CN214412727U - Composite multi-channel demodulation circuit - Google Patents
Composite multi-channel demodulation circuit Download PDFInfo
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- CN214412727U CN214412727U CN202120568535.4U CN202120568535U CN214412727U CN 214412727 U CN214412727 U CN 214412727U CN 202120568535 U CN202120568535 U CN 202120568535U CN 214412727 U CN214412727 U CN 214412727U
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Abstract
The utility model belongs to the technical field of wireless charging, concretely relates to compound multichannel demodulation circuit. The composite multi-path demodulation circuit comprises a processing chip, wherein the processing chip is electrically connected with a power supply and a first ground wire, an input port of the processing chip is respectively electrically connected with a first capacitor and a second capacitor, the first capacitor is electrically connected with a first signal source connecting terminal, the second capacitor is electrically connected with a second signal source connecting terminal, a resistor is connected between the first capacitor and the second capacitor, the first capacitor is electrically connected with a first switch, the second capacitor is electrically connected with a second switch, and the first switch and the second switch are electrically connected with a second ground wire. The utility model discloses can accomplish the signal to two way signal sources with a processing chip and select and handle, be particularly suitable for the demodulation like the modulation signal of wireless charger, it is simple to have a circuit, and former device is few, and is with low costs, and convenient overall arrangement can reduce and put space etc..
Description
Technical Field
The utility model belongs to the technical field of wireless charging, concretely relates to compound multichannel demodulation circuit.
Background
With the continuous improvement of the requirements of the electric equipment on power supply quality, safety, reliability, convenience, instantaneity, special occasions, special geographic environments and the like, a contact type electric energy transmission mode can not meet the actual requirements more and more; the wireless charger is a device which utilizes the principle of electromagnetic induction to charge, the principle is similar to that of a transformer, a coil is respectively arranged at a transmitting end and a receiving end, the coil at the transmitting end sends out an electromagnetic signal to the outside under the action of electric power, and the coil at the receiving end receives the electromagnetic signal and converts the electromagnetic signal into current, so that the purpose of wireless charging is achieved. The wireless charging technology is a special power supply mode, energy is transmitted between the wireless charging technology and a load without a power line, the energy is transmitted by means of electromagnetic waves, then the energy of the electromagnetic waves is converted into electric energy, and finally wireless charging is achieved.
However, in the existing wireless charger, two paths of communication modulation signals exist, as shown in fig. 1, in the general technology, each operational amplifier or comparator only processes one path of signal, and two paths of signals need to be processed by two independent operational amplifiers or comparators; therefore, the problems of more original components, large occupied space, high cost and the like are caused; therefore, it is desirable to design a complex multi-path demodulation circuit which can reduce the number of electronic devices, simplify the circuit layout, reduce the cost, and the like.
SUMMERY OF THE UTILITY MODEL
To the problem that the above-mentioned background art provided, the utility model aims at: the composite multi-channel demodulation circuit is provided.
In order to realize the technical purpose, the utility model discloses a technical scheme as follows:
the utility model provides a compound multichannel demodulation circuit, is including handling the chip, handle chip electric connection have power supply and first ground wire, the input port of handling the chip electric connection respectively have first electric capacity and second electric capacity, first electric capacity electric connection have first signal source connecting terminal, second electric capacity electric connection have second signal source connecting terminal, first electric capacity with the second electric capacity between be connected with resistance, first electric capacity electric connection have first switch, second electric capacity electric connection have the second switch, first switch with the equal electric connection of second switch have the second ground wire.
Further, the processing chip is a comparator or an operational amplifier.
Further, the resistor is connected in parallel with a third capacitor.
Further defined, the first ground line and the second ground line are connected together.
Further, the first switch and the second switch are of the same type.
Further, the first switch is one of a MOS switch, a BJT switch, or an MCU switch.
A demodulation method of a composite multi-path demodulation circuit comprises the following steps:
s1: the first signal source is accessed through the first signal source connecting terminal, and the second signal source is accessed through the second signal source connecting terminal;
s2: the first switch is switched on, the second switch is switched off, the pin 3 of the processing chip is grounded at the moment, the first signal source is short-circuited to the ground, the second signal source is isolated by the second capacitor and then is sent to the pin 2 input end of the input port of the processing chip, the processed signal is obtained at the pin 1 of the output end of the processing chip after comparison by the processing chip, and the signal is sent to the inside of the microprocessor to be identified and then corresponding operation is executed;
s3: switching on the second switch, switching off the first switch, wherein the pin 2 of the processing chip is grounded, the second signal source is short-circuited to the ground, the first signal source is isolated by the first capacitor and then is sent to the pin 3 input end of the input port of the processing chip, and the processed signal is obtained at the pin 1 of the output end of the processing chip after comparison by the processing chip; and the signal is sent to the inside of the microprocessor for identification and then corresponding operation is executed.
The utility model has the advantages that:
the utility model discloses can accomplish the selection and the processing of two way signals with a processing chip, be particularly suitable for like the demodulation of the modulation signal of wireless charger, it is simple to have a circuit, and former device is few, and is with low costs, and convenient overall arrangement can reduce and put space etc..
Drawings
The present invention can be further illustrated by the non-limiting examples given in the accompanying drawings;
FIG. 1 is a prior art circuit schematic;
fig. 2 is a circuit schematic diagram of embodiment 1 of a composite multi-channel demodulation circuit of the present invention;
fig. 3 is a circuit schematic diagram of embodiment 2 of a composite multi-channel demodulation circuit of the present invention;
fig. 4 is a circuit schematic diagram of embodiment 3 of a composite multi-channel demodulation circuit of the present invention;
fig. 5 is a circuit schematic diagram of embodiment 3 of a composite multi-channel demodulation circuit according to the present invention;
Detailed Description
In the description of the present invention, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The terms "mounted," "connected," and "coupled" are to be construed broadly and may, for example, be fixedly coupled, detachably coupled, or integrally coupled; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The terms "ground" and "ground" are used broadly herein and may be one or more reference points in an electronic circuit, a power source, two or more connection points of elements, or a common point of a local circuit, and those skilled in the art will understand that the terms are specifically intended in the present invention.
In order to make the present invention better understood by those skilled in the art, the technical solutions of the present invention are further described below with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 2, a composite multi-channel demodulation circuit includes a processing chip IC1A, the processing chip IC1A is electrically connected to a power supply VCC and a first ground GND1, an input port of the processing chip IC1A is electrically connected to a first capacitor C1 and a second capacitor C2 respectively, a first capacitor C1 is electrically connected to a first signal source connection terminal S1, a second capacitor C2 is electrically connected to a second signal source connection terminal S2, a resistor R1 is connected between the first capacitor C1 and the second capacitor C2, the first capacitor C1 is electrically connected to a first switch K1, the second capacitor C2 is electrically connected to a second switch K2, and the first switch K1 and the second switch K2 are both electrically connected to a second ground GND 2;
the demodulation method of the embodiment comprises the following steps:
s1: a first signal source is accessed through the first signal source connecting terminal S1, and a second signal source is accessed through the second signal source connecting terminal S2;
s2: the first switch K1 is switched on, the second switch K2 is switched off, at the moment, the pin 3 of the processing chip IC1A is grounded, the first signal source is short-circuited to the ground, the second signal source is isolated by the second capacitor C2 and then sent to the pin 2 input end of the input port of the processing chip IC1A, the processed signal is obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC1A, and the processed signal is sent to the inside of the microprocessor to be identified and then corresponding operation is executed;
s3: the second switch K2 is switched on, the first switch K1 is switched off, at this time, the pin 2 of the processing chip IC1A is grounded, the second signal source is short-circuited to the ground, the first signal source is isolated by the first capacitor C1 and then sent to the pin 3 input end of the input port of the processing chip IC1A, and the processed signals are obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC 1A; and the signal is sent to the inside of the microprocessor for identification and then corresponding operation is executed.
In this embodiment, the resistor R1 provides a dc path, and since the internal resistance of the two input ends of the processing chip IC1A is large, the input current is small, and the dc voltage drop at the two ends of the resistor R1 is small, for the signal source, the resistor R1 is much larger than the internal resistance of the signal source, the signal source generates a large signal voltage on the resistor R1, and the voltage can output a required signal after being compared by the processing chip IC 1A;
the implementation has the advantages that the selection and the processing of two paths of signals can be completed by using one processing chip IC1A, the demodulation circuit is particularly suitable for the demodulation of modulation signals of a wireless charger, and the demodulation circuit has the advantages of simple circuit, few original devices, low cost, convenient layout, capability of reducing the placing space and the like.
Example 2:
as shown in fig. 3, a composite multi-path demodulation circuit includes a processing chip IC1A, a power supply VCC and a first ground GND1 are electrically connected to the processing chip IC1A, a first capacitor C1 and a second capacitor C2 are electrically connected to an input port of the processing chip IC1A, the first capacitor C1 is electrically connected to a first signal source connection terminal S1, the second capacitor C2 is electrically connected to a second signal source connection terminal S2, the first capacitor C1 is electrically connected to a first switch K1, the second capacitor C2 is electrically connected to a second switch K2, both the first switch K1 and the second switch K2 are electrically connected to a second ground GND2, the first switch K1 is connected to a first resistor RA in parallel, and the second switch K2 is connected to a second resistor RB in parallel;
the demodulation method of the embodiment comprises the following steps:
s1: a first signal source is accessed through the first signal source connecting terminal S1, and a second signal source is accessed through the second signal source connecting terminal S2;
s2: the first switch K1 is switched on, the second switch K2 is switched off, at the moment, the pin 3 of the processing chip IC1A is grounded, the first signal source is short-circuited to the ground, the second signal source is isolated by the second capacitor C2 and then sent to the pin 2 input end of the input port of the processing chip IC1A, the processed signal is obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC1A, and the processed signal is sent to the inside of the microprocessor to be identified and then corresponding operation is executed;
s3: the second switch K2 is switched on, the first switch K1 is switched off, at this time, the pin 2 of the processing chip IC1A is grounded, the second signal source is short-circuited to the ground, the first signal source is isolated by the first capacitor C1 and then sent to the pin 3 input end of the input port of the processing chip IC1A, and the processed signals are obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC 1A; and the signal is sent to the inside of the microprocessor for identification and then corresponding operation is executed.
Compared with embodiment 1, in this embodiment, the resistor R1 is replaced by the first resistor RA connected in parallel with the first switch K1 and the second resistor RB connected in parallel with the second switch K2, and in a circuit, two resistors can also perform the same function as one resistor, but one resistor circuit is simpler, and one resistor is the simplest and most optimal circuit; it is therefore not recommended to choose such a scheme.
Example 3:
as shown in fig. 4, a composite multi-channel demodulation circuit includes a processing chip IC1A, a processing chip IC1A is electrically connected to a power supply VCC and a ground GND, an input port of the processing chip IC1A is electrically connected to a first capacitor C1 and a second capacitor C2, a first capacitor C1 is electrically connected to a first signal source connection terminal S1, a second capacitor C2 is electrically connected to a second signal source connection terminal S2, a resistor R1 is connected between the first capacitor C1 and the second capacitor C2, the first capacitor C1 is electrically connected to a first switch K1, the second capacitor C2 is electrically connected to a second switch K2, and the first switch K1 and the second switch K2 are both electrically connected to the ground GND;
the demodulation method of the embodiment comprises the following steps:
s1: a first signal source is accessed through the first signal source connecting terminal S1, and a second signal source is accessed through the second signal source connecting terminal S2;
s2: the first switch K1 is switched on, the second switch K2 is switched off, at the moment, the pin 3 of the processing chip IC1A is grounded, the first signal source is short-circuited to the ground, the second signal source is isolated by the second capacitor C2 and then sent to the pin 2 input end of the input port of the processing chip IC1A, the processed signal is obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC1A, and the processed signal is sent to the inside of the microprocessor to be identified and then corresponding operation is executed;
s3: the second switch K2 is switched on, the first switch K1 is switched off, at this time, the pin 2 of the processing chip IC1A is grounded, the second signal source is short-circuited to the ground, the first signal source is isolated by the first capacitor C1 and then sent to the pin 3 input end of the input port of the processing chip IC1A, and the processed signals are obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC 1A; and the signal is sent to the inside of the microprocessor for identification and then corresponding operation is executed.
Compared with embodiment 1, the present embodiment connects the ground wire connected to the processing chip IC1A with the ground wire connected to the first switch K1 and the second switch K2, so that only one ground wire is connected out of the whole circuit, and the use is more convenient.
Example 4:
as shown in fig. 5, a composite multi-channel demodulation circuit includes a processing chip IC1A, the processing chip IC1A is electrically connected to a power supply VCC and a first ground GND1, an input port of the processing chip IC1A is electrically connected to a first capacitor C1 and a second capacitor C2 respectively, a first capacitor C1 is electrically connected to a first signal source connection terminal S1, a second capacitor C2 is electrically connected to a second signal source connection terminal S2, a resistor R1 is connected between the first capacitor C1 and the second capacitor C2, a third capacitor C3 is connected in parallel to the resistor R1, a first switch K1 is electrically connected to the first capacitor C1, a second switch K2 is electrically connected to the second capacitor C2, and a second ground GND2 is electrically connected to both the first switch K1 and the second switch K2;
the demodulation method of the embodiment comprises the following steps:
s1: a first signal source is accessed through the first signal source connecting terminal S1, and a second signal source is accessed through the second signal source connecting terminal S2;
s2: the first switch K1 is switched on, the second switch K2 is switched off, at the moment, the pin 3 of the processing chip IC1A is grounded, the first signal source is short-circuited to the ground, the second signal source is isolated by the second capacitor C2 and then sent to the pin 2 input end of the input port of the processing chip IC1A, the processed signal is obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC1A, and the processed signal is sent to the inside of the microprocessor to be identified and then corresponding operation is executed;
s3: the second switch K2 is switched on, the first switch K1 is switched off, at this time, the pin 2 of the processing chip IC1A is grounded, the second signal source is short-circuited to the ground, the first signal source is isolated by the first capacitor C1 and then sent to the pin 3 input end of the input port of the processing chip IC1A, and the processed signals are obtained at the pin 1 of the output end of the processing chip IC1A after being compared by the processing chip IC 1A; and the signal is sent to the inside of the microprocessor for identification and then corresponding operation is executed.
Compared with embodiment 1, when the noise of the first signal source and the second signal source is large, the third capacitor C3 connected in parallel to the resistor R1 can filter the noise in the circuit, so that the anti-interference capability of the demodulation circuit is improved.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. A composite multi-path demodulation circuit, characterized in that: a composite multi-channel demodulation circuit comprises a processing chip (IC1A), wherein the processing chip (IC1A) is electrically connected with a power supply (VCC) and a first ground wire (GND1), the input ports of the processing chip (IC1A) are respectively and electrically connected with a first capacitor (C1) and a second capacitor (C2), the first capacitor (C1) is electrically connected with a first signal source connecting terminal (S1), the second capacitor (C2) is electrically connected with a second signal source connecting terminal (S2), a resistor (R1) is connected between the first capacitor (C1) and the second capacitor (C2), the first capacitor (C1) is electrically connected with a first switch (K1), the second capacitor (C2) is electrically connected with a second switch (K2), the first switch (K1) and the second switch (K2) are both electrically connected with a second ground wire (GND 2).
2. The composite multi-path demodulation circuit of claim 1, wherein: the processing chip (IC1A) is a comparator or an operational amplifier.
3. The composite multi-path demodulation circuit of claim 1, wherein: the resistor (R1) is connected with a third capacitor (C3) in parallel.
4. The composite multi-path demodulation circuit of claim 1, wherein: the first ground line (GND1) and the second ground line (GND2) are connected together.
5. The composite multi-path demodulation circuit of claim 1, wherein: the first switch (K1) and the second switch (K2) are of the same type.
6. The composite multi-path demodulation circuit of claim 5, wherein: the first switch (K1) is one of MOS switch, BJT switch or MCU switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120568535.4U CN214412727U (en) | 2021-03-19 | 2021-03-19 | Composite multi-channel demodulation circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120568535.4U CN214412727U (en) | 2021-03-19 | 2021-03-19 | Composite multi-channel demodulation circuit |
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| Publication Number | Publication Date |
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| CN214412727U true CN214412727U (en) | 2021-10-15 |
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| CN202120568535.4U Active CN214412727U (en) | 2021-03-19 | 2021-03-19 | Composite multi-channel demodulation circuit |
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