CN214335607U

CN214335607U - Electronic device

Info

Publication number: CN214335607U
Application number: CN202120710746.7U
Authority: CN
Inventors: 耿景卓
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-04-07
Filing date: 2021-04-07
Publication date: 2021-10-01
Anticipated expiration: 2031-04-07

Abstract

An electronic device is provided. The electronic device comprises a middle frame, an adhesive piece and a bent cover plate. The middle frame comprises a first assembling surface and a first outer surface which are connected, and a step groove is formed between the first assembling surface and the first outer surface; the bonding piece is arranged in the step groove; the bent cover plate comprises a body and a bent part connected with the periphery of the body in a bent mode, and one end, far away from the body, of the bent part forms a second assembling surface. The first assembling surface and the second assembling surface are oppositely arranged, and the first assembling surface and the second assembling surface are in adhesive connection through an adhesive piece; and the second outer surface of the curved cover plate, the third outer surface of the adhesive member, and the first outer surface constitute a smooth surface. The position that this application was seted up through changing the step groove has got rid of the existence of center outer peripheral edges boss, makes the surface that center, bonding member and crooked apron can constitute smooth transition, has improved electronic equipment's roughness.

Description

Electronic device

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to electronic equipment.

Background

When an electronic device is assembled, a step groove is usually formed in the middle frame, and then the cover plate is assembled into the step groove. However, the middle frame is provided with a boss protruding out of the appearance surface of the cover plate at the transition position of the middle frame and the cover plate, so that the cover plate and the middle frame cannot be in smooth transition, a user can generate scraping hand feeling when touching the appearance surface, and the use experience of the electronic equipment is reduced.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides an electronic device, including a middle frame, an adhesive member, and a curved cover plate; the middle frame comprises a first assembling surface and a first outer surface which are connected, and a step groove is formed between the first assembling surface and the first outer surface; the bonding piece is arranged in the step groove; the bent cover plate comprises a body and a bent part in bent connection with the periphery of the body, and a second assembling surface is formed at one end, far away from the body, of the bent part;

the first assembling surface and the second assembling surface are oppositely arranged, and the first assembling surface and the second assembling surface are in adhesive connection through the adhesive piece; and the second outer surface of the curved cover plate, the third outer surface of the adhesive member, and the first outer surface constitute a smooth surface.

According to the electronic equipment, the position of the step groove is changed, and the step groove is formed between the first assembly surface and the first outer surface. Thus, the outer periphery of the middle frame is not provided with the lug boss. Therefore, the first outer surface, the second outer surface and the third outer surface can form a smooth surface, even if the appearance surfaces of the bending part, the bonding part and the middle frame form a continuous and integral surface, the existence of the boss is avoided, further, the defects of collision, paint falling and the like in the production and manufacturing processes are avoided, and the yield is improved. And when a user touches the appearance surface of the electronic equipment, the scraping hand feeling can not be generated, and the flatness and the use experience of the electronic equipment are improved.

In addition, this application is owing to not having the existence of boss, and bonds center and crooked apron with the bonding piece, consequently compare in the prior art and can avoid the existence of gap between center and the crooked apron, has further improved smooth transition's between center and the crooked apron effect, has promoted electronic equipment roughness, has more improved electronic equipment's waterproof performance.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a schematic sectional view taken along a-a direction in fig. 2.

Fig. 4 is a partial schematic view of fig. 3.

Fig. 5 is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present application.

Fig. 6 is a schematic partial cross-sectional view of an electronic device according to yet another embodiment of the present application.

Fig. 7 is a schematic partial cross-sectional view of an electronic device according to yet another embodiment of the present application.

Fig. 8 is a schematic partial cross-sectional view of an electronic device in accordance with yet another embodiment of the present application.

FIG. 9 is a top view of a center frame, a support member, and an adhesive member according to an embodiment of the present application.

Fig. 10 is a schematic partial cross-sectional view of an electronic device in accordance with yet another embodiment of the present application.

Fig. 11 is a schematic partial cross-sectional view of an electronic device in accordance with yet another embodiment of the present application.

Fig. 12 is a schematic partial cross-sectional view of an electronic device in accordance with yet another embodiment of the present application.

Fig. 13 is a schematic partial cross-sectional view of an electronic device in accordance with yet another embodiment of the present application.

Fig. 14 is a schematic cross-sectional view of an electronic device in accordance with yet another embodiment of the present application.

Fig. 15 is a process flow diagram of a method of assembling an electronic device according to an embodiment of the present disclosure.

Fig. 16-19 are schematic diagrams corresponding to S100, S200, S300, and S400, respectively.

Fig. 20 is a process flow diagram included in S300 according to an embodiment of the present disclosure.

Fig. 21 is a process flow diagram included in S200 in an embodiment of the present application.

Description of reference numerals:

the electronic device-1, the middle frame-10, the frame-11, the inner surface-111, the first assembly surface-112, the first outer surface-113, the first containing space-12, the step groove-13, the bottom surface-131, the second sub-assembly surface-131 a, the second bending surface-131 b, the first sub-bending surface 131c, the second sub-bending surface-131 d, the adhesive-20 a, the third outer surface-21, the bent cover plate-30, the bent portion-31, the second assembly surface-311, the second outer surface-312, the body-32, the second containing space-33, the first sub-assembly surface-34, the first bending surface-35, the support member-60, the support member-600, the barrier member-70, the first limiting surface-71, the display screen comprises a second limiting surface-72, a display screen-80, a rear shell-90, a first mark-91, a second mark-92 and an accommodating space-93.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Before the technical solutions of the present application are introduced, the technical problems in the related art will be described in detail.

With the continuous development of electronic devices, electronic devices are now popular with users due to their portability and rich and varied operability. But at the same time, the expectations and requirements of users for electronic devices are also increasing. For example, electronic devices generally include a center frame and a curved cover plate, which are assembled by first forming a deeper stepped groove in the center frame, then fitting the curved cover plate into the stepped groove, and bonding the center frame and the curved cover plate together with an adhesive disposed in the stepped groove.

In practice, however, the middle frame needs to be wider than the curved cover plate, so that the middle frame will have a convex curved cover plate profile at the transition to the curved cover plate. When the boss size is too wide, the whole size is influenced to be beautiful. Too narrow a boss dimension can again affect its strength and manufacturability. The design width currently used in the industry is 0.15-0.3 mm. However, regardless of the width of the boss, as long as the boss exists, the curved cover plate and the middle frame cannot be in smooth transition, and a user can generate scraping hand feeling when touching the outer surface, so that the use experience of the electronic device is reduced. In addition, because the size of boss is very little, so in manufacturing and use, there is the boss deformation, bad risk such as fall lacquer.

And, because the existence of boss can make and form a whole circle of small gap between step groove inner wall and the crooked apron outer wall, not only can influence electronic equipment's outward appearance performance like this, still can reduce electronic equipment's waterproof performance.

In addition, because the curved cover plate and the middle frame are bonded together by the adhesive, the filling consistency of the adhesive to the gaps of the middle frame and the curved cover plate is very difficult to control. When the adhesive is too little, the adhesive in the gap is little, and a user can see the bottom color of the middle frame. When the amount of the adhesive is excessive, the glue may not uniformly overflow the metal boss, resulting in poor glue overflow. And because the outer wall of the bent cover plate and the lug boss form a step structure, the residual glue at the corner is not easy to erase.

In view of the above, the present application provides an electronic device to solve the above problems. Referring to fig. 1 to 4 together, fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure. Fig. 2 is a top view of fig. 1. Fig. 3 is a schematic sectional view taken along a-a direction in fig. 2. Fig. 4 is a partial schematic view of fig. 3. The present embodiment provides an electronic apparatus 1. The electronic device 1 includes a middle frame 10, an adhesive member 20, and a curved cover plate 30. The middle frame 10 comprises a first assembling surface 112 and a first outer surface 113 which are connected, and a step groove 13 is formed between the first assembling surface 112 and the first outer surface 113. The adhesive member 20 is disposed in the step groove 13. The curved cover 30 includes a body 32 and a curved portion 31 connected to the periphery of the body 32, and an end of the curved portion 31 away from the body 32 forms a second mounting surface 311. The first mounting surface 112 and the second mounting surface 311 are oppositely arranged, and the first mounting surface 112 and the second mounting surface 311 are adhesively connected through the adhesive 20; and the second outer surface 312 of the curved cover plate 30, the third outer surface 21 of the adhesive member 20, and the first outer surface 113 constitute a smooth surface.

The electronic device 1 provided in the present embodiment includes, but is not limited to, a mobile terminal such as a mobile phone, a tablet Computer, a notebook Computer, a palmtop Computer, a Personal Computer (PC), a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a smart watch, and a pedometer, and a fixed terminal such as a Digital TV and a desktop Computer. This application uses electronic equipment 1 to signal for the intelligent wrist-watch.

The electronic device 1 provided in the present embodiment includes a middle frame 10. The middle frame 10 may serve to support the curved cover 30 and the rear case 90, and the middle frame 10 may also provide a foundation for mounting and protecting other components of the electronic device 1. Optionally, the middle frame 10 comprises a plurality of frames 11 connected in series. That is, the middle frame 10 is formed by surrounding a plurality of frames 11 end to end, and it can also be understood that the middle frame 10 is formed by surrounding a circle of frames 11. Further optionally, the middle frame 10 includes four side frames 11 respectively forming four sides of the middle frame 10. In addition, the middle frame 10 provided in the present embodiment may not include a bottom side, that is, the region surrounded by the frame 11 is vertically connected.

Wherein the middle frame 10 has a plurality of surfaces, such as an inner surface 111, a first mounting surface 112, a first outer surface 113, and the like. The inner surface 111 and the first outer surface 113 are oppositely arranged, and the first assembling surface 112 is connected with the inner surface 111 and the first outer surface 113 in a bending manner, that is, the inner surface 111, the first assembling surface 112 and the first outer surface 113 are sequentially connected in a bending manner. The inner surfaces 111 enclose a first receiving space 12. The first outer surface 113 may be understood as the outer surface opposite to the inner surface, i.e. the outer appearance surface of the electronic device 1. The first assembling surface 112 can be understood as a surface connecting the inner surface and the outer surface, i.e. the upper surface or the lower surface of the middle frame 10, and the first assembling surface 112 is taken as the upper surface for illustration in the present application. The present embodiment may form the step groove 13 on the first mounting surface 112 and the first outer surface 113, that is, the step groove 13 is formed on both the first mounting surface 112 and the first outer surface 113. In the present embodiment, the bottom surface 131 of the step groove 13 may be considered as a part of the first mounting surface 112.

In addition, the step groove 13 may be understood as a space formed by removing a portion of the structure of the upper surface and the design surface, and the space may be used to install other components such as the adhesive member 20. Further, since the stepped groove 13 is formed on both the upper surface and the outer surface, it can be understood that the stepped groove 13 of the present embodiment has a side wall only on one side close to the first housing space 12, and does not have a side wall on the other side. As for the side wall in the remaining direction of the stepped groove 13, the extent to which the stepped groove 12 penetrates the first fitting surface 112 is to be considered. When the step groove 13 is opened one turn around the first fitting surface 112, the step groove 12 is shaped like a circular ring at this time, and thus has no side wall in the remaining direction. Otherwise the step groove will also have side walls in the remaining direction. This can be adjusted to the actual situation. In addition, after the middle frame 10 and the curved cover plate 30 are coupled, the stepped groove 12 may be converted into a groove structure by the coupling of the surface of the middle frame 10 and the surface of the curved cover plate 30.

Alternatively, the middle frame 10 may be a plastic middle frame 10, for example, the middle frame 10 may be made of a thermoplastic or thermosetting plastic material. The middle frame 10 can be processed by an integral injection molding method, so that the middle frame 10 has the advantages of high processing precision and processing efficiency and low cost. Of course, it is understood that the middle frame 10 may be made of other materials such as metal, for example, the middle frame 10 is an aluminum alloy middle frame 10, so that the middle frame 10 and the curved cover plate 30 have the advantages of light weight and high strength. The specific material of the middle frame 10 in the embodiment of the present application is not limited, and those skilled in the art can select the material according to actual requirements.

The electronic device 1 provided in the present embodiment further includes a curved cover 30. Wherein the curved cover plate 30 is typically used to protect the display screen 80 and to encapsulate the electronic device 1. The curved cover plate 30 includes a body 32 and a curved portion 31, and the curved portion 31 is connected to the periphery of the body 32 by bending, so that the curved cover plate 30 forms a 2.5D curved cover plate 30 or a 3D curved cover plate 30, thereby making the edge of the curved cover plate 30 arc. In addition, the body 32 and the bent portion 31 enclose a second accommodating space 33, and the second accommodating space 33 can be used for accommodating partial devices. Alternatively, the curved portion 31 may have an arc shape, and the body 32 may have a linear shape or an arc shape.

Alternatively, the curved cover plate 30 may be a glass curved cover plate 30 or a plastic composite curved cover plate 30. The bent glass cover plate 30 has the advantages of high strength, good hardness and difficult deformation. The plastic composite bent cover plate 30 has the advantages of good toughness and ductility and low cost. The material of the curved cover plate 30 in the embodiment of the present application is not particularly limited, and may be set by those skilled in the art according to actual circumstances.

Further alternatively, the curved cover plate 30 may be a 2.5D composite curved cover plate 30, which is formed by using a polymer as a base material and adding a reinforcing material, a filler, and the like. For example, the curved cover plate 30 may be made of a composite material formed by mixing epoxy resin, calcium carbonate, glass fiber and other additives, so that the curved cover plate 30 has excellent properties of high strength, light weight, high weather resistance, acid and alkali resistance, corrosion resistance, wear resistance and the like. In practical applications, the curved cover plate 30 may be formed by integral injection molding. Because the precision of the integral injection molding is higher and the cost is lower, the bent cover plate 30 processed by the integral injection molding has the advantages of high precision and low cost correspondingly. In practical application, the processing mode of integral injection molding is adopted, so that the matching precision of the bent cover plate 30 and the middle frame 10 is higher, the assembly effect is better, and the problem of interference noise can be effectively reduced.

The electronic device 1 provided by the present embodiment further includes an adhesive member 20, the adhesive member 20 can perform a fixing and bonding function, the adhesive member 20 is disposed in the step groove 13, one end of the adhesive member 20 is bonded to the middle frame 10, and the other end is bonded to the curved cover plate 30. Optionally, the material of the bonding member 20 may be foam tape, epdm, or bonding glue, etc.

As can be seen from the above, since the curved cover plate 30 and the middle frame 10 cannot smoothly transit due to the presence of the bosses in the related art, the user feels a scratch when touching. Therefore, in the present embodiment, the position of the step groove 13 is changed, and the step groove 13 is formed on the first mounting surface 112 and the first outer surface 113 at the same time, so that the outer periphery of the middle frame 10 does not have a boss. Therefore, in the present embodiment, the surface of the curved portion 31 facing away from the second receiving space 33, the surface of the adhesive member 20 facing away from the first receiving space 12, and the first outer surface 113 form a smooth surface, even if the second outer surface 312 of the curved cover plate 30, the third outer surface 21 of the adhesive member 20, and the first outer surface 113 form a continuous and integral surface, the existence of a boss is avoided, and further, the defects such as bumping, paint dropping and the like in the production and manufacturing processes are avoided, and the yield is improved. And when a user touches the appearance surface of the electronic device 1, a scraping hand feeling is not generated, and the flatness and the use experience of the electronic device 1 are improved.

In addition, in the embodiment, because no boss exists, and the middle frame 10 and the curved cover plate 30 are bonded by the bonding piece 20, compared with the related art, the existence of a gap between the middle frame 10 and the curved cover plate 30 can be avoided, the smooth transition effect between the middle frame 10 and the curved cover plate 30 is further improved, the flatness of the electronic device 1 is improved, and the waterproof performance of the electronic device 1 is further improved. The waterproof property mentioned here refers to the ability of the electronic apparatus 1 to be placed in water at a certain depth for a certain period of time without water entering the inside of the electronic apparatus 1.

Optionally, the first outer surface 113 is a curved surface, the second outer surface 312 is a curved surface, the third outer surface 21 is a curved surface, and the first outer surface 113 is a curved surface. It is also understood that the second outer surface 312 of the curved cover plate 30, the third outer surface 21 of the adhesive member 20, and the first outer surface 113 constitute a smoothly curved surface.

Referring to fig. 4 again, in the present embodiment, the bottom surface 131 of the stepped groove 13 is bent to connect with the first outer surface 113, one end of the adhesive member 20 is adhered to the bottom surface 131, and the other end is adhered to the second mounting surface 311.

Since the stepped groove 13 of the present embodiment simultaneously penetrates at least a portion of the first mounting surface 112 and at least a portion of the first outer surface 113, the bottom surface 131 of the stepped groove 13 can be bent to connect the first outer surface 113, and at this time, one end of the adhesive member 20 can be adhered to the bottom surface 131 and the other end can be adhered to the bent cover plate 30. This arrangement of the adhesive member 20 in the closing direction of the curved cover plate 30 further improves the coupling performance of the center frame 10 and the curved cover plate 30. And the structure provided by the present embodiment supports the rubbing process due to the provision of the stepped groove 13 and the adhesive member 20. Wherein, frictioning technology indicates between two bonding parts, a little excessive glue, and after the part assembly target in place, the assembly clearance can be filled completely to glue, and the even product outside that overflows simultaneously, before glue solidifies, clears away unnecessary glue with cotton or tool. The stepped groove 13 provided by the embodiment has a simple structure, so that the glue can be well filled, and after the glue overflows, the whole surface of the stepped groove is smooth and transited because of the stepped structure formed by the absence of the boss. Therefore, the excessive residual glue and the excessive glue can be well removed, and the production yield is further improved.

Alternatively, the adhesive member 20 includes, but is not limited to, glue, which is in a liquid state in an initial state, and is gradually solidified after the bent cover plate 30 is bonded, thereby forming the adhesive member 20 in a solid state.

The above description describes the relation of the adhesive member 20 with the middle frame 10 and the curved cover plate 30, and the present application will continue to describe the relation between the assembling surfaces of the middle frame 10 and the curved cover plate 30.

Referring to fig. 5, fig. 5 is a partial cross-sectional view of an electronic device according to another embodiment of the present disclosure. In this embodiment, the second mounting surface 311 includes a first sub-mounting surface 34 and a first bending surface 35 connected in a bending manner, the first bending surface 35 is further connected in a bending manner to the second outer surface 312, and the first bending surface 35 is closer to the second outer surface 312 than the first sub-mounting surface 34; and the first bending surface 35 is bent toward a direction away from the middle frame 10 compared with the first sub-assembly surface 34.

The present embodiment first describes the curved cover plate 30. Here, the second fitting surface 311 of the curved cover 30 refers to a side surface of the curved portion 31 away from the body 32, which is not a regular horizontal structure, but is provided with a second outer surface 312, i.e., a first chamfered structure, at an edge connected to the second outer surface 312. It can also be understood that the first sub-assembly surface 34, the first bending surface 35, and the second outer surface 312 form a first chamfer structure, and the first bending surface 35 is a first chamfer surface. Moreover, the first bending surface 35 is bent towards a direction away from the middle frame 10 compared with the first sub-assembly surface 34, so that the angle of the edge of the bending portion 31 can be increased, the bending portion 31 is prevented from being too sharp, the process difficulty of bending the cover plate 30 is reduced, and the manufacturing and processing are facilitated. And the bent cover plate 30 is not easy to damage, scratch is prevented, and the service life of the bent cover plate 30 is prolonged.

Alternatively, the first bending surface 35 may be a slope, which further reduces the difficulty of the process of bending the cover plate 30.

Alternatively, the first bending surface 35 can be formed by preparing the second mounting surface 311 and the second outer surface 312 and then processing them, so that the second mounting surface 311 becomes the first sub-mounting surface 34 and the first bending surface 35 connected by bending. Alternatively, the first sub-assembly surface 34 and the first bending surface 35 are prepared during the process of preparing the curved cover plate 30.

Referring to fig. 6, fig. 6 is a partial cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, the bottom surface 131 of the step groove 13 includes a second sub-mounting surface 131a and a second bending surface 131b connected in a bending manner, the second bending surface 131b is further connected in a bending manner to the first outer surface 113, and the second bending surface 131b is closer to the first outer surface 113 than the second sub-mounting surface 131 a; and the second bending surface 131b is bent toward a direction closer to the bending portion 31 than the second sub-mounting surface 131 a.

The present embodiment will be described with reference to the middle frame 10. The assembly surface of the middle frame 10 is the bottom surface 131 of the middle frame 10 with the stepped groove 13. The bottom surface 131 of the stepped groove 13 according to the present embodiment is not a regular horizontal structure, but is composed of a second sub-mounting surface 131a and a second bending surface 131b connected by bending. The second sub-assembly surface 131a is a horizontal surface, the second bending surface 131b is an inclined surface, and the horizontal surface is close to the inner side and the inclined surface is close to the outer side. And the inclined direction of the inclined surface is inclined toward the direction of approaching the curved cover plate 30, that is, the second bending surface 131b is bent toward the direction of approaching the curved portion 31 compared to the second sub-assembly surface 131 a. It is also understood that the distance between the second bending surface 131b close to the second sub-mounting surface 131a and the second outer surface 312 is greater than the distance between the second bending surface 131b far from the second sub-mounting surface 131a and the second outer surface 312. Therefore, the inclined surface of the second bending surface 131b can be used as the sidewall of the other side of the step groove 13, so that when the adhesive is filled, the adhesive can be fixed in the step groove 13, and the adhesive is prevented from overflowing.

Referring to fig. 6 again, in the present embodiment, the first sub-mounting surface 34 is parallel to the second sub-mounting surface 131a, and the first bending surface 35 is parallel to the second bending surface 131 b.

In the present embodiment, in addition to the second sub-mounting surface 131a and the second bending surface 131b, the plane of the second sub-mounting surface 131a may be parallel to the fourth surface 34, and the inclined surface of the second bending surface 131b may be parallel to the fifth surface 35, that is, the mating surface of the bending portion 31 and the mating surface of the middle frame 10 are correspondingly disposed, so that the thickness of the adhesive can be kept consistent, the balance and stability of the connection between the middle frame 10 and the bent cover plate 30 can be improved, and the problem of stress concentration of the adhesive 20 can be prevented.

Referring to fig. 7, fig. 7 is a partial cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, the second bending surface 131b includes a first bending sub-surface 131c and a second bending sub-surface 131d, the second bending sub-surface 131d is further connected to the first outer surface 113 in a bending manner, and the second bending sub-surface 131d is closer to the first outer surface 113 than the first bending sub-surface 131 c; and the second sub-bending surface 131d is bent in a direction away from the bending portion 31 compared with the first sub-bending surface 131 c.

In this embodiment, a second chamfer structure may be further disposed at the connection point of the second bending surface 131b and the first outer surface 113, that is, the second bending surface 131b includes a first sub-bending surface 131c and a second sub-bending surface 131d connected in a bending manner, the first sub-bending surface 131c, the second sub-bending surface 131d, and the first outer surface 113 form the second chamfer structure, and the second sub-bending surface 131d is the second chamfer surface. Moreover, the second sub-bending surface 131d is bent toward a direction away from the bending portion 31 compared with the first sub-bending surface 131c, so that the angle of the edge of the middle frame 10 can be increased, thereby preventing the edge of the middle frame 10 from being too sharp, reducing the process difficulty of the middle frame 10, and facilitating the manufacturing process. And the middle frame 10 is not easy to damage, the scratch is prevented, and the service life of the middle frame 10 is prolonged.

Optionally, the second sub-bending surface 131d may be an inclined surface, so as to further reduce the process difficulty of the middle frame.

Alternatively, the second bending sub-surface 131d may be formed by preparing the second bending sub-surface 131b and the first outer surface 113 and then processing the second bending sub-surface 131b into the first bending sub-surface 131c and the second bending sub-surface 131d connected by bending. Or the first bending sub-surface 131c and the second bending sub-surface 131d may be formed during the process of manufacturing the middle frame 10 (e.g., injection molding).

The above description describes the structure of the middle frame 10 and the curved cover 30, and then the electronic device 1 may further add other structural members on the basis of the above structure, so as to further improve various performances of the electronic device 1.

Referring to fig. 8, fig. 8 is a partial cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, the electronic device 1 further includes a support member 60, and the support member 60 is disposed in the stepped groove 13 to support the second mounting surface 311, so that a predetermined distance is maintained between the second mounting surface 311 and the bottom surface 131 of the stepped groove 13.

In this embodiment, a support 60 may be additionally provided in the stepped groove 13. Wherein the supporting member 60 is provided on the bottom surface 131 of the step groove 13, and the second fitting surface 311 may be coupled to the supporting member 60. It is also understood that the second fitting surface 311 is not entirely connected to the adhesive member 20, but a portion of the surface is connected to the adhesive member 20, and the rest of the surface is provided on the supporting member 60. The support member 60 of the present embodiment is configured to rigidly support the curved cover plate 30 and the support member 60 during the assembling process, so as to ensure the uneven curved cover plate 30 caused by the uneven assembling force and the thickness consistency of the adhesive member 20. Secondly, the rigid support also effectively supports the inner area of the curved cover plate 30, ensuring high-level waterproof stress reliability.

In addition, the present embodiment provides three specific examples for the specific arrangement of the supporting member 60. In one embodiment, when the width of the bottom surface 131 of the step groove 13 in the direction parallel to the second mounting surface 311 is greater than the width of the second mounting surface 311, the supporting member 60 is required to be disposed for supporting. The embodiment is not limited to the position of the support 60 in the step groove 13.

In the second embodiment, when the width of the bottom surface 131 of the step groove 13 is larger than the width of the second fitting surface 311 in the direction parallel to the second fitting surface 311, the curved cover plate 30 may be supported by the adhesive member 20 without providing the supporting member 60. During the preparation process, the curved cover plate 30 is controlled to move slowly towards the middle frame 10 and after the curved cover plate is moved to a specified distance, the adhesive which is still in a liquid state can adhere to the curved cover plate 30, and after the liquid adhesive is solidified to become the adhesive 20, the adhesive 20 can be used for supporting the curved cover plate 30 without the support of the support 60.

In the third embodiment, when the width of the bottom surface 131 of the step groove 13 in the direction parallel to the second assembling surface 311 is smaller than the width of the second assembling surface 311, the protruding portion (i.e., the portion shaded with black in fig. 8) of the step groove 13 serves as the supporting member 60, and when the supporting member 60 is in an integral structure with the middle frame 10, the supporting member 60 may be regarded as a portion of the middle frame 10, but for the sake of convenience of the applicant, the structure of a portion of the middle frame 10 is named as the supporting member 60.

Referring to fig. 9, fig. 9 is a top view of a middle frame, a supporting member, and an adhesive member according to an embodiment of the present application. In this embodiment, the supporter 60 includes a plurality of supporting parts 600 arranged at intervals.

In the present embodiment, the support member 60 is not provided around the stepped groove 13, but the support member 600 is provided at a certain interval, and the support member 600 is provided in a partial region to achieve the effect of fixed support. As shown in fig. 9, the number of the frames 11 is 4, the number of the supporting portions 600 is 8, and 2 supporting portions 600 are provided on each frame 11. In addition, the adhesive member 20 may be disposed between two adjacent supporting portions 600 by the supporting portions 600, so that the connection performance between the middle frame 10 and the curved cover plate 30 may be further improved compared to a case where the supporting members 60 are disposed in a whole circle.

Referring to fig. 10, fig. 10 is a partial cross-sectional view of an electronic device according to still another embodiment of the present application. In this embodiment, the adhesive member 20 is further disposed on the supporting member 60, and the adhesive member 20 adheres the supporting member 60 and the curved cover plate 30.

In addition, during the assembly process, the adhesive member 20 may be disposed in the step groove 13, and in order to achieve the optimal adhesive performance, an excessive amount of the adhesive member 20 is usually filled, so that a portion of the adhesive member 20 disposed in the step groove 13 may overflow onto the supporting member 60, and the present embodiment may improve the connection effect between the curved cover plate 30 and the supporting member 60 by using the adhesive member 20.

Referring to fig. 11, fig. 11 is a partial cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, the electronic device 1 further includes a stopper 70, the stopper 70 is disposed in the second receiving space 33, the stopper 70 is disposed on the first mounting surface 112, or the stopper 70 is disposed on the support 60.

In the present embodiment, the electronic device 1 may further include a stopper 70, and the stopper 70 is disposed on the first mounting surface 112, or the stopper 70 is disposed on the support 60. It is also understood that the blocking member 70 is a protrusion disposed on the first mounting surface 112 or the supporting member 60. As can be seen from the above, filling an excessive amount of the adhesive member 20 may cause a portion of the adhesive member 20 to overflow onto the supporting member 60, so that the blocking member 70 may be used to block the portion of the adhesive member 20, so as to prevent the portion of the adhesive member 20 from entering the first accommodating space 12, and thus affecting other components in the electronic device 1. In the present embodiment, the stopper 70 is schematically provided on the first mounting surface 112.

Referring to fig. 12, fig. 12 is a partial cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, the electronic device 1 further includes a display screen 80, and the display screen 80 is disposed in the second accommodating space 33.

In the present embodiment, the electronic device 1 further includes a display screen 80, and the display screen 80 is a main component of the electronic device 1 that has a display function. In this embodiment, the display 80 can be disposed in the second receiving space 33, and thus the display 80 can be effectively protected by bending the cover plate 30. Moreover, the display screen 80 is disposed on one side of the curved cover plate 30 close to the second accommodating space 33, that is, the curved cover plate 30 is matched with the middle frame 10 or the supporting member 60, so that the display screen 80 can be prevented from being damaged by pressure, and the service life of the display screen 80 is prolonged.

Optionally, the curved cover 30 is a transparent curved cover 30, so that the light emitted from the display screen 80 can be emitted out of the electronic device 1 through the transparent curved cover 30 for the user to view.

Referring to fig. 12 again, in the present embodiment, a portion of the display screen 80 is sandwiched between the curved cover plate 30 and the blocking member 70. Optionally, the blocking member 70 has a first limiting surface 71 deviating from the first receiving space 12, the bending portion 31 has a second limiting surface 72 facing the second receiving space 33, the second limiting surface 72 is opposite to the first limiting surface 71, and a part of the display screen 80 is sandwiched between the first limiting surface 71 and the second limiting surface 72.

In the present embodiment, a part of the display screen 80 may be sandwiched between the curved cover plate 30 and the stopper 70, that is, a part of the display screen 80 may be sandwiched between the first stopper surface 71 and the second stopper surface 72. The blocking member 70 can be used not only to block the adhesive member 20, but also to display the position of the display screen 80 by using the blocking member 70, thereby reducing the difficulty of assembly. In addition, the blocking member 70 and the curved cover 30 may be used to fix the display screen 80, thereby improving the fixing performance of the display screen 80.

Referring to fig. 13, fig. 13 is a partial cross-sectional view of an electronic device according to still another embodiment of the present application. In this embodiment, the first assembly surface 112 has a first mark 91, one side of the curved cover 30 close to the middle frame 10 has a second mark 92, and the first mark 91 directly corresponds to the second mark 92.

In the present embodiment, the first mark 91 may be provided on the first mounting surface 112, and the second mark 92 may be provided on the bent portion 31. In the assembling process, namely, in the process of covering the bent cover plate 30 on the middle frame 10, the bent cover plate 30 can be moved firstly, so that the second mark 92 on the bent cover plate 30 is aligned with the first mark 91 on the middle frame 10, and the bent cover plate 30 is aligned with the middle frame 10 in the assembling direction, and then the assembling is carried out, so that the assembling precision of the electronic device 1 is improved.

Referring to fig. 14, fig. 14 is a schematic cross-sectional view of an electronic device according to still another embodiment of the present application. In this embodiment, the electronic device 1 further includes a rear casing 90, the rear casing 90 is disposed on the middle frame 10, and the rear casing 90 and the curved cover plate 30 are disposed on two opposite sides of the middle frame 10; the rear shell 90, the middle frame 10, and the curved cover plate 30 are enclosed to form an accommodating space 93, and the accommodating space 93 includes the first accommodating space 12 and the second accommodating space 33.

In the present embodiment, the electronic device 1 may further include a rear case 90, and the rear case 90 and the curved cover 30 are disposed at opposite sides of the middle frame 10. The rear case 90, the middle frame 10, and the curved cover 30 can wrap the electronic device 1, so as to form an accommodating space 93. The accommodating space 93 includes a first accommodating space 12 and a second accommodating space 33. Other components of the electronic device 1 can be disposed in the accommodating space 93.

In addition, the material of the rear housing 90 may be the same as that of the middle frame 10, and the detailed description of the embodiment is omitted.

The above is a detailed description of the content related to the electronic device 1 in the present application, and according to an embodiment of the present application, a method for assembling the electronic device 1 is also provided. This assembly method can be used to assemble the electronic device 1 described above. Of course, the electronic device 1 may be assembled by other assembling methods, which is not limited in this application. The electronic device 1 and the assembling method provided by the embodiment of the present application may be used in combination with each other or may be used alone, which does not affect the essence of the present application.

Referring to fig. 15-19, fig. 15 is a process flow diagram of an assembly method of an electronic device according to an embodiment of the present disclosure. Fig. 16-19 are schematic diagrams corresponding to S100, S200, S300, and S400, respectively. The present embodiment provides an assembling method of an electronic device 1, including S100, S200, S300, and S400. The details of S100, S200, S300, and S400 are as follows.

Referring to fig. 16 and S100, a middle frame 10 is provided, which includes a first assembling surface 112 and a first outer surface 113 connected to each other, and a step groove 13 is formed between the first assembling surface 112 and the first outer surface 113.

Referring to fig. 17, S200, an adhesive 20a is provided, and the adhesive 20a is disposed in the step groove 13.

Referring to fig. 18, S300, a curved cover plate 30 is provided, where the curved cover plate 30 includes a body 32 and a curved portion 31 curved and connected to a periphery of the body 32, an end of the curved portion 31 away from the body 32 forms a second mounting surface 311, and the first mounting surface 112 and the second mounting surface 311 are disposed opposite to each other; the second mounting surface 311 is abutted against the adhesive 20a, and a part of the adhesive 20a is protruded from the first outer surface 113.

Referring to fig. 19, S400, the adhesive 20a protruding from the first outer surface 113 is removed, so that the second outer surface 312 of the curved cover plate 30, the third outer surface 21 of the adhesive member 20, and the first outer surface 113 form a smooth surface; and the remaining adhesive 20a is converted into an adhesive member 20, and the adhesive connection of the first mounting surface 112 and the second mounting surface 311 is achieved by the adhesive member 20.

In the assembling method provided in this embodiment, the step groove 13 having a special structure may be provided first, and the beneficial effects brought by the step groove 13 are already mentioned in the foregoing description, and are not described herein again. The liquid adhesive 20a is then set in the step groove 13. A curved cover plate 30 is further provided, and the curved cover plate 30 is assembled to the middle frame 10 and coupled with the adhesive 20 a. At this time, a portion of the adhesive 20a is pressed by the pressing force to protrude from the first outer surface 113, i.e., the outer surface of the electronic device 1. At this time, the appearance surface of the electronic device 1 is smooth and flat, and is not blocked by other components, so that a step structure is not formed. Therefore, the adhesive 20a protruding from the first outer surface 113 can be removed by a device or a person before the adhesive 20a is cured into the adhesive member 20, so that no adhesive residue is formed on the appearance surface of the electronic device 1, and the production yield is further improved.

Referring to fig. 20, fig. 20 is a process flow diagram included in S300 according to an embodiment of the present disclosure. In the present embodiment, the step S300 "of bringing the second mounting surface 311 into contact with the adhesive 20 a" includes steps S310, S320, and S330. The details of S310, S320, and S330 are as follows.

S310, acquiring a first mark 91 on the first assembling surface 112 and a second mark 92 on one side, close to the middle frame 10, of the bent cover plate 30.

And S320, controlling the bent cover plate 30 to move relative to the middle frame 10 so that the second mark 92 is aligned with the first mark 91.

S330, controlling the curved cover 30 to move toward the middle frame 10 so that the second mounting surface 311 abuts against the adhesive 20 a.

The first indicia 91 on the first mounting surface 112 of the center frame 10 may be captured prior to mating the curved cover 30 with the center frame 10, followed by the second indicia 92 on the curved cover 30. The curved cover 30 is then controlled to move horizontally relative to the middle frame 10 so that the second marks 92 are aligned with the first marks 91, and the curved cover 30 is considered to be aligned with the middle frame 10 in the horizontal direction. Finally, the curved cover 30 can be controlled to move towards the middle frame 10, so that the curved cover 30 is assembled with the middle frame 10, and the assembling precision of the electronic device 1 is improved.

Referring to fig. 21, fig. 21 is a process flow diagram included in S200 according to an embodiment of the present disclosure. In this embodiment, the electronic device 1 further includes a support 60, and the support 60 is disposed on the bottom surface 131 of the stepped groove 13; s200 "providing an adhesive 20a, and disposing the adhesive 20a in the step groove 13" includes S210. The details of S210 are as follows.

And S210, providing an adhesive 20a, arranging the adhesive 20a in the step groove 13, and arranging part of the adhesive 20a on the surface of the support 60, which is far away from the bottom surface 131.

To ensure good bonding, an excess of adhesive 20a is typically provided. When an excessive amount of the adhesive 20a is provided in the step groove 13, a part of the adhesive 20a is provided on the surface of the supporting member 60 facing away from the bottom surface 131. Thus, when the curved cover 30 is subsequently controlled to be fitted to the middle frame 10, a part of the surface of the curved cover 30 is adhered to the adhesive 20a on the support 60, thereby improving the coupling performance of the curved cover 30 to the support 60.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An electronic device, comprising a middle frame, an adhesive member, and a curved cover plate; the middle frame comprises a first assembling surface and a first outer surface which are connected, and a step groove is formed between the first assembling surface and the first outer surface; the bonding piece is arranged in the step groove; the bent cover plate comprises a body and a bent part in bent connection with the periphery of the body, and a second assembling surface is formed at one end, far away from the body, of the bent part;

2. The electronic device of claim 1, wherein the bottom surface of the step groove is bent to connect the first outer surface, and one end of the adhesive member is adhered to the bottom surface and the other end is adhered to the second mounting surface.

3. The electronic device of claim 1, wherein the second mounting surface comprises a first sub-mounting surface and a first bending surface connected in a bending manner, the first bending surface is further connected in a bending manner with the second outer surface, and the first bending surface is closer to the second outer surface than the first sub-mounting surface; and the first bending surface is bent towards the direction far away from the middle frame compared with the first sub-assembly surface.

4. The electronic device of claim 3, wherein the bottom surface of the step groove comprises a second sub-mounting surface and a second bending surface connected in a bending manner, the second bending surface is further connected in a bending manner with the first outer surface, and the second bending surface is closer to the first outer surface than the second sub-mounting surface; and the second bending surface is bent towards the direction close to the bending part compared with the second sub-assembly surface.

5. The electronic device of claim 4, wherein the first sub-mount face is parallel to the second sub-mount face and the first bending face is parallel to the second bending face.

6. The electronic device of claim 4, wherein the second bending surface comprises a first bending sub-surface and a second bending sub-surface connected in a bending manner, the second bending sub-surface is further connected in a bending manner with the first outer surface, and the second bending sub-surface is closer to the first outer surface than the first bending sub-surface; and the second sub-bending surface is bent towards the direction far away from the bending part compared with the first sub-bending surface.

7. The electronic device of claim 1, further comprising a support member provided in the stepped recess to support the second mounting surface with a prescribed distance from a bottom surface of the stepped recess.

8. The electronic device of claim 7, wherein the support comprises a plurality of supports disposed at intervals.

9. The electronic device of claim 7, further comprising a stopper provided on the first mounting surface or a support.

10. The electronic device of claim 1, wherein the first mounting surface has a first logo thereon, and a side of the curved cover plate adjacent to the center bezel has a second logo, the first logo corresponding to the second logo.