CN220858570U - Improved thyristor intelligent control module assembly shell - Google Patents
Improved thyristor intelligent control module assembly shell Download PDFInfo
- Publication number
- CN220858570U CN220858570U CN202322358778.7U CN202322358778U CN220858570U CN 220858570 U CN220858570 U CN 220858570U CN 202322358778 U CN202322358778 U CN 202322358778U CN 220858570 U CN220858570 U CN 220858570U
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- plate
- shell
- chip
- heat dissipation
- control module
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- 239000000919 ceramic Substances 0.000 claims abstract description 36
- 238000005192 partition Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000428 dust Substances 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Thyristors (AREA)
Abstract
The utility model relates to the technical field of thyristor shells, in particular to an improved thyristor intelligent control module assembly shell. The utility model relates to an assembled shell, which is an integrally processed shell, wherein the upper surface of the shell is provided with at least one stage of step in an upward extending way; a three-dimensional heat dissipation space is formed below the shell where the step is located; the upper surface of the heat conducting base plate is provided with a ceramic copper-clad plate, and a chip and a connecting bridge are arranged above the ceramic copper-clad plate; the chip and the heat conducting bottom plate are electrically insulated through the ceramic copper-clad plate; the shell with the gap is changed into an integrally processed and molded assembly shell, so that dust is prevented from entering from the inside of the shell; the shell is improved, so that the trigger plate is electrically isolated from the chip and the heat conducting bottom plate; three-dimensional heat dissipation is realized, and centralized heat dissipation is avoided; the filling-free epoxy resin is realized, the cost is saved, the functions of the product are expanded, and the maintenance speed is improved.
Description
Technical Field
The utility model relates to the technical field of thyristor shells, in particular to an improved thyristor intelligent control module assembly shell.
Background
The intelligent control module of the thyristor is widely applied to different industries, and the assembled shell is mainly used for being connected with an external multifunctional control board to realize closed-loop control such as steady flow and voltage stabilization, and the functions of heat dissipation, electric isolation and the like are generally required to be considered. For example, chinese patent, the publication number CN214589126U discloses a detachable case and a battery box, in which the detachable case adopts a split design of a case cover and a case body, and the case cover and the case body are tightly combined by a fastener, so that the detachable case can be installed and detached without damaging the case cover and the case body. But the scheme adopts a split structure, and dust is easy to enter due to gaps on the assembly shell; the internal components are arranged too tightly, the trigger signal is easy to be interfered by electromagnetic interference, and the problem of difficult heat dissipation exists.
Disclosure of utility model
The utility model aims to solve the technical problems that: the defect of the prior art is overcome, and the improved thyristor intelligent control module assembly shell is provided, the shell with the gap is changed into an integrally-machined assembly shell, and dust is prevented from entering from the inside of the shell; the trigger plate is electrically isolated from the chip and the heat conducting bottom plate by improving the space distribution in the shell; meanwhile, three-dimensional heat dissipation is realized, centralized heat dissipation is avoided, and the layout of the internal cavity is more reasonable; the filling-free epoxy resin is realized, the cost is saved, the functions of the product are expanded, and the maintenance speed is improved.
The technical scheme of the utility model is as follows:
an improved thyristor intelligent control module assembly housing comprises the following components:
the assembly shell is an integrally-machined shell, and at least one stage of step is arranged on the upper surface of the shell in an upward extending mode; a three-dimensional heat dissipation space is formed below the shell where the step is located; the electrode is arranged in a space formed by spacing the front and rear partition plates, a connector joint is arranged between the left and right partition plates, and a trigger plate is arranged at the bottom of the connector joint;
The upper surface of the heat conduction bottom plate is provided with a ceramic copper-clad plate, and a chip and a connecting bridge are arranged above the ceramic copper-clad plate; the chip and the heat conducting bottom plate are electrically insulated through the ceramic copper-clad plate;
In addition, the electrode extends downwards through the assembly shell and is fixed to the chip, and the trigger plate is arranged inside the shell and is positioned above the chip.
According to the technical scheme, through improving the spatial distribution in the assembly shell and reasonably distributing the internal structure, the trigger plate is electrically isolated from the chip, the chip and the heat conduction bottom plate, and the three-dimensional heat dissipation space is adopted, so that heat dissipation is more reasonable, and heat dissipation difficulty caused by concentrated placement is avoided. It should be noted that the copper layers at the upper and lower parts of the ceramic copper-clad plate play roles in fixing and heat conduction, and the ceramic layer at the middle part plays roles in insulation, so that the heat dissipation is not affected, and the insulation is also achieved.
In addition, the step purpose in this technical scheme is to raise the inner space of whole casing, makes it possess sufficient space and holds components and parts, also leaves sufficient space of placing for connector assembly joint, trigger plate, chip etc. also for connector assembly joint, trigger plate, the heat dissipation of chip provide the passageway, adopt the mode of multilayer arrangement to dispel the heat, keep apart, space utilization is reasonable.
In some embodiments, the assembly housing is provided in a cuboid shape, and no gap exists on the upper surface of the assembly housing; the internal cavity enclosed by the assembly shell and the heat conduction bottom plate is sequentially provided with a connector joint, a trigger plate, a chip, a ceramic copper-clad plate and the heat conduction bottom plate from top to bottom.
In some embodiments, the four corners of the assembly housing are provided with screws that mate with a thermally conductive base plate.
The screw is used for integrally dismantling, so that all parts are convenient to overhaul and replace; after the shell is removed, the electrode, the touch control plate and the connector at the bottom of the shell can be replaced, and the chip and the connecting bridge on the heat conduction bottom plate can also be replaced, so that the encapsulation of epoxy resin is avoided, the deformation stress of the shell is reduced, and the product quality is improved.
In some embodiments, the three-dimensional heat dissipation space comprises a heat dissipation space I between the trigger plate and the connector joint, a heat dissipation space between the trigger plate and the chip, and a heat dissipation space III between the chip and the heat conduction bottom plate.
In the technical scheme, the internal cavity not only can realize the electric isolation function of components, but also has the function of distributing and radiating; the heat dissipation space I is used for heat dissipation among the electrode, the trigger plate and the connector joint, the heat dissipation space is used for heat dissipation of the trigger plate, the chip and the connecting bridge, and the heat dissipation space III is used for heat dissipation of the chip, the connecting bridge and the ceramic copper-clad plate.
In some embodiments, the electrode is in an L-shaped configuration, including a horizontal portion within the recess, a vertical portion extending through the internal cavity, and a connection portion secured to the chip.
In the technical scheme, a mounting hole matched with an electrode is formed in an assembly shell, and a vertical part extends to an inner cavity along the mounting hole; the horizontal part is exposed on the surface of the assembly shell and is positioned between the front partition plate and the rear partition plate; the electrodes spaced apart by the separator are arranged in a matrix.
In some embodiments, the horizontal part of the electrode is provided with a mounting hole connected with the copper bar through a bolt; the electrode on one side is an input end, and the electrode on the other side is an output end.
In some embodiments, the connecting bridge is arranged in a shape of a gate, and is mounted on the chip and the ceramic copper-clad plate.
The connecting bridge is used for releasing mechanical stress generated by vibration and heat generated in working, and thermal stress can not act on the diode chip and the thyristor chip through the ceramic copper-clad plate, so that the working reliability of the chip is greatly improved.
In some embodiments, the middle part of the ceramic copper-clad plate is a ceramic layer, and the upper part and the lower part are copper layers.
Compared with the prior art, the utility model has the following beneficial effects:
(1) The shell with the gap is changed into an integrally processed and molded assembly shell, so that dust is prevented from entering from the inside of the shell;
(2) The trigger plate is electrically isolated from the chip and the heat conducting bottom plate by improving the space distribution in the shell; meanwhile, three-dimensional heat dissipation is realized, centralized heat dissipation is avoided, and the layout of the internal cavity is more reasonable;
(3) The filling-free epoxy resin is realized, the cost is saved, the functions of the product are expanded, and the maintenance speed is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a cross-sectional view of the present utility model.
Fig. 2 is a top view of the present utility model.
In the figure: 1. assembling a shell; 11. a partition plate; 12. an electrode; 13. a connector fitting; 14. a screw; 15. a mounting hole; 16. a trigger plate; 2. a thermally conductive base plate; 21. ceramic copper-clad plate; 22. a connecting bridge; 23. and a chip.
Detailed Description
In order to make the technical solution of the present utility model better understood by those skilled in the art, the technical solution of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
Example 1
As shown in fig. 1 and 2, the present embodiment provides an improved thyristor intelligent control module assembly housing, which includes an assembly housing 1 and a heat conducting bottom plate 2.
As shown in fig. 1 and 2, a housing 1 is assembled, which is an integrally-formed housing, and the upper surface of the housing is provided with at least one step extending upwards; a three-dimensional heat dissipation space is formed below the shell where the step is located; the separation plates 11 are arranged upwards along the step surface, the electrodes 12 are arranged in the space formed by the separation of the front separation plate 11 and the rear separation plate 11, the connector joint 13 is arranged between the left separation plate 11 and the right separation plate 11, and the trigger plate 16 is arranged at the bottom of the connector joint 13;
as shown in fig. 1, the heat conducting base plate 2 is provided with a ceramic copper-clad plate 21 on the upper surface, and a chip 23 and a connecting bridge 22 are arranged above the ceramic copper-clad plate 21; the chip 23 and the heat conducting bottom plate 2 are electrically insulated by the ceramic copper-clad plate 21.
In addition, the electrode 12 extends downward through the assembly housing and is fixed to the chip 23, and the trigger plate 16 is disposed inside the housing and above the chip 23.
According to the technical scheme, the shell with the gap is changed into an integrally machined assembly shell, so that dust is prevented from entering from the inside of the shell; through improving the spatial distribution in the assembly casing 1, reasonable layout inner structure makes all electric isolation between trigger plate 16 and chip 23, chip 23 and the heat conduction bottom plate 2 to adopt three-dimensional heat dissipation space, make the heat dissipation more reasonable, avoid concentrating the heat dissipation difficulty that the placing caused. It should be noted that, the copper layers at the upper and lower parts of the ceramic copper-clad plate 21 play roles in fixing and heat conduction, while the ceramic layer at the middle part plays roles in insulation, so that the heat dissipation is not affected, and the insulation is also achieved.
In addition, the step in this technical scheme is aimed at raising the inner space of whole casing, makes it possess sufficient space and holds components and parts, also reserves sufficient space of placing for connector joint 13, trigger plate 16, chip 23 etc. and also provides the passageway for connector joint 13, trigger plate 16, the heat dissipation of chip 23, adopts the mode of multilayer arrangement to dispel the heat, keep apart, and space utilization is reasonable.
In some embodiments, as shown in fig. 1 and 2, the assembly housing 1 is provided in a cuboid shape, and no gap exists on the upper surface of the assembly housing; the internal cavity enclosed by the assembly shell 1 and the heat conduction bottom plate 2 is sequentially provided with a connector joint 13, a trigger plate 16, a chip 23, a ceramic copper-clad plate 21 and the heat conduction bottom plate 2 from top to bottom.
In some embodiments, as shown in fig. 1 and 2, the four end corners of the assembly housing 1 are provided with screws 14 matched with the heat conducting bottom plate 2, and the screws 14 are used for being integrally removed, so that all parts are convenient to overhaul and replace; after the shell is removed, the electrode 12, the touch control plate and the connector joint 13 at the bottom of the shell can be replaced, and the chip 23 and the connecting bridge 22 on the heat conduction bottom plate 2 can also be replaced, so that the encapsulating epoxy resin is avoided, the deformation stress of the shell is reduced, and the product quality is improved.
In some embodiments, as shown in fig. 1, the three-dimensional heat dissipation space includes a heat dissipation space i between the trigger plate 16 and the connector terminal 13, a heat dissipation space between the trigger plate 16 and the chip 23, and a heat dissipation space iii between the chip 23 and the heat conducting bottom plate 2, where the internal cavity not only can realize the electrical isolation function of the components, but also can play a role in distributing heat dissipation; the heat dissipation space I is used for heat dissipation among the electrode 12, the trigger plate 16 and the connector joint 13, the heat dissipation space is used for heat dissipation among the trigger plate 16, the chip 23 and the connecting bridge 22, and the heat dissipation space III is used for heat dissipation among the chip 23, the connecting bridge 22 and the ceramic copper-clad plate 21.
In some embodiments, as shown in fig. 1, the electrode 12 is in an L-shape, and includes a horizontal portion located in the groove, a vertical portion penetrating the internal cavity, and a connection portion fixed with the chip 23, where the mounting housing is provided with a mounting hole 15 matched with the electrode 12, and the vertical portion extends to the internal cavity along the mounting hole 15; the horizontal part is exposed on the surface of the assembled shell and is positioned between the front partition 11 and the rear partition 11; the electrodes 12 spaced apart via the separator 11 are arranged in a matrix.
In some embodiments, as shown in fig. 1, a horizontal portion of the electrode 12 is provided with a mounting hole 15 connected with a copper bar through a bolt; the electrode 12 on one side is an input terminal and the electrode 12 on the other side is an output terminal.
In some embodiments, the connection bridge 22 is arranged in a gate shape, and is mounted on the chip 23 and the ceramic copper-clad plate 21, the connection bridge 22 is used for releasing mechanical stress generated by vibration and heat generated in operation, and the thermal stress is not applied to the diode and the thyristor through the ceramic copper-clad plate 21, so that the operational reliability of the chip 23 is greatly improved.
In some embodiments, as shown in fig. 1, the middle part of the ceramic copper-clad plate 21 is a ceramic layer, and the upper and lower parts are copper layers; the ceramic copper-clad plate 21 belongs to a conventional technical means and is not described herein.
The assembly process of the above embodiment is as follows:
The assembly shell 1 is installed, the electrodes 12 are correspondingly installed in grooves formed by the partition plate 11, the connector joints 13 are inserted into corresponding installation openings, and the trigger plate 16 is installed at the tail ends of the connector joints 13; mounting the assembly housing to the housing by means of screws 14, completing the mounting of the entire assembly housing 1;
Installing a heat conducting bottom plate 2, firstly welding a ceramic copper-clad plate 21 onto the heat conducting bottom plate 2, then correspondingly installing a chip 23 and a connecting bridge 22 on the ceramic copper-clad plate 21, and then keeping the trigger plate 16 away from the chip 23 at the moment to avoid the electromagnetic interference of the trigger signal of the trigger plate 16 from the chip 23; the trigger plate 16 integrates a protection circuit module;
Finally, the housing is assembled with the thermally conductive base plate 2 by means of screws 14, thus completing the integral installation, with the electrodes 12 connected to the chip 23.
The overhaul process of the above embodiment is as follows:
When the working process fails, the primary judgment is that the trigger plate 16 fails, the assembly shell can be removed through the disassembling screw 14 and replaced by a new assembly shell, so that other shells and the bottom heat conduction bottom plate 2 are completely reserved, the cost is saved, and the working efficiency is improved; when judging that the chip 23 is damaged, the whole shell can be removed through the disassembling screw 14, and the chip 23 is replaced or the heat conducting bottom plate 2 is replaced, so that the shell on the upper part is reserved, the overhaul efficiency is high, and the cost is saved.
Although the present utility model has been described in detail by way of preferred embodiments with reference to the accompanying drawings, the present utility model is not limited thereto. Various equivalent modifications and substitutions may be made in the embodiments of the present utility model by those skilled in the art without departing from the spirit and scope of the present utility model, and it is intended that all such modifications and substitutions be within the scope of the present utility model/be within the scope of the present utility model as defined by the appended claims. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (8)
1. The improved thyristor intelligent control module assembly shell is characterized by comprising the following components:
The assembly shell (1) is an integrally-processed shell, and the upper surface of the shell is provided with at least one stage of step in an upward extending way; a three-dimensional heat dissipation space is formed below the shell where the step is located; the electrode assembly comprises a front partition plate (11) and a rear partition plate (11), electrodes (12) are arranged in a space formed by the front partition plate and the rear partition plate (11) at intervals, a connector joint (13) is arranged between the left partition plate and the right partition plate (11), and a trigger plate (16) is arranged at the bottom of the connector joint (13);
The heat conduction base plate (2) is provided with a ceramic copper-clad plate (21) on the upper surface, and a chip (23) and a connecting bridge (22) are arranged above the ceramic copper-clad plate (21); the chip (23) and the heat conduction bottom plate (2) are electrically insulated through the ceramic copper-clad plate (21);
In addition, the electrode (12) extends downward through the assembly housing and is fixed to the chip (23), and the trigger plate (16) is disposed inside the housing and above the chip (23).
2. The improved thyristor intelligent control module assembly housing according to claim 1, wherein the assembly housing (1) is provided in a rectangular parallelepiped shape, and no gap exists on the upper surface thereof; an inner cavity surrounded by the assembly shell (1) and the heat conduction bottom plate (2) is sequentially provided with a connector joint (13), a trigger plate (16), a chip (23), a ceramic copper-clad plate (21) and the heat conduction bottom plate (2) from top to bottom.
3. An improved thyristor intelligent control module assembly housing according to claim 1 or 2, characterized in that the four end corners of the assembly housing (1) are provided with screws (14) cooperating with a thermally conductive base plate (2).
4. The improved thyristor intelligent control module assembly housing according to claim 1, wherein said three-dimensional heat dissipation space comprises a heat dissipation space i between the trigger plate (16) and the connector sub-assembly (13), a heat dissipation space between the trigger plate (16) and the chip (23), and a heat dissipation space iii between the chip (23) and the heat conductive base plate (2).
5. The improved thyristor intelligent control module assembly housing according to claim 1, wherein said electrode (12) is L-shaped and comprises a horizontal portion located in the recess, a vertical portion extending through the internal cavity, and a connection portion secured to the chip (23).
6. The improved thyristor intelligent control module assembly housing according to claim 5, wherein the horizontal portion of the electrode (12) is provided with a mounting hole (15) connected with a copper bar through a bolt; one side electrode (12) is an input end, and the other side electrode (12) is an output end.
7. The improved thyristor intelligent control module assembly housing according to claim 1, wherein the connecting bridge (22) is arranged in a gate shape and is mounted on the chip (23) and the ceramic copper-clad plate (21).
8. The improved thyristor intelligent control module assembly housing according to claim 1, wherein the middle part of the ceramic copper-clad plate (21) is a ceramic layer, and the upper part and the lower part are copper layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322358778.7U CN220858570U (en) | 2023-08-31 | 2023-08-31 | Improved thyristor intelligent control module assembly shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322358778.7U CN220858570U (en) | 2023-08-31 | 2023-08-31 | Improved thyristor intelligent control module assembly shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220858570U true CN220858570U (en) | 2024-04-26 |
Family
ID=90771781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322358778.7U Active CN220858570U (en) | 2023-08-31 | 2023-08-31 | Improved thyristor intelligent control module assembly shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220858570U (en) |
-
2023
- 2023-08-31 CN CN202322358778.7U patent/CN220858570U/en active Active
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