CN214411184U - Strong-conductive and tough silver-based bonding wire - Google Patents
Strong-conductive and tough silver-based bonding wire Download PDFInfo
- Publication number
- CN214411184U CN214411184U CN202120650561.1U CN202120650561U CN214411184U CN 214411184 U CN214411184 U CN 214411184U CN 202120650561 U CN202120650561 U CN 202120650561U CN 214411184 U CN214411184 U CN 214411184U
- Authority
- CN
- China
- Prior art keywords
- layer
- coated
- silver
- heat conduction
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a strong conductive tough silver-based bonding wire, which comprises a silver wire substrate, a gold-plated layer, an oxidation resistant layer, a heat conducting layer, a stainless steel galvanized net layer, a tin foil layer and a soft rubber outer layer; the gold-plated layer is coated on the outer surface of the silver wire substrate, the oxidation resistant layer is coated on the outer surface of the gold-plated layer, the heat conduction layer is coated on the outer surface of the oxidation resistant layer, the stainless steel galvanized net layer is arranged in the heat conduction layer, the tin foil layer is coated on the outer surface of the heat conduction layer, and the soft rubber outer layer is coated on the outer surface of the tin foil layer. The utility model discloses electric conductive property is better, and toughness is good, and heat dispersion is better simultaneously.
Description
Technical Field
The utility model relates to a bonding wire technical field, concretely relates to tough silver-based bonding wire of strong electrically conductive.
Background
Bonding wires are alloy wires used as connecting wires in integrated circuits, and are also called ball bonding wires or lead wires. There are three kinds of bonding wires of gold base, silver base and copper base. The trace elements are beryllium, nickel, silver and the like, and have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Vacuum smelting in a high-frequency furnace, secondary remelting and directional crystallization, homogenizing, and cold processing into a finished product. Or by a liquid extrusion process.
The bonding wire is one of four basic materials in the packaging industry, and is an inner lead material with excellent electrical, thermal and mechanical properties and stability. The bonding wire is one of essential basic materials in the manufacturing process of integrated circuits and semiconductor discrete devices as an inner lead for packaging.
However, bonding wires in the current market are often low in use value, poor in conductivity, poor in toughness and poor in heat dissipation performance.
Disclosure of Invention
The utility model discloses the problem that will solve is: the high-conductivity and high-toughness silver-based bonding wire is good in conductivity, good in toughness and good in heat dissipation performance.
The utility model discloses a solve the technical scheme that above-mentioned problem provided and do: a strong-conductivity and high-toughness silver-based bonding wire comprises a silver wire substrate, a gold-plated layer, an oxidation-resistant layer, a heat-conducting layer, a stainless steel zinc-plated net layer, a tin foil layer and a soft rubber outer layer; the gold-plated layer is coated on the outer surface of the silver wire substrate, the oxidation resistant layer is coated on the outer surface of the gold-plated layer, the heat conduction layer is coated on the outer surface of the oxidation resistant layer, the stainless steel galvanized net layer is arranged in the heat conduction layer, the tin foil layer is coated on the outer surface of the heat conduction layer, and the soft rubber outer layer is coated on the outer surface of the tin foil layer.
Preferably, the stainless steel galvanized net layer is woven by nickel-containing stainless steel galvanized metal wires with high tensile strength and is in a cylindrical shape with a grid structure.
Preferably, the heat conductive layer is a thermoplastic resin layer.
Preferably, a plurality of color strips are uniformly arranged on the outer surface of the soft rubber outer layer around the circumference.
Compared with the prior art, the utility model has the advantages that:
1. the utility model takes silver as the main material, and the manufacturing cost is relatively low;
2. the utility model has good conductivity by arranging the gold plating layer on the outer surface of the silver wire substrate;
3. the nickel-containing stainless steel galvanized net layer and the thermoplastic resin layer of the utility model provide stress together, so that the bonding wire has stronger tensile stability and toughness and is not easy to deform;
4. the utility model discloses a heat that the silver wire substrate of thermoplasticity resin layer conduction distributed to the tinfoil layer, and then through the outer external world that looses of soft rubber, heat dispersion is better.
Drawings
The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it.
Fig. 1 is a front view of the present invention;
fig. 2 is a plan view of the present invention.
The attached drawings are marked as follows: 1. the heat-conducting wire comprises a silver wire substrate, 2 parts of a gold-plated layer, 3 parts of an anti-oxidation layer, 4 parts of a heat-conducting layer, 5 parts of a stainless steel galvanized net layer, 6 parts of a tin foil layer, 7 parts of a soft rubber outer layer and 8 parts of a color strip.
Detailed Description
The following detailed description will be made with reference to the accompanying drawings and examples, so that how to implement the technical means of the present invention to solve the technical problems and achieve the technical effects can be fully understood and implemented.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship shown in the drawings are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated without limiting the specific scope of protection of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The specific embodiment of the present invention is shown in fig. 1 and fig. 2, 1, a strong conductive tough silver-based bonding wire, which comprises a silver wire substrate 1, a gold-plated layer 2, an oxidation-resistant layer 3, a heat-conducting layer 4, a stainless steel zinc-plated mesh layer 5, a tin foil layer 6 and a soft rubber outer layer 7; the gold-plated layer 2 is coated on the outer surface of the silver wire substrate 1, the oxidation resistant layer 3 is coated on the outer surface of the gold-plated layer 2, the heat conduction layer 4 is coated on the outer surface of the oxidation resistant layer 3, the stainless steel galvanized mesh layer 5 is arranged in the heat conduction layer 4, the tin foil layer 6 is coated on the outer surface of the heat conduction layer 4, and the soft rubber outer layer 7 is coated on the outer surface of the tin foil layer 6.
As a further improvement of the present invention, in this embodiment, the stainless steel galvanized mesh layer 5 is woven by nickel-containing stainless steel galvanized wire with high tensile strength, and is a cylinder with a grid structure.
As a further improvement of the present invention, in the present embodiment, the heat conductive layer 4 is a thermoplastic resin layer.
As a further improvement of the present invention, in this embodiment, the outer surface of the soft rubber layer 7 is provided with a plurality of color strips 8 uniformly around the circumference. Through setting up the colour strip for the bonding wire has the identification effect, satisfies the user demand.
Specifically, the tin foil layer is tightly attached to the thermoplastic resin layer, the thickness of the tin foil layer is zero point one millimeter, and the tin foil layer has good acid-base barrier performance and good heat conduction performance.
The foregoing is illustrative of the preferred embodiments of the present invention only, and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to be changed. All changes which come within the scope of the independent claims of the invention are to be embraced within their scope.
Claims (4)
1. A strong-conductivity and high-toughness silver-based bonding wire is characterized in that: comprises a silver wire substrate (1), a gold-plated layer (2), an anti-oxidation layer (3), a heat conduction layer (4), a stainless steel galvanized mesh layer (5), a tin foil layer (6) and a soft rubber outer layer (7); the gold-plated layer (2) is coated on the outer surface of the silver wire substrate (1), the oxidation resistant layer (3) is coated on the outer surface of the gold-plated layer (2), the heat conduction layer (4) is coated on the outer surface of the oxidation resistant layer (3), the stainless steel zinc-plated net layer (5) is arranged in the heat conduction layer (4), the tin foil layer (6) is coated on the outer surface of the heat conduction layer (4), and the soft rubber outer layer (7) is coated on the outer surface of the tin foil layer (6).
2. The strongly conductive tough silver-based bonding wire according to claim 1, wherein: the stainless steel galvanized net layer (5) is woven by nickel-containing stainless steel galvanized metal wires with high tensile strength and is cylindrical with a grid structure.
3. The strongly conductive tough silver-based bonding wire according to claim 1, wherein: the heat conduction layer (4) is a thermoplastic resin layer.
4. The strongly conductive tough silver-based bonding wire according to claim 1, wherein: a plurality of color strips (8) are uniformly arranged on the outer surface of the soft rubber outer layer (7) in a circumferential manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120650561.1U CN214411184U (en) | 2021-03-29 | 2021-03-29 | Strong-conductive and tough silver-based bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120650561.1U CN214411184U (en) | 2021-03-29 | 2021-03-29 | Strong-conductive and tough silver-based bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214411184U true CN214411184U (en) | 2021-10-15 |
Family
ID=78031169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120650561.1U Active CN214411184U (en) | 2021-03-29 | 2021-03-29 | Strong-conductive and tough silver-based bonding wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214411184U (en) |
-
2021
- 2021-03-29 CN CN202120650561.1U patent/CN214411184U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103098150B (en) | Piezo-resistance is installed on surface | |
| CN101877339B (en) | Leadframe | |
| US20190139871A1 (en) | Semiconductor device | |
| CN103187382B (en) | Be applied in the aluminium alloy lead frame in power semiconductor components and parts | |
| CN103594213A (en) | overcurrent protection element | |
| CN214411184U (en) | Strong-conductive and tough silver-based bonding wire | |
| CN204577505U (en) | Battery modules brace | |
| CN106332479B (en) | Mobile terminal, housing unit and its manufacturing method | |
| CN101515496A (en) | Thermal resistor and manufacturing method thereof | |
| CN208109921U (en) | A kind of high power current sensing component | |
| CN109963399A (en) | Electronic building brick with direct copper substrate | |
| US20030067054A1 (en) | Surface mountable device | |
| CN211700343U (en) | PCB type battery cover plate and battery with same | |
| KR101645020B1 (en) | Temperature sensor and manufacturing method for temperature sensor | |
| CN208336199U (en) | A kind of wear-resisting bonding gold wire | |
| CN207800160U (en) | A kind of novel conductive silica gel structure | |
| CN107864555B (en) | Flexible circuit board | |
| CN215265779U (en) | Lightning protection device | |
| CN203167424U (en) | Aluminum-base circuit board | |
| CN205564431U (en) | PTC temperature sensing subassembly of parallelly connected structure | |
| CN113224427A (en) | PCB type battery cover plate, preparation method thereof and battery with PCB type battery cover plate | |
| CN212305770U (en) | Printed circuit board and display panel | |
| CN219085695U (en) | High-strength copper lead structure | |
| CN217690678U (en) | Aluminum shell resistor with good heat conduction performance | |
| CN111524989A (en) | Back contact solar cell interconnection structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |