CN218334384U

CN218334384U - Pin assembly

Info

Publication number: CN218334384U
Application number: CN202221905565.0U
Authority: CN
Inventors: 谭友元; 刘伟; 黄烈钰
Original assignee: Mornsun Guangzhou Science and Technology Ltd
Current assignee: Mornsun Guangzhou Science and Technology Ltd
Priority date: 2022-07-22
Filing date: 2022-07-22
Publication date: 2023-01-17
Anticipated expiration: 2032-07-22

Abstract

The utility model relates to a power field provides a pin sub-assembly, and it includes: the rubber body and the metal pins are mutually locked and fixed; at least one surface of the metal pin is exposed on the surface of the colloid and is used for an application bonding pad of the pin and electrically connected with the mainboard. The utility model discloses an at least one side of metal pin exposes in the colloid surface, as the welding pad, has made things convenient for the equipment welding of pin and mainboard, and the pad area that exposes is great, has increased the welding reliability of pin and mainboard.

Description

Pin assembly

Technical Field

The utility model relates to a pin structure especially relates to a pin sub-assembly for power.

Background

The pins of the existing power supply products are generally divided into 2 types, one type is to directly adopt metal with larger size as the pins, such as copper columns, copper blocks and the like, and the other type is to adopt colloid to fix different numbers of metal pins together to form an integral pin, such as a pin header and the like. In the second structure, the part electrically connected with the power supply product is generally made into a plug pin. If the pin of the part manufactured into the patch is needed, 2 schemes are generally provided, the first scheme is to arrange the pin outside the colloid and then bend the pin, however, the scheme can increase the volume of the pin, thereby affecting the volume of the power supply product.

Another solution is to embed the soldering portion of the leads 2 in the molding compound 1 (as shown in fig. 1), and then to form grooves 11 in the molding compound 1 to expose the soldering portion of the metal leads 2 embedded in the molding compound 1, however, the size of the grooves 11 manufactured according to the second solution is limited, if the grooves 11 are made in a circular shape, the minimum value of the diameter is generally > 0.50mm, and the maximum value of the diameter is limited by the width of the molding compound 1, so the leads manufactured according to the second solution have the following disadvantages: (1) Because the pin 2 electrically connected with the power supply product is embedded in the colloid 1, the welding is needed to be carried out through the groove 11, and the welding scheme through the groove 11 generally adopts the mode of planting a solder ball in the groove 11 to realize the welding, so the welding difficulty is increased; (2) Since the area of the groove 11 is generally smaller, the area of the portion of the pin electrically and mechanically connected to the power supply product is smaller, the current capacity of the portion of the pin connected to the power supply product is weak, and the mechanical connection strength is not high.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a pin sub-assembly, it can satisfy the interlocking of metal pin and colloid fixed, can increase again and be connected with the product electricity and mechanical connection part's area.

In order to solve the technical problem, the utility model provides a following technical scheme:

a pin assembly, comprising:

colloid;

the metal pin is provided with a pin part for welding, a welding part and a fixing part; the welding part is provided with a welding surface, and the welding surface is exposed on the surface of the colloid; the fixing part is wrapped in the colloid, and an interlocking structure is formed between the fixing part and the colloid so as to lock the metal pins in the colloid.

Preferably, the thickness of the metal pin is 0.20mm to 1.0mm.

Preferably, the fixing portion includes a first bending section formed by bending and extending downward from the welding portion and a second bending section formed by bending and extending from the first bending section.

Preferably, the number of the fixing portions is two, and the two fixing portions are respectively disposed at the left and right sides of the welding portion.

Preferably, the fixing portion is connected between the lead portion and the soldering portion.

Preferably, the metal pins are provided with 2 rows of symmetrical or asymmetrical pin portions as a part to be soldered to the main board.

Preferably, the area of the welding surface of the surface exposed out of the colloid is more than 0.12mm ² 。

Preferably, the width of the welding surface exposed out of the surface of the colloid is greater than or equal to the width of the colloid.

The utility model also provides a pin sub-assembly, it includes:

a colloid;

the metal pin is provided with a pin part for welding, a welding part and a fixing part; the welding part is arranged on the upper surface of the colloid; the fixing part is embedded in the colloid to fix the metal pins in the colloid.

Preferably, the upper surface of the colloid is provided with an accommodating groove in a downward concave manner, the welding part is accommodated in the accommodating groove, and the welding surface of the welding part is exposed on the upper surface of the colloid.

The utility model has the advantages as follows:

(1) The utility model provides a pin sub-assembly, the face of weld exposes in the surface of colloid to pad welded area has been increased, and then is favorable to increasing electric current through-flow capacity and mechanical connection intensity between metal pin and the power product.

(2) The fixed part wraps up in the colloid, and forms interlocking structure between fixed part and the colloid to guarantee that metal pin fixes in the colloid steadily.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a conventional pin assembly for a power supply product;

fig. 2 is a cross-sectional view of a first embodiment of the pin assembly of the present invention;

fig. 3 is a perspective view of a pin assembly according to a first embodiment of the present invention;

fig. 4 is a perspective view of a first metal pin of a pin assembly according to a first embodiment of the present invention;

fig. 5 is a perspective view of a second metal pin of the pin assembly of the first embodiment of the present invention;

fig. 6 is a cross-sectional view of a pin assembly according to a second embodiment of the present invention.

Detailed Description

First embodiment

Referring to fig. 2 to 5, for the present invention provides a pin assembly for a power supply, which includes: colloid 1 and a plurality of metal pins 2.

The gel body 1 has an upper surface 101 and a lower surface 102, and the upper surface 101 of the gel body 1 is recessed downward to form a receiving groove (not numbered).

The thickness of the metal lead 2 is 0.20mm to 1.0mm, and the metal lead 2 has a lead part 201 for soldering, a soldering part 202, and a fixing part 203.

The lead part 201 can be welded with an external circuit board, and the lead part 201 can be manufactured into a plug-in pin form or a pin form bent into a patch.

The welding part 202 is arranged on the upper surface 101 of the colloid 1 and is accommodated in the accommodating groove, the welding surface 2021 of the welding part 202 is exposed on the upper surface 101 of the colloid 1, the welding surface 2021 is a part where the metal pin 2 is welded with a welding point of a power supply, and the area of the welding surface 2021 is more than 0.12mm ² And the width of the welding surface 2021 is greater than or equal to the width of the colloid 1.

The fixing portion 203 is wrapped in the molding compound 1 (i.e. embedded in the molding compound 1), and the fixing portion 203 and the molding compound 1 form an interlocking structure, so as to stably fix the metal pins 2 in the molding compound 1, in this embodiment, each metal pin 2 is provided with two fixing portions 203, and the two fixing portions 203 are respectively disposed at the left and right sides of the soldering portion 202.

In this embodiment, the metal pins 2 include a first metal pin 204 (as shown in fig. 4) and a second metal pin 205 (as shown in fig. 5) with different structures, the first metal pin 204 and the second metal pin 205 are fixed by the colloid 1, respectively, so as to form a complete power pin, and the first metal pin 204 and the second metal pin 205 can be used as different functional pins in a power supply, such as input, power ground, output, and control functional pins. In this embodiment, the first metal lead 204 includes two rows of symmetrical lead portions 201, each row of the lead portions 201 is four, and the fixing portion 203 of the first metal lead 204 includes a first bending section 2031 formed by bending and extending downward from the welding portion 202 and a second bending section 2032 formed by bending and extending from the first bending section 2031; the second metal lead 205 has two lead portions 201, and the fixing portion 203 of the second metal lead 205 is formed by bending and extending downward from the soldering portion 202.

Compared with the prior art, the utility model discloses the pin sub-assembly has following beneficial effect:

(1) The welding surface 2021 of the welding part 202 of the metal pin 2 is completely exposed on the upper surface 101 of the colloid 1 in the width direction of the colloid 1, the exposed area is very large, and the electric connection part of the pin and a power supply can be greatly increased, so that the current flow capacity and the mechanical connection strength of the metal pin 2 are increased.

(2) The fixing portion 203 is wrapped in the gel 1, and an interlocking structure is formed between the fixing portion 203 and the gel 1, so that the metal pins 2 are stably fixed in the gel 1.

Second embodiment

Referring to fig. 6, the present embodiment provides a pin assembly for a power supply, which includes: the colloid 1 and the metal lead 2 are different from the first embodiment in that the structure of the metal lead 2 in this embodiment is different from that of the metal lead 2 in the first embodiment, in this embodiment, the fixing portion 203 of the metal lead 2 is connected between the lead portion 201 and the soldering portion 202, and the fixing portion 203 is also embedded in the colloid 1, so that the metal lead 2 is stably fixed to the colloid 1. The pin assembly of this embodiment can achieve the same effects as the first embodiment, and will not be described here.

The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and for those skilled in the art, several modifications and decorations can be made without departing from the spirit and scope of the present invention, and these modifications and decorations should also be considered as the protection scope of the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A pin assembly, comprising:

a colloid;

a metal pin having a pin portion for soldering, a soldering portion, and a fixing portion; the welding part is provided with a welding surface, and the welding surface is exposed on the surface of the colloid; the fixing part is wrapped in the colloid, and an interlocking structure is formed between the fixing part and the colloid so as to lock the metal pins in the colloid.

2. The pin assembly of claim 1, wherein: the thickness of the metal pin is 0.20 mm-1.0 mm.

3. The pin assembly of claim 1, wherein: the fixing part comprises a first bending section formed by downwards bending and extending from the welding part and a second bending section formed by bending and extending from the first bending section.

4. The pin assembly of claim 1, wherein: the number of the fixing parts is two, and the two fixing parts are respectively arranged on the left side and the right side of the welding part.

5. The pin assembly of claim 1, wherein: the fixing portion is connected between the lead portion and the soldering portion.

6. The pin assembly of claim 1, wherein: the area of the welding surface exposed out of the surface of the colloid is more than 0.12mm ² 。

7. The pin assembly of claim 1, wherein: the width of the welding surface exposed out of the surface of the colloid is larger than or equal to the width of the colloid.

8. A pin assembly, comprising:

colloid;

the metal pin comprises a pin part for welding, a welding part and a fixing part; the welding part is arranged on the upper surface of the colloid; the fixing part is embedded in the colloid so as to fix the metal pins in the colloid.

9. The pin assembly of claim 8, wherein: the upper surface of colloid is equipped with the holding tank of undercut, the welding part accept in the holding tank, just the welding surface of welding part exposes in the upper surface of colloid.

10. The pin assembly of claim 8, wherein: the fixing part comprises a first bending section formed by downwards bending and extending from the welding part and a second bending section formed by bending and extending from the first bending section.