CN213876612U

CN213876612U - Heat radiator for be used for computer chip

Info

Publication number: CN213876612U
Application number: CN202022475014.2U
Authority: CN
Inventors: 丁照轩; 肖忠金
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-31
Filing date: 2020-10-31
Publication date: 2021-08-03
Anticipated expiration: 2030-10-31

Abstract

The utility model discloses a heat abstractor for computer chip, including the mounting panel, the four corners at mounting panel top all runs through and is provided with the connecting rod, the bottom of connecting rod runs through to the bottom of mounting panel, the surface thread bush that the connecting rod is located mounting panel bottom one end is equipped with first bolt, the surface activity cover of connecting rod is equipped with first spring, the surface of connecting rod is located to the supporting shoe movable sleeve, the top activity cover on connecting rod surface is equipped with the heat-conducting plate. The utility model discloses possess the advantage that the radiating effect is good and be convenient for installation, solved current computer chip heat abstractor comparatively loaded down with trivial details at the use installation, lead to the user when the installation, consuming time is hard, and the computer chip can produce a large amount of heats when using in addition, and general heat abstractor can not satisfy the chip of full state operation, leads to the chip itself high temperature, causes the problem that chip life reduces.

Description

Heat radiator for be used for computer chip

Technical Field

The utility model relates to a computer chip technical field specifically is a heat abstractor for computer chip.

Background

The computer chip is a thin slice made of silicon material, its size is only half of the fingernail, a chip is connected together by several hundred microcircuits, the volume is very small, the microcircuit producing pulse current has been covered with on the chip, need use computer chip heat abstractor in the computer chip use, but the installation of current computer chip heat abstractor is comparatively loaded down with trivial details in the use, lead to the user when the installation, consuming time and effort, and the computer chip can produce a large amount of heats in the use, general heat abstractor can not satisfy the chip of full state operation, lead to the chip itself high temperature, lead to the life reduction of chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor for computer chip possesses the advantage that the radiating effect is good and be convenient for to install, it is comparatively loaded down with trivial details at the use installation to have solved current computer chip heat abstractor, lead to the user when the installation, consuming time is hard, and computer chip can produce a large amount of heats when using in addition, and general heat abstractor can not satisfy the chip of full state operation, leads to the chip itself high temperature, causes the problem that chip life reduces.

In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation device for a computer chip comprises a mounting plate, wherein connecting rods are arranged at four corners of the top of the mounting plate in a penetrating manner, the bottom of each connecting rod penetrates to the bottom of the mounting plate, a first bolt is sleeved on the surface of one end, located at the bottom of the mounting plate, of each connecting rod in a threaded manner, a first spring is sleeved on the surface of each connecting rod in a movable manner, a supporting block is fixedly connected to the top of each first spring in a movable manner, a heat conduction plate is sleeved on the top of the surface of each connecting rod in a movable manner, the top of each supporting block is fixedly connected with the bottom of the heat conduction plate, a second bolt is sleeved on the surface of one end, located at the top of the heat conduction plate, of each connecting rod in a threaded manner, a heat absorption copper plate is fixedly connected to the bottom of each heat conduction plate, a heat conduction copper pipe is fixedly connected to the bottom of each heat conduction pipe, and a heat absorption plate is fixedly connected to the bottom of each heat conduction pipe, the radiator is fixedly connected to the top of the heat conducting plate, the screen frame is fixedly connected to the top of the radiator, the dustproof screen is fixedly connected to the top of the screen frame, the first motor is fixedly connected to the bottom of the dustproof screen, the first fan blades are fixedly connected to both sides of the output end of the first motor, the shell is fixedly connected to both the front side and the back side of the screen frame, the second spring is fixedly connected to the top of the inner cavity of the shell, the moving plate is fixedly connected to the bottom of the second spring, the fixed block is fixedly connected to the bottom of the moving plate, the moving rod is fixedly connected to one side of the moving plate, the side of the moving rod, which is far away from the moving plate, penetrates through the outer portion of the shell, the frame is movably connected to both the front side and the back side of the radiator, the fixed rod is fixedly connected to the top of the frame, and one end of the fixed rod, which is far away from the frame, penetrates through the inner cavity of the shell and contacts with the fixed block, one side fixedly connected with otter board of framework inner chamber, one side fixedly connected with motor of otter board, the equal fixedly connected with second flabellum in top and the bottom of motor output.

Preferably, one side of the shell is provided with a square hole matched with the moving rod, one side of the shell is provided with a first round hole matched with the fixed rod, and the diameter of the first round hole is larger than that of the fixed rod.

Preferably, the number of the heat conduction copper pipes is several, and the heat conduction copper pipes are distributed at the bottom of the heat absorption copper plate.

Preferably, the four corners at the top of the mounting plate are provided with second round holes matched with the connecting rods, and the diameters of the second round holes are larger than those of the connecting rods.

Preferably, the four corners of the bottom of the heat conducting plate are provided with third round holes matched with the connecting rods, and the diameter of each third round hole is larger than that of each connecting rod.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the mounting panel, the connecting rod, first bolt, first spring, the supporting shoe, the heat-conducting plate, the second bolt, the endothermic copper, the heat-conducting copper pipe, the absorber plate, the radiator, the net frame, the dust screen, first motor, first flabellum, a housing, the second spring, the movable plate, the fixed block, the carriage release lever, the framework, the dead lever, the second flabellum, the configuration of otter board and motor is used, possess the advantage that the radiating effect is good and be convenient for install, it is comparatively loaded down with trivial details at the use installation to have solved current computer chip heat abstractor, lead to the user when the installation, consuming time power, and the computer chip can produce a large amount of heats when using, general heat abstractor can not satisfy the chip of full-state operation, lead to chip itself high temperature, lead to the problem that chip life reduces.

2. The utility model discloses a set up the heat conduction copper pipe, the absorber plate of being convenient for passes to the radiator with the heat through the heat absorption copper and dispels the heat, through the square hole, the carriage release lever of being convenient for reciprocates, through setting up first round hole, user installation dead lever, through setting up the second round hole, the person of being convenient for use installs the connecting rod, and through setting up the third round hole, the person of being convenient for use installs the heat-conducting plate.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side view of a portion of the present invention;

fig. 3 is a schematic top view of the dust screen of the present invention;

fig. 4 is an enlarged schematic view of a in fig. 2 according to the present invention.

In the figure: the heat-conducting plate comprises a mounting plate 1, a connecting rod 2, a first bolt 3, a first spring 4, a supporting block 5, a heat-conducting plate 6, a second bolt 7, a heat-absorbing copper plate 8, a heat-conducting copper pipe 9, a heat-absorbing plate 10, a radiator 11, a net frame 12, a dust-proof net 13, a first motor 14, a first fan blade 15, a shell 16, a second spring 17, a movable plate 18, a fixed block 19, a movable rod 20, a frame body 21, a fixed rod 22, a second fan blade 23, a net plate 24 and a motor 25.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model provides a mounting panel 1, connecting rod 2, first bolt 3, first spring 4, supporting shoe 5, heat-conducting plate 6, second bolt 7, heat absorption copper 8, heat conduction copper pipe 9, absorber plate 10, radiator 11, net frame 12, dust screen 13, first motor 14, first flabellum 15, casing 16, second spring 17, movable plate 18, fixed block 19, carriage release lever 20, framework 21, dead lever 22, second flabellum 23, parts such as otter board 24 and motor 25 are the parts that general standard spare or technical personnel in the field know, its structure and principle all can learn through the technical manual or learn through conventional experimental method for technical personnel in the field.

Referring to fig. 1-4, a heat dissipation device for a computer chip comprises a mounting plate 1, wherein four corners of the top of the mounting plate 1 are all provided with a connecting rod 2 in a penetrating manner, the bottom of the connecting rod 2 penetrates to the bottom of the mounting plate 1, a first bolt 3 is sleeved on the surface of the connecting rod 2 at one end of the bottom of the mounting plate 1 in a threaded manner, a first spring 4 is movably sleeved on the surface of the connecting rod 2, a supporting block 5 is fixedly connected to the top of the first spring 4, the supporting block 5 is movably sleeved on the surface of the connecting rod 2, a heat conduction plate 6 is movably sleeved on the top of the surface of the connecting rod 2, the top of the supporting block 5 is fixedly connected with the bottom of the heat conduction plate 6, a second bolt 7 is sleeved on the surface of the connecting rod 2 at one end of the top of the heat conduction plate 6 in a threaded manner, a heat absorption copper plate 8 is fixedly connected to the bottom of the heat absorption plate 8, a heat conduction copper tube 9 is fixedly connected with a heat absorption plate 10 at the bottom of the heat conduction copper tube 9, the top of the heat conducting plate 6 is fixedly connected with a radiator 11, the top of the radiator 11 is fixedly connected with a net frame 12, the top of the net frame 12 is fixedly connected with a dustproof net 13, the bottom of the dustproof net 13 is fixedly connected with a first motor 14, two sides of the output end of the first motor 14 are fixedly connected with first fan blades 15, the bottoms of the front and back of the net frame 12 are fixedly connected with a shell 16, the top of the inner cavity of the shell 16 is fixedly connected with a second spring 17, the bottom of the second spring 17 is fixedly connected with a movable plate 18, the bottom of the movable plate 18 is fixedly connected with a fixed block 19, one side of the movable plate 18 is fixedly connected with a movable rod 20, one side of the movable rod 20, far away from the movable plate 18, penetrates through the outer part of the shell 16, the front and back of the radiator 11 are movably connected with frame bodies 21, the top of the frame body 21 is fixedly connected with a fixed rod 22, one end of the fixed rod 22, far away from the frame body 21, penetrates through the inner cavity of the shell 16 and contacts with the fixed block 19, one side of the inner cavity of the frame body 21 is fixedly connected with a screen plate 24, one side of the screen plate 24 is fixedly connected with a motor 25, the top and the bottom of the output end of the motor 25 are both fixedly connected with a second fan blade 23, through arranging a heat conducting copper pipe 9, the heat absorbing plate 10 is convenient for transferring heat to a radiator 11 through a heat absorbing copper plate 8 for radiating heat, one side of the shell 16 is provided with a square hole matched with the moving rod 20, through the square hole, the moving rod 20 is convenient for moving up and down, one side of the shell 16 is provided with a first round hole matched with a fixed rod 22, through arranging the first round hole, a user installs the fixed rod 22, the diameter of the first round hole is larger than that of the fixed rod 22, the number of the heat conducting copper pipes 9 is a plurality of, the heat conducting copper pipes are distributed at the bottom of the heat absorbing copper plate 8, four corners of the top of the mounting plate 1 are all provided with second round holes matched with the connecting rods 2, through arranging the second round holes, the user can conveniently install the connecting rods 2, the diameter of the second round hole is larger than that of the connecting rod 2, the four corners of the bottom of the heat conducting plate 6 are provided with third round holes matched with the connecting rod 2, the heat conducting plate 6 is convenient for a user to install by arranging the third round holes, the diameter of the third round holes is larger than that of the connecting rod 2, the heat conducting plate 6, the second bolt 7, the heat absorbing copper plate 8, the heat conducting copper pipe 9, the heat absorbing plate 10, the radiator 11, the net frame 12, the dust-proof net 13, the first motor 14, the first fan blade 15, the shell 16, the second spring 17, the moving plate 18, the fixed block 19, the moving rod 20, the frame body 21, the fixed rod 22, the second fan blade 23, the net plate 24 and the motor 25 are matched for use, the heat radiating effect is good, the installation is convenient, the problem of the existing computer chip heat radiating device is complicated to install in the using process is solved, the problem that the service life of a chip is reduced due to the fact that a user consumes time and labor when mounting the chip, the computer chip can generate a large amount of heat when the chip is used, and a common heat dissipation device cannot meet the requirement of the chip running in a full state, and the temperature of the chip is too high is caused.

When the heat dissipation device is used, through an external power supply and a controller, when a user needs to install the heat dissipation device, the user firstly places the mounting plate 1 below the mainboard, then installs the connecting rod 2 on the mounting plate 1 through the mounting hole on the mainboard, then installs the heat conducting plate 6, the first spring 4, the heat conducting copper tube 9, the heat absorbing copper plate 8 and the heat absorbing plate 10 on the connecting rod 2, then fixes the connecting rod through the second bolt 7 and aligns the heat absorbing plate 10 with the chip, then the user inserts the fixing rod 22 into the shell 16, when the fixing rod 22 contacts with the fixing block 19, the fixing rod 22 extrudes the fixing block 19, the fixing block 19 is extruded to drive the moving plate 18 and the moving rod 20 to extrude the second spring 17, when the fixing rod 22 is separated from the fixing block 19, the second spring 17 extends to drive the fixing block 19 and the moving rod 20 to reset through the fixing block 18, when a user needs to dissipate heat of the chip, the user controls the output ends of the first motor 14 and the motor 25 to rotate through the controller, and the output ends of the first motor 14 and the motor 25 rotate to drive the second fan blade 23 and the first fan blade 15 to rotate, so that the purpose of dissipating heat of the chip is achieved.

In summary, the following steps: the heat dissipation device for the computer chip solves the problems that the existing heat dissipation device for the computer chip is complex to install in the using process, so that a user consumes time and labor when installing the heat dissipation device for the computer chip, and when the computer chip is used, a large amount of heat can be generated, and a common heat dissipation device cannot meet the requirement of the chip running in a full state, so that the temperature of the chip is overhigh, and the service life of the chip is shortened.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat sink for a computer chip, comprising a mounting plate (1), characterized in that: the four corners at the top of the mounting plate (1) are all provided with connecting rods (2) in a penetrating manner, the bottom of each connecting rod (2) penetrates through the bottom of the mounting plate (1), a first bolt (3) is sleeved on a surface thread at one end of the bottom of the mounting plate (1) of each connecting rod (2), a first spring (4) is sleeved on a surface movable sleeve of each connecting rod (2), a supporting block (5) is fixedly connected to the top of each first spring (4), the supporting block (5) is movably sleeved on the surface of each connecting rod (2), a heat-conducting plate (6) is sleeved on the top of the surface of each connecting rod (2), the top of each supporting block (5) is fixedly connected with the bottom of the heat-conducting plate (6), a second bolt (7) is sleeved on a surface thread at one end of the top of each heat-conducting plate (6), and a heat-absorbing copper plate (8) is fixedly connected to the bottom of each heat-conducting plate (6), the heat absorption device is characterized in that a heat conduction copper pipe (9) is fixedly connected to the bottom of the heat absorption copper plate (8), a heat absorption plate (10) is fixedly connected to the bottom of the heat conduction copper pipe (9), a radiator (11) is fixedly connected to the top of the heat conduction plate (6), a net frame (12) is fixedly connected to the top of the radiator (11), a dustproof net (13) is fixedly connected to the top of the net frame (12), a first motor (14) is fixedly connected to the bottom of the dustproof net (13), first fan blades (15) are fixedly connected to two sides of the output end of the first motor (14), a shell (16) is fixedly connected to the front side and the back side of the net frame (12), a second spring (17) is fixedly connected to the top of the inner cavity of the shell (16), a movable plate (18) is fixedly connected to the bottom of the second spring (17), and a fixed block (19) is fixedly connected to the bottom of the movable plate (18), one side fixedly connected with carriage release lever (20) of movable plate (18), one side that movable plate (18) were kept away from in carriage release lever (20) runs through to the outside of casing (16), the equal swing joint in front and the back of radiator (11) has framework (21), top fixedly connected with dead lever (22) of framework (21), the one end that framework (21) were kept away from in dead lever (22) runs through to the inner chamber of casing (16) and contacts with fixed block (19), one side fixedly connected with otter board (24) of framework (21) inner chamber, one side fixedly connected with motor (25) of otter board (24), the top and the equal fixedly connected with second flabellum (23) in bottom of motor (25) output.

2. The heat dissipation device for computer chips of claim 1, wherein: a square hole matched with the moving rod (20) is formed in one side of the shell (16), a first round hole matched with the fixing rod (22) is formed in one side of the shell (16), and the diameter of the first round hole is larger than that of the fixing rod (22).

3. The heat dissipation device for computer chips of claim 1, wherein: the number of the heat conduction copper pipes (9) is a plurality, and the heat conduction copper pipes are distributed at the bottom of the heat absorption copper plate (8).

4. The heat dissipation device for computer chips of claim 1, wherein: the four corners at the top of the mounting plate (1) are provided with second round holes matched with the connecting rods (2), and the diameters of the second round holes are larger than those of the connecting rods (2).

5. The heat dissipation device for computer chips of claim 1, wherein: the four corners of the bottom of the heat conducting plate (6) are provided with third round holes matched with the connecting rods (2), and the diameter of each third round hole is larger than that of each connecting rod (2).