CN214529287U

CN214529287U - Electroplating suspension device

Info

Publication number: CN214529287U
Application number: CN202022734375.4U
Authority: CN
Inventors: 赵景才
Original assignee: Yuyao Edson Electroplating Technology Co ltd
Current assignee: Yuyao Edson Electroplating Technology Co ltd
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2021-10-29
Anticipated expiration: 2030-11-23

Abstract

The utility model discloses an electroplating suspension device, wherein the electroplating suspension device is suitable for electroplating a metal ring and comprises a suspension mechanism and a conductive mechanism, wherein the suspension mechanism comprises a carrying body and at least one conductive body, wherein the carrying body comprises a carrying disc and at least two carrying arms, wherein the carrier arm extends outwardly from the carrier platter, wherein the conductive body is electrically connectable to a cathode of a power source, wherein the conductive mechanism is disposed on the carrying arm of the carrying body for the metal ring to be suspended and held under the carrying body in a manner of being suspended on the conductive mechanism, the conductive mechanism is electrically connected to the conductive body such that the metal ring is electrically connected to the cathode of the power source in such a manner as to be electrically connected to the conductive mechanism.

Description

Electroplating suspension device

Technical Field

The utility model relates to an electroplate the field, in particular to electroplate linkage.

Background

Briefly, electroplating refers to the electrolytic reaction in a metal salt solution under the action of direct current to deposit a metal or alloy layer on the surface of an electrical conductor, such as a metal. The electroplating increases the appearance luster of products, for example, common taps in life usually form a copper plating layer, a nickel plating layer and the like on the surface of the tap through electroplating, and also form a gold plating layer and a silver plating layer by utilizing an electroplating process to make the products beautiful. In addition, the electroplating improves the corrosion resistance of the product and prolongs the service life of the product, for example, the iron plate is easy to oxidize and rust after being exposed in the air for a long time, and the iron plate has better corrosion resistance after being formed with a zinc coating and a nickel coating by an electroplating process. In addition, the electroplating can also repair damaged parts and form coatings with special performance, such as a reflective silver coating, a conductive silver coating, an anti-reflection black nickel coating and the like. In conclusion, the electroplating process greatly improves the functionality, decorativeness and protection of the product.

Particularly, for a metal sealing ring with extremely high sealing performance requirement, the electroplating process directly influences the sealing performance of the metal sealing ring. In particular, a metal sealing ring is widely used in a pressure vessel, and the sealing performance of the metal sealing ring is closely related to the safety and reliability of the pressure vessel, and is an important component of the pressure vessel. For example, a metal sealing ring may be applied to the reactor vessel. The reactor pressure vessel is primarily used to house a reactor core, which contains a high temperature, high pressure, and radioactive coolant. Under the normal operating condition or the test operating condition, the structure of the reactor pressure vessel must be kept complete, so that the threat of the leakage of radioactive substances to the surrounding environment and the physical and psychological health of operating personnel can be avoided. Moreover, the sealing performance of the reactor pressure vessel is directly related to the normal reactor opening operation of the nuclear power station. Generally, a reactor pressure vessel is composed of a head and a barrel which are connected by bolts, and a metal sealing ring is provided between the head and the barrel to prevent leakage of radioactive materials. The surface of the metal sealing ring is formed into a silver coating by an electroplating process. In the subsequent use process, the plastic deformation of the silver plating layer is beneficial to better sealing the top cover and the cylinder body, and the safety and the reliability of the reactor vessel are improved.

Specifically, a metal ring electrically connected to the cathode of a power supply and a metal silver block electrically connected to the anode of the power supply are placed in a plating solution containing silver ions, under the action of direct current, the negative ions and the positive ions in the plating solution move regularly, a layer of metal silver is gradually deposited on the surface of the metal ring at the cathode, and the metal silver block at the anode is dissolved continuously to replenish the silver ions consumed in the plating solution. In this way, the metallic silver connected to the anode is gradually transferred to the surface of the metal ring, i.e., the silver plating layer covering the surface of the metal ring is formed using the electrolytic principle.

However, there are still many problems in the electroplating process using the conventional electroplating apparatus and electroplating method. Firstly, the metal ring placed in the electroplating solution is in direct contact with the inner wall of a container for containing the electroplating solution, which causes uneven silver plating layer formed on the surface of the metal ring and even clearance, and greatly affects the sealing performance of the prepared metal sealing ring.

Further, in the conventional plating apparatus, the metal ring is electrically connected to the cathode of the power supply by winding a conductive wire around the surface of the metal ring. And the position covered by the conductive wire is difficult to form a silver plating layer, so that the silver plating layer is unevenly distributed, and the silver plating layer has a side opening of a whole circle, thereby influencing the sealing performance of the metal sealing ring. In addition, in order to ensure that the metal ring can be stably kept in the electroplating solution, the conductive wire is usually wound on the metal ring for a plurality of times, so that the side opening of the silver plating layer is larger, and the sealing effect of the metal sealing ring is not facilitated.

In addition, in the existing silver electroplating process, the electroplating solution is always in a static state, the movement speed of ions in the solution is slow, after a period of time, the ions in the electroplating solution are dispersed unevenly, the concentration of the solution is easy to generate large concentration difference, so that the electroplating efficiency and the current efficiency are low, and the silver plating layer formed on the surface of the metal pipe is uneven in thickness and loose in texture. In addition, hydrogen gas is often generated during the electroplating process, the performance of the plating layer is reduced due to hydrogen contained in the plating layer, and the released hydrogen easily causes spots and stripes on the surface of the plating layer to affect the quality of the silver plating layer.

In addition, the existing electroplating device can only carry out electroplating treatment on one metal ring at a time, the electroplating efficiency is low, the current utilization rate is low, and the electroplating cost is improved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electroplate linkage, wherein electroplate linkage will through the mode of hanging a becket the becket carries out electroplating treatment in arranging an electroplate liquid in, the becket is arranged in with unsettled in the electroplate liquid, be favorable to follow-up formation in a plating layer of becket can evenly cover in the surface of becket.

Another object of the present invention is to provide an electroplating hanger, wherein the electroplating hanger can simultaneously electroplate a plurality of metal rings, thereby improving the electroplating efficiency and the electric energy utilization rate, and being beneficial to reducing the electroplating cost.

Another object of the present invention is to provide an electroplating hanger, wherein the electroplating hanger can stir the electroplating solution, so that the electroplating solution is in an oscillation state, which is favorable for accelerating the movement of ions in the electroplating solution, reduces the concentration gradient of the solution, reduces the polarization of the solution, and further accelerates the electrode process, thereby improving the current efficiency and the electroplating efficiency.

Another object of the present invention is to provide an electroplating suspension device, wherein the electroplating suspension device can move left and right in the electroplating process, and drive the metal ring to move in the electroplating solution, so as to stir the electroplating solution, so that the electroplating solution is in the oscillation state, which is favorable for forming a compact electroplating layer on the surface of the metal ring.

Another object of the present invention is to provide an electroplating hanger, wherein the electroplating hanger can move up and down during the electroplating process and drive the metal ring to move in the electroplating solution to stir the electroplating solution, so that the electroplating solution is in the oscillation state, which is favorable for forming a compact electroplating layer on the surface of the metal ring.

Another object of the present invention is to provide an electroplating suspension device, wherein the outer surface of the metal ring is completely exposed, which is electrically connected to the cathode of a power source, thereby facilitating the subsequent formation of the plating layer on the metal ring to uniformly cover the outer surface of the metal ring.

Another object of the present invention is to provide an electroplating suspension device, wherein the electroplating suspension device is electrically connected to the cathode of the power supply, and the electroplating suspension device is electrically connected to the cathode of the power supply through an internal contact conductive manner, so as to avoid the electroplating process, wherein the outer surface of the metal ring is shielded.

According to an aspect of the utility model, the utility model provides an electroplate linkage is applicable to and electroplates a becket, electroplate linkage includes:

a suspension mechanism, wherein the suspension mechanism comprises a carrier body and at least one conductive body, wherein the carrier body comprises a carrier platter and at least two carrier arms, wherein the carrier arms extend outwardly from the carrier platter, wherein the conductive body is electrically connectable to a cathode of a power supply; and

a conductive mechanism, wherein the conductive mechanism is disposed on the carrying arm of the carrying body, and the metal ring is suspended under the carrying body in a manner of being suspended from the conductive mechanism, and the conductive mechanism is electrically connected to the conductive body, and the metal ring is electrically connected to the cathode of the power supply in a manner of being electrically connected to the conductive mechanism.

According to an embodiment of the utility model, it is a plurality of bear the arm set up in symmetrically bear the dish.

According to an embodiment of the present invention, the bearing body is provided with a bearing arm and a bearing disc which are integrally formed.

According to an embodiment of the present invention, the carrying arm of the carrying body is detachably mounted to the carrying tray.

According to an embodiment of the present invention, the carrying arm includes a carrying portion and a plurality of hanging portions extending outwardly from the carrying portion, the hanging portions are distributed in the carrying portion at intervals, wherein the conductive mechanism is disposed in the hanging portion.

According to an embodiment of the present invention, the carrying tray of the carrying body, the carrying portion of the carrying arm and the hanging portion have conductivity.

According to an embodiment of the present invention, the electroplating suspension device further comprises a support mechanism, wherein the support mechanism is disposed below the main body of the suspension mechanism, and the support mechanism supports the main body upward.

According to an embodiment of the present invention, the electroplating suspension apparatus further comprises a support mechanism, wherein the carrier body is disposed below the support mechanism.

According to an embodiment of the present invention, the electroplating suspension apparatus further comprises an upper and lower driving mechanism, wherein the supporting mechanism is drivably installed in the upper and lower driving mechanism.

According to an embodiment of the present invention, the electroplating suspension apparatus further comprises a left and right driving mechanism, wherein the supporting mechanism is drivably installed in the left and right driving mechanism.

According to an embodiment of the present invention, the conductive mechanism includes a conductive connecting wire and a sealing plug, wherein the conductive connecting wire enters from an assembly opening of the metal ring into an inner chamber of the metal ring, the conductive connecting wire is electrically connected to the metal ring, wherein the sealing plug is disposed in the conductive connecting wire, the sealing plug is retained in the assembly opening of the metal ring, and the sealing plug seals the assembly opening of the metal ring.

According to an embodiment of the present invention, the electrically conductive connection line is electrically connected to the metal ring in contact with an inner surface of the metal ring.

According to an embodiment of the invention, the conductive means further comprises at least one fastener, wherein the fastener is arranged to the sealing plug, wherein the fastener is capable of expanding and squeezing the sealing plug.

Drawings

Fig. 1 is a perspective view of an electroplating suspension apparatus according to a preferred embodiment of the present invention.

Fig. 2 is a first application diagram of the electroplating suspension apparatus according to the above preferred embodiment of the present invention.

Fig. 3 is a schematic view of an application of the electroplating suspension device according to the above preferred embodiment of the present invention.

Fig. 4A is a third schematic view of the electroplating suspension apparatus according to the above preferred embodiment of the present invention.

Fig. 4B is a fourth schematic view of the electroplating suspension apparatus according to the above preferred embodiment of the present invention.

Fig. 5A and 5B are schematic views of a conductive mechanism of the plating suspension device according to the above preferred embodiment of the present invention.

Fig. 6A and 6B are schematic views of a modified embodiment of the conductive mechanism of the plating suspension device according to the above preferred embodiment of the present invention.

Fig. 7A and 7B are schematic views of another modified embodiment of the conductive mechanism of the plating suspension device according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purposes of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1 to 4B of the drawings, an electroplating suspension device 1000 according to a preferred embodiment of the present invention will be described in the following description, wherein the electroplating suspension device 1000 places a metal ring 2000 in an electroplating solution for electroplating by suspending the metal ring 2000, and the metal ring 2000 is suspended in the electroplating solution to facilitate a subsequent electroplating layer formed on the metal ring 2000 to uniformly cover the outer surface of the metal ring.

In this particular embodiment of the present invention, the plating suspension apparatus 1000 comprises at least a conductive mechanism 100 and a suspension mechanism 200, wherein one end of the conductive mechanism 100 is mounted to the metal ring 2000, and the other end of the conductive mechanism 100 is mounted to the suspension mechanism 200. Specifically, the metal ring 200 is held under the suspension mechanism 200 in a manner of being suspended from the suspension mechanism 200 by the conductive mechanism 100. Further, the conductive mechanism 100 is electrically connected to the metal ring 2000 and the suspension mechanism 200, and the suspension mechanism 200 can be electrically connected to a cathode of a power source, such that the metal ring 2000 is electrically connected to the cathode of the power source.

Thus, after the metallic ring 2000 electrically connected to the cathode of the power supply and a metallic silver block electrically connected to the anode of the power supply are placed in an electroplating solution containing silver ions, the metallic silver block electrically connected to the anode of the power supply is gradually transferred to the outer surface of the metallic ring 2000 under the action of a direct current, thereby forming a silver plating layer covering the outer surface of the metallic ring 2000 to manufacture a metallic sealing ring. In the subsequent use process of the metal sealing ring, the silver plating layer is plastically deformed, so that the sealing performance of the metal sealing ring is improved.

It should be noted that the specific application of the plating hanger 1000 is merely exemplary and should not be construed as limiting the scope and content of the plating hanger 1000 of the present invention. The electroplating suspension device 1000 can also be applied to electroplating a copper plating layer or a nickel plating layer on the surface of a key or a faucet, and can also be applied to electroplating a silver plating layer or a gold plating layer on the surface of an ornament, and the like, and the specific application field of the electroplating suspension device 1000 is not limited.

Referring to fig. 1 to 4B, the suspension mechanism 200 of the plating suspension apparatus 1000 includes a carrier body 211 and at least one conductive body 212, wherein the conductive body 212 is disposed on the carrier body 211. The conductive mechanism 100 is disposed on the main body 211, and the conductive mechanism 100 is electrically connected to the main body 212. After the conductive body 212 is electrically connected to the cathode of the power source, the conductive mechanism 100 is electrically connected to the cathode of the power source, and further, the metal ring 2000 electrically connected to the conductive mechanism 100 is electrically connected to the cathode of the power source.

Specifically, the carrier body 211 includes a carrier plate 2111 and at least two carrier arms 2112, wherein the at least two carrier arms 2112 extend outwardly from the carrier plate 2111. One end of the conductive mechanism 100 is mounted to the metal ring 2000, and the other end of the conductive mechanism 100 is mounted to the carrying arm 2112 of the suspension mechanism 200. The conductive body 212 extends outwardly from the carrier arm 2112.

Preferably, the supporting arms 2112 are symmetrically distributed around the supporting plate 2111, and the conductive mechanism 100 is symmetrically disposed on the metal ring 2000, so that after the metal ring 2000 is suspended under the suspension mechanism 200 by the conductive mechanism 100, the metal ring 2000 and the suspension mechanism 200 will not be tilted, thereby ensuring that the metal ring 2000 can be completely immersed in the plating solution. That is, the metal ring 2000 is suspended in the plating solution in parallel with the horizontal plane. Optionally, the metal ring 2000 is completely immersed in the plating solution at an incline.

Preferably, each of the carrying arms 2112 has the same length, and the suspension mechanism 200 is suitable for a container with a circular or square cross section for containing electrolyte, or the size of the container for containing electrolyte is larger than that of the carrying body 211. Alternatively, parts of the carrying arms 2112 may also be implemented with different lengths. For example, the lengths of the carrying arms 2112 on the left side and the right side of the carrying tray 2111 are the same, the lengths of the carrying arms 2112 on the front side and the rear side of the carrying tray 2111 are the same, but the lengths of the carrying arms 2112 on the left side and the right side of the carrying tray 2111 are longer than the lengths of the carrying arms 2112 on the front side and the rear side of the carrying tray 2111. The suspension mechanism 200 is suitable for a container with a rectangular cross section and used for containing electrolyte.

In a specific embodiment of the present invention, the carrying arm 2112 integrally extends outward from the carrying tray 2111, and the suspension mechanism 200 has a stable structure. In a specific embodiment of the present invention, the carrying arm 2112 is detachably mounted on the carrying plate 2111, and the carrying arm 2112 with different lengths can be replaced to make the suspension mechanism 200 suitable for different use environments.

In a specific embodiment of the present invention, the carrying arm 2112 includes a carrying portion 21121 and a plurality of hanging portions 21122, wherein the plurality of hanging portions 21122 extend outward from the carrying portion 21121 at intervals, and the conductive mechanism 100 is mounted on the carrying arm 2112 in the manner of being mounted on the hanging portion 21122. Preferably, the hanging portions 21122 of the carrying arms 2112 held on both sides of the carrying tray 2111 are symmetrical to each other, so that the conductive mechanisms 100 of the carrying body 211 provided to the symmetrical hanging portions 21122 are also symmetrical to each other, which facilitates the metal ring 2000 to be stably held in the plating solution.

Preferably, a plurality of the hanging portions 21122 are distributed at intervals on the bearing portion 21121. Different sizes of the metal ring 200 may be connected to the hanging portion 21122 at different positions by the conductive mechanism 100. For example, the metal ring 200 with a small size may be hung from the hanging portion 21122 closer to the carrier plate 2111, and the metal ring 200 with a large size may be hung from the hanging portion 21122 farther from the carrier plate 2111. In this way, the electroplating suspension mechanism 1000 can simultaneously electroplate a plurality of metal rings 2000, thereby improving the electroplating efficiency and the utilization rate of electric energy, and being beneficial to reducing the electroplating cost.

In a specific embodiment of the present invention, the supporting arms 2112 of the supporting body 211 of the suspension mechanism 200 are implemented as 12, wherein the 6 supporting arms 2112 are symmetrically distributed on the left and right sides of the supporting body 212, and the other 6 supporting arms 2112 are symmetrically distributed on the front and rear sides of the supporting body 212, and each supporting arm 2112 has 3 suspending portions 21122. It should be understood by those skilled in the art that the specific number and embodiments of the carrier arms 2112 and the suspension portions 21122 of the carrier arms 2112 are exemplary only and should not be construed as limiting the scope and content of the plating suspension 1000 of the present invention.

In a specific embodiment of the present invention, the plating suspension apparatus 1000 further comprises a supporting mechanism 300, wherein the supporting plate 2111 of the supporting body 211 of the suspension mechanism 200 is disposed on the upper portion of the supporting mechanism 300, and the supporting arm 2112 of the supporting body 211 is suspended around the supporting plate 2111. For example, the container for containing the plating solution is a ring-shaped structure, and the support mechanism 300 is located at the center of the ring-shaped container.

Preferably, the supporting mechanism 300 is disposed below the carrier plate 2111 of the carrier body 211, and the supporting mechanism 300 provides an upward supporting force for the carrier body 211, so that the carrier body 211 is suspended above the plating solution. Preferably, the carrying plate 2111 of the carrying body 211 is arranged on the supporting mechanism 300, and the supporting mechanism 300 provides an upward pulling force to the carrying body 211, so that the carrying body 211 is kept above the plating solution. For example, the carrier body 211 is suspended from the support mechanism 300, or the support mechanism 300 is implemented as a robotic arm that holds the carrier body 211 above the plating solution in a suspended manner by hanging from the support mechanism 300.

Further, the supporting mechanism 300 can be driven to move up and down to facilitate the installation of the conductive mechanism 100 and the metal ring 200 or the removal of the plated metal ring 200.

Specifically, the plating suspension apparatus 100 further comprises an up-down driving mechanism 400, wherein the supporting mechanism 300 is drivingly disposed on the up-down driving mechanism 400, and the up-down driving mechanism 400 is capable of driving the supporting mechanism 300 to move up and down, so that the metal ring 2000 is immersed in the plating solution or separated from the plating solution. Preferably, the up-down driving mechanism 400 moves up and down by electrically driving the supporting mechanism 300 to extend and retract up and down. Preferably, the up-down driving mechanism 400 moves up and down by hydraulically driving the supporting mechanism 300 to extend and retract up and down.

It is worth mentioning that, during the electroplating process, the supporting mechanism 300 is driven to move up and down, so that the metal ring 2000 moves in the electroplating solution to stir the electroplating solution, so that the electroplating solution is in the oscillation state, which is beneficial to form the dense electroplating layer on the surface of the metal ring.

Further, the plating suspension apparatus 100 further comprises a left and right driving mechanism 500, wherein the supporting mechanism 300 is drivably disposed on the left and right driving mechanism 500, and the left and right driving mechanism 500 can drive the supporting mechanism 300 to move left and right, so as to facilitate the installation of the conductive mechanism 100 and the metal ring 200 or the removal of the plated metal ring 200.

It is worth mentioning that, during the electroplating process, the supporting mechanism 300 is driven to move left and right, so that the metal ring 2000 moves in the electroplating solution to stir the electroplating solution, so that the electroplating solution is in the oscillation state, which is beneficial to form the dense electroplating layer on the surface of the metal ring.

That is, the plating hanger device 100 can stir the plating solution so that the plating solution is in an oscillation state, which is beneficial to quickening the movement of ions in the plating solution, reducing the concentration gradient of the solution, reducing the polarization of the solution, quickening the electrode process, and improving the current efficiency and the plating efficiency.

According to an embodiment of the present invention, the carrying plate 2111 of the carrying body 211, the carrying portion 21121 of the carrying arm 2112 and the hanging portion 21122 are all electrically conductive, and the conductive body 212 is electrically connected to the carrying plate 2111, the carrying portion 21121 of the carrying arm 2112 and the hanging portion 21122. After the conductive mechanism 100 is electrically connected to the hanging portion 21122 of the carrier body 211, the metal ring 200 is electrically connected to the conductive body 212. In a specific embodiment of the present invention, the supporting plate 2111 of the supporting body 211, the supporting portion 21121 of the supporting arm 2112 and the hanging portion 21122 are not electrically conductive, and the conductive mechanism 100 is hung behind the hanging portion 21122 of the supporting body 211 and then electrically connected to the conductive body 212.

In this particular embodiment of the present invention, the conductive mechanism 100 is electrically connected to the metal ring 2000 in such a manner as to contact the inner surface of the metal ring 2000. As such, the metal ring 2000 can be electrically connected to the cathode of the power supply. In other words, the outer surface of the metal ring 2000 is not shielded, i.e., the outer surface of the metal ring 2000 is completely exposed, during the process of electrically connecting the metal ring 2000 to the cathode of the power supply. In this manner, the outer surface of the metal ring 2000 is immersed in the plating solution without being shielded during the plating process, so that the silver ions in the plating solution can undergo the redox reaction at any position of the outer surface of the metal ring 2000, and the silver plating layer formed on the outer surface of the metal ring 2000 is uniform and continuous.

Specifically, the metal ring 2000 has at least one mounting opening 201 and an inner chamber 202 communicated with the mounting opening 201. The conductive means 100 comprises a conductive connection line 10 and a sealing plug 20, wherein the sealing plug 20 is arranged on the conductive connection line 10. The electrically conductive connection line 10 penetrates into the inner chamber 202 of the metal ring 2000 from the fitting opening 201 of the metal ring 2000, and the electrically conductive connection line 100 is electrically connected to the metal ring 2000 in contact with an inner wall defining the inner chamber 201. The sealing plug 20 is fixed to the fitting opening 201 of the metal ring 2000, and the sealing plug 20 is held between the electrically conductive connection line 10 and the metal ring 2000, and allows the electrically conductive connection line 10 to be stably held in the fitting opening 201.

Preferably, the conductive connection line 10 of the conductive mechanism 100 is electrically connected to the metal ring 2000 in such a manner as to contact a lower surface of the inner surface of the metal ring 2000. For example, after entering the inner chamber 202 from the assembling opening 201 of the metal ring 2000, the conductive connection line 10 is suspended by gravity and contacts the lower surface of the inner surface of the metal ring 2000, so that the conductive connection line 10 and the metal ring 2000 are electrically connected to each other.

Alternatively, the electrically conductive connection line 10 of the electrically conductive mechanism 100 is electrically connected to the metal ring 2000 in such a manner as to contact an upper surface of an inner surface of the metal ring 2000. For example, after the sealing plug 20 limits the extending direction of the electrically conductive connection line 10 and the electrically conductive connection line 10 enters the inner chamber 202 from the assembling opening 201 of the metal ring 2000, the electrically conductive connection line 10 can be attached to the upper surface of the inner surface of the metal ring, and the metal ring 2000 is electrically connected to the electrically conductive connection line 10.

Optionally, the inner chamber 202 of the metal ring 2000 contains a conductive medium, such as but not limited to a conductive liquid, a solid, or a gas, etc., after the conductive connection line 10 enters the inner chamber 202 from the assembly opening 201 of the metal ring 2000, the conductive connection line 10 and the conductive medium are electrically connected, and the conductive medium contacts the inner surface of the metal ring 2000, so that the metal ring 2000 can be electrically connected to the cathode of the power supply in a manner of being electrically conductive by internal contact. It should be noted that the manner of electrically connecting the conductive connection line 10 and the metal ring 2000 to each other is only an example, and should not be construed as limiting the content and scope of the conductive mechanism 100 of the present invention.

Further, the sealing plug 20 seals the assembly opening 201 of the metal ring 2000 and the inner chamber 202, and prevents the plating solution from entering the inner chamber 202 from the assembly opening 201 of the metal ring 2000 during the plating process.

Preferably, the sealing plug 20 has elasticity, and during the process of inserting the sealing plug 20 into the assembly opening 20, the sealing plug 20 is elastically deformed, and the conductive connecting wire 10 and the metal ring 2000 press the sealing plug 20, so as to prevent gaps from being generated between the sealing plug 20 and the conductive connecting wire 10, and between the sealing plug 20 and the metal ring 2000, and further prevent the plating solution from entering the inner chamber 202 of the metal ring 2000 from the assembly opening 201. For example, but not limiting of, the sealing plug 20 is made of rubber.

Preferably, the sealing plug 20 has a wire passage 210, and the conductive connecting wire 10 is held in the wire passage 210 of the sealing plug 20, i.e. the conductive connecting wire 10 is mounted to the sealing plug 20 in a manner of passing through the sealing plug 20, and the sealing plug 20 surrounds the conductive connecting wire 10. After the sealing plug 20 is disposed in the assembly opening 201 of the metal ring 2000, the metal ring 20 and the conductive connecting wire 10 press the sealing plug 20, so that the sealing plug 20 is tightly attached to the conductive connecting wire 10 and the metal ring 2000, and the wire passage 210 and the assembly opening 201 are sealed, thereby preventing the electrolyte from entering the inner chamber 202 of the metal ring 2000 from the wire passage 210 and the assembly opening 201.

It should be noted that the embodiment of the metal ring 2000 is not limited, and the metal ring 2000 may be implemented in a circle, an oval, a square, an "O" shape, a "C" shape, or other known shapes. The material of the metal ring 2000 may be implemented by copper, iron or other metal materials. The fitting opening 201 of the metal ring 2000 may be implemented in a circular shape, an oval shape, a square shape, a raceway type, etc. The fitting opening 201 of the metal ring 2000 may be implemented in one, two, three, or more than three numbers. Preferably, the fitting openings 201 implemented in two or more numbers are uniformly distributed in the metal ring 2000. It should be understood by those skilled in the art that the specific embodiments of the metal ring 2000 and the assembling opening 201 thereof are merely illustrative and should not be construed as limiting the content and scope of the conductive mechanism 100 of the present invention.

In this particular embodiment of the present invention, the conductive mechanism 100 can bear the weight of the metal ring 2000, and the metal ring 2000 can be placed in the plating solution in a manner suspended from the conductive mechanism 100 during the plating process.

Specifically, the conductive mechanism 100 further comprises at least one fastener 30, and the sealing plug 20 has a mounting passage 220, wherein the fastener 30 is disposed in the mounting passage 220 of the mounting passage 220. During the process that the fastening member 30 is mounted to the fitting opening 201 of the metal ring 200, the fastening member 30 is expanded and deformed, and presses the sealing plug 20. The sealing plug 20 is elastically deformed, the fastening member 30 and the metal ring 200 simultaneously press the sealing plug 20, and the fitting opening 201 of the metal ring 200 is sealed. The conductive connection line 10, the sealing plug 20 and the fastener 30 are firmly connected to the metal ring 200, so that the metal ring 200 is prevented from being separated from the conductive mechanism 100 during the process that the metal ring 200 is suspended in the plating solution.

That is, the conductive mechanism 100 of the present invention is electrically connected to the metal ring 200 without shielding the outer surface of the metal ring 200, and further, after the conductive mechanism 100 is electrically connected to the cathode of the power supply, the metal ring 200 is electrically connected to the cathode of the power supply. Moreover, the conductive mechanism 100 can bear the weight of the metal ring 200 and is always firmly connected with the metal ring 200, so that the metal ring 200 can be suspended in the plating solution for the electroplating reaction.

Referring to fig. 6A and 6B, in a specific embodiment of the present invention, the fastening member 30 includes an expansion housing 31 and a threaded rod 32, wherein the expansion housing 31 has a fitting passage 3101 and at least two side openings 3102 formed at a side portion of the expansion housing 31, wherein the side openings 3102 are communicated with the fitting passage 3101 of the expansion housing 31. The expansion housing 31 of the fastener 30 is mounted to the mounting passage 220 of the sealing plug 20. The threaded rod 32 has a cross-sectional diameter larger than that of the fitting channel 3101 of the expansion housing 31 in an initial state, and the expansion housing 31 has elasticity.

Referring to fig. 6A and 6B, the threaded rod 32, during the process of entering the assembly channel 3101 of the expansion shell 31, expands the expansion shell 31 such that the assembly channel 3101 and the side opening 3102 increase in size. Preferably, the insertion end of the threaded rod 32 is tapered. The threaded rod 32 moves toward the inner chamber 201 of the metal ring 200 by an external force, and the expansion shell 32 is gradually expanded and increased in volume. The expansion housing 31, the threaded rod 32, the sealing plug 20, and the metal ring 200 are pressed against each other, so that the expansion housing 31, the threaded rod 32, and the sealing plug 20 of the fastener 30 are stably held at the fitting opening 201 of the metal ring 200. And, the expansion shell 31, the threaded rod 32 and the sealing plug 20 of the fastener 30 interact to seal the fitting opening 201 of the metal ring 200 from the plating solution entering the inner chamber 202 of the metal ring 200.

That is, in the specific embodiment shown in fig. 6A and 6B, the fastening member 30 may be mounted on the mounting passage 220 of the sealing plug 20 after the sealing plug 20 is mounted on the metal ring 200, so that the sealing plug 20 can stably seal the mounting opening 201 of the metal ring 200 while the mounting passage 220 of the sealing plug is closed.

Referring to fig. 5A-5B, in a specific embodiment of the present invention, the threaded shaft 32 of the fastener 30 includes a conical head 321 and a connecting portion 322, wherein the conical head 321 has a high end and a low end opposite to the high end, and wherein the connecting portion 322 integrally extends upward from the high end. The fastener 30 further includes a locking member 33, and the locking member 33 is detachably mounted to the connecting portion 322 of the threaded rod 32.

The tapered head 321 of the threaded rod 32 has a cross section that gradually increases in a direction from the high end to the low end, and the high end of the tapered head 321 has a size smaller than the diameter of the fitting channel 3101 of the expansion shell 31 and the low end of the tapered head 321 has a size larger than the diameter of the fitting channel 3101 of the expansion shell 31. The threaded shaft 32 of the fastener 30 is disposed in the assembly channel 3102 of the expansion shell 21 in such a manner that the high end of the conical head 321 is located within the assembly channel 3101 and the low end is located outside the assembly channel 3102.

In the process of detachably mounting the lock member 33 on the threaded rod 32 by being screwed to the threaded rod 32, the lower end portion of the tapered head 321 of the threaded rod 32 enters the fitting channel 3102 of the expansion shell 31, and the expansion shell 31 is expanded, so that the fitting channel 3101 and the side opening 3102 are increased in size, and the volume of the expansion shell 31 is increased. The expansion housing 31, the threaded rod 32, the sealing plug 20, and the metal ring 200 are pressed against each other, so that the expansion housing 31, the threaded rod 32, and the sealing plug 20 of the fastener 30 are stably held at the fitting opening 201 of the metal ring 200. And, the expansion shell 31, the threaded rod 32 and the sealing plug 20 of the fastener 30 interact to seal the fitting opening 201 of the metal ring 200 from the plating solution entering the inner chamber 202 of the metal ring 200.

That is, in this particular embodiment shown in fig. 5A to 5B, the fastening member 30 is previously disposed in the mounting passage 220 of the sealing plug 20, and the electrically conductive connection wire 10 is electrically connected to the inner wall of the metal ring 200 after the sealing plug 20 with the fastening member 30 is mounted to the mounting opening 201 of the metal ring 200. By tightening the locking element 33, the sealing plug 20 can stably seal the fitting opening 201 of the metal ring 200.

It is worth mentioning that the specific embodiment and the specific number of the fasteners 30 are not limited, for example, but not limited to, the fasteners 30 are implemented as expansion screws. In a specific embodiment of the present invention, the fastening member 30 is implemented as a member, and the conductive mechanism 100 is electrically connected to the metal ring 200 by the fastening member 30 and simultaneously bears the weight of the metal ring 200. In a specific embodiment of the present invention, the fastening members 30 are implemented as two, two of the fastening members 30 are respectively located at two sides of the conductive connecting line 10, the conductive mechanism 100 is installed in the process of assembling the opening 201 of the metal ring 200, two of the fastening members 30 uniformly support the sealing plug 20, so that the sealing plug 20 can be uniformly deformed under the action of the fastening members 30 and the metal ring 200, which is beneficial to the sealing plug 20 to better seal the metal ring 200. It should be understood by those skilled in the art that the specific embodiments and number of the fasteners 30 are merely exemplary and should not be construed as limiting the scope and content of the conductive mechanism 100 of the present invention.

Preferably, the extending direction of the conductive connection line 10 of the conductive mechanism 100 stably mounted to the metal ring 200 coincides with the central axis of the metal ring 200. The weight distribution of the metal rings 200 at two sides of the conductive connection line 10 of the conductive mechanism 100 is uniform, so that the metal rings 200 can be prevented from being inclined in the process of suspending the metal rings 200 from the conductive mechanism 100, and the conductive connection line 10 of the conductive sealing device 100 is attached to the outer surface of the metal rings 200, so that the silver plating layer is difficult to form at the attached position.

In a specific embodiment of the present invention, the fastening member 30 is made of a metal material, the fastening member 30 is capable of conducting electricity, the fastening member 30 is electrically connected to the electrically conductive connection line 10, the fastening member 30 contacts the inner surface of the metal ring 200 after being mounted on the metal ring 200, and the fastening member 30 is electrically connected to the metal ring 200.

Specifically, referring to fig. 7A to 7B, the mounting passage 220 of the sealing plug 20 is a tapered hole, the cross-sectional area of the mounting passage 220 of which is gradually reduced from top to bottom, after the fastening member 30 is inserted into the mounting passage 220 of the sealing plug 20, the fastening member 30 is electrically connected to the metal ring 200 in a manner that the end portion thereof abuts against the inner wall of the metal ring 200, the portion of the sealing plug 20 entering the inner chamber 202 of the metal ring 200 is elastically deformed, and the cross-sectional area of the portion of the sealing plug 20 entering the inner chamber 202 of the metal ring 200 is increased, so that the sealing plug 20 can be stably mounted to the metal ring 200 while sealing the mounting opening 201 of the metal ring 200.

That is, in fig. 7A to 7B, in this particular embodiment, the conductive mechanism 100 is electrically connected to the metal ring 200 using the fastener 30. It should be understood by those skilled in the art that the manner in which the conductive mechanism 100 makes the metal ring 100 conductive from the inside is merely exemplary and should not be construed as limiting the scope and content of the conductive mechanism 100 of the present invention.

According to another aspect of the present invention, the present invention provides a metal ring 1000 with a sealing conductive device, wherein the metal ring 1000 with a sealing conductive device comprises one of the metal ring 200 and at least one conductive mechanism 100, wherein the conductive connecting wire 10 of the conductive mechanism 100 enters into the inner chamber 202 of the metal ring 200 from the assembling opening 201 of the metal ring 200, and the conductive connecting wire 10 is electrically connected to the metal ring 200 by internally contacting the metal ring 200. The sealing plug 20, which is provided to the electrically conductive connection line 10, seals the fitting opening 201 of the metal ring 200. The fastener 30 provided to the sealing plug 20 allows the conductive mechanism 100 to be electrically connected to the metal ring 200 while carrying the weight of the metal ring 200. After the conductive connection line 10 of the conductive mechanism 100 is electrically connected to the cathode of the power supply, the metal ring 200 is electrically connected to the cathode of the power supply to enable subsequent electroplating.

It should be noted that the specific number of the conductive mechanisms 100 is not limited, and in a specific embodiment of the present invention, the conductive mechanism 100 is implemented as one, and the extending direction of the conductive connecting line 10 of the conductive mechanism 100 and the extending direction of the central axis of the metal ring 200, which are disposed on the metal ring 200, are the same. In a specific embodiment of the present invention, the seal wire device 100 is implemented in two or more numbers, the assembly openings 201 of the metal ring 200 are also implemented in two or more numbers, each of the assembly openings 201 is symmetrically distributed in the metal ring 200, and the conductive mechanism 100 is symmetrically disposed in the metal ring 200 to prevent the metal ring 200 from shifting and affecting the quality of the silver plating layer forming the metal ring 200.

According to another aspect of the present invention, the present invention further provides an electroplating method, wherein the electroplating method comprises the steps of:

(a) electrically connecting the metal ring 2000 to the cathode of the power supply by means of internal contact for conduction;

(b) maintaining said metal ring 2000 suspended in said plating solution; and

(c) the plating layer is formed on the outer surface of the metal ring 2000.

In a specific embodiment of the present invention, in the step (a), the electrically conductive connecting wire 10 of the sealed electrically conductive device 100 enters the inner chamber 202 of the metal ring 2000 from the assembling opening 201 of the metal ring 2000, the electrically conductive connecting wire 10 contacts the inner surface of the metal ring 2000, and the metal ring 2000 is electrically connected to the electrically conductive connecting wire 10.

Preferably, the conductive connection line 10 of the hermetically sealing and conductive device 100 contacts a lower surface of an inner surface of the metal ring 2000. Optionally, the conductive connection line 10 of the seal conductive apparatus 100 contacts an upper surface of an inner surface of the metal ring 2000. Optionally, the electrically conductive connection line 10 of the seal electrically conductive apparatus 100 is electrically connected to the metal ring 2000 in a manner of contacting the electrically conductive medium filled in the inner chamber 202.

In a specific embodiment of the present invention, in the step (a), the step (d) of sealing the assembly opening 201 and the inner chamber 202 of the metal ring 2000 is further included.

Specifically, in the step (d), the fastening member 30 is expanded, the fastening member 30 and the metal ring 2000 press the sealing plug 20, and the sealing plug 20 seals the assembly opening 201 in a deformed manner.

In a specific embodiment of the present invention, the fastening member 30 electrically connected to the electrically conductive connection line 10 is electrically connected to the inner surface of the metal ring 2000 during the process of being mounted on the metal ring 2000, thereby enabling the metal ring 2000 to be electrically connected to the cathode of the power source in an internal contact and electrically conductive manner.

In a specific embodiment of the present invention, in the step (b), the metal ring 2000 is suspended in the plating solution in a manner parallel to the horizontal plane. Optionally, in the step (b), the metal ring 2000 is completely immersed in the plating solution at an inclination.

After the step (b), the method further comprises the step (e) of driving the support mechanism 300 to move, and the metal ring 2000 agitates the plating solution. Preferably, the support mechanism 300 moves up and down to move the metal ring 200 in the plating solution. Preferably, the support mechanism 300 moves left and right to move the metal ring 200 in the plating solution.

Preferably, wherein in the method of electroplating silver, the concentration of Ag in the electroplating solution is in the range of 30-100g/L, the concentration of KCN is in the range of 80-150g/L, and the temperature of the electroplating solution is maintained at 20 to 40 degrees, and the current density is at 2A/dm²To 8A/dm²The formation of the plating layer having a relatively large thickness is facilitated.

It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily imaginable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

1. An electroplating suspension apparatus adapted for electroplating a metal ring, the electroplating suspension apparatus comprising:

2. The plating suspension apparatus of claim 1, wherein a plurality of the carrier arms are symmetrically disposed on the carrier tray.

3. The plating suspension apparatus of claim 1, wherein the carrier arm and the carrier tray of the carrier body are integrally formed.

4. The plating suspension apparatus of claim 1, wherein the carrier arm of the carrier body is removably mounted to the carrier tray.

5. The plating suspension device as claimed in any one of claims 1 to 4, wherein the carrying arm comprises a carrying portion and a plurality of suspension portions extending outwardly from the carrying portion, the plurality of suspension portions being spaced apart from the carrying portion, wherein the conductive mechanism is disposed on the suspension portions.

6. The plating suspension apparatus of claim 5, wherein the carrier plate of the carrier body, the carrier portion of the carrier arm, and the suspension portion are electrically conductive.

7. The plating suspension apparatus of claim 1, further comprising a support mechanism, wherein the support mechanism is disposed below the carrier body of the suspension mechanism, the support mechanism supporting the carrier body upward.

8. The plating suspension apparatus of claim 1, further comprising a support mechanism, wherein the carrier body is disposed below the support mechanism.

9. The plating suspension apparatus as claimed in claim 7 or 8, further comprising an up-down driving mechanism, wherein the support mechanism is drivably mounted to the up-down driving mechanism.

10. The plating suspension apparatus as claimed in claim 7 or 8, further comprising a left-right drive mechanism, wherein the support mechanism is drivably mounted to the left-right drive mechanism.

11. The plating suspension apparatus of claim 9, further comprising a left and right drive mechanism, wherein the support mechanism is drivably mounted to the left and right drive mechanism.

12. An electroplating suspension apparatus according to any one of claims 1 to 4, wherein the electrically conductive means comprises an electrically conductive connection line and a sealing plug, wherein the electrically conductive connection line enters an inner chamber of the metal ring from a mounting opening of the metal ring, the electrically conductive connection line is electrically connected to the metal ring, wherein the sealing plug is provided to the electrically conductive connection line, the sealing plug is held at the mounting opening of the metal ring, and the sealing plug seals the mounting opening of the metal ring.

13. The plating suspension apparatus of claim 12, wherein the electrically conductive connection line is electrically connected to the metal ring in contact with an inner surface of the metal ring.

14. The plating suspension apparatus of claim 13, wherein the conductive mechanism further comprises at least one fastener, wherein the fastener is disposed on the sealing plug, wherein the fastener is capable of expanding and compressing the sealing plug.