CN214507526U

CN214507526U - Composite circuit packaging substrate structure

Info

Publication number: CN214507526U
Application number: CN202023235118.2U
Authority: CN
Inventors: 籍伟杰; 谢斌; 施勇刚
Original assignee: Jiangyin Lijing Electronic Technology Co ltd
Current assignee: Jiangyin Lijing Electronic Technology Co ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-10-26
Anticipated expiration: 2030-12-29

Abstract

The utility model discloses a composite circuit packaging substrate structure, include: a multi-layer mechanism mounted on top of the PCB circuit board such that the chip is mounted on top of the multi-layer mechanism; the silica gel layer is arranged on the top of the multilayer mechanism and used for packaging the chip and the multilayer mechanism; the complementary unit installs at the top of multilayer mechanism, in the silica gel layer is inserted to complementary unit's one end, the utility model discloses a guide mechanism's deflector can also be stable with the chip centre gripping with chip direction multilayer mechanism's top after the direction, thereby make things convenient for the insertion of chip, and can also guarantee the stable encapsulation of chip, in addition, a plurality of radiating grooves on silica gel layer can promote the area of contact of chip and multilayer mechanism and air, thereby make things convenient for the heat dissipation of chip, when silica gel layer long-term use, complementary unit hugs closely the silica gel layer on the surface of multilayer mechanism and circuit board, prevent that the part on silica gel layer breaks away from, and then promote sealed effect and radiating effect.

Description

Composite circuit packaging substrate structure

Technical Field

The utility model relates to a packaging substrate technical field specifically is a composite circuit packaging substrate structure.

Background

The package substrate is a term of a printed circuit board, and the substrate can provide electrical connection, protection, support, heat dissipation, assembly and other effects for a chip so as to achieve the aims of multi-pin, reduction of the volume of a packaged product, improvement of electrical performance and heat dissipation, and ultrahigh density or multi-chip modularization.

Present packaging substrate is formed through the multilayer insulation panel complex, there is the metal level between the multilayer composite sheet, thereby form miniature circuit board through chemical attack or machining, will need connecting circuit to connect through the metal between layer and layer, place the chip at packaging substrate's top again, the arch of chip bottom inserts in packaging substrate's micropore, be connected between packaging substrate and the chip, the rethread silica gel layer is sealed chip and packaging substrate completely and the heat dissipation, however, when the chip is placed at packaging substrate's top, operation that need relapse between the arch of micropore and chip just can align, the equipment of inconvenient chip and packaging substrate.

Therefore, a composite circuit package substrate structure is proposed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a composite circuit packaging substrate structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a composite circuit package substrate structure comprising:

a multi-layer mechanism mounted on top of the PCB circuit board such that the chip is mounted on top of the multi-layer mechanism;

the silica gel layer is arranged on the top of the multilayer mechanism and used for packaging the chip and the multilayer mechanism;

the auxiliary mechanism is arranged at the top of the multilayer mechanism, and one end of the auxiliary mechanism is inserted into the silica gel layer so that the silica gel layer is attached to the multilayer mechanism;

and the guide mechanism is arranged on the top of the multilayer mechanism, and the chip is placed on the top of the multilayer mechanism after being guided by the guide mechanism.

Preferably, the multilayer mechanism comprises a plurality of insulating layers, a circuit layer is arranged between every two adjacent insulating layers, the circuit layer is fixedly connected with the insulating layers, and a plurality of micropores for circuit connection are formed in the insulating layers and the circuit layers.

Preferably, the side surface of the silica gel layer is provided with a heat dissipation groove, and the heat dissipation groove is in an inwards concave state.

Preferably, the auxiliary mechanism is including installing the fixing base at the multilayer mechanism top, set up the spout in the fixing base, sliding connection has the picture peg in the spout, the picture peg can insert in the radiating groove.

Preferably, the end part of the inserting plate is provided with an inclined surface, and the inclined surface is inclined downwards.

Preferably, guiding mechanism includes the guide frame with multilayer mechanism fixed connection, the inside of guide frame is equipped with a plurality of and is the deflector of symmetric distribution, the deflector is the arc, the deflector contacts with the side of chip.

Preferably, the guide plate comprises an arc-shaped part, a protruding part is arranged on the arc-shaped part close to the inner wall of the guide frame, and a compensation groove is formed in the opposite surface, located on the protruding part, of the arc-shaped part.

Preferably, the inserting plate and the guide plate are both rubber plates.

The utility model discloses possess following beneficial effect at least:

the chip is guided and installed on the top of the multilayer mechanism through the guide mechanism, heat is dissipated through the heat dissipation grooves of the silica gel layer, the silica gel layer is tightly attached to the multilayer mechanism through the auxiliary mechanism, compared with the prior art, when the chip is placed on the top of the packaging substrate, the micropore and the protrusion of the chip can be aligned only through repeated operation, and the assembly of the chip and the packaging substrate is inconvenient, the chip is guided to the top of the multilayer mechanism through the guide plate of the guide mechanism, and can be stably clamped after being guided, so that the insertion of the chip is convenient, and the stable packaging of the chip can be ensured, in addition, the contact area between the chip and the multilayer mechanism and the air can be improved through the plurality of heat dissipation grooves of the silica gel layer, so that the heat dissipation of the chip is convenient, when the silica gel layer is used for a long time, the auxiliary mechanism tightly attaches the silica gel layer to the surfaces of the multilayer mechanism and the circuit board, the part on the silica gel layer is prevented from separating, and then the sealing effect and the heat dissipation effect are improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a bottom view of the present invention;

FIG. 3 is a partial structure view of the present invention;

FIG. 4 is a diagram of a chip separation structure according to the present invention;

fig. 5 is a partial cross-sectional view of the present invention;

fig. 6 is an enlarged view of the area a in fig. 5.

In the figure: 1-a multilayer mechanism; 2-chip; 3-a silica gel layer; 4-an auxiliary mechanism; 5-a guiding mechanism; 6-an insulating layer; 7-a circuit layer; 8-micropores; 9-a heat dissipation groove; 10-a fixed seat; 11-inserting plates; 12-a bevel; 13-a guide frame; 14-a guide plate; 15-an arc-shaped portion; 16-a projection; 17-compensation groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: a composite circuit package substrate structure comprising:

the multilayer mechanism 1, the said multilayer mechanism 1 is installed on the top of PCB circuit board, make the chip 2 install on the top of the multilayer mechanism 1;

the silica gel layer 3 is arranged on the top of the multilayer mechanism 1 and used for packaging the chip 2 and the multilayer mechanism 1;

the auxiliary mechanism 4 is arranged at the top of the multilayer mechanism 1, and one end of the auxiliary mechanism 4 is inserted into the silica gel layer 3, so that the silica gel layer 3 is attached to the multilayer mechanism 1;

and the guide mechanism 5 is arranged on the top of the multilayer mechanism 1, and the chip 2 is placed on the top of the multilayer mechanism 1 after being guided by the guide mechanism 5.

The multilayer mechanism 1 comprises a plurality of insulating layers 6, a circuit layer 7 is arranged between every two adjacent insulating layers 6, the circuit layers 7 are fixedly connected with the insulating layers 6, a plurality of micropores 8 for circuit connection are formed in the insulating layers 6 and the circuit layers 7, the circuit layers 7 are isolated through the insulating layers 6, so that circuits of different layers are formed, metal is filled between the micropores 8 so as to form circuit connection between layers, so that the connection between the chip 2 and the circuits is convenient, and the size of the multilayer mechanism 1 is generally 2 or 3 inches; dense micropores 8 are above 2 inches, resulting in 5000 + 10000 micropores 8; the micropore 8 of the substrate can be designed to be 50 microns, a metal sputtering process is carried out in the micropore 8, the circuit layer 7 can be conducted up and down after the micropore 8 is filled with metal, a composite circuit with a multilayer structure can be manufactured, and the insulating layer 6 can be made of silicon carbide, glass or ceramic.

Radiating groove 9 has been seted up to the side on silica gel layer 3, radiating groove 9 is the indent state, makes silica gel layer 3 and air area of contact increase, and then makes things convenient for silica gel layer 3 and air circumstance's heat exchange, and then promotes the radiating effect with the air under the prerequisite of guaranteeing the base plate encapsulation.

Complementary unit 4 is including installing fixing base 10 at 1 top of multi-layer mechanism, the spout has been seted up in fixing base 10, sliding connection has picture peg 11 in the spout, picture peg 11 can insert in the radiating groove 9 for picture peg 11 is convenient to laminate silica gel layer 3 and multi-layer mechanism 1 completely, and after the encapsulation of silica gel layer 3 finishes, promotes picture peg 11, and picture peg 11 inserts the radiating groove 9 position department on silica gel layer 3, and then guarantees the complete encapsulation of multi-layer mechanism 1 and chip 2.

The end part of the inserting plate 11 is provided with an inclined plane 12, and the inclined plane 12 inclines downwards, so that the silica gel layer 3 is pressed down to the surface of the multilayer mechanism 1 by the inclined plane 12, and the silica gel layer 3 is further convenient to be tightly attached to the multilayer mechanism 1.

Guiding mechanism 5 includes the guide frame 13 with 1 fixed connection of multilayer mechanism, the inside of guide frame 13 is equipped with the deflector 14 that a plurality of is the symmetric distribution, deflector 14 is the arc, deflector 14 contacts with the side of chip 2, and after chip 2 placed into guide frame 13, chip 2 oppressed deflector 14 motion, under the elastic action of deflector 14 self, deflector 14 compression, the side of chip 2 was supported tightly after leading-in micropore 8 was drawn by deflector 14 to make things convenient for the installation of chip 2.

Guide plate 14 includes arc portion 15, arc portion 15 is equipped with a bulge 16 near the wall part in guide frame 13, compensation groove 17 has been seted up to the opposite face that arc portion is located bulge 16, through the area of contact of 16 increase arc portion 15 and guide frame 13 of bulge, thereby avoid the separation of arc portion 15 and guide frame 13, compensate bulge 16 through compensation groove 17 and be for compressing tightly the back protrusion, thereby guarantee that arc portion 15 is in comparatively level and smooth state after being compressed tightly by 2 sides of chip, the area of contact of increase and 2 sides of chip, thereby the convenient installation to chip 2.

The picture peg 11 with the deflector 14 is the rubber slab, and the rubber slab can provide better elasticity, can also play insulating effect, and the rubber slab can also increase the frictional force with the contact position in addition to make things convenient for the stable fixed of contact position more.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A composite circuit package substrate structure, comprising:

a multilayer mechanism (1), the multilayer mechanism (1) being mounted on top of a PCB circuit board such that a chip (2) is mounted on top of the multilayer mechanism (1);

the silica gel layer (3) is arranged on the top of the multilayer mechanism (1) and used for packaging the chip (2) and the multilayer mechanism (1);

the auxiliary mechanism (4) is arranged at the top of the multilayer mechanism (1), and one end of the auxiliary mechanism (4) is inserted into the silica gel layer (3) so that the silica gel layer (3) is attached to the multilayer mechanism (1);

and the guide mechanism (5) is arranged on the top of the multilayer mechanism (1), and the chip (2) is placed on the top of the multilayer mechanism (1) after being guided by the guide mechanism (5).

2. The composite circuit package substrate structure of claim 1, wherein: multilayer mechanism (1) includes a plurality of insulating layer (6), and every adjacent two be equipped with circuit layer (7) between insulating layer (6), fixed connection between circuit layer (7) and insulating layer (6), set up a plurality of micropore (8) that are used for the circuit connection in insulating layer (6) and circuit layer (7).

3. The composite circuit package substrate structure of claim 1, wherein: radiating grooves (9) are formed in the side faces of the silica gel layer (3), and the radiating grooves (9) are in an inwards concave state.

4. The composite circuit package substrate structure of claim 3, wherein: complementary unit (4) is including installing fixing base (10) at multilayer mechanism (1) top, set up the spout in fixing base (10), sliding connection has picture peg (11) in the spout, picture peg (11) can insert in radiating groove (9).

5. The composite circuit package substrate structure of claim 4, wherein: the end part of the inserting plate (11) is provided with an inclined surface (12), and the inclined surface (12) inclines downwards.

6. The composite circuit package substrate structure of claim 4, wherein: guiding mechanism (5) include with multilayer mechanism (1) fixed connection's guide frame (13), the inside of guide frame (13) is equipped with deflector (14) that a plurality of is the symmetric distribution, deflector (14) are the arc, deflector (14) and the side contact of chip (2).

7. The composite circuit package substrate structure of claim 6, wherein: the guide plate (14) comprises an arc-shaped part (15), a protruding part (16) is arranged on the arc-shaped part (15) close to the inner wall of the guide frame (13), and a compensation groove (17) is formed in the opposite surface, located on the protruding part (16), of the arc-shaped part (15).

8. The composite circuit package substrate structure of claim 6, wherein: the inserting plate (11) and the guide plate (14) are both rubber plates.