CN214334503U - Electroplated diamond wire brittle failure testing device - Google Patents
Electroplated diamond wire brittle failure testing device Download PDFInfo
- Publication number
- CN214334503U CN214334503U CN202023046628.5U CN202023046628U CN214334503U CN 214334503 U CN214334503 U CN 214334503U CN 202023046628 U CN202023046628 U CN 202023046628U CN 214334503 U CN214334503 U CN 214334503U
- Authority
- CN
- China
- Prior art keywords
- plate
- pressing plate
- diamond wire
- adjusting plate
- raised platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
A brittle fracture inspection device for an electroplated diamond wire comprises a substrate, a guide pillar, an adjusting plate, a spring and a pressing plate; the substrate is provided with a raised platform; the adjusting plate is arranged on the base plate and is in the same horizontal center line with the raised platform, and the two side planes of the adjusting plate, which are opposite to the raised platform, are the same in size and adjustable in distance; the two guide posts are arranged on the base plate, and a straight line formed by the two guide posts is parallel to a common horizontal central line of the convex platform and the pressing plate; the spring is sleeved on the guide post; the pressing plate is provided with two identical through holes for being matched and sleeved on the guide pillar and the spring, the top of each through hole is also provided with a step hole for limiting the spring to pass through, and one side surface of the pressing plate is attached to two opposite side surfaces of the raised platform and the adjusting plate after the pressing plate is pressed downwards; a step surface which is concave upwards is arranged between the two through holes at the bottom of the pressing plate, so that a space is formed between the pressing plate and the upper plane of the substrate after the pressing plate is pressed downwards.
Description
Technical Field
The utility model relates to an electroplate buddha's warrior attendant line field, especially relate to an electroplate buddha's warrior attendant line brittle failure verifying attachment.
Background
In the field of manufacturing and cutting of electroplated diamond wires, the wire breakage rate is an important factor influencing the production efficiency in the production process. Therefore, the indexes need to be managed and controlled in the manufacturing process and the using process of the electroplated diamond wire. Generally, a diamond wire is subjected to brittle fracture inspection by folding a sample wire with a certain length in half, forming an arc at the tail of the double-folded wire, placing the arc on the finger surface of an index finger by an inspector, and pressing the arc with a thumb to compress the arc into a double-folded state. And (4) unfolding the folding line after once pressing, judging that 1 brittle fracture is recorded if the folding line is broken, and otherwise, recording 0 brittle fracture. And sequentially taking 6 sections of sample lines for detection and recording. According to the inspection mode, the inspection process basically depends on the experience of inspectors, detection results can be different due to different inspectors, the inspection process has more subjective factors, objective and reliable experimental data cannot be provided, and quality monitoring and improvement are not facilitated.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electroplating diamond wire brittle failure testing device, which aims to correspondingly improve the testing method of electroplating diamond wire finished product brittle failure so as to solve the consistency problem of product brittle failure testing. The specific technical scheme is as follows:
the electroplated diamond wire brittle failure inspection device is characterized by comprising a substrate, a guide pillar, an adjusting plate, a spring and a pressing plate; the substrate is provided with a raised platform; the adjusting plate is arranged on the base plate and is in the same horizontal center line with the raised platform, and the two side planes of the adjusting plate, which are opposite to the raised platform, are the same in size and adjustable in distance; the two guide posts are arranged on the base plate, and a straight line formed by the two guide posts is parallel to a common horizontal central line of the convex platform and the pressing plate; the spring is sleeved on the guide post; the pressing plate is provided with two identical through holes for being matched and sleeved on the guide pillar and the spring, the top of each through hole is also provided with a step hole for limiting the spring to pass through, and one side surface of the pressing plate is attached to two opposite side surfaces of the raised platform and the adjusting plate after the pressing plate is pressed downwards; a step surface which is concave upwards is arranged between the two through holes at the bottom of the pressure plate, so that a square cavity is formed between the pressure plate and the base plate and between the pressure plate and the adjusting plate after the pressure plate is pressed downwards.
Furthermore, in order to install the equipment and detect, a fixed reference is always provided, the raised platform and the base plate on the base plate are integrally formed and fixed, and the distance between the raised platform and the two opposite side surfaces of the adjusting plate is controlled by moving the adjusting plate.
Furthermore, the adjusting plate is connected with the base plate through bolts, a groove-shaped fixing opening is formed in the base plate, a threaded hole is formed in the adjusting plate, and the adjusting plate is matched with the bolts to be used for fixing the adjusting plate on the base plate.
Furthermore, the guide post is connected with the threaded hole in the base plate through threads at the bottom end of the guide post.
Furthermore, because the distance between the convex platform and the adjusting plate is very small in practical inspection, and it is difficult to smoothly and quickly place the diamond wire in the distance between the convex platform and the adjusting plate, the angles between the two opposite side surfaces of the convex platform and the adjusting plate and the respective upper planes are chamfered, and a V-shaped opening is formed above the gap.
Furthermore, the angles between two opposite side surfaces between the raised platform and the adjusting plate and the side surfaces opposite to the guide columns are chamfered.
Further, the depth of the upward concave step surface at the bottom of the pressure plate is 2 times of the length of the wire diameter of the diamond wire.
The method comprises the following steps:
(1) adjusting the distance between the adjusting plate and a chamfer at the upper part of the raised platform on the substrate to be about 3 times of the outer diameter length of the diamond line sample line;
(2) then, taking a section of sample wire, folding the sample wire in half, and aligning two line heads of the diamond wire;
(3) respectively pinching two ends of the folded diamond wire by hands, and moving the steel wire to the bottom of the gap after the pressing block 3 is in a natural state and simultaneously passes through a gap formed by the raised platform of the substrate and the chamfer angle of the adjusting plate, wherein the bent end is positioned outside the sideline of the substrate and the pressing block, and one end of the two ends is positioned at the suspended position of the substrate;
(4) pressing the pressing plate downwards to be tightly attached to the upper plane of the substrate, wherein a space with the diameter distance of two sample wires is formed between the upward concave step surface between the through holes at the bottom of the pressing plate and the upper plane of the substrate, so that the sample wires to be tested are extruded in the vertical direction to the degree of bending;
(5) keeping a pressing plate in a downward pressing state, holding one end of a wire head, manually pulling out the sample wire, limiting the distance of the diamond wire in the horizontal direction due to a gap between the convex platform and the adjusting plate, and meanwhile, enabling the bent end of the diamond wire to pass through a square hole formed by the pressing plate, the substrate and the adjusting plate together, wherein the same as the fact that the Yangxian county is pressed to the required bending radius;
(6) after the sample wire is pulled out, the pressing plate is loosened, and the pressing plate is restored to the original position under the action of the spring;
(7) the test line was unfolded and the bend was observed for fracture and the data was faithfully recorded.
Has the advantages that: the device is simple and convenient to operate, can replace a manual finger to detect the brittle fracture of the diamond wire, eliminates a judgment error caused by subjective error, has more stable detection result and has higher reference value; and the device can be adjusted according to products with different diameters and test standards, and the product adaptability range is wide.
Drawings
FIG. 1 is a perspective view of the present invention;
fig. 2 is a front view of the present invention;
fig. 3 is a front perspective view of the present invention;
fig. 4 is a top perspective view of the present invention.
Wherein, 1-a substrate; 11-a raised platform; 2-guide pillar; 3, pressing a plate; 31-a through hole; 4-adjusting plate; 5-a spring; 6-groove type fixing port.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings, and it should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "proximal", "distal", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1-4, an electroplated diamond wire brittle fracture testing device comprises a substrate 1, a guide post 2, an adjusting plate 4, a spring 5 and a pressing plate 3; the substrate 1 is provided with a raised platform 11; the adjusting plate 4 is arranged on the substrate 1 and is in the same horizontal center line with the raised platform 11, the two side planes of the adjusting plate 4 opposite to the raised platform 11 are the same in size, and the distance between the two side planes is adjustable; the two guide posts 2 are arranged on the base plate 1, and a straight line formed by the two guide posts 2 is parallel to a common horizontal central line of the convex platform 11 and the pressing plate 3; the spring 5 is sleeved on the guide post 2; the pressing plate 3 is provided with two identical through holes 31 which are used for being sleeved on the guide pillars 2 and the springs 5 in a matching manner, the tops of the through holes 31 are also provided with step holes which are used for limiting the springs to pass through, and after the pressing plate 3 is pressed downwards, one side face of the pressing plate is attached to two opposite side faces of the raised platform 11 and the adjusting plate 4; an upward concave step surface 32 is further arranged between the two through holes at the bottom of the pressing plate 3, so that after the pressing plate is pressed downwards, a square hollow is formed among the pressing plate 3, the substrate 1 and the adjusting plate 4.
In the present embodiment, the raised platform 11 on the substrate 1 is integrally formed with the substrate 1, and the adjusting plate 4 is movably adjustable on the substrate 1.
In this embodiment, the base plate 1 is provided with a groove-shaped fixing opening 12 for fixing the adjusting plate 4 in cooperation with a bolt.
In this embodiment, the guide posts 2 are connected to the threaded holes in the base plate 1 by threads at their bottom ends.
In the present embodiment, the corners between the two opposite side surfaces of the raised platform 11 and the adjustment plate 4 on the base plate 1 and the respective upper planes are chamfered.
In this embodiment, the corners between the two opposite sides of the raised platform and the adjustment plate and the sides opposite to the guide posts are chamfered.
In this embodiment, the depth of the step surface of the pressing plate with the upward concave bottom is 2 times of the length of the diameter of the diamond wire.
The specific steps of using the device to detect the brittle fracture of the diamond wire are as follows:
(1) adjusting the distance between the adjusting plate 4 and the chamfer at the upper part of the raised platform 11 on the substrate 1, and determining the distance to be 3 times of the outer diameter length of the diamond linear sample line through a filler gauge;
(2) then taking a section of diamond wire sample, folding the sample in half, and aligning two line heads of the diamond wire;
(3) respectively pinching two ends of the folded diamond wire by hands, and moving the steel wire to the bottom of a gap after the pressing block 3 is in a natural state and simultaneously passes through a gap formed by the raised platform 11 on the substrate 1 and the chamfer angle of the adjusting plate 4, wherein the bent end is positioned outside the sideline of the substrate 1 and the pressing plate 3, and one end of each of the two ends is positioned at the suspended position of the substrate 1;
(4) pressing the pressing plate 3 downwards to be tightly attached to the upper plane of the substrate 1, wherein a space with the diameter and the length of two sample wires is formed between the upward concave step surface 32 between the through holes at the bottom of the pressing plate 3 and the upper plane of the substrate 1, so that the sample wires to be tested are extruded in the vertical direction to the degree of bending;
(5) keeping the pressing plate 3 in a downward pressing state, holding one end of a wire head, manually pulling out a sample wire, limiting the distance of the diamond wire in the horizontal direction due to a gap between the raised platform 11 and the adjusting plate 4, and meanwhile, enabling the bent end of the diamond wire to pass through a square hole formed by the pressing plate 3, the substrate 1 and the adjusting plate 4 together, wherein the bending radius of the sample wire is equal to the required bending radius of the sample wire;
(6) after the sample wire is pulled out, the pressing plate is loosened, and the pressing plate is restored to the original position under the action of the spring;
(7) the test line was unfolded and the bend was observed for fracture and the data was faithfully recorded.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The electroplated diamond wire brittle failure inspection device is characterized by comprising a substrate, a guide pillar, an adjusting plate, a spring and a pressing plate; the substrate is provided with a raised platform; the adjusting plate is arranged on the base plate and is in the same horizontal center line with the raised platform, and the two side planes of the adjusting plate, which are opposite to the raised platform, are the same in size and adjustable in distance; the two guide posts are arranged on the base plate, and a straight line formed by the two guide posts is parallel to a common horizontal central line of the convex platform and the pressing plate; the spring is sleeved on the guide post; the pressing plate is provided with two identical through holes for being matched and sleeved on the guide pillar and the spring, the top of each through hole is also provided with a step hole for limiting the spring to pass through, and one side surface of the pressing plate is attached to two opposite side surfaces of the raised platform and the adjusting plate after the pressing plate is pressed downwards; a step surface which is concave upwards is arranged between the two through holes at the bottom of the pressing plate, so that a square hole is formed among the pressing plate, the base plate and the adjusting plate after the pressing plate is pressed downwards.
2. The electroplated diamond wire brittle fracture inspection device as claimed in claim 1, wherein the raised platform on the substrate is integrally formed with the substrate, and the adjusting plate is movably adjustable on the substrate.
3. The electroplated diamond wire brittle fracture testing device as recited in claim 1, characterized in that the base plate is provided with a groove-shaped fixing opening, and a fixing adjusting plate is used in cooperation with a bolt.
4. The electroplated diamond wire brittle fracture testing device as recited in claim 1, characterized in that the guide post is connected with the threaded hole on the base plate through the thread at the bottom end of the guide post.
5. The electroplated diamond wire brittle fracture testing device as claimed in claim 1, wherein, the corners between two opposite side surfaces of the raised platform and the adjusting plate on the base plate and the respective upper planes are chamfered.
6. The electroplated diamond wire brittle fracture testing device as recited in claim 1, characterized in that the corners between two opposite sides of the raised platform and the adjusting plate and the sides respectively opposite to the guide pillars are chamfered.
7. The electroplated diamond wire brittle fracture testing device as recited in claim 1, characterized in that the depth of the upward concave step surface of the bottom of the pressure plate is 2 times of the diameter length of the diamond wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023046628.5U CN214334503U (en) | 2020-12-17 | 2020-12-17 | Electroplated diamond wire brittle failure testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023046628.5U CN214334503U (en) | 2020-12-17 | 2020-12-17 | Electroplated diamond wire brittle failure testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214334503U true CN214334503U (en) | 2021-10-01 |
Family
ID=77900163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023046628.5U Active CN214334503U (en) | 2020-12-17 | 2020-12-17 | Electroplated diamond wire brittle failure testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214334503U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116499905A (en) * | 2023-06-30 | 2023-07-28 | 张家口原轼新型材料股份有限公司 | Inspection equipment and inspection method for diamond wire breaking frequency test |
-
2020
- 2020-12-17 CN CN202023046628.5U patent/CN214334503U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116499905A (en) * | 2023-06-30 | 2023-07-28 | 张家口原轼新型材料股份有限公司 | Inspection equipment and inspection method for diamond wire breaking frequency test |
| CN116499905B (en) * | 2023-06-30 | 2023-09-05 | 张家口原轼新型材料股份有限公司 | Inspection equipment and inspection method for diamond wire breaking frequency test |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214334503U (en) | Electroplated diamond wire brittle failure testing device | |
| CN105486592B (en) | A kind of steel fibre tensioning clamping fixture and steel fibre tensile property test system | |
| KR20130097021A (en) | Specimen multiaxial loading test device | |
| CN206848322U (en) | A kind of resistance test fixture | |
| CN212807851U (en) | Wire harness terminal strength detection device | |
| CN116660009A (en) | Auxiliary device and method for centering and aligning sample | |
| CN218782098U (en) | Pressure pipeline pressure detection device | |
| CN104034923A (en) | Self-adaptive test clamp for separate-type LED device | |
| CN216432925U (en) | Checking fixture for workpiece | |
| CN208476110U (en) | Automobile door handle Function detection harness | |
| CN206235285U (en) | A kind of edge testing apparatus for verticality of plate workpiece | |
| CN219417007U (en) | Clamp for testing machine test | |
| CN209016408U (en) | A kind of crimping apparatus of network line joint | |
| CN214699958U (en) | Fixing device for acoustic emission detection probe of non-metal pressure container | |
| CN219915139U (en) | Quick test positioner after tensile test breaks | |
| CN206709731U (en) | A kind of tubing simple inpecting tool | |
| CN212604667U (en) | Dropper prefabrication platform convenient to measure | |
| CN217765778U (en) | Cabinet body processing is with intensity check out test set | |
| CN216117164U (en) | 3D mattress material detection device | |
| CN111238934A (en) | Metal test piece tensile mechanical property device and test method thereof | |
| CN217132805U (en) | Bonding strength testing device | |
| CN219708389U (en) | Automatic tinning machine arm of transformer snatchs mechanism | |
| CN218411984U (en) | Tensile elongation test instrument after breaking | |
| CN116429563A (en) | Clamp for testing machine test | |
| CN220819640U (en) | Improved fiber concrete shear test clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 223800 No.18, Qixiashan Road, Susu Industrial Park, Suqian City, Jiangsu Province Patentee after: Jiangsu Jucheng Diamond Technology Co.,Ltd. Address before: 223800 No.18, Qixiashan Road, Susu Industrial Park, Sucheng District, Suqian City, Jiangsu Province Patentee before: JIANGSU JUCHENG DIAMOND TECHNOLOGY Co.,Ltd. |