CN214412683U

CN214412683U - SMT filter

Info

Publication number: CN214412683U
Application number: CN202120542741.8U
Authority: CN
Inventors: 王波; 李锦琦; 万佳美; 孔晓
Original assignee: Dongguan Leader Precision Industry Co Ltd
Current assignee: Dongguan Leader Precision Industry Co Ltd
Priority date: 2021-03-16
Filing date: 2021-03-16
Publication date: 2021-10-15
Anticipated expiration: 2031-03-16
Also published as: TWM617360U

Abstract

The utility model belongs to the technical field of electronic components, a SMT filter is disclosed, it includes the magnetic substrate, the winding wire, a plurality of soldering lug and a plurality of lead wire, the magnetic substrate is U style of calligraphy structure, U style of calligraphy structure includes magnetic bottom plate and two magnetic side plates, two magnetic side plates are connected respectively in the both ends of magnetic bottom plate, the winding wire coiling is on the magnetic bottom plate, the soldering lug pastes on the terminal surface that the magnetic side plate deviates from the magnetic bottom plate, be provided with at least one soldering lug on every magnetic side plate, the one end of lead wire is connected in the winding wire, the other end is connected in the side that the soldering lug deviates from the magnetic side plate, a plurality of lead wires and a plurality of soldering lug one-to-ones set up. In the processing procedure of the magnetic substrate, the U-shaped structure is easier to form than the I-shaped structure, so that the production cycle of the SMT filter is shortened; in the winding process, the yield of the winding on the U-shaped structure is higher than that of the winding on the I-shaped structure, the production period of the SMT filter can be shortened, and the winding yield is improved.

Description

SMT filter

Technical Field

The utility model belongs to the technical field of electronic components, especially, relate to a SMT wave filter.

Background

The filter is used for effectively filtering a frequency point of a specific frequency in the power line or frequencies except the frequency point to obtain a power signal of the specific frequency or eliminate the power signal of the specific frequency.

At present, an SMT filter with an I-shaped structure exists in the market, the I-shaped structure is complex in appearance structure and difficult to form, so that the production cycle of the filter is long, and the winding yield is low.

Therefore, an SMT filter is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a SMT wave filter, its structure is easy shaping more, shortens production cycle, improves wire-wound yield.

To achieve the purpose, the utility model adopts the following technical proposal:

an SMT filter comprising:

the magnetic substrate is of a U-shaped structure, the U-shaped structure comprises a magnetic bottom plate and two magnetic side plates, and the two magnetic side plates are respectively connected to two ends of the magnetic bottom plate;

the winding wire is wound on the magnetic bottom plate;

the soldering lugs are attached to the end faces, away from the magnetic bottom plate, of the magnetic side plates, and at least one soldering lug is arranged on each magnetic side plate;

and one end of the lead wire is connected to the winding wire, the other end of the lead wire is connected to the side face, deviating from the magnetic side plate, of the soldering lug, and the lead wires and the soldering lugs are arranged in a one-to-one correspondence mode.

Preferably, the magnetic bottom plate is provided with a magnetic side plate, the magnetic side plate is provided with a magnetic bottom plate, and the magnetic bottom plate is provided with a magnetic bottom plate.

Preferably, the mutually facing sides of the two magnetic side plates are inner sides, and two ends of the magnetic connecting piece are respectively attached to the two inner sides.

Preferably, the side face of the magnetic connecting piece, which faces away from the magnetic bottom plate, is flush with the end faces of the two magnetic side plates, which face away from the magnetic bottom plate.

Preferably, the lead is wound from the inner side surface of the magnetic side plate to the pad.

Preferably, the magnetic connecting piece is adhered to the magnetic side plate.

Preferably, the same number of leads are wound on the two magnetic side plates.

Preferably, the lead is soldered to the pad.

Preferably, the magnetic bottom plate and the two magnetic side plates are integrally formed.

Preferably, the winding wire is an enameled wire.

The utility model has the advantages that:

the utility model provides a SMT filter, the magnetic base body of which is in a U-shaped structure, the U-shaped structure is easier to form than an I-shaped structure in the processing procedure of the magnetic base body, and the forming yield is higher, thereby shortening the production cycle of the SMT filter; simultaneously, in wire-wound processing procedure, wire-wound yield ratio is high at the structural wire-wound yield ratio of I shape of U style of calligraphy, consequently, the utility model provides an SMT wave filter can shorten production cycle, improves the wire winding yield.

Drawings

Fig. 1 is a schematic structural diagram of a view angle of an SMT filter according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another view angle of an SMT filter according to an embodiment of the present invention;

fig. 3 is an exploded schematic diagram of an SMT filter according to an embodiment of the present invention.

In the figure:

1. a magnetic matrix; 2. a winding wire; 3. soldering lugs; 4. a lead wire; 5. a magnetic connector;

11. magnetic side plates.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts throughout, or parts having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "mounted" are to be construed broadly and can include, for example, a mounted connection, a removable connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediary, a connection between two elements, or an interaction between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may include both the first and second features being in direct contact, and may also include the first and second features being in contact, not in direct contact, but with another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

As shown in fig. 1 to 3, the present embodiment provides an SMT filter, which includes a magnetic substrate 1, a winding wire 2, a plurality of bonding pads 3, and a plurality of leads 4, wherein the magnetic substrate 1 is in a U-shaped structure, the U-shaped structure includes a magnetic bottom plate and two magnetic side plates 11, and the two magnetic side plates 11 are respectively connected to two ends of the magnetic bottom plate; the winding wire 2 is wound on the magnetic bottom plate; the soldering lugs 3 are attached to the end faces, away from the magnetic bottom plate, of the magnetic side plates 11, and at least one soldering lug 3 is arranged on each magnetic side plate 11; one end of the lead wire 4 is connected to the winding wire 2, the other end is connected to the side face of the soldering lug 3 departing from the magnetic side plate 11, and the plurality of lead wires 4 and the plurality of soldering lugs 3 are arranged in a one-to-one correspondence manner. In the present embodiment, the winding wire 2 is an enameled wire.

In the SMT filter provided by the present embodiment, the magnetic substrate 1 is in a U-shaped structure, and in the processing process of the magnetic substrate 1, the U-shaped structure is easier to form than the i-shaped structure, and the forming yield is higher, so that the production cycle of the SMT filter is shortened; meanwhile, in the winding process, the yield of the winding on the U-shaped structure is higher than that of the winding on the I-shaped structure, so that the SMT filter provided by the embodiment can shorten the production period and improve the winding yield.

The SMT filter that this embodiment provided still includes magnetic connector 5, and magnetic connector 5 connects in two magnetism curb plates 11 simultaneously, and magnetic connector 5 and magnetism bottom plate are spaced each other. The magnetic connecting piece 5 is connected with the magnetic substrate 1 to form a magnetic conductive loop, so that the filtering function is realized.

Specifically, the side of two magnetism curb plates 11 that face each other is the medial surface, and two tip of magnetism connecting piece 5 laminate respectively in two medial surfaces for magnetism connecting piece 5 presss from both sides between two magnetism curb plates 11, can reduce the magnetic leakage effect, reduces the magnetism and decreases the magnetic loss volume, increases the magnetic conduction circulation.

More specifically, the side of the magnetic connecting piece 5 facing away from the magnetic bottom plate is flush with the end faces of the two magnetic side plates 11 facing away from the magnetic bottom plate. In this embodiment, magnetism connecting piece 5 is the cube structure, and the structural two relative sides of cube laminate respectively in the medial surface of two magnetism curb plates 11, and the side that just deviates from the magnetism bottom plate and the terminal surface parallel and level of two magnetism curb plates 11, has further increased the magnetic conduction flux, makes holistic structure neat moreover, is favorable to improving the stability that this wave filter and PCB board are connected.

In the present embodiment, the magnetic connector 5 is bonded to the magnetic side plate 11.

Specifically, the lead 4 is wound onto the soldering lug 3 from the inner side surface of the magnetic side plate 11, so that the connection stability of the lead 4 is improved, and the occupied space is saved.

In the present embodiment, the lead 4 is soldered to the pad 3, which ensures the connection between the two.

Specifically, the same number of leads 4 are wound on the two magnetic side plates 11. In the present embodiment, as shown in fig. 2, six leads 4 and six bonding pads 3 are provided, and three bonding pads 3 are provided on each magnetic side plate 11, two of the bonding pads 3 are located on one side of the magnetic connector 5, and the other bonding pad 3 is located on the other side of the magnetic connector 5.

Specifically, the magnetic bottom plate and the two magnetic side plates 11 are integrally formed, which is beneficial to improving the production efficiency of the magnetic substrate 1.

In the present embodiment, the magnetic substrate 1 and the magnetic connecting member 5 are made of a magnetic material, which may be a manganese-zinc material, a nickel-zinc material, or a magnesium-zinc material, and the like, and are not limited herein.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An SMT filter, comprising:

the magnetic substrate (1) is of a U-shaped structure, the U-shaped structure comprises a magnetic bottom plate and two magnetic side plates (11), and the two magnetic side plates (11) are respectively connected to two ends of the magnetic bottom plate;

the winding wire (2) is wound on the magnetic bottom plate;

the soldering lugs (3) are attached to the end faces, away from the magnetic bottom plate, of the magnetic side plates (11), and at least one soldering lug (3) is arranged on each magnetic side plate (11);

a plurality of lead wires (4), the one end of lead wire (4) connect in winding wire (2), the other end connect in soldering lug (3) deviate from the side of magnetism curb plate (11), it is a plurality of lead wire (4) and a plurality of soldering lug (3) one-to-one sets up.

2. An SMT filter according to claim 1, further comprising a magnetic connector (5), wherein the magnetic connector (5) is coupled to both of the magnetic side plates (11), the magnetic connector (5) being spaced apart from the magnetic base plate.

3. An SMT filter according to claim 2, wherein the facing sides of the two magnetic side plates (11) are inner sides, and wherein the two ends of the magnetic connector (5) are respectively engaged with the two inner sides.

4. An SMT filter according to claim 3, wherein a side of the magnetic connector (5) facing away from the magnetic base plate is flush with an end surface of the two magnetic side plates (11) facing away from the magnetic base plate.

5. An SMT filter according to claim 3, wherein the leads (4) wrap from the inner side of the magnetic side plate (11) onto the bonding pads (3).

6. An SMT filter according to claim 2, wherein the magnetic connector (5) is bonded to the magnetic side plate (11).

7. An SMT filter according to any of claims 1-6, wherein the same number of leads (4) are wound on both magnetic side plates (11).

8. An SMT filter according to any of claims 1-6, wherein the leads (4) are soldered to the pads (3).

9. An SMT filter according to any of claims 1-6, wherein the magnetic bottom plate and the two magnetic side plates (11) are integrally formed.

10. An SMT filter according to any of claims 1-6, wherein the winding wire (2) is an enameled wire.