CN214438539U - Low-temperature cooling ultrasonic device - Google Patents

Low-temperature cooling ultrasonic device Download PDF

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Publication number
CN214438539U
CN214438539U CN202023133527.1U CN202023133527U CN214438539U CN 214438539 U CN214438539 U CN 214438539U CN 202023133527 U CN202023133527 U CN 202023133527U CN 214438539 U CN214438539 U CN 214438539U
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China
Prior art keywords
insulation
ultrasonic
temperature
temperature sensor
heat preservation
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CN202023133527.1U
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Chinese (zh)
Inventor
刘珊
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Guizhou Institute of Technology
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Guizhou Institute of Technology
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Abstract

The utility model discloses a cryogenic cooling ultrasonic device, including the insulation can, the top of insulation can is equipped with ultrasonic probe and temperature sensor, and ultrasonic probe and temperature sensor stretch into to the insulation can inside, and ultrasonic probe is connected with supersonic generator, and the embedding has a plurality of semiconductor refrigerator on the lateral wall of insulation can, and semiconductor refrigerator's cold junction fin is fixed on the inner wall of insulation can, and semiconductor refrigerator's hot junction fan sets up outside the insulation can, and temperature sensor and all semiconductor refrigerator all are connected with microcomputer digital thermostat. The ultrasonic low-temperature cooling device achieves the effect of low-temperature cooling ultrasound by matching the ultrasonic generator, the ultrasonic probe, the heat preservation box, the container bracket, the ultrasonic container, the heat preservation box door, the hollow glass, the semiconductor refrigerator, the cold-end radiating fin, the hot-end fan, the temperature sensor and the microcomputer digital temperature controller. In the whole structure, the temperature in the heat insulation box is monitored in real time through the temperature sensor.

Description

Low-temperature cooling ultrasonic device
Technical Field
The utility model relates to an ultrasonic device, especially a cryogenic cooling ultrasonic device.
Background
Ultrasonic devices are widely used in the fields of chemistry and biomedicine. In the chemical field, nanoparticles usually require ultrasound at low temperature to have good dispersion effect. In the biomedical field, the ultrasound process also needs to be performed at a lower temperature in order to not denature the target protein. However, during the ultrasound process, the ultrasound probe may release heat, affecting the ultrasound effect. The low-temperature ultrasonic device commonly used at present is that ice blocks are added outside an ultrasonic container to reduce the temperature. The experimental device has uncontrollable temperature and large experimental error. If the environmental temperature is high or the ultrasonic time is long, the ice blocks can be heated and melted in the ultrasonic process, so that the ultrasonic effect is poor, the liquid level is increased, and the ultrasonic container is unstable. In the experimental process, ice blocks need to be continuously replaced and redundant ice water needs to be removed, so that the steps are complicated, and the experimental efficiency is influenced.
Therefore, it is an urgent technical problem to provide a cryogenic cooling ultrasonic apparatus which is easy to operate.
Disclosure of Invention
An object of the utility model is to provide a cryogenic cooling ultrasonic device. The device can keep low temperature for a long time, and the temperature control is accurate, convenient to use, and the supersound is effectual.
The technical scheme of the utility model: a low-temperature cooling ultrasonic device comprises an insulation box, wherein an ultrasonic probe and a temperature sensor are arranged at the top of the insulation box, the ultrasonic probe and the temperature sensor extend into the insulation box, the ultrasonic probe is connected with an ultrasonic generator, a plurality of semiconductor refrigerators are embedded into the side wall of the insulation box, cold end cooling fins of the semiconductor refrigerators are fixed on the inner wall of the insulation box, hot end fans of the semiconductor refrigerators are arranged outside the insulation box, and the temperature sensor and all the semiconductor refrigerators are connected with a microcomputer digital temperature controller.
In the low-temperature cooling ultrasonic device, a container support is arranged right below the ultrasonic probe in the heat insulation box.
In the ultrasonic device with low temperature cooling, the container support is a lifting support and is made of rubber materials.
In the low-temperature cooling ultrasonic device, the front surface of the heat preservation box is a heat preservation box door, and hollow glass is arranged on the heat preservation box door.
In the ultrasonic device with low temperature cooling, the semiconductor refrigerators are uniformly arranged on the left side wall, the right side wall and the rear side wall of the heat preservation box.
The utility model has the advantages that: compared with the prior art, the utility model has the advantages of following several aspects:
the utility model discloses an ultrasonic generator, ultrasonic probe, insulation can, container support, ultrasonic container, heat preservation chamber door, cavity glass, semiconductor cooler, cold junction fin, hot junction fan, temperature sensor, microcomputer digit thermostat's cooperation is used, has reached the supersound effect of cryogenic cooling. In the whole structure, the temperature in the heat insulation box is monitored in real time through a temperature sensor; refrigerating the heat preservation box in real time through a semiconductor refrigerator; the ultrasonic container is placed in the heat preservation box, so that the temperature can be prevented from being influenced by the external environment, and the internal temperature is easy to control; the purpose of intelligent control can be achieved by arranging a microcomputer digital temperature controller.
The device is convenient to use and accurate in temperature control, and inconvenience caused by using ice blocks or refrigerants is avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic front structure view of the incubator.
Reference numerals: 1-ultrasonic generator, 2-ultrasonic probe, 3-heat preservation box, 4-container bracket, 5-ultrasonic container, 6-heat preservation box door, 7-hollow glass, 8-semiconductor refrigerator, 9-cold end radiating fin, 10-hot end fan, 11-temperature sensor and 12-microcomputer digital temperature controller.
Detailed Description
The following description is made with reference to the accompanying drawings and examples, but not to be construed as limiting the invention.
The embodiment of the utility model provides a: a low-temperature cooling ultrasonic device is shown in the attached figures 1-2 and comprises an insulation box 3, wherein an ultrasonic probe 2 and a temperature sensor 11 are fixedly arranged at the top of the insulation box 3, the ultrasonic probe 2 and the temperature sensor 11 extend into the insulation box 3, the ultrasonic probe 2 is connected with an ultrasonic generator 1, a plurality of semiconductor refrigerators 8 are fixedly embedded in the outer side wall of the insulation box 3, cold-end cooling fins 9 of the semiconductor refrigerators 8 are fixed on the inner wall of the insulation box 3, hot-end fans 10 of the semiconductor refrigerators 8 are arranged outside the insulation box 3, and the temperature sensor 11 and all the semiconductor refrigerators 8 are electrically connected with a microcomputer digital temperature controller 12.
The utility model discloses a theory of operation is: putting a sample solution needing low-temperature ultrasound into an ultrasonic container 5, then putting the sample solution into the heat preservation box 3 under an ultrasonic probe 2, positioning the ultrasonic probe 2 in the middle of the ultrasonic container 5, extending into the liquid level of the liquid sample, and closing a heat preservation box door 6. The microcomputer digital temperature controller 12 is started, and the temperature range (for example, 0 ℃ to 5 ℃) on the microcomputer digital temperature controller 12 is set. At this time, the real-time temperature inside the incubator 3 displayed by the microcomputer digital temperature controller 12 is room temperature (>5 ℃), and the semiconductor refrigerator 8 on the wall of the incubator 3 starts to refrigerate. When the temperature sensor 11 detects that the real-time temperature in the incubator 3 is about 0 ℃, the ultrasonic generator 1 is manually started, and the ultrasonic probe 2 starts to carry out low-temperature cooling ultrasonic on the sample. During the ultrasound process, the ultrasound probe 2 will release heat, causing the real-time temperature in the incubator 3 to rise. When the temperature sensor 11 detects that the real-time temperature in the insulation can 3 is higher than 5 ℃, the microcomputer digital temperature controller 12 controls the semiconductor refrigerator 8 to start refrigerating, and the cold and heat exchange is realized through the cold-end radiating fin 9 and the hot-end fan 10 until the real-time temperature in the insulation can 3 is lower than 0 ℃, and the microcomputer digital temperature controller 12 controls the semiconductor refrigerator 8 to stop refrigerating and to circulate. The low-temperature cooling ultrasonic temperature of the sample is kept within the temperature range (for example, 0 ℃ to 5 ℃) set by the microcomputer digital temperature controller 12 until the ultrasonic process is finished.
The microcomputer digital temperature controller 12 has two functions: firstly, the temperature sensor 11 is connected to display the real-time temperature in the heat insulation box 3; and secondly, all the semiconductor refrigerators 8 are connected, and the start and stop of the semiconductor refrigerators 8 are automatically controlled according to the set temperature range.
A container support 4 is arranged under the ultrasonic probe 2 in the heat preservation box 3, and the container support 4 is used for placing an ultrasonic container 5.
The container support 4 is a lifting support to meet different experimental requirements. The container support 4 is made of rubber materials, and the shock absorption effect can be achieved.
The front surface of the heat preservation box 3 is a heat preservation box door 6, and hollow glass 7 is arranged on the heat preservation box door 6. The internal condition of the incubator 3 can be observed conveniently and frosting can be prevented.
The semiconductor refrigerators 8 are uniformly disposed on the left and right side walls and the rear side wall of the heat insulating case 3. Avoid the inside refrigeration of insulation can 3 each regional great difference in temperature that appears between the initial stage.

Claims (5)

1. A cryogenically-cooled ultrasonic apparatus, comprising: including insulation can (3), the top of insulation can (3) is equipped with ultrasonic probe (2) and temperature sensor (11), ultrasonic probe (2) and temperature sensor (11) stretch into inside insulation can (3), ultrasonic probe (2) are connected with supersonic generator (1), the embedding has a plurality of semiconductor cooler (8) on the lateral wall of insulation can (3), cold junction fin (9) of semiconductor cooler (8) are fixed on the inner wall of insulation can (3), hot junction fan (10) of semiconductor cooler (8) set up in insulation can (3) outside, temperature sensor (11) and all semiconductor cooler (8) all are connected with microcomputer digital temperature controller (12).
2. The cryogenically-cooled ultrasonic apparatus of claim 1 wherein: a container bracket (4) is arranged under the ultrasonic probe (2) in the heat preservation box (3).
3. The cryogenically-cooled ultrasonic apparatus of claim 2 wherein: the container support (4) is a lifting support, and the container support (4) is made of rubber materials.
4. The cryogenically-cooled ultrasonic apparatus of claim 1 wherein: the front surface of the heat preservation box (3) is a heat preservation box door (6), and hollow glass (7) is arranged on the heat preservation box door (6).
5. The cryogenically-cooled ultrasonic apparatus of claim 1 wherein: the semiconductor refrigerators (8) are uniformly arranged on the left side wall, the right side wall and the rear side wall of the heat preservation box (3).
CN202023133527.1U 2020-12-23 2020-12-23 Low-temperature cooling ultrasonic device Active CN214438539U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023133527.1U CN214438539U (en) 2020-12-23 2020-12-23 Low-temperature cooling ultrasonic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023133527.1U CN214438539U (en) 2020-12-23 2020-12-23 Low-temperature cooling ultrasonic device

Publications (1)

Publication Number Publication Date
CN214438539U true CN214438539U (en) 2021-10-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023133527.1U Active CN214438539U (en) 2020-12-23 2020-12-23 Low-temperature cooling ultrasonic device

Country Status (1)

Country Link
CN (1) CN214438539U (en)

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