CN214413158U - High-shielding surface acoustic wave filter - Google Patents
High-shielding surface acoustic wave filter Download PDFInfo
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- CN214413158U CN214413158U CN202120487106.4U CN202120487106U CN214413158U CN 214413158 U CN214413158 U CN 214413158U CN 202120487106 U CN202120487106 U CN 202120487106U CN 214413158 U CN214413158 U CN 214413158U
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Abstract
The utility model relates to a surface acoustic wave filter technical field just discloses a high shielding nature surface acoustic wave filter. A high-shielding surface acoustic wave filter comprises a shell, a base and a substrate assembly, wherein a U-shaped connecting piece is fixedly installed at the bottom of the shell, a third glue injection hole is formed in the middle of the U-shaped connecting piece, a groove is formed in the top of the base, a first glue injection hole is formed in the bottom of the base, and a second glue injection hole is formed in the middle of the base; the utility model discloses a bottom at the casing inner chamber sets up U type connecting piece to set up glue injection hole three in one side that two supports of U type connecting piece are close to each other, glue injection hole one and the injecting glue hole two that the cooperation set up respectively in the left and right sides of base, make the casing be connected more stably with the base, traditional direct bonding compares, can reduce the loss of preparation material, also can avoid glue to flow the inside of casing, thereby can ensure the qualification rate of wave filter product.
Description
Technical Field
The utility model relates to a surface acoustic wave filter technical field specifically is a high shielding nature surface acoustic wave filter.
Background
A Surface Acoustic Wave (SAW) is an elastic wave that propagates along the Surface of an elastic solid or a medium. The surface acoustic wave filter is a frequency selective device made by utilizing piezoelectric effect and surface acoustic wave resonance characteristics, and generally comprises a piezoelectric substrate and an interdigital transducer arranged on the surface of the piezoelectric substrate according to a certain circuit structure, wherein the interdigital transducer comprises an input transducer and an output transducer. The input transducer converts the input electric signal into an acoustic signal through a reverse pressure effect, the acoustic signal propagates along the surface of the substrate to reach the output transducer, and finally the acoustic signal is converted into an electric signal by the output transducer to be output. The SAW filter has the characteristics of flexible design, analog/digital compatibility, reduced in-band attenuation, good anti-electromagnetic interference (EMI) performance, small volume, light weight, high reliability and the like, and the SAW filter is widely applied to a plurality of fields such as base stations, navigation, mobile communication and the like. SAW technology can solve problems more economically in some respects than other available technologies, and can solve difficult problems that are difficult to achieve with other technologies. With the increasing high frequency and miniaturization of military and civil electronic systems, the electronic system is widely applied. However, the existing filter is generally in a closed type arrangement, so that the heat dissipation performance of the existing filter is poor, and the service life of the existing filter is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high shielding nature surface acoustic wave filter reaches the purpose that improves the radiating effect of wave filter.
In order to achieve the above object, the utility model provides a following technical scheme: a high-shielding surface acoustic wave filter comprises a shell, a base and a substrate assembly, wherein a U-shaped connecting piece is fixedly installed at the bottom of the shell, a third glue injection hole is formed in the middle of the U-shaped connecting piece, a groove is formed in the top of the base, a first glue injection hole is formed in the bottom of the base, and a second glue injection hole is formed in the middle of the base;
the casing includes heat dissipation layer and silica gel layer, the inside at the heat dissipation layer is bonded to the silica gel layer.
Preferably, the base plate subassembly includes filter substrate, shielding band, input interdigital transducer, metal protrusion, signal processor, output interdigital transducer, the filter substrate sets up the top at the base, the shielding band sets up the left and right sides at filter substrate top, input interdigital transducer sets up the right side at filter substrate top, the metal protrusion sets up the middle part at filter substrate top, signal processor sets up the middle part at filter substrate top, output interdigital transducer sets up the right side at filter substrate top.
Preferably, the U-shaped connecting piece is arranged in an inverted U shape, and the third glue injection hole is formed in one side, close to each other, of the two supports at the bottom of the U-shaped connecting piece.
Preferably, the size of the groove is matched with the size of a bracket of the U-shaped connecting piece.
Preferably, the first glue injection hole is communicated with the second glue injection hole.
Preferably, the following components: the number of the U-shaped connecting pieces is two, and the two U-shaped connecting pieces are respectively arranged on the left side and the right side of the bottom of the inner cavity of the shell.
The utility model provides a high shielding nature surface acoustic wave filter. The method has the following beneficial effects:
(1) the utility model discloses a set up casing 1 into outside heat dissipation layer 101 and inside silica gel layer 102 to can effectively guarantee the result of use and the life of wave filter, be provided with the silica gel layer in inside, the silica gel layer has better buffering effect, can prevent that the casing from extrudeing internal component in the course of working, avoid the damage of internal component, the silica gel layer has good heat conduction effect simultaneously, cooperate outside heat dissipation layer, can prevent that the inside high temperature of wave filter in the use from influencing its life.
(2) The utility model discloses a set up U type connecting piece in the bottom of casing inner chamber to set up glue injection hole three in one side that two supports of U type connecting piece are close to each other, glue injection hole one and the glue injection hole two that the cooperation set up respectively in the left and right sides of base, make the casing be connected more stably with the base, traditional direct bonding compares, can reduce the loss of preparation material, also can avoid glue to flow the inside of casing, thereby can ensure the qualification rate of wave filter product.
Drawings
Fig. 1 is a schematic top view of the cross-sectional structure of the present invention;
FIG. 2 is a schematic view of the front sectional structure of the connection between the housing and the base of the present invention;
fig. 3 is an enlarged view of a in fig. 2.
In the figure: the package structure comprises a shell 1, a heat dissipation layer 101, a silica gel layer 102, a base 2, a base plate 3, a filter substrate 301, a shielding band 302, an input interdigital transducer 303, a metal protrusion 304, a signal processor 305, an output interdigital transducer 306, a 4U-shaped connecting piece, a groove 5, a first glue injection hole 6, a second glue injection hole 7 and a third glue injection hole 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1-3, the utility model provides a technical solution: a high-shielding surface acoustic wave filter comprises a shell 1, a base 2 and a substrate assembly 3, wherein U-shaped connecting pieces 4 are fixedly installed at the bottom of the shell 1, the number of the U-shaped connecting pieces 4 is two, the two U-shaped connecting pieces 4 are respectively arranged on the left side and the right side of the bottom of an inner cavity of the shell 1, a glue injection hole III 8 is formed in the middle of each U-shaped connecting piece 4, the U-shaped connecting pieces 4 are arranged in an inverted U shape, the glue injection hole III 8 is formed in one side, close to each other, of the two supports at the bottom of each U-shaped connecting piece 4, a groove 5 is formed in the top of the base 2, the size of the groove 5 is matched with the size of the support of each U-shaped connecting piece 4, a glue injection hole I6 is formed in the bottom of the base 2, a glue injection hole II 7 is formed in the middle of the base 2, the glue injection hole I6 is communicated with the glue injection hole II 7, the U-shaped connecting pieces 4 are arranged at the bottom of the inner cavity of the shell 1, and a glue injection hole III 8 is formed in one side, close to each two supports of each U-shaped connecting piece 4, the first glue injection hole 6 and the second glue injection hole 7 are respectively arranged on the left side and the right side of the base 2 in a matched mode, so that the shell 1 and the base 2 are connected more stably, compared with the traditional direct bonding mode, the loss of manufacturing materials can be reduced, glue can be prevented from flowing into the shell 1, and the qualified rate of filter products can be guaranteed;
The base plate component 3 comprises a filter substrate 301, a shielding belt 302, an input interdigital transducer 303, a metal protrusion 304, a signal processor 305 and an output interdigital transducer 306, wherein the filter substrate 301 is arranged at the top of the base 2, the shielding belt 302 is arranged at the left side and the right side of the top of the filter substrate 301, the input interdigital transducer 303 is arranged at the right side of the top of the filter substrate 301, the metal protrusion is arranged at the middle of the top of the filter substrate 301, the signal processor 305 is arranged at the middle of the top of the filter substrate 301, and the output interdigital transducer 306 is arranged at the right side of the top of the filter substrate 301.
The working principle is as follows: through setting up casing 1 to outside heat dissipation layer 101 and inside silica gel layer 102 to can effectively guarantee the result of use and the life of wave filter, be provided with silica gel layer 102 in inside, silica gel layer 102 has better buffering effect, can prevent that casing 1 from extrudeing the internals in the course of working, avoid the damage of internals, silica gel layer 102 has good heat conduction effect simultaneously, cooperate outside heat dissipation layer 101, can prevent that the inside high temperature of wave filter in the use, influence its life.
Set up U type connecting piece 4 through the bottom at the 1 inner chamber of casing, and set up glue injection hole three 8 in one side that two supports of U type connecting piece 4 are close to each other, the cooperation is glue injection hole one 6 and the glue injection hole two 7 that set up respectively in the left and right sides of base 2, it is more stable to make casing 1 be connected with base 2, traditional direct bonding compares, can reduce the loss of preparation material, also can avoid glue to flow the inside of casing 1, thereby can ensure the qualification rate of wave filter product.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A high-shielding surface acoustic wave filter includes a housing (1), a base (2), and a substrate assembly (3), characterized in that: a U-shaped connecting piece (4) is fixedly installed at the bottom of the shell (1), a third glue injection hole (8) is formed in the middle of the U-shaped connecting piece (4), a groove (5) is formed in the top of the base (2), a first glue injection hole (6) is formed in the bottom of the base (2), and a second glue injection hole (7) is formed in the middle of the base (2);
the shell (1) comprises a heat dissipation layer (101) and a silica gel layer (102), and the silica gel layer (102) is bonded inside the heat dissipation layer (101).
2. The highly shielding surface acoustic wave filter as set forth in claim 1, wherein: the base plate subassembly (3) includes filter substrate (301), shielding area (302), input interdigital transducer (303), metal protrusion (304), signal processor (305), output interdigital transducer (306), filter substrate (301) set up the top at base (2), shielding area (302) set up the left and right sides at filter substrate (301) top, input interdigital transducer (303) set up the right side at filter substrate (301) top, the metal protrusion sets up the middle part at filter substrate (301) top, signal processor (305) set up the middle part at filter substrate (301) top, output interdigital transducer (306) set up the right side at filter substrate (301) top.
3. The highly shielding surface acoustic wave filter as set forth in claim 1, wherein: the U-shaped connecting piece (4) is arranged in an inverted U shape, and the three glue injection holes (8) are formed in one side, close to each other, of the two supports at the bottom of the U-shaped connecting piece (4).
4. The highly shielding surface acoustic wave filter as set forth in claim 1, wherein: the size of the groove (5) is matched with the size of the bracket of the U-shaped connecting piece (4).
5. The highly shielding surface acoustic wave filter as set forth in claim 1, wherein: and the first glue injection hole (6) and the second glue injection hole (7) are communicated.
6. The highly shielding surface acoustic wave filter as set forth in claim 1, wherein: the number of the U-shaped connecting pieces (4) is two, and the two U-shaped connecting pieces (4) are respectively arranged on the left side and the right side of the bottom of the inner cavity of the shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120487106.4U CN214413158U (en) | 2021-03-08 | 2021-03-08 | High-shielding surface acoustic wave filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120487106.4U CN214413158U (en) | 2021-03-08 | 2021-03-08 | High-shielding surface acoustic wave filter |
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| Publication Number | Publication Date |
|---|---|
| CN214413158U true CN214413158U (en) | 2021-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120487106.4U Active CN214413158U (en) | 2021-03-08 | 2021-03-08 | High-shielding surface acoustic wave filter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115119448A (en) * | 2022-08-26 | 2022-09-27 | 中微龙图电子科技无锡有限责任公司 | Acoustic surface filter positioning base convenient to install and use |
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2021
- 2021-03-08 CN CN202120487106.4U patent/CN214413158U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115119448A (en) * | 2022-08-26 | 2022-09-27 | 中微龙图电子科技无锡有限责任公司 | Acoustic surface filter positioning base convenient to install and use |
| CN115119448B (en) * | 2022-08-26 | 2022-11-15 | 中微龙图电子科技无锡有限责任公司 | Acoustic surface filter positioning base convenient to install and use |
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