CN214374930U

CN214374930U - Magnetic suction type probe card device

Info

Publication number: CN214374930U
Application number: CN202120016530.0U
Authority: CN
Inventors: 吴铭钦; 刘峰; 黄宏义
Original assignee: Suzhou Yuzhu Electromechanical Co Ltd
Current assignee: Suzhou Yuzhu Electromechanical Co Ltd
Priority date: 2021-01-05
Filing date: 2021-01-05
Publication date: 2021-10-08
Anticipated expiration: 2031-01-05

Abstract

The utility model relates to a formula probe card device is inhaled to magnetism, including a probe card and a test seat. The probe card comprises a plurality of probes arranged on the substrate, the probes extend downwards to the lower surface of the substrate, and a magnetic layer is plated on the upper surface of each probe. The test seat is arranged corresponding to the probe card and comprises a wafer test platform and an electromagnet, the electromagnet is arranged below the wafer test platform and can generate magnetic force to adsorb the plurality of probes to the wafer test platform, and the plurality of probes are made to contact with the wafer on the wafer test platform to detect the wafer. The utility model discloses usable magnetic force adsorbs the probe and contacts the wafer, can effectively ensure that plural probe all contacts the wafer probing point, and avoids the probe by excessive application of force, reduces the fatigue or the fracture of probe structure, reduces the production degree of probe mark on the wafer test contact simultaneously.

Description

Magnetic suction type probe card device

Technical Field

The utility model relates to a measuring device's technique especially indicates a formula probe card device is inhaled to magnetism.

Background

The probe card testing device is a device for connecting a wafer to be tested with an electronic testing system so as to test a plurality of points to be tested on the wafer. When the probe card testing device is used for detecting, a probe of the probe card testing device needs to form good electric contact with a wafer to be detected, so that a signal sent by an electronic testing system can be really transmitted to the wafer to be detected, and the grain detection of the wafer to be detected can be carried out.

As semiconductor technology develops, the test die on the wafer to be tested is made smaller and smaller, and the density of the corresponding test points to be tested is relatively increased. In the case of micro-LED displays (micro-LEDs), the size has been reduced to below 0.1 millimeter (mm). Of course, the probes on the probe card testing apparatus for testing the points to be tested on the wafer to be tested are also relatively more and more finely manufactured, and the distribution of the probes must be more and more dense. In order to realize the requirement of mass production, the number of the probes is also adjusted to the maximum value, and in the application of micro-light emitting diode (micro-LED) displays, the number of the probes is at least more than 500, so as to meet the practical detection practicability.

In the conventional probe card testing device, such as a vertical probe card (MEMS) testing device or a Cantilever probe card (Cantilever) testing device, a mechanical force is used to press down the probe card to contact the testing contacts on the wafer to be tested during the die testing, but due to the difference in the level of the surface of the wafer to be tested, when the probe card testing device applies a certain pressure, some of the probes may not contact the testing contacts of the wafer to be tested, and some of the probes may be pressed to an excessive degree, so that the testing contacts of the wafer to be tested generate excessive needle marks. And the probe is too big by the degree of exerting pressure, also can lead to probe deformation or wearing and tearing, and the probe structure is easy fatigue fracture for a long time, just need to carry out maintenance or change to the probe card this moment, promotes the cost of detecting. In addition, the mechanical deformation of the probe is not uniform, which also causes the difference of the contact resistance, thereby affecting the accuracy of the electrical property measurement result.

In view of this, the present invention provides a magnetic probe card device for overcoming the above-mentioned drawbacks of the prior art, which can utilize magnetic force to adsorb the probes to ensure that all the probes can uniformly apply force to contact the test points of the object to be tested, so as to effectively overcome the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main objective is providing a formula probe card device is inhaled to magnetism, and its usable magnetic force adsorbs the probe, can ensure that all probes can both contact the wafer that awaits measuring to carry out the wafer detection.

Another object of the utility model is to provide a formula probe card device is inhaled to magnetism, it utilizes magnetic force to adsorb the probe and can avoid the probe by excessive application of force, reduces the deformation of probe, and then reduces the fatigue or the fracture of probe structure, can promote the incorruptibility of probe, reduces the production of needle trace on the wafer test contact simultaneously.

To achieve the above object, the present invention provides a magnetic probe card device, which includes a probe card and a test socket corresponding to the probe card. The probe card comprises a substrate and a plurality of probes, wherein the plurality of probes are arranged on the substrate and extend downwards to the lower surface of the substrate, and each probe is plated with a magnetic layer. The test seat comprises a wafer test platform and an electromagnet, wherein the electromagnet is arranged below the wafer test platform and can generate magnetic force to adsorb the plurality of probes to the wafer test platform.

In this embodiment, each probe includes a connection portion and a testing portion, the testing portion is perpendicular to the connection portion, and the magnetic layer is disposed on the connection portion and corresponds to a position of the testing portion.

In this embodiment, the magnetic probe card apparatus further includes a controller connected to the probe card and the test socket, wherein the controller controls the electromagnet of the test socket to generate a magnetic force, so that the probes of the probe card are attracted to the wafer test platform, and the controller controls the probe card to receive and transmit the test signal.

In this embodiment, the substrate of the probe card is further provided with a test opening, and the plurality of probes are disposed in the test opening in a ring or array manner.

In this embodiment, the substrate of the probe card is provided with a plurality of wires, and the plurality of wires are respectively connected to the plurality of probes and the controller.

The utility model discloses utilize magnetic force to adsorb the probe, can ensure that all probes can both contact the wafer, and can avoid the probe by excessive application of force, reduce the deformation of probe, and then reduce the fatigue or the fracture of probe structure, can promote the incorruptibility of probe, the orbit of needle trace on the test contact of reducible wafer simultaneously.

The purpose, technical content, and features of the present invention and the effects achieved thereby will be better understood through the detailed description of the embodiments.

Drawings

Fig. 1 is a side view of the device architecture of the present invention.

Fig. 2 is a schematic cross-sectional view of a probe card according to the present invention.

Fig. 3 is a schematic view of the usage state of the present invention.

Description of reference numerals: 1-magnetic type probe card device; 10-a probe card; 12-a substrate; 120-test opening; 122-a wire; 14-a probe; 140-a test section; 142-a connecting portion; 144-a magnetic layer; 20-a test seat; 22-wafer test platform; 24-an electromagnet; 30-a machine platform; 32-a mobile device; 40-a wafer; 50-a controller.

Detailed Description

The utility model relates to a formula probe card device is inhaled to magnetism can provide the technique that utilizes magnetic force to adsorb the probe card, can ensure that all probes can both contact the wafer, and utilizes magnetic force to adsorb the probe and can avoid the probe by excessive application of force, reduces the deformation of probe, and then reduces the probe structure and produces fatigue or fracture, promotes the incorruptibility of probe, can reduce the production orbit of needle trace on the test contact simultaneously.

To illustrate how the present invention achieves the above-mentioned effects, the technology of the present invention will be further described below. Referring to fig. 1, the structure of the magnetic probe card device 1 of the present invention includes a probe card 10, a test socket 20, a machine table 30 and a controller 50, the probe card 10 and the test socket 20 are mounted on the machine table 30, the probe card 10 is located above the test socket 20, the machine table 30 is connected to the controller 50, the controller 50 can be a computer with a display, so as to provide the user with the actions of operating the probe card 10, the test socket 20 and the machine table 30 through the controller 50, and the controller 50 can further operate the machine table 30 to make the test socket 20 move corresponding to the probe card 10.

Referring to fig. 1 and fig. 2, a structure of a probe card 10 is described, in this embodiment, the probe card 10 includes a substrate 12 and a plurality of probes 14, in this embodiment, the substrate 12 is an insulating substrate, a test opening 120 is formed on the substrate 12, the probes 14 can be disposed on the substrate 12 and disposed in the test opening 120 in a ring or array manner, and the probes 14 extend downward to a lower surface of the substrate 12. The substrate 12 is further provided with a plurality of wires 122, the plurality of wires 122 are respectively connected to the plurality of probes 14 and the controller 50, and signals generated by the controller 50 can be transmitted to the probes 14 through the wires 122, and signals received by the probes 14 can also be transmitted back to the controller 50.

Referring to fig. 2, to describe the structure of the probe in detail, in the present embodiment, each probe 14 includes a connection portion 142 and a testing portion 140, and the testing portion 140 is perpendicular to the connection portion 142 and extends downward to the lower surface of the substrate 12. In the embodiment, the magnetic layer 144 is a magnetic conductive material, such as a nickel layer, a cobalt layer, or a rhodium layer, but not limited to these materials or alloys thereof, and the magnetic layer 144 is disposed on the connection portion 142 and corresponds to the connection position of the test portion 140, so that each probe 14 can be attracted by an object having magnetic force. In addition, the magnetic layer 144 can be disposed on the connection portion 142 and correspond to the position of the connection testing portion 140, and can also cover the connection portion 142 of the probe 14, but expose part of the testing portion 140, so that the testing portion 140 of the probe 14 contacts the testing point on the wafer to perform the testing on the wafer.

Referring back to fig. 1, the structure of the test socket 20 is illustrated, wherein the test socket 20 includes a wafer test platform 22 and an electromagnet 24. The wafer test platform 22 is provided for carrying a test wafer so that the probes 14 of the probe card 10 contact the wafer for wafer inspection. The electromagnet 24 is disposed under the wafer testing platform 22, and the electromagnet 24 can receive the control of the controller 50 to generate a magnetic force, so that the probe 14 with the magnetic layer 144 is attracted to the wafer testing platform 22 to contact the testing contact of the wafer for wafer testing.

The machine table 30 is further provided with a moving device 32, the moving device 32 is also connected to the controller 50 to control the moving device 32 through the controller 50, and the moving device 32 provides the test socket 20 to be arranged to control the test socket 20 to move up, down, back, left and right relative to the probe card 10. The controller 50 further controls the electromagnet 24 of the test socket 20 to generate a magnetic force to attract the plurality of probes 14 on the probe card 10 to the wafer testing platform 22.

After the structure of the magnetic probe card device 1 of the present invention is described, please refer to fig. 3 to describe the usage status of the magnetic probe card device 1 for detecting the wafer. When the wafer is inspected, the test wafer 40 is first disposed on the wafer test platform 22, then the controller 50 controls the X-axis and the Y-axis of the moving device 32 of the machine 30 to move the test seat 20 forward, backward, leftward, and rightward, so that the point to be inspected on the wafer 40 on the test seat 20 can correspond to the position of the probe 14 of the probe card 10, and then the Z-axis of the test seat 20 is controlled to move upward toward the probe card 10 until the probe 14 on the probe card 10 approaches the test wafer 40, and the wafer is stopped if the distance between the probe 14 and the test wafer 40 is within 0.1 mm, but the distance is greater than 0 mm. The controller 50 then controls the electromagnets 24 to be activated to generate magnetic force to attract the probes 14, since the magnetic layer 144 is disposed on all the probes 14 in this embodiment, so that all the probes 14 are attracted by the magnetic force to contact the points to be tested on the test wafer 40. It should be noted that in the present embodiment, the electromagnetic force is used to control the probes 14 to contact the wafer 40, and the magnetic attraction force is different from the conventional method of pressing by mechanical deformation, so that the deformation range of the probes 14 can be greatly reduced by the technique of the present embodiment, the risk of mechanical fatigue, even breakage, of the probes caused by excessive deformation of the probes 14 can be eliminated, and the trace of the probe marks generated on the wafer by the probes 14 can also be reduced.

After the probes 14 contact the points to be tested on the wafer 40, the controller 50 can generate the test signals to transmit the test signals to the wafer 40 through the probes 14, and then receive the test signals transmitted back from the wafer 40 to the controller 50 through the probes 14, so that the controller 50 analyzes the transmitted test signals to complete the testing of the wafer 40.

To sum up, the utility model discloses utilize magnetic force to adsorb the probe, can ensure that all probes can both contact the wafer, and can avoid the probe by excessive application of force, reduce the deformation of probe, and then reduce the fatigue or the fracture of probe structure, can promote the incorruptibility of probe, the orbit of probe trace on the test contact of reducible wafer simultaneously.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The utility model provides a formula probe card device is inhaled to magnetism which characterized in that includes:

a probe card, including a substrate and a plurality of probes, the plurality of probes are disposed on the substrate and extend downwards to the lower surface of the substrate, each probe is plated with a magnetic layer; and

the test seat is arranged corresponding to the probe card and comprises a wafer test platform and an electromagnet, the electromagnet is arranged below the wafer test platform, and the magnetic force generated by the electromagnet can adsorb the plurality of probes to the wafer test platform.

2. The magnetic-type probe card device of claim 1, wherein: the magnetic layer is a nickel layer, a cobalt layer or a rhodium layer.

3. The magnetic-type probe card device of claim 1, wherein: each probe comprises a connecting part and a testing part, the testing part is vertically connected with the connecting part, and the magnetic layer is laid on the connecting part and corresponds to the position of the testing part.

4. The magnetic-type probe card device of claim 1, wherein: the wafer test platform comprises a probe card and a test seat, wherein the probe card is arranged on the test seat, the test seat is arranged on the wafer test platform, the wafer test platform comprises a plurality of electromagnets, the electromagnets are arranged on the test seat, the electromagnets are arranged on the electromagnets, and the electromagnets are connected with the controller.

5. The magnetic-type probe card device of claim 1, wherein: the substrate of the probe card is provided with a test opening, and the plurality of probes are arranged in the test opening in a ring arrangement or array manner.

6. The magnetic-type probe card device of claim 4, wherein: the substrate of the probe card is provided with a plurality of wires which are respectively connected with the plurality of probes and the controller.

7. The magnetic-type probe card device of claim 1, wherein: the probe card and the test seat are arranged on the machine table, and the machine table is provided with a moving device which is connected with the test seat so as to control the test seat to move.