CN214558369U - Laser processing platform and laser processing equipment - Google Patents

Abstract

The application provides a laser processing platform and laser processing equipment, wherein, the laser processing platform includes: the laser processing platform is provided with an annular groove, the top of the outer ring of the annular groove is higher than the top of the inner ring of the annular groove, and the top of the outer ring of the annular groove is in contact with the lower surface of a workpiece to be processed; the region to be processed of the workpiece to be processed is aligned with the upper opening of the annular groove; a water drainage groove is arranged in the inner ring of the annular groove; the outer ring side wall of the annular groove is provided with a water inlet for injecting working liquid; in the laser processing process, working liquid enters the annular groove through the water inlet and fills the annular groove, the working liquid is in contact with a to-be-processed area of a to-be-processed workpiece, and hanging slag generated by laser processing is discharged through the water discharging groove. The laser processing platform and the laser processing equipment of this application embodiment take away the dust that produces in the laser processing process through the working solution of motion, eliminate and hang the sediment phenomenon, promote the laser processing effect.

Description

Laser processing platform and laser processing equipment

Technical Field

The application relates to the technical field of laser processing, in particular to a laser processing platform and laser processing equipment.

Background

Some dust is generated in the process of laser processing (punching, cutting, slotting, ablating and the like) of a workpiece, and as the processed sample size is larger (such as the processing thickness is increased or the processing stroke is increased), the dust can be gathered and attached to the vicinity of the to-be-processed area of the workpiece, and the dust is called slag adhering. The slag adhering phenomenon can cause a lot of unqualified processing products and can not meet the production requirements. Moreover, sparks are generated in the laser processing process, a thick recast layer is generated when the sparks are splashed on the wall surface of the workpiece, a large amount of micro cracks are generated, and the processing quality is seriously affected. Patent CN208772753U discloses a tool for laser beam machining glass aperture, including the surface be equipped with positioning groove's bottom plate with inlay the cushion of establishing in positioning groove, the cushion middle part has the fretwork groove, is equipped with on the bottom plate and carries out refrigerated cooling structure for waiting to process the glass lower surface. The middle of the cooling structure is provided with a water inlet hole and a cylindrical pipe, and the edge of the cooling structure is provided with a water outlet hole. When cooling, utilize the water pump to carry water to get into the inlet opening, the cooling water overflows the position between cylindrical pipe and the water tank body after cylindrical pipe overflows gradually, discharges from the apopore for the cooling water cools off the processing position of glass work piece. However, the structure of the jig is complex, the water pump is required to pump water from bottom to top, if the water speed is too fast, the glass workpiece is easy to overflow, and if the water speed is too slow, the machining fragments are not easy to clear, so that the machining quality is influenced.

SUMMERY OF THE UTILITY MODEL

The object of the present application is to solve at least to some extent one of the above mentioned technical problems.

For this reason, the first aim at of this application provides a laser beam machining platform, through to the position design ring channel that corresponds on the laser beam machining platform and treat the processing region, injects working solution in the inslot, can take away the dust that produces in the laser beam machining process through the working solution of motion, eliminates and hangs the sediment phenomenon, promotes the laser beam machining effect.

A second object of the present application is to propose a laser machining apparatus.

In order to achieve the above object, an embodiment of the first aspect of the present application provides a laser processing platform, including: the laser processing platform is provided with an annular groove, the top of the outer ring of the annular groove is higher than the top of the inner ring of the annular groove, and the top of the outer ring of the annular groove is in contact with the lower surface of a workpiece to be processed; the to-be-machined area of the to-be-machined workpiece is aligned with the upper opening of the annular groove; a water drainage groove is arranged in the inner ring of the annular groove; the outer ring side wall of the annular groove is provided with a water inlet for injecting working liquid; in the laser processing process, the working liquid enters the annular groove through the water inlet and fills the annular groove, the working liquid is in contact with the to-be-processed area of the to-be-processed workpiece, and the hanging slag generated by laser processing is discharged through the drainage groove.

Optionally, the water inlet is located at the bottom of the annular groove.

Optionally, a vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be machined is within a preset distance range.

Optionally, a first flow rate at which the working fluid is injected into the water inlet is kept within a first flow rate range, and a vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed is within a preset distance range, so that the working fluid is always in contact with a region to be processed of the workpiece to be processed in a laser processing process.

Optionally, a first distance from the bottom of the annular groove to the top of the inner ring is greater than a vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed, so that the working fluid is firstly contacted with the region to be processed of the workpiece to be processed, and then is discharged through the drainage groove.

Optionally, the second flow rate at which the working fluid exits the drain tank is maintained in a second flow rate range.

Optionally, a second flow rate of the working fluid discharged from the drainage channel is in a multiple relation with a first flow rate of the working fluid injected into the water inlet.

Optionally, the working fluid rises in the annular groove at a third flow rate.

Optionally, the sectional area of the drainage groove is larger than that of the to-be-processed area of the to-be-processed workpiece.

Optionally, the upper surface of the laser processing platform is further provided with an adsorption hole, an adsorption channel is arranged in the laser processing platform, one end of the adsorption channel is communicated with the adsorption hole, and the other end of the adsorption channel is connected with a vacuum generating device for providing adsorption force.

The laser processing platform of this application, through treating the position design ring channel of machining region to laser processing platform is last to correspond, the inslot injects working solution, can take away the dust that produces in the laser processing process through the working solution of motion, eliminates and hangs the sediment phenomenon, promotes the laser processing effect. Meanwhile, spark and recasting layers generated during laser processing are avoided, and microcracks in a processing area are avoided.

In order to achieve the above object, an embodiment of a second aspect of the present application provides a laser processing apparatus, including the laser processing platform and the laser processing module described in the embodiment of the first aspect, the laser processing module is disposed above the laser processing platform, and a laser emitted by the laser processing module irradiates an area to be processed of a workpiece to be processed.

Optionally, the laser processing module further comprises a laser light path control device, and in the laser processing process, the laser light path control device controls laser to penetrate through the workpiece to be processed and controls the processing point of the laser to be always located on the contact surface between the area to be processed of the workpiece to be processed and the working solution.

Optionally, the starting position of the processing point of the laser is the lower surface of the region to be processed of the workpiece to be processed.

Optionally, the workpiece to be processed is a transparent workpiece.

The laser processing equipment of this application, through treating the position design ring channel of machining region to laser processing platform upper correspondence, the inslot is injected working solution, can take away the dust that produces in the laser processing process through the working solution of motion, eliminates and hangs the sediment phenomenon, promotes the laser processing effect. Meanwhile, spark and recasting layers generated during laser processing are avoided, and microcracks in a processing area are avoided.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:

FIG. 1 is a schematic structural diagram of a laser processing platform according to an embodiment of the present application;

FIG. 2 is a top view of a laser machining platform according to one embodiment of the present application;

FIG. 3 is a top view of a laser machining platform according to another embodiment of the present application;

FIG. 4 is a first top view of the working fluid flow of one embodiment of the present application;

FIG. 5 is a second top view of the working fluid flow of one embodiment of the present application;

FIG. 6 is a third top view of the working fluid flow of one embodiment of the present application;

FIG. 7 is a side view of the working fluid flow of one embodiment of the present application;

FIG. 8 is a schematic structural diagram of a laser processing platform according to another embodiment of the present application;

FIG. 9 is a schematic structural view of a laser machining apparatus according to an embodiment of the present application;

fig. 10 is a schematic structural view of a laser processing apparatus according to another embodiment of the present application.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

The present application is described in further detail below with reference to specific examples, which should not be construed as limiting the scope of the invention as claimed.

The laser processing platform and the laser processing apparatus according to the embodiments of the present application are described below with reference to the drawings.

As shown in fig. 1-3, the upper surface of the laser machining platform is provided with an annular groove 1.

As can be seen from the figure, the top of the outer ring of the annular groove 1 is higher than the top of the inner ring of the annular groove 1, and the top of the outer ring of the annular groove is in contact with the lower surface of the workpiece to be machined.

The region 21 to be machined of the workpiece 2 to be machined is aligned with the upper opening of the annular groove 1.

A water drainage channel 3 is provided in the inner ring of the annular groove 1. The cross-sectional area a4 of the drain channel 3 is smaller than the cross-sectional area A3 of the inner ring of the annular groove 1.

The outer ring side wall of the annular groove 1 is provided with a water inlet 4 for injecting working liquid. In the prior art, a water inlet is arranged in the middle, a part of working solution flows to the middle part of a to-be-processed area of a to-be-processed workpiece at the moment of impact, and a part of working solution flows to the periphery of the to-be-processed area of the to-be-processed workpiece, so that the discharge direction of the adhered slag in the laser processing process is uncontrollable, the adhered slag is scattered, and the processing effect is influenced. In addition, because the work piece of waiting to process is directly strikeed to the working solution, when laser beam machining accomplished, the center of waiting to process the work piece can form a through-hole, and the working solution can directly spill over in the through-hole, and laser has not closed yet this moment, and laser can produce the refraction when the working solution that overflows, leads to other regional laser damage. Consequently, this application sets up the water inlet at the lateral wall, can solve the problem that exists among the prior art effectively.

Further, the water inlet 4 is located at the bottom of the annular groove 1, in particular, as can be seen in fig. 1, at the side of the bottom of the annular groove 1. If the height of the water inlet 4 is set too high, the working fluid is impacted to the region 21 to be processed of the workpiece 2 to be processed when the working fluid is not uniformly diffused to the region between the inner ring and the outer ring, uneven water flow can be formed at the moment, and the working fluid can overflow from a through hole formed by the workpiece 2 to be processed when the processing is finished.

During laser machining, the working fluid first passes through the water inlet 4, as shown in fig. 4. Wherein the first flow velocity V1 at which the working fluid is injected into the inlet 4 is maintained in the first flow velocity range.

Next, as shown in fig. 5, the working fluid impinges on the inner ring of the annular groove 1, and starts flowing around the annular groove 1.

As shown in fig. 6, the working fluid fills the bottom of the annular groove 1 to form an annular shape.

As shown in fig. 7, the working fluid starts to rise at a constant speed until the working fluid contacts the region 21 to be machined of the workpiece 2 to be machined.

Wherein, the flow velocity of the working liquid in the annular groove 1 is a third flow velocity V23 when the working liquid moves uniformly and ascends.

Since the vertical distance H2 between the top of the inner ring of the annular groove 1 and the lower surface of the workpiece to be machined is within a preset distance range. H2 ranged from 0.1 to 3 mm. Thus, after the region between the inner ring and the outer ring of the annular groove 1 is filled with the working fluid, the working fluid flows toward the surface of the region to be machined first, rather than flowing along the region to be machined, and is directly discharged from the drain grooves 3 in the inner ring.

The first distance H1 from the bottom of the annular groove to the top of the inner ring is greater than the vertical distance H2 between the top of the inner ring of the annular groove and the lower surface of the workpiece to be machined, so that the working liquid can rise at a constant speed after entering the annular groove.

And finally, the flowing of the working liquid takes away the slag generated by laser processing and is discharged downwards through the water discharge groove 3.

The sectional area a4 of the drainage channel 3 is larger than the sectional area a5 of the area 21 to be processed, so that the working fluid can be discharged from the drainage channel 3, and overflow from the area 21 to be processed is avoided.

The second flow rate V4 at which the working fluid exits the drain tank 3 is maintained in the second flow rate range. V4 ranged from 0.1 to 3 m/s. Therefore, during laser processing, the slag adhering can not be brought away too soon due to too high speed of the working liquid, and the efficiency of removing the slag adhering is not high due to too low flow speed.

Further, before the working fluid is injected into the annular groove 1, the area between the workpiece 2 to be machined and the annular groove 1 is air. If the flow rate of V4 is too slow, the working fluid will not be able to drain the air between the workpiece 2 to be machined and the annular groove 1. In this case, laser processing causes a large amount of slag adhering. If the V4 flow rate is too high, the laser drilling will be started and the working fluid will overflow.

Furthermore, the second flow velocity V4 of the working fluid discharged from the drainage channel is in a multiple relation with the first flow velocity V1 of the injected water inlet, for example, V1 is more than or equal to 0.5V4, which ensures that the working fluid can contact with the lower surface of the area to be processed and then be discharged from the drainage channel 3.

Furthermore, the working liquid rises in the annular groove at a third flow speed, so that the working liquid can contact the lower surface of the area to be processed, the lower surface is cooled, the adhering slag is taken away, and the problem of overflow of the working liquid in the prior art can be avoided.

It should be understood that the shape of the annular groove 1 is not limited to the circular shape shown in the drawings, but may be an elliptical shape, or other shapes.

The following description will be made in detail by taking the circular annular groove and the laser drilling as an example.

As shown in fig. 1-2, a workpiece 2 to be processed is placed on a laser processing platform, the laser processing platform is provided with at least one annular groove 1 for injecting working fluid, and a region 21 to be processed of the workpiece 2 to be processed is aligned with the annular groove 1. Wherein the bottom region between the outer ring and the inner ring of the annular groove 1 is closed, and the wall height of the outer ring (H1+ H2) is greater than the wall height of the inner ring (H1). The inner ring of the annular groove 1 is provided with a drainage groove 3, and the lower end of the annular groove is in an open state and used for discharging working liquid. The water inlet 4 for injecting the working fluid is arranged on the outer side of the bottom end of the outer ring wall surface, and the diameter of the water inlet is D1. Working solution is injected from a water inlet 4 on the side surface, then the working solution impacts the wall surface of the inner ring, the local flow rate of the working solution is reduced in the impact process, the working solution is uniformly dispersed in the annular groove body between the inner ring and the outer ring, the working solution rises at a constant speed to fill the annular groove body between the inner ring and the outer ring, the impact force of the working solution on a workpiece to be processed is reduced, the uniform and uniform supply of the water flow of the working solution in laser processing is ensured, and the working solution does not overflow when the laser processing is completed.

The relation between the flow velocity V1 of the working fluid injected into the water inlet 4 and the flow velocity V23 of the working fluid entering the area between the outer ring and the inner ring of the annular groove 1 is that V1 is more than or equal to 0.5V 23. The height H1 of the wall surface of the inner ring, the diameter D1 of the water inlet 4 and the vertical distance H2 between the top of the inner ring of the annular groove 1 and the upper surface of the laser processing platform are in the relationship that H1 is more than or equal to D1+ H2. So that the working liquid is always contacted with the area to be processed of the workpiece to be processed in the laser processing process.

The number of annular grooves 1 may be a plurality, the number being related to the need for laser drilling, one annular groove corresponding to one drilling zone.

The laser processing platform of this application embodiment, through treating the position design ring channel of machining region to laser processing platform upper correspondence, the inslot is injected working solution, can take away the dust that produces in the laser processing process through the working solution of motion, eliminates and hangs the sediment phenomenon, promotes the laser processing effect. Meanwhile, spark and recasting layers generated during laser processing are avoided, and microcracks in a processing area are avoided.

The embodiment shown in fig. 1 and 3 corresponds to the solution of the first embodiment, except that the annular groove is oval.

In another embodiment of the present application, as shown in fig. 8, an adsorption hole 5 is further formed in the upper surface of the laser processing platform, an adsorption channel 6 is disposed in the laser processing platform, one end of the adsorption channel 6 is communicated with the adsorption hole 5, and the other end of the adsorption channel 6 is connected to a vacuum generating device 7 for providing an adsorption force. The vacuum generating device 7 can suck away the air in the adsorption channel 6, so that the adsorption holes 5 adsorb the workpiece 2 to be processed, and the workpiece 2 to be processed is better fixed.

In order to realize the embodiment, the application also provides laser processing equipment.

As shown in fig. 9, the laser processing apparatus includes the laser processing platform 100 and the laser processing module 200 described in the previous embodiment.

The laser processing module 200 is disposed above the laser processing platform 100, and laser emitted from the laser processing module 200 irradiates the region 21 to be processed of the workpiece 2 to be processed.

Wherein, the workpiece 2 to be processed is a transparent workpiece.

In one embodiment of the present application, the laser processing module 200 may include a laser, a beam expander, a field lens, etc. to focus the laser on the workpiece 2 to be processed. The wavelength of the laser covers the full spectrum.

The lower surface of the region to be processed 21 of the workpiece to be processed 2 is brought into contact with the working fluid therebelow. Through set up the working solution in the lower surface below of the regional 21 of treating processing work piece 2, when laser beam machining, can take away the heat, avoid adding man-hour production spark, avoid producing the recasting layer, play the effect of cooling simultaneously, avoid laser to add the dust that produces and melt the slag problem of hanging that leads to of cladding. On the other hand, microcracks generated during laser processing can be reduced.

The explanation is given by using glass laser drilling and using working solution as water: during laser processing, laser penetrates through the glass, punching processing is started on the bottom surface (interface between the bottom surface of the glass and water) of the glass, and during the processing, the laser processing focus is controlled to move from bottom to top until punching is finished. In the course of working, water rises along the trompil gradually for the laser beam machining point is the interface of water and glass piece all the time, takes away the heat on the one hand, avoids laser beam machining to produce the spark, avoids producing the recasting layer, plays the effect of cooling simultaneously, avoids laser beam machining to produce the dust cladding that leads to hang the sediment problem. On the other hand, microcracks generated during laser processing can be reduced. Water is always in contact with the lower surface of the glass sheet during laser processing.

In another embodiment of the present application, as shown in fig. 10, the laser processing module 200 further includes a laser path control device 210.

In the laser processing process, the laser light path control device 210 controls the laser to penetrate through the workpiece 2 to be processed and controls the processing point of the laser to be always located on the contact surface between the region to be processed of the workpiece 2 to be processed and the working solution.

The starting position of the processing point of the laser is the lower surface of the region to be processed 21 of the workpiece to be processed 2.

Specifically, the starting position of the processing point of the laser is the lower surface of the region to be processed 21 of the workpiece to be processed 2, and the processing is completed by moving up slowly while scanning. Specific implementation modes can include the following steps: firstly, a 3D galvanometer is used for scanning, so that three-dimensional scanning processing can be realized; secondly, processing a plane by using a 2D galvanometer, and driving a laser processing module to move up and down by a laser path control system to realize three-dimensional scanning processing; or the position of the product is moved to realize three-dimensional scanning processing; and thirdly, the three-dimensional motion mechanism drives the laser processing module or the workpiece to be processed to move in the three-dimensional direction, so that three-dimensional processing is realized. Or the three modes are matched and combined to realize processing on different focal planes.

The workpiece 2 to be processed is a transparent workpiece, and the material can be any one of glass, sapphire, silicon crystal and transparent high polymer material.

In some embodiments, the surface of the workpiece 2 to be machined is also coated with a thin film. The thin film may include an ITO film, a metal film, or a thin film of other material. The laser processing equipment has a better processing effect on the workpiece to be processed coated with the film, can avoid adverse effects (such as the phenomenon of forming white fog) caused by heat generated during processing on the product, and reduces the thermal influence and damage on the film.

In some embodiments, the workpiece 2 to be processed may also be an optical lens, and a thin film including any one or more of an antireflection film, a high-reflection film, a filter film, a polarizing film, a protective film, and a conductive film may be coated on the optical lens.

The laser processing equipment has a better processing effect on the optical lens coated with the film, can avoid adverse effects (such as the phenomenon of forming white fog) caused by heat generated during processing on the product, and reduces the thermal influence and damage on the film.

It should be understood that the laser machining process may be, for example, cutting, blind-drilling, partial ablation, modifying, etc., and the application is not limited thereto.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

It should be noted that in the description of the present specification, reference to the description of the term "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Claims (14)

1. A laser machining platform, comprising:

the laser processing platform is provided with an annular groove, the top of the outer ring of the annular groove is higher than the top of the inner ring of the annular groove, and the top of the outer ring of the annular groove is in contact with the lower surface of a workpiece to be processed;

the to-be-machined area of the to-be-machined workpiece is aligned with the upper opening of the annular groove;

a water drainage groove is arranged in the inner ring of the annular groove;

the outer ring side wall of the annular groove is provided with a water inlet for injecting working liquid;

in the laser processing process, the working liquid enters the annular groove through the water inlet and fills the annular groove, the working liquid is in contact with the to-be-processed area of the to-be-processed workpiece, and the hanging slag generated by laser processing is discharged through the drainage groove.

2. The laser machining platform of claim 1, wherein the water inlet is located at a bottom of the annular groove.

3. The laser machining platform of claim 1, wherein a vertical distance between a top of the inner ring of the annular groove and a lower surface of the workpiece to be machined is within a predetermined distance range.

4. The laser processing platform of claim 1, wherein a first flow rate at which the working fluid is injected into the water inlet is maintained within a first flow rate range, and a vertical distance between a top of the inner ring of the annular groove and a lower surface of the workpiece to be processed is within a preset distance range, so that the working fluid is always in contact with a region to be processed of the workpiece to be processed during laser processing.

5. The laser processing platform of claim 3 or 4, wherein a first distance from the bottom of the annular groove to the top of the inner ring is greater than a vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed, so that the working fluid is firstly contacted with the region to be processed of the workpiece to be processed and then is discharged through the drainage groove.

6. The laser-machining platform of claim 1, wherein the second flow rate at which the working fluid exits the drain groove is maintained within a second flow rate range.

7. The laser machining platform of claim 6, wherein the second flow rate of the working fluid exiting the drain channel is a multiple of the first flow rate of the working fluid entering the inlet port.

8. The laser machining platform of claim 1, wherein the working fluid rises at a uniform rate at a third flow rate within the annular groove.

9. The laser processing platform of claim 1, wherein the cross-sectional area of the water drainage groove is larger than the cross-sectional area of the region to be processed of the workpiece to be processed.

10. The laser processing platform of claim 1, wherein an adsorption hole is further formed in the upper surface of the laser processing platform, an adsorption channel is arranged in the laser processing platform, one end of the adsorption channel is communicated with the adsorption hole, and the other end of the adsorption channel is connected with a vacuum generating device for providing adsorption force.

11. A laser processing apparatus comprising the laser processing platform according to any one of claims 1 to 10 and a laser processing module, wherein the laser processing module is disposed above the laser processing platform, and laser emitted from the laser processing module irradiates an area to be processed of a workpiece to be processed.

12. The laser processing apparatus according to claim 11, wherein the laser processing module further comprises a laser path control device, and during the laser processing, the laser path control device controls the laser to penetrate through the workpiece to be processed and controls a processing point of the laser to be always located on a contact surface between a region to be processed of the workpiece to be processed and the working solution.

13. The laser processing apparatus according to claim 12, wherein a starting position of a processing point of the laser is a lower surface of a region to be processed of the workpiece to be processed.

14. The laser processing apparatus according to claim 11, wherein the workpiece to be processed is a transparent workpiece.

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