CN214528814U

CN214528814U - Protective film for electronic product

Info

Publication number: CN214528814U
Application number: CN202023316772.6U
Authority: CN
Inventors: 沈雅琴; 胡卫明; 其他发明人请求不公开姓名
Original assignee: Suzhou Yikaixuan Electronic Technology Co ltd
Current assignee: Suzhou Yikaixuan Electronic Technology Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-10-29
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses a protection pad pasting for electronic product, include: the composite film comprises a composite substrate film, a pressure-sensitive adhesive layer and a release film which are sequentially superposed, wherein the pressure-sensitive adhesive layer is positioned between the composite substrate film and the release film, and the surface of the composite substrate film, which is in contact with the pressure-sensitive adhesive layer, is provided with a grid layer formed by interweaving warp raised lines and weft raised lines; the release film further comprises a substrate layer and a release agent layer coated on the surface of the substrate layer, the release agent layer is in contact with the pressure-sensitive adhesive layer, the composite substrate film is formed by thermally laminating a PET (polyethylene terephthalate) substrate film and a PE (polyethylene) substrate film, and the grid layer is positioned on the PE substrate film of the composite substrate film. The utility model discloses protection pad pasting for electronic product has both effectively reduced the timely effectual discharge of air that will produce among the compound substrate membrane laminating process, also improves the support ability and the intensity of protection film when improving protection film curved surface subsides coverage.

Description

Protective film for electronic product

Technical Field

The utility model relates to a protection pad pasting for electronic product belongs to electronic product processing technology field.

Background

With the development of science and technology, electronic products play an increasingly important role in people's life, and various electronic products need to carry out CNC (computerized numerical control) processing on components such as metal frames and glass in the electronic products. The protective film is needed to fix and protect the electronic product parts in the processing process.

The bearing protective film is an auxiliary material which is widely applied to the manufacturing, packaging and transportation processes of electronic and electrical, optical display and electrical equipment, plays a role in bearing and protecting products from accidental scratching. Since the protective film needs to be removed when the corresponding product is used after being supported and protected, the protective film needs to have good supporting and protecting capabilities, and also needs to have the characteristics of being easy to peel off and having no residual glue on the contact surface of the product.

Disclosure of Invention

The utility model aims at providing a protection pad pasting for electronic product, this protection pad pasting for electronic product both effectively reduced the timely effectual discharge of air that will produce among the compound substrate membrane laminating process, also when improving protection film curved surface subsides coverage, improved the support capacity and the intensity of protection film.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a protective film for an electronic product, comprising: the composite film comprises a composite substrate film, a pressure-sensitive adhesive layer and a release film which are sequentially superposed, wherein the pressure-sensitive adhesive layer is positioned between the composite substrate film and the release film, and the surface of the composite substrate film, which is in contact with the pressure-sensitive adhesive layer, is provided with a grid layer formed by interweaving warp raised lines and weft raised lines;

the release film further comprises a substrate layer and a release agent layer coated on the surface of the substrate layer, the release agent layer is in contact with the pressure-sensitive adhesive layer, the composite substrate film is formed by thermally laminating a PET (polyethylene terephthalate) substrate film and a PE (polyethylene) substrate film, and the grid layer is positioned on the PE substrate film of the composite substrate film.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the substrate layer is a PET film, a BOPP film, a PP film or a PE film.

2. In the above scheme, the thickness ratio of the composite substrate film to the substrate layer of the release film is 10: 2 to 5.

3. In the scheme, the height of the warp convex strips and the height of the weft convex strips are 1-5 mu m.

4. In the scheme, the included angle between the warp convex strips and the weft convex strips is 80-100 degrees.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

1. the utility model discloses a protective film for electronic products, the surface of the composite substrate film contacting with the pressure sensitive adhesive layer is provided with a grid layer formed by interweaving warp sand grips and weft sand grips; from the type membrane further includes the substrate layer and coats in the type agent layer on substrate layer surface, the type agent layer contacts with pressure sensitive adhesive layer, and the bubble that has effectively reduced compound substrate membrane laminating in-process and has produced is to the influence of being pasted the thing, and the air that will laminate in-process production is effectual discharges in time, has also reduced pressure sensitive adhesive layer and the area of contact that is pasted and cover the surface for it realizes more easily to tear, greatly reduced the cull.

2. The utility model discloses protection pad pasting for electronic product, its composite substrate membrane is formed by PET substrate membrane and the hot laminating of PE substrate membrane, the net layer is located the PE substrate membrane of composite substrate membrane, improves the support ability and the intensity of protection film when the laminating nature is pasted to the protection film curved surface.

Drawings

FIG. 1 is a schematic structural view of a protective film for electronic products according to the present invention;

fig. 2 is a schematic view of a cross-sectional structure of the protective film for electronic products of the present invention.

In the above drawings: 1. a composite substrate film; 11. a PET substrate film; 12. a PE substrate film; 3. a release film; 31. a substrate layer; 32. a release agent layer; 4. a mesh layer; 41. warp cord raised lines; 42. and weft raised lines.

Detailed Description

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1: a protective film for an electronic product, comprising: the composite base material film comprises a composite base material film 1, a pressure-sensitive adhesive layer 2 and a release film 3 which are sequentially overlapped, wherein the pressure-sensitive adhesive layer 2 is positioned between the composite base material film 1 and the release film 3, and a grid layer 4 formed by interweaving warp raised lines 41 and weft raised lines 42 is arranged on the surface, in contact with the pressure-sensitive adhesive layer 2, of the composite base material film 1;

from type membrane 3 further includes substrate layer 31 and coats in the release agent layer 32 on substrate layer 31 surface, release agent layer 32 and pressure sensitive adhesive layer 2 contact, composite substrate membrane 1 is formed by PET substrate membrane 11 and the thermal laminating of PE substrate membrane 12, net layer 4 is located composite substrate membrane 1's PE substrate membrane 12.

The base material layer 31 is a BOPP film, and the height of the warp ribs 41 and the weft ribs 42 is 3.5 μm.

The included angle between the warp ribs 41 and the weft ribs 42 is 95 °.

The thickness ratio of the substrate layer 31 of the composite substrate film 1 to the substrate layer 31 of the release film 3 is 10: 3.

example 2: a protective film for an electronic product, comprising: the composite base material film comprises a composite base material film 1, a pressure-sensitive adhesive layer 2 and a release film 3 which are sequentially overlapped, wherein the pressure-sensitive adhesive layer 2 is positioned between the composite base material film 1 and the release film 3, and a grid layer 4 formed by interweaving warp raised lines 41 and weft raised lines 42 is arranged on the surface, in contact with the pressure-sensitive adhesive layer 2, of the composite base material film 1;

The base material layer 31 is a PP film or a PE film.

The height of the warp ridges 41 and the weft ridges 42 was 2.5 μm, and the included angle between the warp ridges 41 and the weft ridges 42 was 82 °.

The thickness ratio of the substrate layer 31 of the composite substrate film 1 to the substrate layer 31 of the release film 3 is 10: 4.

when the protective film for the electronic product is adopted, the surface of the composite base material film, which is in contact with the pressure-sensitive adhesive layer, is provided with a grid layer formed by interweaving warp raised lines and weft raised lines; the release film further comprises a substrate layer and a release agent layer coated on the surface of the substrate layer, the release agent layer is in contact with the pressure-sensitive adhesive layer, so that the influence of bubbles generated in the laminating process of the composite substrate film on a pasted object is effectively reduced, air generated in the laminating process is effectively discharged in time, the contact area between the pressure-sensitive adhesive layer and the pasted surface is also reduced, tearing is easier to realize, and the residual adhesive is greatly reduced; in addition, the composite base material film is formed by thermally laminating the PET base material film and the PE base material film, so that the curved surface laminating property of the protective film is improved, and the supporting capacity and the strength of the protective film are improved.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. The utility model provides a protection pad pasting for electronic product which characterized in that: the method comprises the following steps: the pressure-sensitive adhesive tape comprises a composite base material film (1), a pressure-sensitive adhesive layer (2) and a release film (3) which are sequentially overlapped, wherein the pressure-sensitive adhesive layer (2) is positioned between the composite base material film (1) and the release film (3), and a grid layer (4) formed by interweaving warp convex strips (41) and weft convex strips (42) is arranged on the surface, in contact with the pressure-sensitive adhesive layer (2), of the composite base material film (1);

from type membrane (3) further include substrate layer (31) and coat in release agent layer (32) on substrate layer (31) surface, release agent layer (32) and pressure sensitive adhesive layer (2) contact, compound substrate membrane (1) is formed by PET substrate membrane (11) and PE substrate membrane (12) heat laminating, net layer (4) are located on PE substrate membrane (12) of compound substrate membrane (1).

2. The protective film for electronic products according to claim 1, wherein: the substrate layer (31) is a PET film, a BOPP film, a PP film or a PE film.

3. The protective film for electronic products according to claim 1, wherein: the height of the warp convex strips (41) and the height of the weft convex strips (42) are 1-5 mu m.

4. The protective film for electronic products according to claim 1, wherein: the included angle between the warp convex strips (41) and the weft convex strips (42) is 80-100 degrees.

5. The protective film for electronic products according to claim 1, wherein: the thickness ratio of the composite base material film (1) to the base material layer (31) of the release film (3) is 10: 2 to 5.