CN214504370U - Chip radiator of computer mainboard - Google Patents
Chip radiator of computer mainboard Download PDFInfo
- Publication number
- CN214504370U CN214504370U CN202121133292.8U CN202121133292U CN214504370U CN 214504370 U CN214504370 U CN 214504370U CN 202121133292 U CN202121133292 U CN 202121133292U CN 214504370 U CN214504370 U CN 214504370U
- Authority
- CN
- China
- Prior art keywords
- chip
- support bracket
- radiator
- mainboard
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 238000010030 laminating Methods 0.000 claims abstract 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a chip radiator of a computer mainboard, which comprises a mainboard body, wherein a plurality of round holes are arranged inside the mainboard body, and a Central Processing Unit (CPU) chip is arranged at the top central position of the mainboard body; the top rod-shaped structure of the support bracket penetrates through the main board body and is arranged in the main board body, and the bottom of the support bracket is of a hollow structure; the heat dissipation copper pipe is arranged in the fixed shell in a vertical sliding mode in a T-shaped structure, and the bottom of the heat dissipation copper pipe is tightly attached to the top of the CPU chip; the fan, the fan passes through bolt fixed mounting in both sides around the set casing, the top outside cover of support bracket is equipped with and the mainboard body between the rubber gasket of closely laminating. This chip radiator of computer motherboard not only is convenient for install the radiator, and installation stability is stronger, is difficult to cause the damage to the chip moreover, and the thermal diffusivity is stronger, is convenient for simultaneously carry out dustproof processing to the radiator.
Description
Technical Field
The utility model relates to a chip radiator technical field specifically is a chip radiator of computer motherboard.
Background
The computer chip is the core of the computer, and can complete almost all the work of the computer, such as operation, data processing, data transmission, analysis and the like, so that the computer can normally operate, the chip generates high temperature in the operation process, and the chip is easy to damage after long-term high-temperature operation, and therefore a radiator is needed for radiating the chip.
Chinese patent is granted No. CN210515119U, and the announcement day is 20200512, discloses a computer CPU radiator, including treater, mount pad, first heat radiation structure and second heat radiation structure, treater fixed mounting is in the upper end surface of mainboard, the inside of mount pad is close to its intermediate position and has offered the mounting groove that type of dogcharacter runs through, the mount pad is being close to its four interior angle departments and all has offered the mounting hole that runs through, the mount pad runs through four mounting holes through quick mounting structure and installs in the upper end surface of mainboard, first heat radiation structure installs in the inside mounting groove of mount pad, just first heat radiation structure's bottom and treater butt, second heat radiation structure fixed mounting is in the upper end surface of mount pad. The utility model discloses be convenient for quick assemble the radiator on the mainboard, the work efficiency when the radiator equipment of having improved, and the radiator is comparatively quick and even to the radiating effect of treater, the effectual radiating effect that has improved.
The prior art scheme among the above-mentioned has following defect, not only is not convenient for install the radiator, and installation stability is relatively poor, causes the damage to the chip easily moreover, and the thermal diffusivity is relatively poor, is not convenient for carry out dustproof processing to the radiator simultaneously, consequently, we propose the chip radiator of computer mainboard to in the problem of proposing in the solution of the aforesaid.
Disclosure of Invention
An object of the utility model is to provide a chip radiator of computer motherboard to solve the chip radiator of a computer motherboard that present commonly used that above-mentioned background art provided, not only be not convenient for install the radiator, the installation stability is relatively poor, causes the damage to the chip easily moreover, and the thermal diffusivity is relatively poor, is not convenient for simultaneously carry out dustproof problem of handling to the radiator.
In order to achieve the above object, the utility model provides a following technical scheme: a chip heat sink for a computer motherboard, comprising:
the mainboard comprises a mainboard body, wherein a plurality of round holes are formed in the mainboard body, and a CPU chip is arranged in the center of the top of the mainboard body;
the top rod-shaped structure of the support bracket penetrates through the main board body and is arranged in the main board body, and the bottom of the support bracket is of a hollow structure;
the heat dissipation copper pipe is arranged in the fixed shell in a vertical sliding mode in a T-shaped structure, and the bottom of the heat dissipation copper pipe is tightly attached to the top of the CPU chip;
and the fans are fixedly arranged on the front side and the rear side of the fixed shell through bolts.
Preferably, the top outside cover of support bracket is equipped with the rubber gasket who closely laminates between with the mainboard body, and threaded connection is installed at the top of rubber gasket in the double-screw bolt that supports the top outside of bracket.
Preferably, a fixing shell with a cross section in a square structure is lapped on the top of the stud, and a nut is mounted on one side, far away from the stud, of the bottom of the fixing shell;
wherein, the nut is cylindric structure threaded connection in the top of support bracket.
Preferably, the outer side of the heat dissipation copper pipe is welded with heat dissipation copper sheets arranged in parallel between the single bodies, and the left side and the right side of the heat dissipation copper pipe are fixedly connected with connecting rods which are slidably arranged in the fixed shell;
wherein, the top of connecting rod is provided with the spring that resets it.
Preferably, the left side and the right side of the inside of the fixed shell are respectively inserted with a filter plate with a cross section in a concave structure, the top of the fixed shell is slidably provided with a cover plate with an inside net-shaped structure, and the inside of the cover plate is rotatably provided with a limiting rod in threaded connection with the top of the fixed shell.
Compared with the prior art, the beneficial effects of the utility model are that: the chip radiator of the computer mainboard is convenient to install, high in installation stability, not easy to damage a chip, high in heat dissipation performance and convenient to perform dustproof treatment on the radiator;
1. the supporting bracket is inserted upwards through the bottom of the main board body, the main board body and the supporting bracket are fixed by rotating the stud, the fixing shell is inserted into the top of the supporting bracket, and the fixing shell and the supporting bracket are fixed by rotating the nut, so that the device is convenient for mounting a radiator and has strong mounting stability;
2. the heat dissipation copper pipe is tightly attached to the CPU chip, the heat of the CPU chip is transmitted into the heat dissipation copper pipe, the heat dissipation copper pipe is dissipated through the heat dissipation copper sheet, the spring resets the heat dissipation copper pipe through the spring, and the heat dissipation copper pipe has upward buffering performance, so that the device is not easy to damage the chip and has strong heat dissipation performance;
3. the fan exhausts to the outside, and the air passes through the filter and laps the inside that flows in the set casing, makes the apron upwards take out through rotating the gag lever post, makes the filter upwards take out, and convenience of customers clears up, makes the device be convenient for carry out dustproof processing to the radiator.
Drawings
FIG. 1 is a front sectional structure of the present invention;
FIG. 2 is a schematic view of the overlooking and sectioning structure of the connection between the heat dissipation copper pipe and the connecting rod of the present invention;
FIG. 3 is a sectional structure of the fixing shell and the filter plate;
fig. 4 is a schematic view of the three-dimensional structure of the main board body and the support bracket of the present invention.
In the figure: 1. a main board body; 2. a support bracket; 3. a rubber gasket; 4. a stud; 5. a stationary case; 6. a nut; 7. a heat dissipation copper pipe; 8. a CPU chip; 9. a heat dissipation copper sheet; 10. a connecting rod; 11. a spring; 12. a filter plate; 13. a cover plate; 14. a limiting rod; 15. a fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a chip heat sink for a computer motherboard, comprising: when the chip radiator of the computer mainboard is used, the bottom of the support bracket 2 is of a hollow structure, the support bracket 2 is inserted upwards through the bottom of the mainboard body 1, the stud 4 is in threaded connection with the support bracket 2, the stud 4 is moved downwards by rotating the stud 4, so that the mainboard body 1 and the support bracket 2 are fixed, the stud 4 is prevented from damaging the mainboard body 1 by arranging the rubber gasket 3, the fixing shell 5 is lapped on the top of the stud 4, the nut 6 is in threaded connection with the support bracket 2, the nut 6 is moved downwards by rotating the nut 6, so that the fixing shell 5 and the support bracket 2 are fixed, the device is convenient to install the radiator, and the installation stability is high;
as shown in fig. 1 and 2, the bottom of the heat dissipation copper pipe 7 is tightly attached to the top of the CPU chip 8, so that heat generated by the CPU chip 8 is transmitted to the inside of the heat dissipation copper pipe 7, the inside of the heat dissipation copper pipe 7 is dissipated by arranging the heat dissipation copper sheet 9, the heat is dissipated by the front fan 15 and the rear fan 15, the connecting rod 10 is vertically slidably mounted inside the fixed shell 5, and the connecting rod 10 is reset by the spring 11, so that the heat dissipation copper pipe 7 has upward buffering performance, the device is not easy to damage the chip, and the heat dissipation performance is strong;
as shown in fig. 1 and 3, the filter plate 12 is inserted into the fixed casing 5, when the fan 15 exhausts outwards, air is filtered through the filter plate 12, the cover plate 13 is of a net structure, so that the cover plate 13 can filter air entering from the top, the connection mode between the limiting rod 14 and the fixed casing 5 is threaded connection, the cover plate 13 is slidably mounted in the fixed casing 5 up and down, the limiting rod 14 is separated from the cover plate 13 by rotating the limiting rod 14, so that the cover plate 13 can be taken out upwards, the filter plate 12 can be taken out upwards, a user can clean the cover plate 13 and the filter plate 12, and the device is convenient for performing dustproof treatment on the radiator, namely the whole working process of the chip radiator of the computer mainboard.
Those not described in detail in this specification are within the skill of the art. The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the record of description and attached drawing, and the concrete connection mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, and machinery, part and equipment all adopt prior art, and conventional model is including the conventional connected mode of circuit connection adoption conventional among the prior art, and here detailed description is not again.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (5)
1. A chip heat sink for a computer motherboard, comprising:
the mainboard comprises a mainboard body (1), wherein a plurality of round holes are formed in the mainboard body (1), and a CPU chip (8) is arranged in the center of the top of the mainboard body (1);
the top rod-shaped structure of the support bracket (2) is arranged in the main board body (1) in a penetrating way, and the bottom of the support bracket (2) is of a hollow structure;
the heat dissipation copper pipe (7) is arranged in the fixed shell (5) in a vertical sliding mode in a T-shaped structure, and the bottom of the heat dissipation copper pipe (7) is tightly attached to the top of the CPU chip (8);
and the fans (15) are fixedly arranged on the front side and the rear side of the fixed shell (5) through bolts.
2. The chip heat sink for a computer motherboard according to claim 1, wherein: the top outside cover of support bracket (2) is equipped with rubber gasket (3) of closely laminating between with mainboard body (1), and threaded connection is installed at the top of rubber gasket (3) in double-screw bolt (4) in the support bracket (2) top outside.
3. The chip heat sink for a computer motherboard according to claim 2, wherein: a fixing shell (5) with a cross section in a square structure is lapped on the top of the stud (4), and a nut (6) is mounted on one side, far away from the stud (4), of the bottom of the fixing shell (5);
the screw cap (6) is in threaded connection with the top of the support bracket (2) in a cylindrical structure.
4. The chip heat sink for a computer motherboard according to claim 1, wherein: radiating copper sheets (9) which are arranged in parallel between the single bodies are welded on the outer sides of the radiating copper pipes (7), and connecting rods (10) which are slidably arranged in the fixed shell (5) are fixedly connected to the left side and the right side of each radiating copper pipe (7);
wherein, a spring (11) for resetting the connecting rod (10) is arranged above the connecting rod.
5. A chip heat sink for a computer motherboard according to claim 3, wherein: the filter plate (12) with the cross section of a concave-shaped structure is inserted into the left side and the right side of the inside of the fixed shell (5), the cover plate (13) with the inside of a net-shaped structure is slidably mounted at the top of the fixed shell (5), and the limiting rod (14) which is in threaded connection with the top of the fixed shell (5) is rotatably mounted in the cover plate (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121133292.8U CN214504370U (en) | 2021-05-25 | 2021-05-25 | Chip radiator of computer mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121133292.8U CN214504370U (en) | 2021-05-25 | 2021-05-25 | Chip radiator of computer mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214504370U true CN214504370U (en) | 2021-10-26 |
Family
ID=78205221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121133292.8U Expired - Fee Related CN214504370U (en) | 2021-05-25 | 2021-05-25 | Chip radiator of computer mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214504370U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721475A (en) * | 2022-03-24 | 2022-07-08 | 谢莹 | Computer data processing device |
-
2021
- 2021-05-25 CN CN202121133292.8U patent/CN214504370U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721475A (en) * | 2022-03-24 | 2022-07-08 | 谢莹 | Computer data processing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211026 |