CN214477427U - Packaging shell structure of semiconductor device - Google Patents
Packaging shell structure of semiconductor device Download PDFInfo
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- CN214477427U CN214477427U CN202120624605.3U CN202120624605U CN214477427U CN 214477427 U CN214477427 U CN 214477427U CN 202120624605 U CN202120624605 U CN 202120624605U CN 214477427 U CN214477427 U CN 214477427U
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Abstract
The application relates to the technical field of semiconductor device packaging, and discloses a packaging shell structure of a semiconductor device, which comprises a bottom shell and a packaging shell, wherein a semiconductor device body is welded on the inner wall of the bottom end of the bottom shell, a plurality of groups of through holes are transversely arranged on the front surface and the back surface of the bottom shell at equal intervals, pins are welded in the through holes arranged on the front surface and the back surface of the bottom shell, one end of the pin, which is positioned in the bottom shell, is electrically connected with the semiconductor device body, the bottom shell is engaged with the packaging shell in a sealing and clamping manner, the inner wall of the bottom end of the bottom shell is positioned at both sides of the semiconductor device body and is welded with a supporting component, the middle part of the upper surface of the packaging shell is provided with a threaded through hole, and a heat dissipation mechanism is arranged in the threaded through hole formed in the upper surface of the packaging shell, so that the problem that the electrical performance of the semiconductor device is reduced due to the fact that the semiconductor device is corroded by dust and the like is solved.
Description
Technical Field
The present application relates to the field of semiconductor device packaging technologies, and in particular, to a package housing structure of a semiconductor device.
Background
The semiconductor device is an electronic device with the conductivity between a good electric conductor and an insulator, which utilizes the special electric characteristics of semiconductor materials to complete specific functions and can be used for generating, controlling, receiving, converting, amplifying signals and carrying out energy conversion, a packaging shell for mounting the semiconductor device is a bridge for communicating the internal world of a chip with an external circuit, contacts on the chip are connected to pins of the packaging shell by leads, and the pins are connected with other devices by leads on a printed board.
Chinese utility model patent with publication number CN209766402U discloses a semiconductor device package casing and laser system, including: the shell is arranged on the base and surrounds the base to form an accommodating cavity, and the accommodating cavity is used for accommodating a semiconductor.
In view of the above-mentioned related technologies, the package structure is susceptible to dust and impurities in the external environment, which causes corrosion to the semiconductor device and leads to degradation of its electrical performance.
SUMMERY OF THE UTILITY MODEL
The application provides a packaging shell structure of a semiconductor device, which aims to avoid the problem that the electrical performance of the semiconductor device is reduced due to corrosion of dust and the like to the semiconductor device.
The application provides a semiconductor device's encapsulation shell structure adopts following technical scheme:
the utility model provides a semiconductor device's encapsulation shell structure, includes drain pan and packaging shell, the welding of drain pan bottom inner wall department has the semiconductor device body, and the drain pan openly and the back equal horizontal equidistance seted up a plurality of groups through-hole, all weld in the through-hole that the drain pan was openly seted up with the back has the pin, the one end and the semiconductor device body electric connection that the pin is located the drain pan, the drain pan meshes sealed joint with the packaging shell mutually, the bottom inner wall department of drain pan is located semiconductor device body both sides and all welds the supporting component, threaded through-hole has been seted up to packaging shell upper surface middle part position, and is provided with heat dissipation mechanism in the threaded through-hole that the packaging shell upper surface was seted up.
Through adopting above-mentioned technical scheme, rotate the installation circle through the mounting hole and be connected with the packaging shell, the installation of being convenient for is dismantled, press the filter screen frame again, thereby through butt joint piece and draw-in groove looks joint, be convenient for install dustproof filter screen, make things convenient for staff's periodic maintenance to change, be drain pan and the inside heat dissipation of packaging shell through the installation circle again, the radiating effect to the semiconductor device body has been improved, utilize fine filter screen and dustproof filter screen economic benefits and social filtering, be favorable to having avoided the entering such as dust impurity among the external environment, cause the corruption and lead to the problem that the electrical performance descends to the semiconductor device body.
Preferably, the heat dissipation mechanism comprises an installation ring, a fine filter screen, a filter screen frame and a dustproof filter screen, wherein a thread groove is formed in the outer wall of the installation ring, the thread groove formed in the outer wall of the installation ring is in threaded connection with a thread through hole formed in the upper surface of the packaging shell in a matching manner, a through hole is formed in the upper surface of the installation ring, and the fine filter screen is welded in the through hole formed in the upper surface of the installation ring.
By adopting the technical scheme, the packaging shell and the mounting ring are mounted through threaded connection, so that the packaging shell and the mounting ring are convenient to mount and dismount, and a certain protection effect is facilitated by using the fine filter screen.
Preferably, the mounting hole has all been seted up to collar flange upper surface both sides, and the echelonment draw-in groove has all been seted up to collar flange inner wall both sides, and dustproof filter screen bonds in the filter screen frame, the equal transverse welding in filter screen frame lateral wall both sides has the butt joint piece, the butt joint piece agrees with the slip joint mutually with the draw-in groove.
Through adopting above-mentioned technical scheme, utilize butt joint piece and draw-in groove, be convenient for make filter screen frame and installation circle joint installation, make things convenient for the staff to regularly change the dustproof filter screen of maintenance, improved dustproof effect.
Preferably, the supporting component comprises a vertical rod and a supporting rod, the vertical rod is welded on the inner wall of the bottom end of the bottom shell, the supporting rod is welded on the inner wall of the top end of the packaging shell, a groove is formed in the upper surface of the vertical rod, and one end, close to the bottom shell, of the supporting rod is abutted to the groove formed in the upper surface of the vertical rod.
Through adopting above-mentioned technical scheme, utilize the mutual butt of die-pin and pole setting to support, be convenient for play and support firm effect, be favorable to avoiding drain pan and packaging shell to receive external force when extrudeing, and cause the impaired problem of inside semiconductor device body, improved the protective effect to the semiconductor device body.
Preferably, a dovetail-shaped notch is formed in the edge of the upper surface of the bottom shell, a convex bayonet is formed in the edge of the lower surface of the packaging shell, and the bayonet is engaged with the notch to be fixedly clamped.
By adopting the technical scheme, the bottom shell and the packaging shell are conveniently and fixedly installed and convenient for further processing operation by utilizing the clamping of the bayonet and the notch.
In summary, the present application includes at least one of the following beneficial technical effects:
1. through being equipped with the drain pan, packaging shell and heat dissipation mechanism cooperate, utilize the installation circle, the strainer, strainer frame and dustproof filter screen, rotate the installation circle through the mounting hole and be connected with the packaging shell, convenient to install and dismantle, press the strainer frame again, thereby through butt joint piece and draw-in groove looks joint, the dustproof filter screen of installation of being convenient for, make things convenient for staff's periodic maintenance to change, again through the installation circle for drain pan and the inside heat dissipation of packaging shell, the radiating effect to the semiconductor device body has been improved, utilize strainer and dustproof filter screen economic benefits and social filtering, be favorable to having avoided the entering such as dust impurity among the external environment, cause the corruption and lead to the problem that electrical performance descends to the semiconductor device body.
2. Through being equipped with the drain pan, encapsulation shell and supporting mechanism cooperate, utilize the mutual butt of die-pin and pole setting to support, be convenient for play the firm effect of support, when being favorable to avoiding drain pan and encapsulation shell to receive external force extrusion, and cause the impaired problem of inside semiconductor device body, improved the protective effect to the semiconductor device body, recycle bayonet socket and notch looks joint, be convenient for install fixed drain pan and encapsulation shell, make things convenient for its further processing operation.
Drawings
FIG. 1 is a schematic structural diagram of a heat dissipation mechanism according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a bottom case according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a mounting ring according to an embodiment of the present application.
Description of reference numerals: 1. a bottom case; 2. packaging the shell; 3. a semiconductor device body; 4. a pin; 5. a support assembly; 51. erecting a rod; 52. a support rod; 6. a heat dissipation mechanism; 61. installing a ring; 62. fine filtering net; 63. a screen frame; 64. a dustproof filter screen; 7. mounting holes; 8. a card slot; 9. a butting block; 10. a recess; 11. and (4) a bayonet.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses a packaging shell structure of a semiconductor device. Referring to fig. 1 and 2, a packaging shell structure of a semiconductor device comprises a bottom shell 1 and a packaging shell 2, wherein a semiconductor device body 3 is welded on the inner wall of the bottom end of the bottom shell 1, a plurality of groups of through holes are transversely and equidistantly formed on the front surface and the back surface of the bottom shell 1, pins 4 are welded in the through holes formed on the front surface and the back surface of the bottom shell 1, one end of each pin 4 positioned in the bottom shell 1 is electrically connected with the semiconductor device body 3, the bottom shell 1 is meshed with the packaging shell 2 in a sealing and clamping manner, supporting components 5 are welded on the inner wall of the bottom end of the bottom shell 1 positioned on two sides of the semiconductor device body 3, a threaded through hole is formed in the middle of the upper surface of the packaging shell 2, a heat dissipation mechanism 6 is arranged in the threaded through hole formed in the upper surface of the packaging shell 2, the heat dissipation effect on the semiconductor device body 3 is improved, and dust impurities and the like in the external environment are prevented from entering at the same time, the semiconductor device body 3 is corroded to cause a problem of deterioration in electrical performance.
Referring to fig. 1 and 3, the heat dissipation mechanism 6 includes an installation ring 61, a fine filter net 62, a filter net frame 63 and a dustproof filter net 64, a thread groove is formed in the outer wall of the installation ring 61, the thread groove formed in the outer wall of the installation ring 61 is in threaded connection with a thread through hole formed in the upper surface of the package case 2, the installation and the disassembly are convenient, a through hole is formed in the upper surface of the installation ring 61, and the fine filter net 62 is welded in the through hole formed in the upper surface of the installation ring 61, so that a certain protection effect is convenient to play.
Referring to fig. 1, fig. 3, mounting hole 7 has all been seted up to installation circle 61 upper surface both sides, and installation circle 61 inner wall both sides have all seted up echelonment draw-in groove 8, and dustproof filter screen 64 bonds in filter screen frame 63, the equal transverse welding in filter screen frame 63 lateral wall both sides has butt piece 9, butt piece 9 agrees with the slip joint with draw-in groove 8 mutually, be convenient for make filter screen frame 63 and installation circle 61 joint installation, make things convenient for the staff periodic replacement to maintain dustproof filter screen 64, dustproof effect has been improved.
Referring to fig. 1, supporting component 5 includes pole setting 51 and die-pin 52, pole setting 51 welds on the bottom inner wall of drain pan 1, die-pin 52 welds on the top inner wall of packaging shell 2, pole setting 51 upper surface is seted up flutedly, die-pin 52 is located the recess that the one end butt that is close to drain pan 1 was located pole setting 51 upper surface and was seted up, be convenient for play and support firm effect, be favorable to avoiding drain pan 1 and packaging shell 2 to receive external force when extrudeing, and cause the impaired problem of inside semiconductor device body 3, the protective effect to semiconductor device body 3 has been improved.
Referring to fig. 1, a dovetail-shaped notch 10 is formed in the edge of the upper surface of the bottom case 1, a convex bayonet 11 is formed in the edge of the lower surface of the package case 2, and the bayonet 11 is engaged with the notch 10 to be fixedly clamped, so that the bottom case 1 and the package case 2 can be conveniently mounted and fixed, and further processing operation of the bottom case and the package case is facilitated.
The implementation principle of the package shell structure of the semiconductor device in the embodiment of the application is as follows: the installation ring 61 is rotated through the installation hole 7 to be connected with the packaging shell 2, so that the installation and the disassembly are convenient, the filter screen frame 63 is pressed, the filter screen frame is clamped with the clamping groove 8 through the abutting block 9, the dustproof filter screen 64 is convenient to install, the regular maintenance and the replacement of workers are convenient, the bottom shell 1 and the packaging shell 2 are internally radiated through the installation ring 61, the radiating effect on the semiconductor device body 3 is improved, the fine filter screen 62 and the dustproof filter screen 64 are used for filtering with double effects, the entering of dust impurities in the external environment and the like is favorably avoided, the problem of electric performance reduction caused by corrosion on the semiconductor device body 3 is favorably avoided, the supporting rod 52 and the upright rod 51 are abutted and supported with each other, the supporting and stabilizing effects are favorably realized, the problem of damage to the internal semiconductor device body 3 caused by the extrusion of the bottom shell 1 and the packaging shell 2 by external force is favorably avoided, and the protection effect on the semiconductor device body 3 is improved, and then the bottom shell 1 and the packaging shell 2 are conveniently installed and fixed through the clamping of the bayonet 11 and the notch 10, so that the further processing operation is convenient.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (5)
1. A package housing structure of a semiconductor device, characterized in that: including drain pan (1) and packaging shell (2), the welding of drain pan (1) bottom inner wall department has semiconductor device body (3), and drain pan (1) openly and the equal horizontal equidistance in the back has seted up a plurality of groups through-hole, all weld in the through-hole that drain pan (1) openly and the back was seted up pin (4), one end and semiconductor device body (3) electric connection that pin (4) are located drain pan (1), drain pan (1) meshes sealed joint with packaging shell (2) mutually, the bottom inner wall department of drain pan (1) is located semiconductor device body (3) both sides and all welds supporting component (5), screw thread through-hole has been seted up to packaging shell (2) upper surface middle part position, and is provided with heat dissipation mechanism (6) in the screw thread through-hole that packaging shell (2) upper surface was seted up.
2. The package housing structure of a semiconductor device according to claim 1, wherein: the heat dissipation mechanism (6) comprises an installation ring (61), a fine filter screen (62), a filter screen frame (63) and a dustproof filter screen (64), a thread groove is formed in the outer wall of the installation ring (61), the thread groove formed in the outer wall of the installation ring (61) is in threaded connection with a thread through hole formed in the upper surface of the packaging shell (2), a through hole is formed in the upper surface of the installation ring (61), and the fine filter screen (62) is welded in the through hole formed in the upper surface of the installation ring (61).
3. The package housing structure of a semiconductor device according to claim 2, wherein: mounting hole (7) have all been seted up to installation circle (61) upper surface both sides, and installation circle (61) inner wall both sides have all been seted up echelonment draw-in groove (8), and dustproof filter screen (64) bond in filter screen frame (63), the equal transverse welding in filter screen frame (63) lateral wall both sides has butt block (9), butt block (9) agree with the slip joint mutually with draw-in groove (8).
4. The package housing structure of a semiconductor device according to claim 1, wherein: the supporting component (5) comprises an upright rod (51) and a supporting rod (52), the upright rod (51) is welded on the inner wall of the bottom end of the bottom shell (1), the supporting rod (52) is welded on the inner wall of the top end of the packaging shell (2), a groove is formed in the upper surface of the upright rod (51), and the supporting rod (52) is located in the groove formed in the upper surface of the upright rod (51) in a butting mode close to one end of the bottom shell (1).
5. The package housing structure of a semiconductor device according to claim 1, wherein: the improved packaging structure is characterized in that a dovetail-shaped notch (10) is formed in the edge of the upper surface of the bottom shell (1), a convex bayonet (11) is formed in the edge of the lower surface of the packaging shell (2), and the bayonet (11) is meshed with the notch (10) and fixedly clamped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120624605.3U CN214477427U (en) | 2021-03-29 | 2021-03-29 | Packaging shell structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120624605.3U CN214477427U (en) | 2021-03-29 | 2021-03-29 | Packaging shell structure of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214477427U true CN214477427U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120624605.3U Active CN214477427U (en) | 2021-03-29 | 2021-03-29 | Packaging shell structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214477427U (en) |
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2021
- 2021-03-29 CN CN202120624605.3U patent/CN214477427U/en active Active
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