CN214378434U - Light and thin reflective photoelectric switch - Google Patents
Light and thin reflective photoelectric switch Download PDFInfo
- Publication number
- CN214378434U CN214378434U CN202022935504.6U CN202022935504U CN214378434U CN 214378434 U CN214378434 U CN 214378434U CN 202022935504 U CN202022935504 U CN 202022935504U CN 214378434 U CN214378434 U CN 214378434U
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- light
- photoelectric switch
- bowl
- mounting substrate
- light emitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Switches Operated By Changes In Physical Conditions (AREA)
Abstract
The utility model provides a frivolous type reflection photoelectric switch, which comprises a main body, be provided with the bowl cup in the main part, bowl cup intussuseption is filled with first colloid, the bottom of bowl cup is provided with first installation basement and second installation basement, be provided with the light-emitting component who is used for sending light signal on the first installation basement and be used for receiving light signal's photic subassembly, through setting up the bowl cup in the main part, and set up light-emitting component and photic device in the installation basement of bowl bottom of cup, thereby photoelectric switch's thickness has been reduced, light-emitting component and photic subassembly respectively with the second installation basement between be connected through the bonding silk, be provided with the barn door between light-emitting component and the photic subassembly. Compared with the prior art, the utility model discloses a photoelectric switch thickness is less for photoelectric switch can be applicable to the microcircuit that has strict requirement to the components and parts size.
Description
Technical Field
The embodiment of the utility model provides a but not limited to the photoelectric technology field especially relates to a frivolous type reflection type photoelectric switch.
Background
The photoelectric switch is widely applied to various circuits, and is one of the most various photoelectric devices with the most application. However, in the conventional photoelectric switch, as shown in fig. 1, the light emitting diode and the photo transistor are directly disposed on the metalized region of the substrate, and the metal cap with the reflective coating is disposed above the substrate, so that the thickness of the photoelectric switch is large, and the conventional photoelectric switch is not suitable for a microcircuit having strict requirements on the size of components.
SUMMERY OF THE UTILITY MODEL
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the utility model provides a frivolous type reflection photoelectric switch compares photoelectric switch in prior art, and it is provided with the bowl cup in photoelectric switch's the main part to set up luminescent device and photic device in the installation base of bowl bottom of cup portion, thereby reduced photoelectric switch's thickness, consequently can be applicable to the microcircuit that has strict demand to the components and parts size.
According to a first aspect of the present invention, a light and thin reflective photoelectric switch includes a main body, a bowl is disposed on the main body, and a first colloid for encapsulation is filled in the bowl; the bowl is characterized in that a first mounting substrate and a second mounting substrate are arranged at the bottom of the bowl cup, a light emitting component used for sending a light signal and a light receiving component used for receiving the light signal are arranged on the first mounting substrate, the light emitting component and the light receiving component are respectively connected with the second mounting substrate through bonding wires, and a light barrier is arranged between the light emitting component and the light receiving component.
According to the utility model discloses frivolous type reflection type photoelectric switch of first aspect embodiment has following beneficial effect at least: the bowl cup is arranged on the main body of the photoelectric switch, and the light-emitting device and the light-receiving device are arranged on the mounting substrate at the bottom of the bowl cup, so that the thickness of the photoelectric switch is reduced, correspondingly, the amount of the packaging colloid arranged in the bowl cup is correspondingly reduced, the generation of bad conditions such as crystal pulling is reduced, and the reliability is improved. Simultaneously, the whole thickness of photoelectric switch is also reduced for photoelectric switch can be applicable to the microcircuit that has strict requirements to the components and parts size.
It can be understood that the light and thin reflective photoelectric switch of the embodiments of the present invention further includes a first pin and a second pin for implementing communication of the photoelectric switch, the first pin is connected to the first mounting substrate, and the second pin is connected to the second mounting substrate. Through setting up first pin and second pin, can conveniently be connected to the photoelectric switch in the circuit.
It will be appreciated that the depth of the bowl is no greater than 450 microns. The depth of the bowl cup is limited to be not more than 450 microns, the thickness of the photoelectric switch can be further reduced, the using amount of the packaging colloid in the bowl cup is reduced, the generation of bad conditions such as crystal pulling is reduced, and the reliability is improved.
It is understood that the light emitting element includes an infrared ray emitting chip and the light receiving element includes an infrared ray receiving chip. Adopt infrared emission chip and infrared ray receiving chip as light emitting component and photic subassembly respectively, can promote photoelectric switch's sensitivity on the one hand, on the other hand can reduce photoelectric switch's energy consumption, and can reduce the calorific capacity of photoelectric switch during operation simultaneously.
It is understood that the height of the infrared transmitting chip and the infrared receiving chip is not more than 240 micrometers. The height of the infrared transmitting chip and the height of the infrared receiving chip which limit the photoelectric switch are not more than 240 microns, so that the depth of the photoelectric switch bowl can be correspondingly reduced, the thickness of the photoelectric switch is reduced, and the photoelectric switch can be suitable for a microcircuit which has strict requirements on the size of a component.
It is understood that the bond wire has a height of no more than 210 microns. The depth of the photoelectric switch bowl can be correspondingly reduced by limiting the height of the bonding wire to be not more than 210 micrometers, so that the thickness of the photoelectric switch is reduced, and the photoelectric switch can be suitable for a microcircuit with strict requirements on the size of a component.
It is understood that the light barrier is a black plastic plate. The black plastic plate has a good absorption effect on electromagnetic waves in an infrared band, and the light transmittance of the light barrier can be reduced as much as possible under the condition of keeping low cost by adopting the black plastic plate.
It is understood that the first colloid is black epoxy glue. Adopt black epoxy glue on the one hand can obtain better encapsulation effect, on the other hand can improve photoelectric switch's interference killing feature for the photic subassembly is difficult to be triggered by interfering signal.
It is understood that a second adhesive for fixing the light emitting assembly is disposed between the light emitting assembly and the first mounting substrate. The second colloid is used for fixing the light emitting component, the embodiment of the utility model provides a second colloid includes the silver colloid, can provide good conductive ability when fixing the light emitting component.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the technical solutions of the present invention, and are incorporated in and constitute a part of this specification, together with the embodiments of the present invention for explaining the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.
FIG. 1 is a schematic diagram of a prior art optoelectronic switch;
fig. 2 is a schematic structural diagram of a thin and light reflective photoelectric switch according to an embodiment of the present invention;
fig. 3 is another angle structure diagram of the optoelectronic switch in fig. 2.
Reference numerals: the light emitting diode comprises a main body 100, a bowl 101, a first mounting substrate 102, a second mounting substrate 103, a light receiving component 104, a bonding wire 105, a first pin 106, a second pin 107, a light barrier 200 and a light emitting component 201.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a photoelectric switch in the prior art, in which a light emitting diode and a phototransistor are directly disposed on a metalized region of a substrate, and a metal cap with a reflective coating is disposed above the substrate, resulting in a large thickness of the photoelectric switch, which is not suitable for a microcircuit having strict requirements on the size of a component.
The embodiment of the utility model provides a light and thin reflective photoelectric switch, which comprises a main body, wherein a bowl is arranged on the main body, and a first colloid for packaging is filled in the bowl; the bowl cup comprises a bowl cup body and is characterized in that a first mounting substrate and a second mounting substrate are arranged at the bottom of the bowl cup body, a light emitting component used for sending a light signal and a light receiving component used for receiving the light signal are arranged on the first mounting substrate, the light emitting component and the light receiving component are respectively connected with the second mounting substrate through bonding wires, and a light barrier is arranged between the light emitting component and the light receiving component. Through set up the bowl cup in photoelectric switch's main part to set up luminescent device and photic device on the mount pad of bowl cup bottom, thereby reduced photoelectric switch's thickness, correspondingly, set up the inside encapsulation colloid's of bowl cup quantity also corresponding reduction, thereby reduced the production of pulling out bad conditions such as brilliant, promoted the reliability. Simultaneously, the whole thickness of photoelectric switch is also reduced for photoelectric switch can be applicable to the microcircuit that has strict requirements to the components and parts size.
The embodiments of the present invention will be further explained with reference to the drawings.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a light and thin reflective photoelectric switch according to an embodiment of the present invention.
In the example of fig. 2, the light and thin reflective photoelectric switch of the embodiment of the present invention includes a main body 100, a bowl 101 recessed below the main body 100 is disposed on the main body 100, a first mounting substrate 102 and a second mounting substrate 103 are disposed at the bottom of the bowl 101, and a light emitting component 201 for transmitting an optical signal and a light receiving component 104 for receiving the optical signal are disposed on the first mounting substrate 102. The bowl cup 101 which is concave downwards is arranged on the photoelectric switch main body 100, and the light-emitting device and the light-receiving device are arranged on the mounting substrate at the bottom of the bowl cup 101, so that the thickness of the photoelectric switch is reduced, and the photoelectric switch can be suitable for a micro circuit with strict requirements on the size of components.
It can be understood that the bowl 101 is filled with a first adhesive for encapsulation, and the first adhesive plays a role in fixing and protecting components in the bowl 101, and also plays a role in transmitting light emitted by the light emitting component 201.
Specifically, first colloid includes black epoxy glue, adopts black epoxy glue can obtain better encapsulation effect on the one hand, and on the other hand can improve photoelectric switch's interference killing feature for it is difficult for being triggered by interfering signal to receive optical element 104.
Specifically, the ratio of the melanin to the epoxy in the black epoxy glue can be determined by the power of the light emitting element 201, for example, when the power of the light emitting element 201 is higher, the ratio of the melanin is increased, and for example, when the power of the light emitting element 201 is lower, the ratio of the melanin is decreased.
Specifically, bowl 101 has a depth of no greater than 450 microns. By limiting the depth of the bowl cup 101 to be not more than 450 micrometers, the thickness of the photoelectric switch can be further reduced, the using amount of the packaging colloid in the bowl cup 101 is reduced, the generation of bad conditions such as crystal pulling is reduced, and the reliability is improved.
It can be understood that a cap may be further disposed above the bowl 101, and by disposing the reflective coating on the cap, light emitted from the light emitting component 201 can be reflected by the reflective coating on the cap for being received by the light receiving component 104.
Referring to fig. 2, it can be understood that the light emitting element 201 and the light receiving element 104 are respectively connected to the second mounting substrate 103 through the bonding wire 105, and the light emitting element 201, the light receiving element 104 and the second mounting substrate 103 are respectively connected through the bonding wire 105, so that the stability of the operation of the photoelectric switch can be improved, and meanwhile, the transmission of light emitted by the light emitting element 201 cannot be influenced because the diameter of the bonding wire 105 is small.
Specifically, the height of the bond wire 105 is no greater than 210 microns. By defining the height of the bond wire 105 to be no greater than 210 microns, the depth of the opto-electronic switch bowl 101 can be correspondingly reduced, thereby reducing the thickness of the opto-electronic switch, enabling the opto-electronic switch to be suitable for microcircuits having stringent requirements for component size.
Specifically, the bonding wire 105 is made of gold, and since the gold wire has good conductivity, the performance of the photoelectric switch can be improved by using the gold wire as the bonding wire 105.
It is understood that a second adhesive for fixing the light emitting device 201 is disposed between the light emitting device 201 and the first mounting substrate 102.
It is understood that a second adhesive for fixing the light emitting element 201 is also provided between the light receiving element 104 and the first mounting substrate 102.
Specifically, the second colloid includes silver paste, and the silver paste can provide good conductivity while fixing the light emitting element 201 and the light receiving element 104.
It is understood that the mounting substrate may be made of a ceramic material, and the use of the ceramic material as the mounting substrate can improve the lifetime of the optoelectronic switch.
It can be understood that the embodiment of the present invention does not specifically limit the shape of the mounting substrate, for example, the shape of the mounting substrate may be a rectangle, and as another example, the shape of the mounting substrate may be a quadrangle.
It is understood that the light emitting element 201 includes an infrared ray emitting chip, and the light receiving element 104 includes an infrared ray receiving chip. Adopt infrared emission chip and infrared ray receiving chip as light emitting component 201 and photic subassembly 104 respectively, can promote photoelectric switch's sensitivity on the one hand, on the other hand can reduce photoelectric switch's energy consumption, and can reduce the calorific capacity of photoelectric switch during operation simultaneously.
Specifically, the height of the infrared transmitting chip and the infrared receiving chip is not more than 240 microns. The height of the infrared ray transmitting chip and the infrared ray receiving chip of the photoelectric switch is limited to be not more than 240 micrometers, so that the depth of the photoelectric switch bowl cup 101 can be correspondingly reduced, the thickness of the photoelectric switch is reduced, and the photoelectric switch can be suitable for a microcircuit with strict requirements on the size of components.
It should be noted that, the embodiment of the present invention does not specifically limit the light emitting component 201 and the light receiving component 104, for example, the light emitting component 201 adopts an infrared emitting chip, and the light receiving component 104 adopts an infrared receiving chip; for another example, the light emitting element 201 is a light emitting diode, and the light receiving element 104 is a phototransistor.
Referring to fig. 2, it can be understood that the light and thin reflective type photoelectric switch according to the embodiment of the present invention further includes a first pin 106 and a second pin 107 for realizing communication of the photoelectric switch, the first pin 106 is connected to the first mounting substrate 102, and the second pin 107 is connected to the second mounting substrate 103. By providing the first pin 106 and the second pin 107, the photoelectric switch can be conveniently connected to a circuit.
Referring to fig. 3, fig. 3 is another angle structure diagram of the optoelectronic switch in fig. 2.
In the example of fig. 3, the photoelectric switch includes a light barrier 200 disposed between a light emitting element 201 and a light receiving element 104. The light barrier 200 is used to ensure that the light emitted from the light emitting element 201 cannot be directly detected by the light receiving element 104, and needs to be reflected or refracted to be detected by the light receiving element 104.
Specifically, the light barrier 200 employs a black plastic plate. The black plastic plate has a good absorption effect on electromagnetic waves in an infrared band, and the light transmittance of the light barrier 200 can be reduced as much as possible while keeping the cost low by adopting the black plastic plate.
Referring to fig. 3, the light emitting elements 201 and the light receiving elements 104 are respectively disposed on two first mounting substrates 102 separated by the light barrier 200, the two first mounting substrates 102 are respectively connected with the first pins 106 in a one-to-one correspondence manner, meanwhile, the photoelectric switch is further provided with second mounting substrates 103 respectively connected with the two first mounting substrates 102 in a one-to-one correspondence manner, and the two second mounting substrates 103 are respectively connected with the second pins 107 in a one-to-one correspondence manner.
While the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A light and thin type reflection-type photoelectric switch is characterized by comprising a main body, wherein a bowl is arranged on the main body, and a first colloid for packaging is filled in the bowl; the bowl is characterized in that a first mounting substrate and a second mounting substrate are arranged at the bottom of the bowl cup, a light emitting component used for sending a light signal and a light receiving component used for receiving the light signal are arranged on the first mounting substrate, the light emitting component and the light receiving component are respectively connected with the second mounting substrate through bonding wires, and a light barrier is arranged between the light emitting component and the light receiving component.
2. The light, thin and reflective optoelectronic switch of claim 1, further comprising a first pin and a second pin for enabling communication of the optoelectronic switch, wherein the first pin is connected to the first mounting substrate and the second pin is connected to the second mounting substrate.
3. The light, thin and reflective optoelectronic switch of claim 1 wherein the depth of the bowl is no greater than 450 microns.
4. The light, thin and reflective optoelectronic switch of claim 1, wherein the light emitting device comprises an infrared emitting chip and the light receiving device comprises an infrared receiving chip.
5. The light, thin and reflective optoelectronic switch of claim 4, wherein the height of said IR emitting chip and said IR receiving chip is no greater than 240 μm.
6. The light, thin and reflective optoelectronic switch of claim 1 wherein the height of the bonding wire is no greater than 210 microns.
7. The light, thin and reflective optoelectronic switch of claim 1, wherein the light barrier is a black plastic plate.
8. The light, thin and reflective optoelectronic switch of claim 1, wherein the first encapsulant is black epoxy adhesive.
9. The light, thin and reflective optoelectronic switch of claim 1, wherein a second adhesive is disposed between the light emitting device and the first mounting substrate for fixing the light emitting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022935504.6U CN214378434U (en) | 2020-12-09 | 2020-12-09 | Light and thin reflective photoelectric switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022935504.6U CN214378434U (en) | 2020-12-09 | 2020-12-09 | Light and thin reflective photoelectric switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214378434U true CN214378434U (en) | 2021-10-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022935504.6U Active CN214378434U (en) | 2020-12-09 | 2020-12-09 | Light and thin reflective photoelectric switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214378434U (en) |
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2020
- 2020-12-09 CN CN202022935504.6U patent/CN214378434U/en active Active
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