CN101995525A - Testing device and method - Google Patents
Testing device and method Download PDFInfo
- Publication number
- CN101995525A CN101995525A CN 200910194612 CN200910194612A CN101995525A CN 101995525 A CN101995525 A CN 101995525A CN 200910194612 CN200910194612 CN 200910194612 CN 200910194612 A CN200910194612 A CN 200910194612A CN 101995525 A CN101995525 A CN 101995525A
- Authority
- CN
- China
- Prior art keywords
- probe
- proving installation
- microscope
- objective table
- measured device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides a testing device. The testing device comprises a base, an electrically testing part, a microscope fixer and a microscope, wherein the electrically testing part is arranged on the base; the microscope fixer is fixed on the base; the microscope is fixed above the electrically testing part through the microscope fixer; the electrically testing part comprises an objective table and probes; the objective table is used for fixing a tested device; and the probes are fixed in the objective table and are used for testing the electrical characteristic of the tested device. By the testing device and a testing method provided by the invention, micro electro mechanical products can be electrically tested and the functions of the internal mechanical structure of the micro electro mechanical products can be tested. The testing device substitutes a plurality of probes fixed in the objective table for a probe card used in the traditional electrically testing method, so the testing cost is greatly reduced.
Description
Technical field
The present invention relates to integrated circuit and MEMS (micro electro mechanical system) field tests, particularly a kind of proving installation and method of testing thereof.
Background technology
In the manufacture process of semiconductor integrated circuit apparatus, before this integrated device electronics is encapsulated, for whether the electrical specification in whole or in part of checking this equipment is accurate, usually need be to this testing equipment.Testing apparatus generally includes tester and probe.Probe is the interface between tester and the Devices to test, is electrically connected interior electric signal exploring block of tester and the test pressure welding point on the Devices to test.Traditional probe is the printed circuit board (PCB) that has much thin probe, and probe is made by tungsten usually, and the physics that is undertaken by probe and Devices to test contacts with electricity, Devices to test is tested the current delivery of pressure welding point and is given tester.But (Micro Electro Mechanical System, developing rapidly MEMS) proposed new requirement to precise detection technology to MEMS (micro electro mechanical system).
MEMS (micro electro mechanical system) is the electromechanical integrated product that a kind of volume is very little, quality is very light, and it is measured with the micron is unit.Mainly comprise microsensor, actuator and corresponding treatment circuit three parts.It comes from the silicon Micrometer-Nanometer Processing Technology, is the product of multidisciplinary intersections such as microelectronics, material, machinery, chemistry, sensor, automatic control.The measuring technology of MEMS (micro electro mechanical system) and method have become one of key link of MEMS design, emulation, manufacturing and quality control and evaluation.Because MEMS has characteristics such as physical dimension is little, integrated level height, when adopting traditional probe that the MEMS product is carried out electrical testing, be in the product middle layer but not the MEMS product on surface for the test pressure welding point, probe might can't be deep on its test pressure welding point and finish effective electrical testing.Simultaneously, for inside also integrated for the MEMS product of small mechanical part, also need whether effectively its mechanical part is carried out functional test to determine the running of its mechanical part when it is carried out electrical testing, traditional proving installation can't not only be realized electrical testing but also realize functional test.Thereby development precision height, new means of testing simple and convenient, that cost is low have become pressing for of MEMS development.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of method of testing and device, possibly can't be applicable to the MEMS (micro electro mechanical system) product to solve existing proving installation and method, and can't not only realize electrical testing but also realize the problem of functional test.
For solving the problems of the technologies described above, the invention provides a kind of proving installation, comprise pedestal, the electrical testing parts, microscope fixator and microscope, described electrical testing parts are arranged on the described pedestal, described microscope fixator is fixed on the described pedestal, described microscope is fixed in the top of described electrical testing parts by described microscope fixator, described electrical testing parts comprise objective table and probe, described objective table is used for fixing measured device, and described probe stationary is tested the electrical specification of described measured device in described objective table.
Optionally, described probe comprises sleeve and syringe needle, and a distal process of described syringe needle is for described sleeve, and the other end of described syringe needle connects spring, and described spring is fixed in the described sleeve.
Optionally, described objective table comprises bearing bed, probe stationary layer and signal transport layer, fix by nut between described each layer, the surface of described bearing bed has draw-in groove, in order to place measured device, the bottom of described draw-in groove has first vacuum channel and first probe aperture of perforation, second probe aperture that has vertical perforation in the described probe stationary layer, the perforation of aliging with first probe aperture of described bearing bed of described second probe aperture, described probe is inserted in described second probe aperture and first probe aperture, the syringe needle of described probe projects upwards the bottom surface in described draw-in groove, has signal wire interface in the described signal transport layer, one end of described signal wire interface connects described probe, and the other end of described signal wire interface connects tester.
Optionally, described signal wire interface is a plurality of, comprises positive signal line interface and negative signal line interface.
Optionally, the bottom of described draw-in groove has first vacuum channel of perforation in addition, have the vacuum interface and second vacuum channel in the described probe stationary layer, one end of described second vacuum channel connects described vacuum interface, described vacuum interface connects vacuum extractor, the perforation of aliging with first vacuum channel of described bearing bed of the other end of described second vacuum channel.
Optionally, first probe aperture of described second probe aperture and the perforation of aliging with it is a plurality of, and its quantity and position are provided with according to the quantity and the position of the test pressure welding point of described measured device.
Optionally, the number of second vacuum channel of described first vacuum channel and the perforation of aliging with it is a plurality of, and its quantity and position can be provided with according to the size and dimension of described measured device.
Optionally, described bearing bed, probe stationary layer and signal transport layer adopt metal material.
Optionally, the material that adopts of described bearing bed, probe stationary layer and signal transport layer is an aluminium.
Optionally, described syringe needle is gold-plated material.
Optionally, described syringe needle is the round end material.
Optionally, increase by an insulative when described probe is inserted described second probe aperture and first probe aperture outside described probe, described insulative makes described probe place insulation fully between the part of described objective table and described objective table.
Optionally, the surface of described bearing bed, probe stationary layer and signal transport layer has channel for heat dissipation.
Optionally, described microscope is infrared microscope or charge-coupled device microscope.
The present invention also provides a kind of MEMS (micro electro mechanical system) product test method of using above-mentioned proving installation, may further comprise the steps:
Measured device is fixed on the objective table;
Use probe that described measured device is carried out electrical testing;
Provide power supply by described probe for described micro electronmechanical product, use the mechanical part function situation of the described micro electronmechanical product of microscopic inside, carry out functional test.
Proving installation provided by the invention and method of testing thereof can realize micro electronmechanical product is carried out electrical testing, also can realize simultaneously the function of micro electronmechanical product internal mechanical structure is tested.This proving installation adopts a plurality of probe stationary has been replaced the employed probe of traditional electrical method of testing in the mode of objective table, greatly reduces testing cost.Simultaneously because the test pressure welding point of micro electronmechanical product is positioned at the middle layer of product, adopt traditional probe possibly can't touch its test pressure welding point, and the probe on the proving installation of the present invention can well address this problem, and probe and test contacting between the pressure welding point is better.
Description of drawings
Fig. 1 is the side-looking structural representation of proving installation of the present invention;
Fig. 2 is the structural representation of objective table of the present invention;
Fig. 3 is the structural representation of probe of the present invention;
Fig. 4 is the structural representation as a kind of MEMS (micro electro mechanical system) product of measured device;
Fig. 5 is for being positioned over measured device the structural representation of electrical testing parts of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Proving installation of the present invention and method of testing thereof can utilize multiple substitute mode to realize; be to be illustrated below by preferred embodiment; certainly the present invention is not limited to this specific embodiment, and the known general replacement of one of ordinary skilled in the art is encompassed in protection scope of the present invention undoubtedly.
Secondly, the present invention utilizes synoptic diagram to describe in detail, and when the embodiment of the invention was described in detail in detail, for convenience of explanation, synoptic diagram was disobeyed the local amplification of general ratio, should be with this as limitation of the invention.
See also Fig. 1, Fig. 1 is the side-looking structural representation of proving installation of the present invention.As shown in Figure 1, proving installation of the present invention comprises pedestal 1, electrical testing parts 2, microscope fixator 3 and microscope 4.Described electrical testing parts 2 are arranged on the described pedestal 1, be used to carry measured device and the electrical specification of measured device is tested, described microscope fixator 3 is fixed on the described pedestal 1, be used for fixing described microscope 4, described microscope 4 is fixed in the top of described electrical testing parts 2 by described microscope fixator 3, and described microscope 4 can be infrared microscope or charge-coupled device microscope.
See also Fig. 2 and Fig. 3, Fig. 2 is the structural representation of objective table of the present invention, and Fig. 3 is the structural representation of probe of the present invention.Electrical testing parts 2 of the present invention comprise objective table 5 and probe 6.Described objective table 5 is used for fixing measured device, and described probe 6 is fixed in the described objective table, and the electrical specification of described measured device is tested.
As shown in Figure 2, described objective table 5 comprises bearing bed 7, probe stationary layer 8 and signal transport layer 9, and is fixing by nut 10 between described each layer.Described each layer all adopts metal material, and selected material needs to reduce noise effect, has good thermolysis simultaneously, and preferred material is an aluminium.Heat radiation requirement when carrying out high-current test in order to satisfy, the surface of described each layer also can be designed to have the surface of crisscross channel for heat dissipation, to increase the area of dissipation of each laminar surface.
The surface of described bearing bed 7 has recessed draw-in groove 11, and in order to place measured device, the bottom of described draw-in groove 11 has first vacuum channel 13 and first probe aperture 16 of perforation.
Have the vacuum interface 15 and second vacuum channel 14 in the described probe stationary layer 8, one end of described second vacuum channel 14 connects described vacuum interface 15, described vacuum interface 15 is used to connect the vacuum extractor (not shown), the perforation of aliging with first vacuum channel 13 of described bearing bed 7 of the other end of described second vacuum channel 14.Measured device is by being passed to the pull of vacuum fixed placement of first vacuum channel 13 in draw-in groove 11 by the vacuum interface 15 and second vacuum channel 14.Adopt vacuum suction fixedly the mode of measured device can effectively reduce the contact area of measured device and draw-in groove 11, avoid infringements such as measured device generation scratch, pollution and wearing and tearing.The number of second vacuum channel 14 of described first vacuum channel 13 and the perforation of aliging with it can be for a plurality of, and its quantity and position can be provided with according to the size and dimension of measured device, so that measured device can be by more firm being adsorbed in the draw-in groove 11.The perforation of aliging with first probe aperture 16 of described bearing bed 7 of second probe aperture 17 that also has vertical perforation in the described probe stationary layer 8, described second probe aperture 17, described probe 6 is inserted in described second probe aperture 17 and first probe aperture 16.According to the test needs of measured device, first probe aperture 16 of described second probe aperture 17 and the perforation of aliging with it can be for a plurality of, and its quantity and position are provided with according to the quantity and the position of the test pressure welding point of described measured device.
Have signal wire interface in the described signal transport layer 9, an end of described signal wire interface connects described probe, and the other end of described signal wire interface connects tester.Described signal wire interface can comprise positive signal line interface 18 and negative signal line interface 19 for a plurality of.The quantity of described positive signal line interface 18 and negative signal line interface 19 is determined according to the quantity of the probe of installing on the described probe stationary layer 86, a positive signal line interface 18 or a negative signal line interface 19 connect a described probe 6, by described positive signal line interface 18 and negative signal line interface 19 test signal that described probe 6 tests obtain are sent to the tester (not shown).
As shown in Figure 3, probe 6 of the present invention comprises sleeve 20 and syringe needle 21, one distal process of described syringe needle 21 is for described sleeve 20, the other end of described syringe needle 21 connects spring, described spring is fixed in the described sleeve 20, described syringe needle 21 is used for contacting with the test pressure welding point of measured device, because the lower end of described syringe needle 21 has connected spring, make the length of whole probe have certain retractility, thereby when measured device during to described syringe needle 21 application of forces, the reacting force of spring will make described syringe needle 21 with measured device good the contact can be arranged.Described syringe needle 21 is preferred to adopt gold-plated round end syringe needle, can better contact with measured device to guarantee described syringe needle 21, also is convenient to control the size of the pin trace that described syringe needle 21 stays on the test pressure welding point of measured device simultaneously.Because described objective table 5 also is a metal material, when guaranteeing to test described probe 6 can with described objective table 5 insulation, when in the described objective table 5 of described probe 6 insertions, using, also need to increase outside described probe 6 an insulative (not shown), described insulative need make described probe 6 place part and 5 insulation fully of described objective table of described objective table 5.When described probe 6 was inserted second probe aperture 17 of described objective table 5 and first probe aperture 16, the syringe needle 21 of described probe 6 projected upwards in the bottom surface of described draw-in groove 11.
See also Fig. 4, Fig. 4 is the structural representation as a kind of MEMS (micro electro mechanical system) product of measured device.As shown in Figure 4, measured device 12 comprises protective seam 22, device layer 23 and lower protective layer 24.The circuit structure and the physical construction that comprise this product in the described device layer 23; test pressure welding point 25 is positioned on the described device layer 23; position corresponding to described test pressure welding point 25 on the described upward protective seam 22 has test pressure welding point perforate 26, and the test pressure welding point 25 that is positioned on the described device layer 23 is come out.Have the perforate 27 of observation on the described lower protective layer 24, described observation perforate 27 itself can be the opening that leads to its internal mechanical structure on this micro electronmechanical product, can be observed the function situation of the physical construction of this micro electronmechanical product inside by observation perforate 27.
Please in conjunction with referring to Fig. 1 and Fig. 5, Fig. 5 is for being positioned over measured device the structural representation of electrical testing parts of the present invention.When adopting above-mentioned proving installation that above-mentioned MEMS (micro electro mechanical system) product is tested; at first; described measured device 12 is positioned in the described draw-in groove 11; the last protective seam 22 of described measured device 12 makes the test pressure welding point 25 of described measured device 12 can contact with the probe 6 of installation on the described objective table 5 by test pressure welding point perforate 26 in the face of the bottom surface of the draw-in groove 11 on the described objective table 5.Open the described vacuum extractor that described vacuum interface 15 connects, the pull of vacuum that is passed to described first vacuum channel 13 by described second vacuum channel 14 tightly is adsorbed in described measured device 12 in the described draw-in groove 11.Because pull of vacuum is to the effect of described measured device 12, the syringe needle 21 of described probe 6 touches described test pressure welding point 25 and is subjected to certain acting force, thereby make the length of spring compressed in the sleeve 20 of described probe 6, the screen resilience of spring makes described syringe needle 21 better contact with described test pressure welding point 25.The test signal of described probe 6 is passed to tester by described positive signal line interface 18 and negative signal line interface 19, finishes the electrical testing to measured device 12.Secondly, because described probe 6 provides power supply for described measured device 12, make the physical construction running of described measured device 12 inside, thereby after finishing electrical testing, use the microscope 4 of described proving installation to carry out observation test, finish functional test described measured device 12 by the function situation of the physical construction of 27 pairs of described measured devices of the observation perforate on the described measured device 12,12 inside.Itself do not possess the situation of observing perforate 27 for described measured device 12, can adopt infrared microscope that the function situation of the physical construction of described measured device 12 inside is tested observation.
Because the objective table of proving installation of the present invention 5 minutes is for 9 three layers of bearing bed 7, probe stationary layer 8 and signal transport layers, fixing between described each layer by nut 10, such hierarchical design can be adjusted the spacing of each layer flexibly, thereby can be further the high and low position of 25 of probe 6 and measured device test pressure welding point be adjusted, made probe 6 engaged test pressure welding point better 25.Simultaneously, the very convenient dismounting of this hierarchical design after probe 6 reaches serviceable life or damages, can be taken the probe that more renews apart with above-mentioned three layers easily.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (15)
1. proving installation, comprise pedestal, the electrical testing parts, microscope fixator and microscope, described electrical testing parts are arranged on the described pedestal, described microscope fixator is fixed on the described pedestal, described microscope is fixed in the top of described electrical testing parts by described microscope fixator, it is characterized in that, described electrical testing parts comprise objective table and probe, described objective table is used for fixing measured device, and described probe stationary is tested the electrical specification of described measured device in described objective table.
2. proving installation as claimed in claim 1 is characterized in that described probe comprises sleeve and syringe needle, and a distal process of described syringe needle is for described sleeve, and the other end of described syringe needle connects spring, and described spring is fixed in the described sleeve.
3. proving installation as claimed in claim 1 or 2, it is characterized in that, described objective table comprises bearing bed, probe stationary layer and signal transport layer, fix by nut between described each layer, the surface of described bearing bed has draw-in groove, in order to place measured device, the bottom of described draw-in groove has first vacuum channel and first probe aperture of perforation, second probe aperture that has vertical perforation in the described probe stationary layer, the perforation of aliging with first probe aperture of described bearing bed of described second probe aperture, described probe is inserted in described second probe aperture and first probe aperture, the syringe needle of described probe projects upwards the bottom surface in described draw-in groove, have signal wire interface in the described signal transport layer, an end of described signal wire interface connects described probe, and the other end of described signal wire interface connects tester.
4. proving installation as claimed in claim 3 is characterized in that, described signal wire interface is a plurality of, comprises positive signal line interface and negative signal line interface.
5. proving installation as claimed in claim 3, it is characterized in that, the bottom of described draw-in groove has first vacuum channel of perforation in addition, have the vacuum interface and second vacuum channel in the described probe stationary layer, one end of described second vacuum channel connects described vacuum interface, described vacuum interface connects vacuum extractor, the perforation of aliging with first vacuum channel of described bearing bed of the other end of described second vacuum channel.
6. proving installation as claimed in claim 3 is characterized in that, first probe aperture of described second probe aperture and the perforation of aliging with it is a plurality of, and its quantity and position are provided with according to the quantity and the position of the test pressure welding point of described measured device.
7. proving installation as claimed in claim 5 is characterized in that, the number of second vacuum channel of described first vacuum channel and the perforation of aliging with it is a plurality of, and its quantity and position can be provided with according to the size and dimension of described measured device.
8. proving installation as claimed in claim 3 is characterized in that, described bearing bed, probe stationary layer and signal transport layer adopt metal material.
9. proving installation as claimed in claim 8 is characterized in that, the material that described bearing bed, probe stationary layer and signal transport layer adopt is an aluminium.
10. proving installation as claimed in claim 2 is characterized in that, described syringe needle is gold-plated material.
11. proving installation as claimed in claim 2 is characterized in that, described syringe needle is the round end material.
12. proving installation as claimed in claim 8, it is characterized in that, increase by an insulative when described probe is inserted described second probe aperture and first probe aperture outside described probe, described insulative makes described probe place insulation fully between the part of described objective table and described objective table.
13. proving installation as claimed in claim 3 is characterized in that, the surface of described bearing bed, probe stationary layer and signal transport layer has channel for heat dissipation.
14. proving installation as claimed in claim 1 is characterized in that, described microscope is infrared microscope or charge-coupled device microscope.
15. a MEMS (micro electro mechanical system) product test method of using arbitrary proving installation among the claim 1-15 may further comprise the steps:
Measured device is fixed on the objective table;
Use probe that described measured device is carried out electrical testing;
Provide power supply by described probe for described micro electronmechanical product, use the mechanical part function situation of the described micro electronmechanical product of microscopic inside, carry out functional test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910194612 CN101995525B (en) | 2009-08-26 | 2009-08-26 | Testing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910194612 CN101995525B (en) | 2009-08-26 | 2009-08-26 | Testing device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101995525A true CN101995525A (en) | 2011-03-30 |
| CN101995525B CN101995525B (en) | 2013-03-13 |
Family
ID=43785946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910194612 Expired - Fee Related CN101995525B (en) | 2009-08-26 | 2009-08-26 | Testing device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101995525B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102749570A (en) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | Wafer test device and wafer test method for probe station |
| CN103091514A (en) * | 2011-10-27 | 2013-05-08 | 无锡华润上华科技有限公司 | Manual operated probe station structure |
| CN107589305A (en) * | 2017-10-17 | 2018-01-16 | 南京恒电电子有限公司 | A kind of test system and operating method of mini-pads silicon substrate PIN junction capacitances |
-
2009
- 2009-08-26 CN CN 200910194612 patent/CN101995525B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103091514A (en) * | 2011-10-27 | 2013-05-08 | 无锡华润上华科技有限公司 | Manual operated probe station structure |
| CN102749570A (en) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | Wafer test device and wafer test method for probe station |
| CN107589305A (en) * | 2017-10-17 | 2018-01-16 | 南京恒电电子有限公司 | A kind of test system and operating method of mini-pads silicon substrate PIN junction capacitances |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101995525B (en) | 2013-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9329205B2 (en) | High-precision semiconductor device probing apparatus and system thereof | |
| KR101267145B1 (en) | Probe Card | |
| KR101149760B1 (en) | a probe | |
| CN204514967U (en) | A kind of PCB test connector | |
| TW201040539A (en) | Testing system and testing method | |
| JP2002139529A (en) | Electric resistance measuring connector, and electric resistance measuring device and measuring method for circuit board | |
| CN102749570A (en) | Wafer test device and wafer test method for probe station | |
| CN104880658B (en) | Test device for acceleration transducer | |
| CN101995525B (en) | Testing device and method | |
| CN106771969A (en) | A kind of FPC touch screen base plate Open Short test devices and method | |
| TW200801530A (en) | Air bridge structures and method of making and using air bridge structures | |
| CN105548852B (en) | Semiconductor evaluating apparatus and its evaluation method | |
| CN100474577C (en) | Base board and electric test method therefor | |
| TW201617626A (en) | Testing base | |
| US9915682B2 (en) | Non-permanent termination structure for microprobe measurements | |
| TWI274165B (en) | Probe card interposer | |
| CN205958702U (en) | Half consent test jig of PCB | |
| CN209044015U (en) | A kind of high-precision quasi core piece design analytical equipment | |
| CN112782438A (en) | Magnetic suction type probe card device | |
| CN209460301U (en) | A kind of probe station | |
| CN102621463B (en) | Support plate with airtight conducting holes used for semiconductor testing device and manufacture method thereof | |
| JP2005207861A (en) | Testing device for power semiconductor element, and test method using it | |
| CN206330995U (en) | Wafer sort needle stand structure-improved | |
| TWI364541B (en) | Direct-docking probing device | |
| KR200486766Y1 (en) | Test socket |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20200826 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |