CN214360245U

CN214360245U - Ceramic suspension beam type MEMS micro-heating plate

Info

Publication number: CN214360245U
Application number: CN202022854959.5U
Authority: CN
Inventors: 井华; 谷文; 陈红林
Original assignee: Suzhou Maimaosi Sensor Technology Co ltd
Current assignee: Suzhou Maimaosi Sensor Technology Co ltd
Priority date: 2020-12-02
Filing date: 2020-12-02
Publication date: 2021-10-08
Anticipated expiration: 2030-12-02

Abstract

The utility model relates to a sensor technical field, concretely relates to pottery cantilever beam formula MEMS micro-heating board. The device comprises a monocrystalline silicon substrate, a ceramic suspension beam layer, a heating wire layer, an insulating layer and a test layer. The ceramic cantilever beam layer is printed, dried and calcined on a monocrystalline silicon substrate, the shape of the heating wire layer is defined through a photoresist homogenizing photoetching technology, the heating wire layer is deposited on the ceramic cantilever beam layer through a magnetron sputtering technology, the insulating layer is deposited on the heating wire layer through PECVD (plasma enhanced chemical vapor deposition), the shape of the testing layer is defined through the photoresist homogenizing photoetching technology, the testing layer is deposited on the ceramic insulating layer through the magnetron sputtering technology, the back surface of the monocrystalline silicon substrate is etched and formed to form an etched part, and the ceramic cantilever beam structure of the ceramic cantilever beam layer is formed in a suspension mode. The utility model discloses a have lower coefficient of heat conductivity and harder ceramic material as the hanging beam structure of the little hot plate of MEMS, than traditional division of heat-insulating groove monocrystalline silicon hanging beam little hot plate, thermal-insulated effect is showing, and overall structure is more reliable, through the pottery hanging beam effectively can reduce self consumption.

Description

Ceramic suspension beam type MEMS micro-heating plate

Technical Field

The utility model relates to a sensor technical field, concretely relates to pottery cantilever beam formula MEMS micro-heating board.

Background

The micro-hotplate is a common micro-heating platform, and the basic structure of the micro-hotplate comprises a suspended dielectric film and a thin film resistor line. When an electric current is passed through the thin-film resistive tracks, part of the resistive, joule heating generated is used to heat the micro-hotplate and another part is dissipated in the surrounding environment in the form of conduction, convection and thermal radiation.

With the continuous development of MEMS technology and microelectronic technology, micro-hotplates are widely used due to their great advantages of array fabrication process, small volume, low power consumption and easy combination of other materials, such as micro gas sensors, micro accelerometers, micro barometers, and thin film calorimetric card meters. Among them, the micro-hotplate accounts for the largest proportion in the application of micro gas sensors.

In the prior art, the main research focus of the micro-hotplate is to reduce the power consumption as much as possible, on one hand, a vacuum heat insulation layer, a heat insulation groove or a heat insulation layer made of other materials is added at the bottom of a heating layer. Such as those disclosed in utility model 201710126277.2 and utility model 201420399824.6. On the other hand, researchers have also reduced power consumption by reducing the heat loss of the target heat conduction, for example, a diamond layer with very high heat conductivity and insulation is added between the heating electrode and the gear shaping electrode layer as disclosed in utility model 201920113696.7, which finally achieves the effect of reducing power consumption.

Most of the research directions of the micro-heating plates are suspended film micro-heating plates which are favored because of the lower heat loss of the suspended film micro-heating plates. However, in the use process of the suspended membrane type micro-hotplate, the suspended membrane structure is warped unevenly due to expansion with heat and contraction with cold caused by long-term power-on and power-off, so that many adverse effects are caused, such as resistance change of a heating wire, falling of a sensitive material in the use of the gas sensor, and the like.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide an adoption has lower leading-in coefficient and the little hot plate of MEMS of harder pottery conduct hanging beam structure.

The utility model provides a technical scheme that its technical problem adopted is:

a ceramic cantilever beam type MEMS micro-hotplate is characterized in that: the method comprises the following steps: single crystal silicon substrate

The ceramic cantilever beam layer is printed, dried and calcined on the monocrystalline silicon substrate;

heating a wire layer and an electrode end thereof, and depositing the heating wire layer and the electrode end thereof on the ceramic suspension beam layer through magnetron sputtering;

an insulating layer deposited on the heating wire layer by a vapor deposition method;

the test layer and the electrode end thereof are deposited on the insulating layer through magnetron sputtering;

and carving the specified position of the monocrystalline silicon substrate to enable the ceramic suspension beam structure of the ceramic suspension beam layer to be formed in a suspension manner.

Further, the ceramic suspension beam layer is two groups of I-shaped suspension beams or four groups of X-shaped suspension beams.

Further, the thickness of the ceramic suspended beam layer is 50-800 μm.

Further, the thickness of the heating filament layer and the test layer is 50-500 nm.

Further, the thickness of the insulating layer is 100-800 nm.

Further, the insulating layer is a silicon oxide layer or a silicon nitride layer.

The utility model has the advantages that:

1. the suspended beam structure of the MEMS micro-hot plate is made of the ceramic material with lower heat conductivity coefficient and hardness, compared with the traditional monocrystalline silicon suspended beam micro-hot plate with the heat insulation groove, the MEMS micro-hot plate has the advantages that the heat insulation effect is remarkable, the whole structure is more reliable, and the self power consumption can be effectively reduced through the ceramic suspended beam.

2. The ceramic and the monocrystalline silicon substrate are combined by adopting printing, drying and calcining processes, so that the process is simple and reliable, and the cost is lower.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a method for manufacturing a four-suspension beam according to an embodiment of the present invention;

FIG. 3 is a schematic view of a method for manufacturing two groups of suspension beams according to an embodiment of the present invention;

FIG. 4 is a schematic view of the present invention;

labeled as:

1. the device comprises a monocrystalline silicon substrate, 2, a ceramic cantilever beam layer, 3, a heating wire layer, 4, an insulating layer, 5, a testing layer, 101, a cavity, 201, a cantilever beam structure, 301, a heating wire electrode end, 501, a testing layer electrode end, 6 and sensitive materials.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

A ceramic suspended beam type MEMS micro-hotplate is shown in figure 1 and comprises a monocrystalline silicon substrate 1, a ceramic suspended beam layer 2, a heating wire layer 3, an insulating layer 4 and a test layer 5. The ceramic suspension beam layer 2 is printed, dried and calcined on the monocrystalline silicon substrate 1, the heating wire layer 3 defines the shape thereof through the photoresist-homogenizing photoetching technology and is deposited on the ceramic suspension beam layer 2 through the magnetron sputtering technology, the insulating layer 4 is deposited on the heating wire layer 2 through PECVD (vapor deposition method), the testing layer 5 defines the shape thereof through the photoresist-homogenizing photoetching technology and is deposited on the ceramic insulating layer 4 through the magnetron sputtering technology, the testing layer 5 adopts a fork tooth electrode as the testing layer, the back of the monocrystalline silicon substrate 1 is etched and formed to form a cavity 101, and the ceramic suspension beam structure 201 of the ceramic suspension beam layer 2 is formed in a suspension manner.

The utility model discloses in, two sets of pottery suspension beam that pottery suspension beam layer 2 can adopt I shape hang the roof beam, perhaps adopt four group's pottery suspension beam of X shape, I shape pottery suspension beam middle width enlarges as the functional area, and X type pottery suspension beam middle cross portion is used for preparing above-mentioned zone of heating, insulating layer and test layer above the functional area as the functional area.

The thickness of the ceramic suspended beam layer 2 is 50-800 μm, the thickness of the heating wire layer 3 and the testing layer 5 is 50-500nm, the thickness of the insulating layer 4 is 100-800nm, and the insulating layer 4 adopts a silicon oxide layer or a silicon nitride layer with good structural strength and insulating and heat-insulating properties as the insulating layer.

As shown in fig. 2, the manufacturing method of the ceramic cantilever MEMS micro-hotplate of the present invention is as follows:

s1: cleaning a single crystal silicon substrate 1; the monocrystalline silicon substrate is easily cleaned by acid solution, organic solvent, deionized water and the like and then dried, and the size of the monocrystalline silicon substrate is a common size which can be 2 inches, 4 inches, 6 inches or 8 inches and the like.

S2: preparing a ceramic cantilever beam layer 2, and printing: printing ceramic slurry on the monocrystalline silicon substrate in a regular pattern, and adopting two groups of suspension beams or four groups of suspension beam structures; the single crystal silicon substrate 1 is patterned by screen printing with a ceramic paste, the ceramic paste is formed by mixing glass, a ceramic material and an organic solvent in proportion, the printing thickness is 50-800 microns, and the cantilever beam pattern is shown as S2 in FIG. 2. Wherein, the width of the suspended beam structure on the ceramic suspended beam layer is 2% -30% of the width of the micro-hot plate, and the preferential width of the micro-hot plate is 3.4%. Drying: then, primarily drying the printed ceramic slurry; the drying temperature is 50-200 ℃, and the drying time is 2-24 h. And (3) calcining: finally, calcining the ceramic slurry subjected to primary drying to form a ceramic layer; the calcination temperature is 450-1400 ℃, and the time is 2-24 h. The calcination is beneficial to the compactness and hardness of the cantilever ceramic layer 2, and the cantilever ceramic layer can have good adhesive force with the monocrystalline silicon substrate 1, thereby ensuring the reliability and stability of the ceramic layer.

S3: preparing a heating wire layer 3 and an electrode end 301 thereof, defining the shape and the position of a heating layer and the electrode end thereof on the ceramic suspension beam layer by a photoresist-homogenizing photoetching technology, depositing a metal heating wire layer and the electrode end thereof by a magnetron sputtering technology, and removing residual photoresist by a stripping process; the metal heating wire is deposited by using platinum or gold.

S6: preparing an insulating layer 4, and depositing an insulating layer on the heating wire layer by adopting a vapor deposition method; and adopting a PECVD technology to deposit a silicon oxide layer or a silicon nitride layer with the thickness of 100-.

S7: preparing a test layer 5 and an electrode end 501 thereof, and preparing the test layer and the electrode end thereof by adopting the step S5; after deposition of the test layer, the remaining photoresist was also removed by a glass process.

S8: and etching and forming, namely etching through the back of the monocrystalline silicon substrate at the set position by using concentrated sulfuric acid by adopting wet etching to obtain the ceramic suspended beam type micro-hot plate.

As shown in fig. 3, it is a schematic flow chart of the preparation method of the two groups of ceramic suspension beam structures of the present invention.

As shown in fig. 4, for the utility model discloses use the schematic diagram, coating sensitive material 6 on the later stage retest layer 5, can form ceramic cantilever beam gas sensor, again with it encapsulate the shaping can.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A ceramic cantilever beam type MEMS micro-hotplate is characterized in that: the method comprises the following steps: a single crystal silicon substrate (1);

the ceramic cantilever beam layer (2) is printed, dried and calcined on the monocrystalline silicon substrate (1);

the heating wire layer (3) and the electrode end (301) thereof are deposited on the ceramic cantilever beam layer (2) through magnetron sputtering;

an insulating layer (4) deposited on the heating wire layer (3) by a vapor deposition method;

the test layer (5) and the electrode end (501) thereof are deposited on the insulating layer (4) through magnetron sputtering;

and carving the specified position of the monocrystalline silicon substrate (1) to enable the ceramic cantilever beam structure (201) of the ceramic cantilever beam layer (2) to be formed in a suspended mode.

2. A ceramic cantilever beam MEMS micro-hotplate according to claim 1, wherein: the ceramic suspension beam layer (2) is two groups of I-shaped suspension beams or four groups of X-shaped suspension beams.

3. A ceramic cantilever beam MEMS micro-hotplate according to claim 1, wherein: the thickness of the ceramic suspended beam layer (2) is 50-800 μm.

4. A ceramic cantilever beam MEMS micro-hotplate according to claim 1, wherein: the thickness of the heating wire layer (3) and the test layer (5) is 50-500 nm.

5. A ceramic cantilever beam MEMS micro-hotplate according to claim 1, wherein: the thickness of the insulating layer (4) is 100-800 nm.

6. A ceramic cantilever MEMS micro-hotplate according to one of claims 1-5, wherein: the insulating layer (4) is a silicon oxide layer or a silicon nitride layer.