CN215627733U

CN215627733U - Protective film for electronic product

Info

Publication number: CN215627733U
Application number: CN202023316723.2U
Authority: CN
Inventors: 徐杰; 胡卫明; 其他发明人请求不公开姓名
Original assignee: Suzhou Yikaixuan Electronic Technology Co ltd
Current assignee: Suzhou Yikaixuan Electronic Technology Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2022-01-25
Anticipated expiration: 2030-12-31

Abstract

The utility model discloses a protective film for electronic products, comprising: the PET film comprises a PET substrate film, a pressure-sensitive adhesive layer and a release film which are sequentially superposed, wherein the pressure-sensitive adhesive layer is positioned between the PET substrate film and the release film, and the surface of the PET substrate film, which is in contact with the pressure-sensitive adhesive layer, is provided with a grid layer formed by interweaving warp raised lines and weft raised lines; the release film further comprises a substrate layer and a release agent layer, a corona layer is formed on the surface of the substrate layer, an antistatic coating is arranged between the corona layer of the substrate layer and the release agent layer, and the release agent layer is in contact with the pressure-sensitive adhesive layer. The protective film for the electronic product reduces the contact area between the pressure-sensitive adhesive layer and the pasted surface, so that the tearing is easier to realize, the residual adhesive is greatly reduced, the dust is prevented from being attached to the release film, and the probability of pollution to the product is greatly reduced.

Description

Protective film for electronic product

Technical Field

The utility model relates to a protective film for an electronic product, and belongs to the technical field of electronic product processing.

Background

With the development of science and technology, electronic products play an increasingly important role in people's life, and various electronic products need to carry out CNC (computerized numerical control) processing on components such as metal frames and glass in the electronic products. The protective film is needed to fix and protect the electronic product parts in the processing process. The protective film is an auxiliary material which is widely applied to the manufacturing, packaging and transportation processes of electronic and electrical, optical display and electrical equipment, plays a role in bearing and protects products from accidental scratching. Since the protective film needs to be removed when the corresponding product is used after being supported and protected, the protective film needs to have good supporting and protecting capabilities, and also needs to have the characteristics of being easy to peel off and having no residual glue on the contact surface of the product.

Disclosure of Invention

The utility model aims to provide a protective film for an electronic product, which reduces the contact area between a pressure-sensitive adhesive layer and a pasted surface, makes tearing easier to realize, greatly reduces adhesive residue, prevents dust from being attached to a release film, and greatly reduces the probability of pollution to the product.

In order to achieve the purpose, the utility model adopts the technical scheme that: a protective film for an electronic product, comprising: the PET film comprises a PET substrate film, a pressure-sensitive adhesive layer and a release film which are sequentially superposed, wherein the pressure-sensitive adhesive layer is positioned between the PET substrate film and the release film, and the surface of the PET substrate film, which is in contact with the pressure-sensitive adhesive layer, is provided with a grid layer formed by interweaving warp raised lines and weft raised lines;

the release film further comprises a substrate layer and a release agent layer, a corona layer is formed on the surface of the substrate layer, an antistatic coating is arranged between the corona layer of the substrate layer and the release agent layer, the release agent layer is in contact with the pressure-sensitive adhesive layer, and the thickness of the pressure-sensitive adhesive layer is 30-80 micrometers.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the substrate layer is a PET film, a BOPP film, a PP film or a PE film.

3. In the scheme, the height of the warp convex strips and the height of the weft convex strips are 1-5 mu m.

4. In the scheme, the included angle between the warp convex strips and the weft convex strips is 80-100 degrees.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

1. the utility model relates to a protective film for electronic products, wherein a grid layer formed by interweaving warp raised lines and weft raised lines is arranged on the surface of a PET (polyethylene terephthalate) base material film, which is in contact with a pressure-sensitive adhesive layer; from the type membrane further includes the substrate layer and coats in the type agent layer on substrate layer surface, the type agent layer contacts with pressure sensitive adhesive layer, and the bubble that has effectively reduced PET substrate membrane laminating in-process and has produced is to the influence of being pasted the thing, and the air that will laminate in-process production is effectual discharges in time, has also reduced pressure sensitive adhesive layer and the area of contact that is pasted and cover the surface for it realizes more easily to tear, greatly reduced the cull.

2. According to the protective film for the electronic product, the corona layer is formed on the surface of the substrate layer of the release film, and the antistatic coating is arranged between the corona layer of the substrate layer and the release agent layer, so that the bonding force of the substrate layer and the antistatic coating is improved, the reliability of the peeling force is favorably maintained, dust is prevented from being attached to the release film, and the probability of pollution to the product is greatly reduced.

Drawings

FIG. 1 is a schematic structural diagram of a protective film for an electronic product according to the present invention;

fig. 2 is a schematic cross-sectional structure diagram of a protective film for electronic products according to the present invention.

In the above drawings: 1. a PET substrate film; 2. a pressure sensitive adhesive layer; 3. a release film; 31. a substrate layer; 32. a release agent layer; 4. a mesh layer; 41. warp cord raised lines; 42. weft raised lines; 5. a corona layer; 6. an antistatic coating.

Detailed Description

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1: a protective film for an electronic product, comprising: the PET substrate film comprises a PET substrate film 1, a pressure-sensitive adhesive layer 2 and a release film 3 which are sequentially overlapped, wherein the pressure-sensitive adhesive layer 2 is positioned between the PET substrate film 1 and the release film 3, and a grid layer 4 formed by interweaving warp raised lines 41 and weft raised lines 42 is arranged on the surface, in contact with the pressure-sensitive adhesive layer 2, of the PET substrate film 1;

from type membrane 3 further includes substrate layer 31 and mold release layer 32, substrate layer 31 surface forms a corona layer 5, has an antistatic coating 6 between 5 of corona layer and the mold release layer 32 of this substrate layer 31, mold release layer 32 and pressure sensitive adhesive layer 2 contact.

The release film 3 further comprises a substrate layer 31 and a release agent layer 32 coated on the surface of the substrate layer 31, wherein the release agent layer 32 is in contact with the pressure-sensitive adhesive layer 2.

The substrate layer 31 is a BOPP film, and the thickness of the pressure sensitive adhesive layer 2 is 35 μm.

The height of the warp ribs 41 and the weft ribs 42 was 2 μm.

The included angle between the warp ribs 41 and the weft ribs 42 is 90 °.

Example 2: a protective film for an electronic product, comprising: the PET substrate film comprises a PET substrate film 1, a pressure-sensitive adhesive layer 2 and a release film 3 which are sequentially overlapped, wherein the pressure-sensitive adhesive layer 2 is positioned between the PET substrate film 1 and the release film 3, and a grid layer 4 formed by interweaving warp raised lines 41 and weft raised lines 42 is arranged on the surface, in contact with the pressure-sensitive adhesive layer 2, of the PET substrate film 1;

The substrate layer 31 is a PP film, and the thickness of the pressure-sensitive adhesive layer 2 is 50 μm.

The height of the warp ribs 41 and the weft ribs 42 was 3 μm.

The included angle between the warp ribs 41 and the weft ribs 42 is 85 °.

When the protective film for the electronic product is adopted, the surface of the PET base material film, which is in contact with the pressure-sensitive adhesive layer, is provided with a grid layer formed by interweaving warp raised lines and weft raised lines; the release film further comprises a substrate layer and a release agent layer coated on the surface of the substrate layer, the release agent layer is in contact with the pressure-sensitive adhesive layer, so that the influence of bubbles generated in the laminating process of the PET substrate film on a pasted object is effectively reduced, air generated in the laminating process is effectively discharged in time, the contact area between the pressure-sensitive adhesive layer and the pasted surface is also reduced, tearing is easier to realize, and the residual adhesive is greatly reduced; in addition, it forms a corona layer from the substrate layer surface of type membrane, has an antistatic coating between the corona layer of this substrate layer and the type agent layer, has both improved the substrate layer and has had an adhesion stress with antistatic coating, is favorable to keeping the reliability of peel strength, also prevents that the dust from attaching to from type membrane, greatly reduced the probability to the pollution of product.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A protective film for an electronic product, characterized in that: the method comprises the following steps: the PET film comprises a PET base material film (1), a pressure-sensitive adhesive layer (2) and a release film (3) which are sequentially overlapped, wherein the pressure-sensitive adhesive layer (2) is positioned between the PET base material film (1) and the release film (3), and a grid layer (4) formed by interweaving warp convex strips (41) and weft convex strips (42) is arranged on the surface, in contact with the pressure-sensitive adhesive layer (2), of the PET base material film (1);

from type membrane (3) further include substrate layer (31) and mold release layer (32), substrate layer (31) surface forms a corona layer (5), has an antistatic coating (6) between corona layer (5) and mold release layer (32) of this substrate layer (31), mold release layer (32) and pressure sensitive adhesive layer (2) contact, the thickness of pressure sensitive adhesive layer (2) is 30~80 μm.

2. The protective film for electronic products according to claim 1, wherein: the substrate layer (31) is a PET film, a BOPP film, a PP film or a PE film.

3. The protective film for electronic products according to claim 1, wherein: the height of the warp convex strips (41) and the height of the weft convex strips (42) are 1-5 mu m.

4. The protective film for electronic products according to claim 1, wherein: the included angle between the warp convex strips (41) and the weft convex strips (42) is 80-100 degrees.