CN214336904U - Antenna packaging structure with horizontal and vertical dual radiation directions - Google Patents

Abstract

The utility model provides an antenna packaging structure with horizontal and vertical dual radiation directions, which comprises a rewiring layer, an antenna array layer, a plastic packaging material layer, a solder ball lug and a chip; the antenna array layer is positioned on the first surface of the rewiring layer, is electrically connected with the metal wire layer, and comprises a plurality of first antennas and second antennas which are respectively arranged in an array; the first antenna radiates along the horizontal direction, and the second antenna radiates along the vertical direction; the first antenna comprises a plurality of first metal sheets extending along a first direction and a plurality of second metal sheets extending along a second direction; two ends of the second metal sheet are respectively connected with the first metal sheet; the second antenna comprises a third metal sheet and a metal column; the plastic packaging material layer is located on the first surface of the rewiring layer. The utility model discloses the antenna of radiation along horizontal direction and vertical direction is followed in the simultaneous design for the side and the front that the packaging body can be followed to the antenna radiate simultaneously, can increase antenna radiation wavelength, improve antenna design elasticity, help improving the device performance.

Description

Antenna packaging structure with horizontal and vertical dual radiation directions

Technical Field

The utility model relates to a semiconductor package technical field especially relates to a horizontal perpendicular dual radiation direction's antenna packaging structure.

Background

With the arrival of the 5G communication and artificial intelligence era, the data volume to be transmitted and processed by high-speed interaction of chips applied to the related fields is larger and larger, the requirements on the mobile internet and the internet of things are stronger and stronger, and the miniaturization and the multi-functionalization of electronic terminal products become a large trend of industrial development. How to integrate and package different kinds of high-density chips together to form a system with powerful functions and small volume power consumption has become a great challenge in the field of advanced packaging of semiconductor chips.

Since Fan-out package (Fan-out) technology can integrate multiple chips and has better performance than carrier-based system-in-package, the Fan-out package technology is widely applied to the future 5G rf front-end chip integrated package. Fan-Out Wafer Level Packaging (FOWLP) combines the advantages of Fan-Out Packaging and Wafer Level Packaging technologies, can fully meet the requirements of people on multiple functions, high performance, high energy efficiency, low cost and small size of electronic devices, and is one of the most promising Packaging technologies for meeting the requirements of mobile and network application electronic devices.

In order to further reduce the device area, the antenna has been integrated into a fan-out wafer level package structure, but in the prior art, only the antenna design in the vertical radiation direction is usually adopted, and the plastic package (molding) thickness has a process limit, so that the design difficulty of the antenna is increased, and further miniaturization of the device is hindered.

SUMMERY OF THE UTILITY MODEL

In view of the above prior art's shortcoming, the utility model aims to provide a horizontal perpendicular dual radiation direction's antenna packaging structure for only adopt the antenna design of vertical radiation direction among the fan-out type packaging structure of solution prior art, there is the processing procedure limit because of plastic envelope thickness, make the design degree of difficulty of antenna increase the scheduling problem.

In order to achieve the above objects and other related objects, the present invention provides an antenna package structure with horizontal and vertical dual radiating directions, which includes: the rewiring layer is provided with a first surface and a second surface which are opposite, and comprises a dielectric layer and a metal wire layer which is positioned in the dielectric layer and on the surface of the dielectric layer; the antenna array layer is positioned on the first surface of the rewiring layer and is electrically connected with the metal wire layer; the antenna array layer comprises a plurality of first antennas and a plurality of second antennas, and the first antennas and the second antennas are respectively arranged in an array; the first antenna radiates in the horizontal direction, and the second antenna radiates in the vertical direction; the first antenna comprises a plurality of first metal sheets extending along a first direction and a plurality of second metal sheets extending along a second direction, and the first direction is not parallel to the second direction; the plurality of first metal sheets are arranged in parallel at intervals, the plurality of second metal sheets are arranged in parallel at intervals, and two ends of each second metal sheet are respectively connected with the first metal sheets; the second antenna comprises a third metal sheet and a metal column, the metal column extends longitudinally, the third metal sheet is positioned at the top of the metal column, and the radiation surface of the third metal sheet is parallel to the horizontal plane; the plastic packaging material layer is positioned on the first surface of the rewiring layer and is used for plastic packaging the antenna array layer; the solder ball bump is positioned on the second surface of the rewiring layer and is electrically connected with the metal wire layer; and the chip is electrically connected with the solder ball bump.

Optionally, the antenna package structure in the horizontal and vertical dual radiation directions further includes an under bump metal layer, where the under bump metal layer is located on the second surface of the redistribution layer, and two ends of the under bump metal layer are electrically connected to the metal wire layer and the solder ball bump, respectively.

Optionally, the antenna package structure in the horizontal and vertical dual radiation directions further includes an underfill layer, where the underfill layer is located between the chip and the solder ball bump.

Optionally, the first metal sheet and the second metal sheet are both two.

Optionally, the under bump metallurgy layer includes a chromium layer, a chromium-copper layer, and a copper layer from bottom to top.

Optionally, the material of the first antenna and the second antenna includes one or more of gold, silver, and copper.

Optionally, the first direction and the second direction are perpendicular.

Optionally, the plurality of first antennas are arranged in multiple rows and multiple columns, the plurality of second antennas are arranged in a linear shape, and the second antennas are located between the first antennas.

As described above, the utility model discloses a horizontal perpendicular dual radiation direction's antenna packaging structure designs the antenna along horizontal direction and vertical direction radiation simultaneously for the side and the front of packaging body can be followed to the antenna direction and the radiation is carried out simultaneously, can increase antenna radiation wavelength, can improve antenna design elasticity, helps improving the device performance. Compare in the present device that only has the vertical radiation direction, the utility model discloses can reduce the thickness of plastic packaging material layer under the condition that reaches the equivalent performance, help the further miniaturization of device.

Drawings

Fig. 1 is a flowchart illustrating an exemplary manufacturing process of a method for manufacturing a horizontal and vertical dual radiation direction antenna package structure according to the present invention.

Fig. 2 to 11 are schematic exemplary structural diagrams presented in steps of the manufacturing process flow of fig. 1, wherein fig. 10 and 11 are schematic exemplary cross-sectional structural diagrams of the antenna package structure from different positions in the horizontal and vertical dual radiation directions provided by the present invention.

Description of the element reference numerals

11 support base

12 Release layer

13 protective layer

14 dielectric layer

141 opening

15 Metal wire layer

16 first antenna

161 first metal sheet

162 second metal sheet

17 layer of a plastic encapsulant

18 solder ball bump

19 chip

20 under bump metallurgy

21 second antenna

211 third metal sheet

212 metal post

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structure are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. Where the description of numerical ranges is referred to in this specification, the endpoints are included unless otherwise specified.

In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

The existing fan-out wafer level packaged antenna structure usually only adopts a single design in a vertical radiation direction, and in order to improve the performance of the antenna, the antenna is usually required to be ensured to have a certain height, so that the plastic packaging material layer potential of the plastic packaging antenna is required to be made very thick to ensure the complete plastic packaging antenna, but the existing plastic packaging material layer has a thickness process limit, so that the design of the antenna is limited. Thus, the utility model provides an improve the countermeasure.

Specifically, as shown in fig. 1, the utility model provides a horizontal vertical dual radiation direction's antenna packaging structure, its preparation method includes following steps:

s1: providing a support substrate 11, and forming a separation layer on the support substrate 11, wherein the obtained structure is shown in fig. 2 and fig. 3;

s2: forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a dielectric layer 14 and a metal wire layer 15 positioned in the dielectric layer 14 and on the surface of the dielectric layer 14, and the obtained structure is shown in fig. 4;

s3: forming an antenna array layer on the redistribution layer, wherein the antenna array layer is electrically connected with the metal wire layer 15 (the metal wire layer is used as an antenna feeder); the antenna array layer comprises a plurality of first antennas 16 and a plurality of second antennas 21 (namely, the first antennas 16 and the second antennas 21 are both a plurality of antennas), and the plurality of first antennas 16 and the plurality of second antennas 21 are respectively arranged in an array; the first antenna 16 radiates in the horizontal direction and the second antenna 21 radiates in the vertical direction; the first antenna 16 includes a plurality of first metal sheets 161 extending along a first direction and a plurality of second metal sheets 162 extending along a second direction, the first direction is not parallel to the second direction; the plurality of first metals 161 are arranged in parallel at intervals, the plurality of second metal sheets 162 are arranged in parallel at intervals, and two ends of each second metal sheet 162 are respectively connected with the first metal sheets 161; the second antenna 21 comprises a third metal sheet 211 and a metal column 212, the metal column 212 extends along the longitudinal direction, the third metal sheet 211 is positioned at the top of the metal column 211, the third metal sheet 211 and the metal column 211 are in electrical contact, and the radiation surface of the third metal sheet 211 is parallel to the horizontal plane;

s4: forming a plastic packaging material layer 17, and plastic packaging the antenna array layer by the plastic packaging material layer 17 to obtain a structure shown in fig. 6;

s5: removing the support substrate 11 and the separation layer, the resulting structure being shown in fig. 8;

s6: forming solder ball bumps 18 on the surface of the redistribution layer away from the antenna array layer, wherein the solder ball bumps 18 are electrically connected with the metal wire layer 15, and the obtained structure is shown in fig. 9;

s7: the chip 19 is attached to the solder ball bump 18, and the resulting structure is shown in fig. 10 and 11, where fig. 10 and 11 are schematic cross-sectional structures from two different positions (as can be understood in conjunction with the structure of fig. 7).

The utility model discloses the antenna of horizontal direction and vertical direction radiation is followed in the simultaneous design for the side that the packaging body can be followed to the antenna and openly radiate simultaneously, can increase antenna radiation wavelength, can improve antenna design elasticity, helps improving the device performance, compares in the present device that only has the vertical direction of radiation and compares, the utility model discloses can reduce the thickness of plastic packaging material layer under the condition that reaches the equivalent performance, help the further miniaturization of device.

The support substrate 11 plays a supporting role as the name implies, and avoids the defects of bending deformation and the like in the device preparation process. By way of example, the support substrate includes, but is not limited to, a glass substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, a metal substrate, and the like, which have a certain hardness and are not easily bent. In this embodiment, a transparent substrate such as a glass substrate is preferable, which facilitates subsequent irradiation of UV light from the back surface of the support substrate 11 for peeling the separation layer to peel the support substrate 11 from the separation layer. The support substrate 11 may be washed and dried before the separation layer is prepared.

In one example, the separation layer includes a release layer 12 and a protection layer 13, the release layer 12 is formed on a surface of the support substrate 11, and the protection layer 13 is formed on a surface of the release layer 12 facing away from the support substrate 11, for protecting the release layer 12. Of course, in other examples, the separation layer may be provided only with the release layer 12. In a further example, the release layer 12 includes, but is not limited to, a combination of one or more of a carbon material layer, a resin material layer, and an organic material layer, and the protective layer 13 includes, but is not limited to, a polyimide layer. For example, the supporting substrate 11 is a transparent substrate such as a glass substrate, the release layer 12 is a UV resin layer, and the release layer 12 may be irradiated from the back surface of the supporting substrate 11 to be peeled off in the subsequent peeling, thereby achieving peeling. The release layer 12 may also be an LTHC light-to-heat conversion layer, and the subsequent step may be heating the LTHC light-to-heat conversion layer based on a laser, etc., so as to separate the supporting substrate 11 from the LTHC light-to-heat conversion layer, thereby reducing the difficulty of the stripping process and preventing the device from being damaged. The method for forming the release layer 12 and the protective layer 13 may be determined according to the material thereof, and may be selected from spin coating, spray coating, direct attachment, and the like.

By way of example, the material of the dielectric layer 14 includes, but is not limited to, one or a combination of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass, and may also be other high-K dielectric materials; the material of the metal wire layer 15 includes, but is not limited to, one or more of gold, silver, copper, aluminum, and the like. The dielectric layer 14 is formed by a method including, but not limited to, vapor deposition, and the metal wire layer 15 is formed by a method including, but not limited to, sputtering, electroplating, electroless plating, and the like. In one example, the process of forming the metal wiring layer includes: firstly, forming the dielectric layer 14 on the separation layer, then forming an opening corresponding to the metal wire layer 15 in the dielectric layer 14 by adopting a photoetching process, and then forming a metal material layer in the opening and on the surface of the dielectric layer 14 to form the metal wire layer 15. The dielectric layer 14 and the metal wire layer 15 may be of a single-layer or multi-layer structure, but it is necessary to ensure that the metal wire layers 15 of different layers are electrically connected with each other.

In an example, after the redistribution layer is formed, a step of forming an Under Bump Metallurgy (UBM) layer 20 on a surface of the redistribution layer is further included, where the under bump metallurgy layer 20 is electrically connected to the metal line layer 15, and the antenna array layer is formed on a surface of the under bump metallurgy layer 20 and electrically connected to the under bump metallurgy layer 20. The under bump metal layer 20 may have a single-layer or multi-layer structure, and the method for forming the under bump metal layer 20 includes, but is not limited to, one or a combination of a sputtering method and an electroplating method. For example, in an example, the under bump metal layer 20 includes a chromium layer, a chromium-copper (50% to 50%) layer, and a copper layer from bottom to top, and a very thin gold layer may be further disposed on the surface of the under bump metal layer 20 to prevent oxidation of the copper layer. The bottom of the under bump metal layer 20 may be further provided with a diffusion layer, such as a lead-tin alloy layer, and according to different application requirements, a eutectic compound or other components may be further selected to achieve better electrical contact between the under bump metal layer 20 and the metal wire layer 15.

As an example, forming the antenna array layer may include the steps of:

forming an antenna metal layer on the redistribution layer by a method including but not limited to sputtering or electroplating, wherein the material of the antenna metal layer includes but not limited to a single metal or a metal alloy of gold, silver, copper, and the like;

coating a photoresist layer on the antenna metal layer, and exposing and developing the photoresist layer to define the positions and the shapes of the first antenna 16 and the second antenna 21 in the antenna metal layer;

and etching the antenna metal layer to form the antenna array layer.

In one example, as shown in fig. 7, the first metal sheet 161 and the second metal sheet 162 are two, and the first direction and the second direction are perpendicular to each other. The first metal sheet 161 and the second metal sheet 162 both extend along the horizontal direction (the length of the extension along the horizontal direction is greater than the height of the extension along the longitudinal direction), that is, the surfaces with relatively large surface areas (in this embodiment, the surfaces are rectangular surfaces) are perpendicular to the horizontal plane (the width of the surface parallel to the horizontal plane is small, for example, less than 5000nm), the first metal sheet 161 has the function of guiding and amplifying electromagnetic waves as an array, the second metal sheet 162 plays the function of radiating electromagnetic waves, and radiates the electromagnetic waves outwards along the horizontal direction during operation, and the plastic package material located between the metal sheets plays the function of a propagation medium, so as to propagate the electromagnetic waves radiated from the surface of the second metal sheet 162 along the horizontal direction (for example, the direction indicated by the arrow in fig. 7). The metal pillar 212 of the second antenna 21 acts as an oscillator to guide and amplify the electromagnetic waves, and the third metal sheet 211 acts to radiate the electromagnetic waves, which are radiated outward in the vertical direction during operation, and the electromagnetic waves radiated from the surface of the third metal sheet 211 are radiated in the vertical direction by the guide and amplification of the metal pillar 211. Of course, in other examples, the first antenna and the second antenna may also adopt other structures, which is not strictly limited.

In one example, the plurality of first antennas 16 are arranged in a plurality of rows and columns (e.g., a 2X2 array), and the plurality of second antennas 21 are arranged linearly (i.e., in a single row and column or a plurality of rows and columns configuration), thereby further improving antenna performance. In a further example, the array of second antennas 21 is located in the middle of the array of first antennas 16, which contributes to the stability of the device structure and the improvement of the device performance.

As an example, the method of forming the molding compound layer 17 includes, but is not limited to, a combination of one or more of compression molding, transfer molding, liquid encapsulation molding, vacuum lamination, and spin coating, and the material of the molding compound layer 17 may include a combination of one or more of polyimide, silicone, and epoxy. After the plastic package material layer 17 is formed, planarization treatment may be performed on the plastic package material layer 17 by a grinding or polishing method, so as to facilitate subsequent processes.

After the plastic packaging material layer 17 is formed, the supporting substrate 11 and the separation layer are removed by one or more methods including, but not limited to, a grinding method, a laser irradiation method, a heating method, and the like, according to the material of the supporting substrate 11 and the separation layer. If the aforementioned protective layer is formed, it can be removed simultaneously in this step.

In an example, after removing the support substrate 11 and the separation layer, a step of forming an opening 141 in the dielectric layer 14 is further included, the opening 141 exposes the metal wire layer 15, and the solder ball bump 18 is formed in the opening 141. For example, laser etching is used to form the opening 141, and then ball mounting (ball mount) is used to form the solder ball bump 18 in the opening 141, which helps to further ensure good electrical contact between the solder ball bump 18 and the metal wire layer 15. The material of the solder bump 18 includes, but is not limited to, tin, gold, copper or tin, gold, copper alloy.

By way of example, the chip 19 may be soldered to the solder ball bumps 18 using a mechanical compression bonding (die bond) method including, but not limited to, flash high temperature. The chip 19 includes, but is not limited to, various types of active and passive components, such as power devices, resistors, capacitors, etc., and the chip 19 may be single or plural.

In an example, before or after forming the chip 19, an underfill layer may be further formed between the solder ball bumps 18 and the chip 19 to form a good protection for the chip 19 and the solder ball bumps 18. Such as by forming a seal ring oxide layer between the chip 19 and the solder ball bumps 18 using, but not limited to, capillary filling after the chip 19 is attached. Or before attaching the chip 19, an underfill layer is formed between the surface of the solder ball bump 18 and the solder ball bump 18, then laser etching is used to form openings in the underfill layer to expose the solder ball bump 18, and then the chip 19 is soldered to the surface of the solder ball bump 18 through the openings.

The utility model provides a two radiation direction's of horizontal vertical antenna packaging structure can adopt in aforementioned arbitrary scheme method preparation, so the aforesaid is right antenna packaging structure's introduction can quote so far throughout, does not give unnecessary details for succinct purpose as far as possible. Of course, the antenna package structure may also be prepared based on other methods, and is not developed one by one here.

Specifically, as shown in fig. 10, the antenna package structure with horizontal and vertical dual radiation directions includes: the rewiring layer is provided with a first surface and a second surface which are opposite, and comprises a dielectric layer 14 and a metal wire layer 15 which is positioned in the dielectric layer 14 and on the surface of the dielectric layer 14; an antenna array layer on the first surface of the redistribution layer, the antenna array layer being electrically connected to the metal wire layer 15 (the metal wire layer acting as an antenna feed); the antenna array layer comprises a plurality of first antennas 16 and a plurality of second antennas 21 (namely, the first antennas 16 and the second antennas 21 are both a plurality of antennas), and the plurality of first antennas 16 and the plurality of second antennas 21 are respectively arranged in an array; the first antenna 16 radiates in the horizontal direction and the second antenna 21 radiates in the vertical direction; the first antenna 16 includes a plurality of first metal sheets 161 extending along a first direction and a plurality of second metal sheets 162 extending along a second direction, the first direction is not parallel to the second direction; the plurality of first metal sheets 161 are arranged in parallel at intervals, the plurality of second metal sheets 162 are arranged in parallel at intervals, and two ends of the second metal sheets 162 are respectively connected with the first metal sheets 161; the second antenna 21 comprises a third metal sheet 211 and a metal column 212, the metal column 212 extends along the longitudinal direction, the third metal sheet 211 is positioned at the top of the metal column 211, the third metal sheet 211 and the metal column 211 are in electrical contact, and the radiation surface of the third metal sheet 211 is parallel to the horizontal plane; a molding compound layer 17 located on the first surface of the redistribution layer and molding the antenna array layer in a plastic (which may be fully coated or partially coated, for example, the second antenna may be exposed on the surface of the molding compound layer and the first antenna is completely coated by the molding compound layer); a solder ball bump 18 on the second surface of the re-wiring layer and electrically connected to the metal wire layer 15; and a chip 19 electrically connected to the solder ball bumps 18.

By way of example, the dielectric layer 14 includes, but is not limited to, any one or combination of an epoxy layer, a silicone layer, a PI layer (polyimide layer), a PBO layer (polyphenylene benzoxazole layer), a BCB layer (benzocyclobutene layer), a silicon oxide layer, a phosphosilicate glass layer, a fluorine-containing glass layer; the metal wire layer 15 includes, but is not limited to, a combination of one or more of gold, silver, copper, aluminum, and the like.

By way of example, the antenna 16 may be made of a single metal or a metal alloy, such as gold, silver, or copper.

In an example, the antenna package structure with horizontal and vertical dual radiation directions further includes an under bump metal layer 20, where the under bump metal layer 20 is located on the second surface of the redistribution layer, and two ends of the under bump metal layer 20 are electrically connected to the metal wire layer 15 and the solder ball bump 18, respectively. In one example, the ubm layer 20 includes, from bottom to top, a chromium layer, a chromium-copper (50% to 50%) layer, and a copper layer.

In one example, the structure of the horizontal-vertical dual radiating direction antenna 16 further includes an underfill layer, which is located between the chip 19 and the solder ball bump 18.

As an example, the first metal sheet 161 and the second metal sheet 162 are both two. And by way of example, the first and second directions are perpendicular. The surfaces of the first metal sheet 161 and the second metal sheet 162 perpendicular to the horizontal plane are rectangular surfaces, and the areas of the surfaces are far larger than the areas of the surfaces parallel to the horizontal plane. Alternatively, it can be described that each of the first and second metal sheets 161 and 162 includes a first surface and a second surface perpendicular to each other, the first surface being a surface parallel to a horizontal plane and the second surface being a surface perpendicular to the horizontal plane, the second surface having an area larger than that of the first surface. That is, the first metal sheet 161 and the second metal sheet 162 are thin plates, and both have a length greater than their height and width. The radiation surface of the third metal sheet can be a rectangular surface, and the first antenna and the second antenna are preferably made of the same material.

In one example, the plurality of first antennas 16 are arranged in a plurality of rows and columns (e.g., a 2X2 array), and the plurality of second antennas 21 are arranged linearly (i.e., in a single row and column or a plurality of rows and columns configuration), thereby further improving antenna performance. In a further example, the array of second antennas 21 is located in the middle of the array of first antennas 16, which contributes to the stability of the device structure and the improvement of the device performance.

By providing antennas that radiate in the horizontal and vertical directions, respectively (i.e., the antenna direction can radiate from the side and front of the package), the flexibility of antenna design can be improved, which helps to improve device performance. Compare with the device that only has vertical direction radiation antenna now, under the condition that realizes the same device performance, the utility model discloses can reduce the thickness of plastic packaging material layer, help further reducing of device size.

To sum up, the utility model provides a horizontal perpendicular dual radiation direction's antenna packaging structure, include: the rewiring layer is provided with a first surface and a second surface which are opposite, and comprises a dielectric layer and a metal wire layer which is positioned in the dielectric layer and on the surface of the dielectric layer; the antenna array layer is positioned on the first surface of the rewiring layer and is electrically connected with the metal wire layer; the antenna array layer comprises a plurality of first antennas and a plurality of second antennas, and the first antennas and the second antennas are respectively arranged in an array; the first antenna radiates in the horizontal direction, and the second antenna radiates in the vertical direction; the first antenna comprises a plurality of first metal sheets extending along a first direction and a plurality of second metal sheets extending along a second direction, and the first direction is not parallel to the second direction; the plurality of first metal sheets are arranged in parallel at intervals, the plurality of second metal sheets are arranged in parallel at intervals, and two ends of each second metal sheet are respectively connected with the first metal sheets; the second antenna comprises a third metal sheet and a metal column, the metal column extends longitudinally, the third metal sheet is positioned at the top of the metal column, and the radiation surface of the third metal sheet is parallel to the horizontal plane; the plastic packaging material layer is positioned on the first surface of the rewiring layer and is used for plastic packaging the antenna array layer; the solder ball bump is positioned on the second surface of the rewiring layer and is electrically connected with the metal wire layer; and the chip is electrically connected with the solder ball bump. The utility model discloses the antenna of radiation along horizontal direction and vertical direction is followed in the simultaneous design for the side and the front of packaging body can be followed to the antenna direction and radiated simultaneously, can increase antenna radiation wavelength, can improve antenna design elasticity, help improving the device performance. Compare in the present device that only has the vertical radiation direction, the utility model discloses can reduce the thickness of plastic packaging material layer under the condition that reaches the equivalent performance, help the further miniaturization of device.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (7)

1. The utility model provides a two radiating direction's of horizontal vertical antenna packaging structure, its characterized in that, two radiating direction's of horizontal vertical antenna packaging structure includes:

the rewiring layer is provided with a first surface and a second surface which are opposite, and comprises a dielectric layer and a metal wire layer which is positioned in the dielectric layer and on the surface of the dielectric layer;

the antenna array layer is positioned on the first surface of the rewiring layer and is electrically connected with the metal wire layer; the antenna array layer comprises a plurality of first antennas and a plurality of second antennas, and the first antennas and the second antennas are distributed in an array arrangement; the first antenna radiates in the horizontal direction, and the second antenna radiates in the vertical direction; the first antenna comprises a plurality of first metal sheets extending along a first direction and a plurality of second metal sheets extending along a second direction, and the first direction is not parallel to the second direction; the plurality of first metal sheets are arranged in parallel at intervals, the plurality of second metal sheets are arranged in parallel at intervals, and two ends of each second metal sheet are respectively connected with the first metal sheets; the second antenna comprises a third metal sheet and a metal column, the metal column extends longitudinally, the third metal sheet is positioned at the top of the metal column, and the radiation surface of the third metal sheet is parallel to the horizontal plane;

the plastic packaging material layer is positioned on the first surface of the rewiring layer and is used for plastic packaging the antenna array layer;

the solder ball bump is positioned on the second surface of the rewiring layer and is electrically connected with the metal wire layer;

and the chip is electrically connected with the solder ball bump.

2. The antenna package structure of claim 1, wherein: the antenna packaging structure with the horizontal and vertical double radiation directions further comprises an under bump metal layer, wherein the under bump metal layer is located on the second surface of the rewiring layer, and two ends of the under bump metal layer are electrically connected with the metal wire layer and the solder ball bumps respectively.

3. The antenna package structure of claim 2, wherein: the under bump metal layer includes a chromium layer, a chromium-copper layer, and a copper layer from bottom to top.

4. The antenna package structure of claim 1, wherein: the first antenna and the second antenna are made of a material including one or more of gold, silver and copper.

5. The structure of claim 1, wherein the structure further comprises an underfill layer, and the underfill layer is located between the chip and the solder ball bump.

6. The antenna package structure of claim 1, wherein: the first metal sheet and the second metal sheet are two, and the first direction is perpendicular to the second direction.

7. The structure of any one of claims 1-6, wherein: the plurality of first antennas are arranged in multiple rows and multiple columns, the plurality of second antennas are arranged in a linear mode, and the second antennas are located between the first antennas.

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