CN214381599U

CN214381599U - Circuit board and communication module

Info

Publication number: CN214381599U
Application number: CN202120355579.9U
Authority: CN
Inventors: 潘盛昌
Original assignee: Fibocom Wireless Inc
Current assignee: Fibocom Wireless Inc
Priority date: 2021-02-08
Filing date: 2021-02-08
Publication date: 2021-10-08
Anticipated expiration: 2031-02-08

Abstract

The application discloses circuit board and communication module. The circuit board comprises a main circuit board and an auxiliary circuit board, the main circuit board is provided with a notch, a supporting part is arranged at the notch, at least part of the auxiliary circuit board is arranged in the notch, and the auxiliary circuit board is borne on the supporting part and is electrically connected with the main circuit board. Based on this, this application can be favorable to reducing the whole thickness of circuit board to the double-sided overall arrangement electronic component is realized to the sub-circuit board, can reduce electronic component's layout area on the plane that the sub-circuit board is located, thereby reduces the layout area that the sub-circuit board occupied on main circuit board, is favorable to the miniaturized design of circuit board.

Description

Circuit board and communication module

Technical Field

The application relates to the technical field of printed circuit boards, in particular to a circuit board and a communication module.

Background

In the prior art, electronic elements are usually arranged on a circuit board (such as a PCB) in a single-sided mounting manner, along with the enhancement of the functions of electronic equipment, the number of the electronic elements on the circuit board is more and more, and more electronic elements undoubtedly occupy larger area, so that the layout area of the circuit board is larger, and the miniaturization design requirements of the electronic equipment cannot be met. Meanwhile, because the sub circuit board is directly arranged on the surface of the main circuit board, the whole thickness after mounting is larger, and the light and thin design requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides a circuit board and a communication module, so as to solve the problems of large layout area and large thickness of the conventional circuit board.

A circuit board provided in a first aspect of the present application includes a main circuit board and an sub circuit board. The main circuit board is provided with a notch, a supporting part is arranged at the notch, at least part of the sub circuit board is arranged in the notch, and the sub circuit board is borne on the supporting part and is electrically connected with the main circuit board.

Optionally, at least one of the two opposite surfaces of the sub-circuit board is provided with an electronic component.

Optionally, the radial dimension of each sub circuit board is gradually reduced along a predetermined direction perpendicular to the main circuit board.

Optionally, along the predetermined direction perpendicular to the main circuit board, an included angle between the side surface of the sub circuit board and the predetermined direction is 45 degrees.

Optionally, the side surface of the sub circuit board is provided with a plurality of bonding pads, and the sub circuit board is electrically connected with the main circuit board through the bonding pads.

Optionally, a groove is formed in one side, facing the main circuit board, of the bonding pad.

Optionally, the cross section of the groove is at least one of arc, rectangle and sawtooth.

Optionally, the distance between adjacent pads is greater than or equal to 0.2 mm.

Optionally, the electronic component is covered with a shield.

A communication module provided in a second aspect of the present application includes any one of the circuit boards described above.

In the circuit board and the communication module of the application, the sub circuit board is at least partially arranged in the notch and borne on the supporting part of the main circuit board, the whole thickness of the circuit board in the thickness direction is smaller than the sum of the thicknesses of the main circuit board and the sub circuit board, the whole thickness of the circuit board can be reduced, and the main circuit board is hollowed out at the notch, electronic elements can be arranged on two sides of the sub circuit board, the layout area of the electronic elements can be reduced on the plane where the sub circuit board is located through double-sided layout, the layout area occupied by the sub circuit board on the main circuit board is reduced, and the miniaturization design of the circuit board is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a circuit board according to another embodiment of the present application;

FIG. 3 is a schematic perspective view of a bonding pad according to an embodiment of the present application;

FIG. 4 is a front view of the structure of the bonding pad shown in FIG. 3;

fig. 5 is a top view of the structure of the bonding pad shown in fig. 3.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below with reference to the embodiments and the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments, and not all embodiments. Based on the embodiments in the present application, the following respective embodiments and technical features thereof may be combined with each other without conflict.

It should be understood that in the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing technical solutions and simplifying the description of the respective embodiments of the present application, and do not indicate or imply that a device or an element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

Referring to fig. 1, a circuit board 10 includes a main circuit board 11 and a sub circuit board 21.

The main circuit board 11 is provided with a notch 12, and the main circuit board 11 is provided with a supporting part 13 matched with the sub circuit board 21 at the notch 12, and the sub circuit board 21 is carried on the supporting part 13 and is electrically connected with the main circuit board 11. Matching is understood to mean: the notch 12 and the support portion 13 can support the sub circuit board 21 based on the attribute information (e.g., shape, size, structural strength, etc.) of the sub circuit board 21 so that the sub circuit board 21 and the main circuit board 11 are maintained in a state in accordance with actual requirements.

The sub circuit board 21 is at least partially disposed in the notch 12, wherein, in the thickness direction of the circuit board 10, the overall thickness of the circuit board 10 is smaller than the sum of the thicknesses of the main circuit board 11 and the sub circuit board 21, so that the overall thickness of the circuit board 10 can be reduced, which is beneficial to the light and thin design of the circuit board 10, and moreover, because the main circuit board 11 is hollowed out at the notch 12, as shown in fig. 2, the electronic components 41 can be disposed on both the upper and lower surfaces of the sub circuit board 21, and this double-sided layout manner can reduce the layout area of the electronic components 41 on the plane where the sub circuit board 21 is located, thereby reducing the layout area occupied by the sub circuit board 21 on the main circuit board 11, which is beneficial to the miniaturization design of the circuit board 10.

The sub Circuit Board 21 may be regarded as an electrical component conventionally mounted on the main Circuit Board 11, including but not limited to various sensors and Circuit boards thereof, and its type is not limited to a PCB (Printed Circuit Board). The electrical connection between the sub circuit board 21 and the main circuit board 11 can be determined according to actual requirements. In one implementation, the sub circuit board 21 and the supporting portion 13 of the main circuit board 11 are connected by welding, for example, by soldering or the like to conduct a line.

The sub circuit board 21 is at least partially disposed in the notch 12, and includes four structures:

first, the sub circuit board 21 is partially accommodated in the notch 12, for example, the upper surface of the sub circuit board 21 is higher than the upper surface of the main circuit board 11, and the lower surface of the sub circuit board 21 is located between the upper surface and the lower surface of the main circuit board 11.

Secondly, the upper surface of the sub circuit board 21 is positioned between the upper surface and the lower surface of the main circuit board 11, and the lower surface of the sub circuit board 21 is lower than the lower surface of the main circuit board 11.

Thirdly, the upper surface of the sub circuit board 21 is higher than the upper surface of the main circuit board 11, the lower surface of the sub circuit board 21 is lower than the lower surface of the main circuit board 11, and the middle part of the sub circuit board 21 is arranged in the notch 12.

And fourthly, the sub circuit board 21 is completely accommodated in the notch 12, namely, the upper surface of the sub circuit board 21 is lower than the upper surface of the main circuit board 11, and the lower surface of the sub circuit board 21 is higher than the lower surface of the main circuit board 11.

The upper surface and the lower surface of the embodiment of the present application refer to two surfaces arranged in parallel in the thickness direction of the sub circuit board 21, that is, two surfaces with the largest corresponding area of the main circuit board 11 or the sub circuit board 21.

In some embodiments, the radial dimension of the sub circuit board 21 is gradually reduced in a predetermined direction perpendicular to the main circuit board 11, that is, in a direction perpendicular to the main circuit board 11, which is a relative direction between two faces of the main circuit board 11 having the largest area, that is, a vertical direction as shown in fig. 1 and 2. Here, the sub circuit board 21 may be in a shape with a wide top and a narrow bottom in the vertical direction, and the supporting portion 13 is disposed in the notch 12, so that the notch 12 is in a shape with a wide top and a narrow bottom matching the sub circuit board 21, for example, as shown in fig. 1 and fig. 2, the sub circuit board 21 is in a shape of a truncated pyramid, and the supporting portion 13 is an inclined surface structure matching the side surface of the truncated pyramid; also, if the side surface of the sub circuit board 21 is set to be an inverted step shape, the supporting portion 13 may be set to be a step shape matching with the sub circuit board 21. It should be understood that the sub circuit board 21 may also be configured as an inverted circular truncated cone, or a structure with saw teeth or the like on the side. The vertical direction in the embodiment of the present application refers to a vertical direction corresponding to a placement mode of the circuit board 10 during processing or during conventional use, for example, a direction from top to bottom of the circuit board 10 in fig. 1 and 2.

By arranging the sub circuit board 21 with the radial size gradually reduced from top to bottom, the sub circuit board 21 is easier to position when being embedded into the notch 12, and the stability of fixing the sub circuit board 21 and the main circuit board 11 is improved.

With reference to fig. 1 and fig. 2, in one implementation, an included angle between the side surface of the sub circuit board 21 and the vertical direction is 45 degrees, which is beneficial to make the stress at the contact position between the sub circuit board 21 and the main circuit board 11 more uniform, reduce the damage caused by stress concentration, and improve the service life of the sub circuit board 21 and the main circuit board 11.

In some embodiments, as shown in fig. 2, at least one of the two opposite surfaces of the sub circuit board 21 is provided with an electronic component 41, and the electronic component 41 can be regarded as an electrical component, such as a sensor, etc., attached to the sub circuit board 21. Because the main circuit board 11 is hollowed in the notch 12, the electronic components 41 can be arranged on both sides of the sub circuit board 21, and the layout area of the electronic components 41 can be reduced on the plane where the sub circuit board 21 is located by the double-sided layout mode, so that the layout area occupied by the sub circuit board 21 on the main circuit board 11 is reduced, and the miniaturization design of the circuit board 10 is facilitated.

In some embodiments, as shown in fig. 2, the side surface of the sub circuit board 21 is provided with a plurality of pads 31 arranged at intervals, and the sub circuit board 21 is electrically connected to the main circuit board 11 through the pads 31.

Referring to fig. 3, 4 and 5, a groove 32 may be formed on a side of each pad 31 facing the main circuit board 11, and the groove 32 may be circular, rectangular or zigzag, but is not limited thereto. It should be noted that fig. 4 is a schematic structural diagram of the pads 31 when the pads 31 are viewed from the front (or from the side of the sub-circuit board 21), wherein the dotted lines indicate the grooves 32, the oblique lines fill the spaces between the pads 31 (the same as fig. 3), and fig. 5 is a schematic structural diagram of a top view from the top in the front direction of fig. 4. As shown in fig. 3, 4 and 5, the groove 32 may be formed along a direction in which one long side of the sub circuit board 21 points to the other long side, and the groove 32 is formed in the pad 31 to provide a receiving space for the solder, so that the fluidity of the solder after melting can be fully exerted, and the welding effect of the main circuit board 11 and the pad 31 can be increased and the welding firmness can be improved by improving the adsorption force of the solder after melting.

In some embodiments, the interval between the adjacent pads 31 is greater than or equal to 0.2mm, and the solder is prevented from overflowing to the adjacent pads 31 to cause short circuit by increasing the interval between the pads 31, so that the safety of the daughter circuit board is improved.

In some embodiments, the thickness of the sub circuit board 21 is smaller than that of the main circuit board 11, so that the sub circuit board 21 can be better accommodated in the notch 12 of the main circuit board 11, and the overall thickness of the circuit board 10 can be effectively reduced.

In some embodiments, a shielding member (not shown) is disposed on the electronic component 41, and the shielding member completely covers the electronic component 41, so that interference of external factors to the electronic component 41 can be effectively reduced.

The embodiment of the present application further provides a communication module, which includes the circuit board 10 according to any of the above embodiments. Therefore, the communication module has the beneficial effects produced by the circuit board 10.

The electronic device to which the communication module is applied may be implemented in various forms. For example, the electronic devices may include mobile electronic devices such as mobile phones, tablet computers, notebook computers, palm top computers, Personal Digital Assistants (PDAs), Portable Media Players (PMPs), navigation devices, wearable devices, smart bands, pedometers, and fixed electronic devices such as Digital TVs, desktop computers, and the like.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent structural changes made by using the contents of the specification and the drawings are included in the scope of the present application.

Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element, and that elements, features, or elements having the same designation in different embodiments may or may not have the same meaning as that of the other elements, and that the particular meaning will be determined by its interpretation in the particular embodiment or by its context in further embodiments.

In addition, although the terms "first, second, third, etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well. The terms "or" and/or "are to be construed as inclusive or meaning any one or any combination. An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

Claims

1. A circuit board, comprising:

the main circuit board is provided with a notch, and a supporting part is arranged at the notch of the main circuit board;

and at least part of the sub circuit board is arranged in the gap, and the sub circuit board is borne on the supporting part and is electrically connected with the main circuit board.

2. The circuit board of claim 1, wherein at least one of the opposing surfaces of the sub-circuit board is provided with electronic components.

3. The circuit board of claim 1, wherein the radial dimensions of the sub circuit boards are tapered in a predetermined direction perpendicular to the main circuit board.

4. The circuit board of claim 3, wherein the side surface of the sub circuit board is at an angle of 45 degrees to the predetermined direction along the predetermined direction perpendicular to the main circuit board.

5. The circuit board of claim 1, wherein the side of the daughter circuit board is provided with a plurality of pads, and the daughter circuit board is electrically connected to the main circuit board through the pads.

6. The circuit board of claim 5, wherein a side of the pad facing the main circuit board is recessed.

7. The circuit board of claim 6, wherein the cross section of the groove is at least one of arc-shaped, rectangular and saw-toothed.

8. The circuit board of claim 5, wherein a distance between adjacent pads is greater than or equal to 0.2 mm.

9. The circuit board of claim 2, wherein the electronic component is covered with a shield.

10. A telecommunications module comprising a circuit board according to any of claims 1 to 9.