the feed inlet of the side plate assembly 30 are step-shaped, so that the IC material pipe 50 is conveniently guided, and the IC material pipe 50 is accurately pushed to the feed inlet. The guide block 33 is used for facilitating the pushing of the IC material pipe 50 to the feeding port while limiting. The front section of the bottom of the guide groove is provided with a material guide block 11 along the material inlet. The guide block 11 is convenient for guiding the IC materials from the feeding hole to the conveyer belt 21. The end part of the front end of the guide block 11 is arranged in the feed opening and is not level with the guide groove, and the optimal distance is 0.5 mm from the feed opening, so that the IC material pipe 50 is prevented from being in contact with the material pipe when being withdrawn, the pipe is conveniently withdrawn, and the service life of the guide block 11 is prolonged.
The upper cover of the front end of the guide groove is provided with a feeding limiting piece 12 for limiting the position of the upper surface of the front end of the guide groove. The upper cover at the rear end of the guide groove is provided with a discharging limiting sheet 13 for limiting the position above the rear end of the guide groove. A limiting block 15 is arranged on the base 10 corresponding to the discharge port. The limiting block 15 and the discharge hole are separated by a preset distance, a material taking hole is formed between the limiting block 15 and the discharge hole, and the limiting block 15 is used for blocking IC materials conveyed to the material taking hole. As an embodiment, in order to be suitable for IC materials of different specifications, the base 10 is symmetrically provided with material placing tables 14 corresponding to two sides outside the discharge port, and a distance between the material placing tables 14 is greater than a width of the conveyor belt 21 and smaller than a width of a body of the IC material. The material taking port is arranged above the space between the two material placing tables 14, so that the manipulator can conveniently and directly grab the material. The limiting block 15 is used for blocking the IC materials conveyed to the material placing table 14. The position of the limiting block 15 can be adjusted front and back, so that the IC material clamp is convenient to be suitable for IC materials of various specifications.
As an implementation mode, the width of the guide block 11 is smaller than the width of the IC material body, when the IC material is placed on the guide block 11, the IC material body is convenient to directly contact with the guide block 11, the friction force between the guide block 11 and the IC material is reduced, and meanwhile, the IC material can be prevented from moving laterally in the conveying process due to the action of the pins. The height of the front end surface of the material guide block 11 is matched with that of the IC material pipe 50, and the height of the rear end surface of the material guide block is equal to that of the surface of the conveying belt 21 at the bottom of the guide groove, so that the IC material is conveniently guided to the conveying belt 21. The surface height of the material placing table 14 is higher than the surface height of the conveying belt 21 by a preset distance, so that the IC materials conveyed to the material placing table 14 are staggered with the front IC materials up and down, the adjacent end surfaces (burr surfaces) of the front IC material and the rear IC material are staggered and avoided, the material taking friction is reduced, and the suction rate is increased. The front end of the material placing table 14 is provided with a lifting inclined plane 16 from the bottom of the discharge port to the surface of the material placing table 14, so that the IC material is pushed onto the material placing table 14 by the IC material in front.
In one embodiment, the distance between the rear half part of the inner side surface of the guide block 33 and the feed port is smaller than the thickness of the tube wall of the IC material tube. The front end of the side plate assembly 30 is used for supporting the IC material pipe 50 at a position corresponding to the position between the guide block 33 and the feeding hole, and meanwhile, the IC material in the pipe is not influenced to come out.
As an embodiment, the front end of the feeding limiting piece 12 exceeds the guide groove, the front end of the feeding limiting piece is tilted upwards, and when the IC material pipe 50 is conveyed to the feeding opening, the feeding limiting piece 12 can limit the IC material pipe 50.
In one embodiment, the side plate assembly 30 is composed of an upper side plate 31 and a lower side plate 32, and the distance between the upper side plates 31 on both sides of the front end and the rear end of the guide groove is greater than the distance between the upper side plates 31 on both sides of the middle part of the guide groove, so that the IC material can enter and leave the guide groove conveniently. The distance between the upper side plates 31 on both sides of the middle part of the guide groove is larger than the width of the body of the IC material and smaller than the total width of the IC material. After the IC material enters the middle of the guide chute, the upper side plate 31 covers the pins of the IC material to prevent the IC material from falling off from the guide chute. The distance between the lower side plates 32 on the two sides of the guide groove is larger than the total width of the IC material, the thickness of the lower side plates 32 is larger than the thickness of pins of the IC material, and the friction force between the pins of the IC material and the upper side plates 31 and the lower side plates 32 is reduced.
In one embodiment, the upper plate 31 and the lower plate 32 are respectively provided with a plurality of slots corresponding to the same position, the slots are distributed along the left-right direction, and the upper plate 31 and the lower plate 32 are fixed on the base 10 by screws passing through the slots. The left and right positions of the upper side plate 31 and the lower side plate 32 can be conveniently adjusted, and the width of the guide groove can be further adjusted, so that the IC material conveying device is suitable for conveying IC materials of different specifications.
As an embodiment, the width of the feeding hole is larger than the inner width of the IC material tube 50 and smaller than the total width of the IC material tube 50, and the guide grooves are provided with guide slopes corresponding to two sides of the feeding hole, so that the IC material can enter the guide grooves from the IC material tube 50.
In one embodiment, a material buffer sensor 34 is disposed in the middle of the guide groove. When the continuous sensing timing of the material buffer sensor 34 exceeds 2 seconds (which can be preset), the tube-packed material feeding device stops blowing and feeding the IC material tube 50, the conveying belt mechanism 20 continues to feed the IC material to the material taking opening according to the material taking condition, after the material buffer sensor 34 senses that the IC material in the guide groove is removed, and 3 seconds (which can be preset) after timing again, the rear IC material tube 50 of the tube-packed material feeding device continues to blow and feed, and the process is repeated.
As an implementation mode, the distance between the limiting block 15 and the discharge hole is larger than the length of 1 IC material, and the distance between the limiting block 15 and the discharge limiting sheet 13 is smaller than the length of 2 IC materials, so that the manipulator can grab the IC materials conveyed to the material placing table 14 conveniently.
As an implementation mode, the one end of stopper 15 towards the discharge gate is wavy, reduces the frictional force between IC material and the stopper 15 on putting material platform 14, promotes the stability that the manipulator snatched the IC material.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A tube IC material feeding device is characterized by comprising a base, a conveying belt mechanism and 2 groups of side plate assemblies, wherein the 2 groups of side plate assemblies are oppositely arranged on the base in a left-right corresponding mode, a guide groove matched with an IC material is formed between the side plate assemblies on the left side and the right side, a feeding hole and a discharging hole are formed in the front end and the rear end of the guide groove respectively, a conveying belt of the conveying belt mechanism is arranged at the bottom of the guide groove, the width of the conveying belt is smaller than the width of a body of the IC material, and a guide block is arranged on the side plate assembly on one side of the guide groove, corresponding to the feeding hole; the front end of the inner side surface of the guide block is an inclined surface inclined towards the outer side, and the rear end of the inner side surface is vertical to the feed inlet; a guide block is arranged at the front section of the bottom of the guide groove along the feed inlet, a feed limiting piece is covered on the front end of the guide groove, and a discharge limiting piece is covered on the rear end of the guide groove; the base is provided with a limiting block corresponding to the discharge port.
2. The tube-packed IC material supply device of claim 1, wherein the width of the guide block is smaller than the width of the body of the IC material; the height of the surface of the front end of the material guide block is matched with that of the IC material pipe, and the height of the surface of the rear end of the material guide block is equal to that of the surface of the conveying belt at the bottom of the guide groove; the surface height of the material placing table is higher than the surface height of the conveying belt by a preset distance; the front end of the material placing table is provided with a lifting inclined plane from the bottom of the discharge port to the surface of the material placing table.
3. The tubular IC material feeder of claim 1, wherein the distance between the rear end of the inner side of the guide block and the feed port is smaller than the thickness of the tube wall of the IC material tube.
4. The tubular IC material feeding device according to claim 1, wherein the front end of the feeding stopper exceeds the guide groove, and the front end is tilted upward.
5. The tubular IC material feeder of claim 1, wherein the side plate assemblies each comprise an upper side plate and a lower side plate, the upper side plates on both sides of the front and rear ends of the guide groove are spaced apart from each other by a distance greater than the distance between the upper side plates on both sides of the middle portion of the guide groove, the upper side plates on both sides of the middle portion of the guide groove are spaced apart from each other by a distance greater than the body width of the IC material and less than the total width of the IC material, the lower side plates on both sides of the guide groove are spaced apart from each other by a distance greater than the total width of the IC material, and the lower side plates are thicker than the pins of the IC material.
6. The tubular IC material feeder according to claim 5, wherein the upper plate and the lower plate are respectively provided with a plurality of slots corresponding to the same position, the slots are distributed along the left-right direction, and the upper plate and the lower plate are fixed to the base by screws passing through the slots.
7. The tubular IC material supply device of claim 1, wherein the width of the feed opening is greater than and greater than the inner width of the IC material tube and less than the total width of the IC material tube; the guide groove is provided with guide inclined planes corresponding to the two sides of the feed inlet.
8. A tube IC material feeder as claimed in claim 1, wherein a material buffer sensor is provided in the middle of the guide groove.
9. The tube-packed IC material feeding device according to claim 1, wherein the distance between the stopper and the discharge port is greater than the length of 1 IC material, and the distance between the stopper and the discharge port is less than the length of 2 IC materials.
10. The tubular IC material feeding device according to claim 1, wherein an end of the stopper facing the discharge port is wavy.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120051986 | 2021-01-08 | ||
| CN2021200519860 | 2021-01-08 |
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| Publication Number | Publication Date |
|---|---|
| CN214568276U true CN214568276U (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120743780.4U Active CN214568276U (en) | 2021-01-08 | 2021-04-12 | Pipe-packed IC material feeding device |
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| CN (1) | CN214568276U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116331793A (en) * | 2023-03-30 | 2023-06-27 | 芯朋半导体科技(如东)有限公司 | Plastic package feeding device for integrated circuit back-end |
-
2021
- 2021-04-12 CN CN202120743780.4U patent/CN214568276U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116331793A (en) * | 2023-03-30 | 2023-06-27 | 芯朋半导体科技(如东)有限公司 | Plastic package feeding device for integrated circuit back-end |
| CN116331793B (en) * | 2023-03-30 | 2023-09-26 | 芯朋半导体科技(如东)有限公司 | Plastic package feeding device for integrated circuit back-end |
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