CN214516283U

CN214516283U - Wafer cleaning tank

Info

Publication number: CN214516283U
Application number: CN202022781192.8U
Authority: CN
Inventors: 刘佳鑫; 童灿钊; 赵冬冬; 李迁; 巫礼杰; 仰瑞; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd
Current assignee: Shenzhen Hans Semiconductor Equipment Technology Co Ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-10-29
Anticipated expiration: 2030-11-25

Abstract

The embodiment of the utility model discloses wafer cleaning tank, including wasing pond, pivot, wafer microscope carrier and washing shower nozzle all set up in wasing the pond, wash the pond and be the tubbiness structure that is enclosed by lateral wall and base, the pivot sets up on the base, the one end of pivot with thereby the wafer microscope carrier is connected and is driven the rotation of wafer microscope carrier, washs the shower nozzle and is located the top of wafer microscope carrier, washing shower nozzle are used for spraying the washing liquid to the wafer microscope carrier, and the internal surface of lateral wall corresponds the position of wafer microscope carrier is equipped with the buffer layer. When cleaning solution and wafer piece that are thrown away when wasing hit the washing pond lateral wall with high speed, hit the buffer layer earlier on, based on the cushioning effect of buffer layer, effectively prevent that cleaning solution and wafer piece from rebounding, improved the cleaning quality of wafer, also avoided wafer and part to be scratched.

Description

Wafer cleaning tank

Technical Field

The utility model relates to a wafer cleaning technology in the technical field of wafer processing, in particular to a wafer cleaning tank.

Background

In the world today, the semiconductor industry is undoubtedly becoming a hot door of the world manufacturing industry, and semiconductor products have been penetrated into various fields such as electric appliances, automobiles, military industry, aerospace and the like. With the competition of various countries in the semiconductor field, the semiconductor industry has been developed and perfected, especially in the wafer processing field. As a cleaning process throughout the whole wafer process, the cleaning effect of the wafer directly affects the quality of the final wafer product, and is a very important part of the wafer process. The wafer cleaning process is a wafer processing process for removing organic matters, metal ions, particle ash layers and the like remained on the surface of a wafer after other processing processes. The cleaning equipment in the market is roughly divided into a single-chip type cleaning machine and a groove type cleaning machine. The groove type cleaning machine is characterized in that a plurality of wafers are placed in a cleaning liquid tank to be cleaned at the same time, the single-wafer type cleaning equipment drives the wafers attached to the iron ring to rotate at a high speed of more than 1500r/min mainly through a rotating shaft, and meanwhile, cleaning liquid is sprayed and cleaned to the wafers from top to bottom. The groove type cleaning machine has higher cleaning speed, but the pollution among wafers is easy to occur in the cleaning process, so that the single-chip type cleaning machine has better cleaning effect than the groove type cleaning machine.

The cleaning tank of the existing single wafer cleaning machine is mainly made of stainless steel, and in the rotating structure of the rotating shaft, a certain part of core parts such as the rotating shaft, a bearing and the like is inevitably exposed to the cleaning environment. Cleaning liquid and wafer fragments attached to the wafer or a fixing piece falling off due to accidental looseness are thrown out by the rotating shaft rotating at a high speed in the circumferential direction, and impact the inner wall of the cleaning tank with large kinetic energy, so that the cleaning liquid splashes or is atomized and rebounds from the wafer fragments. The splashed cleaning liquid is attached to the rotating shaft parts exposed in the cleaning environment and leaks downwards along the installation gaps of the parts, and the service life of the equipment parts is greatly reduced due to certain corrosivity; the cleaning liquid which is atomized by high-speed impact is easy to adhere to the wafer, so that the surface of the wafer after being cleaned is stained with the cleaning liquid fog beads again, and the cleaning effect of the wafer is reduced; the wafer debris and the detached fasteners bounce back causing mechanical damage to the parts or the wafer.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a wafer cleaning tank for solve the washing liquid among the prior art and the wafer piece problem of bounce-back. In order to reach one or part or whole purpose or other purposes, the utility model provides a wafer washing tank, including wasing pond, pivot, wafer microscope carrier and washing shower nozzle, the wafer microscope carrier with wash the shower nozzle and all set up in the washing pond, it is the tubbiness structure that encloses by lateral wall and base to wash the pond, the pivot sets up on the base, thereby the one end of pivot with the wafer microscope carrier is connected and is driven the wafer microscope carrier rotates, it is located the top of wafer microscope carrier to wash the shower nozzle, it is used for to wash the shower nozzle to the wafer microscope carrier sprays the washing liquid, the internal surface of lateral wall corresponds the position of wafer microscope carrier is equipped with the buffer layer.

Preferably, the buffer layer is a flexible buffer layer having water absorption property.

Preferably, the upper end of the side wall is provided with a first flange for blocking the cleaning liquid from splashing.

Preferably, the middle part of the base is provided with a second flange, the second flange protrudes upwards along the periphery of the rotating shaft to form a boss, a collecting groove is formed between the second flange and the side wall, and a water outlet is formed at the bottom of the collecting groove.

Preferably, the edge of the highest surface of the boss is smaller than the edge of the wafer carrier, and the edge of the wafer carrier is correspondingly located above the collection groove.

Preferably, a filter screen is further arranged at the water outlet.

Preferably, the cleaning nozzle and the wafer carrier are coaxially arranged, the wafer carrier is driven by the rotating shaft to rotate around the shaft, and the cleaning nozzle swings around the shaft.

Preferably, the wafer cleaning tank further comprises a control center, which respectively controls the rotation speed of the wafer carrier driven by the rotating shaft, the rotation angle of the cleaning nozzle and the spraying amount of the cleaning liquid of the cleaning nozzle.

Preferably, the wafer carrying platform is provided with a mounting position for placing the wafer, and the wafer is fixed on the mounting position through vacuum adsorption.

Implement the embodiment of the utility model provides a, will have following beneficial effect:

after the wafer cleaning tank is adopted, when cleaning liquid thrown away during cleaning and wafer fragments impact the side wall of the cleaning tank at a high speed, the cleaning liquid and the wafer fragments are firstly impacted on the buffer layer, based on the buffer action of the buffer layer, the rebounding of the cleaning liquid, the wafer fragments and the fixing piece is effectively prevented, the service life of equipment parts is prolonged, the cleaning quality of the wafer is improved, and the wafer and parts are also prevented from being scratched.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

FIG. 1 is a schematic diagram of a wafer cleaning tank according to an embodiment.

FIG. 2 is a schematic view of the embodiment shown in FIG. 1 when the cleaning solution hits the cushioning layer.

Fig. 3 is a schematic view of the embodiment shown in fig. 1 when wafer debris and the securing members impact the cushion layer.

Fig. 4 is a top view of the embodiment shown in fig. 1.

In the figure: 101. a cleaning tank; 102. a buffer layer; 103. a collecting groove; 104. a water outlet; 105. a rotating shaft; 106. a second flange; 107. a wafer carrier; 108. a first flange; 109. a fixing member; 110. a wafer; 111. cleaning the spray head; 112. an adhesive layer; 113-wafer chipping.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1, as an embodiment of the splash-proof cleaning tank 101 for cleaning the wafer 110 according to the present invention, the splash-proof cleaning tank 101 for cleaning the wafer 110 includes a rotating shaft 105, a cleaning tank 101, a wafer stage 107 disposed in the cleaning tank 101, and a cleaning head 111. The wafer carrying table 107 is used for placing a wafer 110 to be cleaned, a fixing member 109 is correspondingly arranged on the wafer carrying table 107 and used for fixing the position of the wafer 110, a cleaning spray head 111 sprays cleaning liquid to the wafer 110 on the wafer carrying table 107, the cleaning tank 101 is a barrel-shaped structure enclosed by an inner side wall and a base, one end of a rotating shaft 105 extends into the cleaning tank 101 and is used for driving the wafer carrying table 107 to rotate, and a buffer layer 102 is arranged on the inner surface of the inner side wall corresponding to the position of the wafer carrying table 107.

Due to the high-speed rotation of the rotating shaft 105, the wafer scraps 113 and even the fixing member 109 loosened accidentally during the cleaning process are thrown out accidentally, so that the wall of the cleaning tank 101 is broken by impact, and in a serious case, the rebounded wafer scraps 113 or fixing member 109 may damage other parts or wafers 110 in the cleaning tank 101, and the parts of the cleaning machine and the wafers 110 may be discarded. The buffer layer 102 can play a role in buffering when the wafer scraps 113 or the fixing member 109 are thrown away, and the larger the thickness of the buffer layer 102 is, the more obvious the buffering role is, the better the protection capability on the parts, the wafer 110 and the cleaning tank 101 is, and the better the cleaning effect of the wafer 110 is.

Preferably, the wafer stage 107 is provided with a mounting position for placing the wafer 110, and the wafer 110 is fixed to the mounting position by vacuum suction.

The cleaning tank 101 can effectively prevent the cleaning liquid from contacting with other external parts. Optionally, the material of the cleaning tank 101 is preferably a stainless steel welding design, the size of the stainless steel cleaning tank 101 can be flexibly designed according to the actual size of the wafer 110, the shape is substantially a square structure and is sealed without leakage, the cleaning tank can be formed by sealing and welding a plurality of corrosion-resistant stainless steel plates, and leakage can also be prevented by smearing waterproof and fireproof materials at the welding seams. In addition, the shape of the cleaning tank 101 may be a circular structure as shown in fig. 4.

Specifically, the buffer layer 102 is composed of a flexible buffer material, and the flexible buffer material has water absorption. Further, the buffer layer 102 is attached to the inner sidewall by a double-sided adhesive tape including a nonwoven substrate. The buffer layer 102 can buffer the cleaning liquid thrown away in the cleaning process, the wafer fragments 113 and the fixing piece 109 loosened and falling off, so as to prevent the cleaning liquid from splashing or atomizing due to impact with the inner side wall of the cleaning pool 101, and avoid the phenomena of poor cleaning effect of the wafer 110 after cleaning due to liquid leakage and excessive inner fog beads caused by splashing.

Referring to fig. 2 and 3, as a specific embodiment of the splash-proof cleaning tank 101 for cleaning the wafer 110 provided by the present invention, the buffer layer 102 is adhered to the inner sidewall of the cleaning tank 101 through the double-sided adhesive layer 112 containing the non-woven fabric substrate at the back, the wafer 110 is surrounded in the middle of the cleaning tank 101, the height of the adhered buffer layer 102 is 100 mm-200 mm, the lowermost edge of the buffer layer 102 is 20 mm-30 mm lower than the upper surface of the wafer 110, and the buffering water-absorbing sponge forms a buffering tape and a protection film on the inner sidewall of the cleaning tank 101, so as to buffer the impact of the cleaning solution, the wafer scraps 113 and the fixing member 109 which accidentally drops, as shown by the arrow in fig. 2, the cleaning solution is absorbed and retained, and then flows down along the inner sidewall.

As shown by the arrow in fig. 3, the wafer fragments 113 and the fixing members 109 accidentally falling off are not rebounded but absorbed in the porous structure of the buffer layer 102 or slide along the inner sidewall, so as to protect the components from the erosion of the cleaning solution and the physical damage caused by the wafer fragments 113 and the fixing members 109. Specifically, the material of the buffer layer 102 includes, but is not limited to, any one or a combination of more of sponge, felt, cotton, fabric thereof, and the like, and the material can be selected according to the ph of the cleaning solution.

Preferably, the buffer layer material is the sponge that absorbs water, the single structure and the low price of sponge to when changing it, only need from wash the inside wall of pond 101 tear the sponge of renewal can, can not have any damage to washing pond 101 inside wall, easy operation, the change time is short, cost of maintenance is low.

In addition, wash pond 101 inside wall and paste buffer layer 102, it can also play the protection isolation to the inside wall that washs pond 101, can reduce the speed that washs the pond 101 inside wall and be corroded by the washing liquid, reduces and washs the probability that the pond 101 inside wall is hit splits by mounting 109 or the 113 fish tails of wafer piece, has improved the life who washs pond 101.

Preferably, the upper end of the inner sidewall is provided with a first flange 108 for blocking the washing liquid from splashing out. The first flange 108 is welded to the uppermost edge of the cleaning tank 101 or is formed by bending the top end of the cleaning tank 101, and acts like a fence to prevent water drops and water vapor from splashing and escaping upwards.

Alternatively, the length of the first flange 108 configuration may be designed according to the degree of automation of the cleaning apparatus: when the cleaning machine adopts a manual loading and unloading mode of the wafer 110, the structural length of the first flange 108 can be reduced so as to properly increase the loading and unloading operation space; when the cleaning machine adopts automatic feeding and discharging, the length of the first flange 108 can be increased, and the space for upward dissipation of the cleaning liquid is reduced.

Preferably, the middle part of the base is provided with a second flange 106, the second flange 106 protrudes upwards along the periphery of the rotating shaft 105 to form a boss, a collection groove 103 is formed between the second flange 106 and the inner side wall, and the bottom of the collection groove 103 is provided with a water outlet 104.

Optionally, the second flange 106 is welded to the center of the inner base of the cleaning tank 101 or integrally formed with the cleaning tank 101, and the middle protrusion forms a hollow circular truncated cone structure for the rotation shaft 105 to extend out, so as to drive the wafer carrier 107 to rotate inside the cleaning tank 101. Meanwhile, the collecting groove 103 formed between the second flange 106 and the inner side wall can separate other parts such as the rotating shaft 105 from the cleaning liquid collected at the bottom of the cleaning pool 101, and prevent the cleaning liquid from adhering to the parts such as the rotating shaft 105 and leaking downwards along the installation gap of the parts of the rotating shaft 105.

The water outlet 104 is disposed at the bottom of the collecting tank 103, and communicates the internal space and the external space of the cleaning tank 101, so as to discharge the cleaning liquid collected at the bottom of the cleaning tank 101 out of the cleaning tank 101 in time, thereby preventing the cleaning liquid from collecting in the cleaning tank 101 and overflowing the second flange 106. The second flange 106 can increase the service life of the washer and reduce the maintenance frequency and cost of the washer.

Optionally, a filter screen is disposed at the water outlet 104 to filter out wafer debris 113 or fallen fixing elements when discharging the cleaning liquid in the collecting tank 103, so as to prevent blockage.

Further, the edge of the highest surface of the boss is smaller than the edge of the wafer carrier 107, and the edge of the wafer carrier 107 is correspondingly located above the collection groove 103, so that part of the cleaning solution directly falls into the collection groove 103 along the edge of the wafer 110.

Specifically, the cleaning head 111, the wafer stage 107, and the spindle 105 are coaxially disposed. The wafer stage 107 rotates circumferentially around the shaft in a single rotation direction, and the cleaning nozzle 111 swings back and forth around the shaft to uniformly spray the cleaning liquid in a fixed interval.

Preferably, the splash-proof cleaning tank 101 for cleaning the wafer 110 further comprises a control center, which respectively controls the rotation speed of the wafer carrier 107 driven by the rotation shaft 105, the rotation angle of the cleaning nozzle 111 and the spraying amount of the cleaning liquid of the cleaning nozzle 111, so as to realize semi-automation of the equipment.

The specific implementation process of this embodiment is as follows:

before cleaning, the wafer 110 is fixed at a fixed planar position on the porous wafer stage 107 by a fixing member 109, and is then fixed by vacuum suction. After the wafer is fixed, the rotating shaft 105 is started, the wafer carrier 107 is driven to rotate at a high speed of more than 1500r/min, the wafer 110 also rotates, the cleaning liquid spray head is directly above the center of the wafer 110 and is fed back by a control center signal, the cleaning liquid spray head 111 is controlled to spray cleaning liquid, meanwhile, the cleaning spray head 111 swings back and forth at a certain angle around the shaft periodically, and the rotating motion of the rotating shaft 105 is matched with the periodic swinging motion of the cleaning spray head 111, so that the upper surface of the wafer 110 is cleaned in all aspects.

During the cleaning process, the cleaning liquid is continuously sprayed from the cleaning nozzle 111, and at the moment of contacting the wafer 110 rotating at a high speed, the debris, organic matters and metal particles on the surface of the wafer 110 are thrown out along the circumferential direction of the rotation of the wafer 110 along with the cleaning liquid, and the cleaning liquid thrown out at a high speed impinges on the buffer layer 102 adhered on the inner side wall of the cleaning tank 101.

The sponge is taken as an example, the buffer absorption effect of the sponge on the cleaning liquid is as shown in the schematic diagram of the attached drawing 2, because the sponge has a soft, loose and intercommunicated porous structure, the kinetic energy of the cleaning liquid thrown away at a high speed can be buffered and absorbed in a short time, the cleaning liquid can permeate into the buffer water-absorbing sponge, the cleaning liquid absorbed by the buffer finally slowly seeps downwards along with the action of gravity in the buffer water-absorbing sponge until the bottom of the cleaning pool 101 is collected and discharged, the structure effectively avoids the possibility that the cleaning liquid directly impacts the inner side wall of the cleaning pool 101 to generate liquid splashing atomization, the waterproof performance of the cleaning machine is improved, and meanwhile, the fog beads on the surface of the wafer 110 after the cleaning is finished are reduced, so that the cleaning effect of the cleaning machine is greatly improved.

The buffering effect of the sponge on the wafer fragments 113 and the fallen fixing piece 109 is as shown in the schematic diagram of fig. 3, the sponge with a non-woven fabric substrate double-sided adhesive tape on the pasting surface increases a layer of protective interlayer on the inner side wall of the main body of the cleaning tank 101, when the fixing piece 109 is accidentally loosened and thrown away and the wafer fragments 113 are fallen and thrown away, the sponge can be buffered in the first time, the falling objects are prevented from directly impacting the inner side wall of the main body of the cleaning tank 101, and the inner side wall is prevented from being damaged and rebounded.

During each cleaning process, a trace amount of wafer scraps 113 are generated and thrown out, and the surface roughness of the inner side wall of the cleaning tank 101 is increased by continuously accumulated scrap scratches, so that the time of adhering the wafer scraps with corrosive cleaning liquid to the inner side wall is longer, and the corrosion effect is more obvious.

Meanwhile, if the cleaning machine is frequently used and regular maintenance is not performed, parts may be aged, parts which are worn out greatly in the cleaning tank 101 and are corroded by the cleaning solution after being collected for a long time, such as the fixing member 109, may be fixed loose or have a dangerous section broken, if the broken or loose parts occur in the cleaning operation, the parts may be thrown away with huge kinetic energy, and the larger the thickness of the sponge for buffering water absorption is, the stronger the capability of buffering and absorbing the kinetic energy is.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. A wafer cleaning tank is characterized in that: the cleaning device comprises a cleaning pool, a rotating shaft, a wafer carrying platform and a cleaning spray head, wherein the wafer carrying platform and the cleaning spray head are arranged in the cleaning pool, the cleaning pool is of a barrel-shaped structure enclosed by a side wall and a base, the rotating shaft is arranged on the base, one end of the rotating shaft is connected with the wafer carrying platform so as to drive the wafer carrying platform to rotate, the cleaning spray head is located above the wafer carrying platform, the cleaning spray head is used for spraying cleaning liquid to the wafer carrying platform, and a buffer layer is arranged on the inner surface of the side wall corresponding to the position of the wafer carrying platform.

2. The wafer cleaning tank of claim 1, wherein: the buffer layer is a flexible buffer layer with water absorption.

3. The wafer cleaning tank of claim 1, wherein: the upper end of the side wall is provided with a first flange for blocking the cleaning liquid from splashing.

4. The wafer cleaning tank as set forth in any one of claims 1 to 3, wherein: the middle part of the base is provided with a second flange, the second flange is upwards protruded along the periphery of the rotating shaft to form a boss, a gathering groove is formed between the second flange and the side wall, and a water outlet is formed in the bottom of the gathering groove.

5. The wafer cleaning tank of claim 4, wherein: the edge of the highest surface of the boss is smaller than the edge of the wafer carrying platform, and the edge of the wafer carrying platform is correspondingly positioned above the gathering groove.

6. The wafer cleaning tank of claim 4, wherein: and a filter screen is also arranged at the water outlet.

7. The wafer cleaning tank as set forth in any one of claims 1 to 3, wherein: the cleaning nozzle and the wafer carrying platform are coaxially arranged, the wafer carrying platform is driven by the rotating shaft to rotate around a shaft, and the cleaning nozzle swings around the shaft.

8. The wafer cleaning tank of claim 7, wherein: the wafer cleaning tank also comprises a control center which respectively controls the rotating speed of the rotating shaft driving the wafer carrying platform, the rotating angle of the cleaning spray head and the cleaning liquid spraying amount of the cleaning spray head.

9. The wafer cleaning tank of claim 1, wherein: the wafer carrying platform is provided with an installation position for placing the wafer, and the wafer is fixed on the installation position through vacuum adsorption.