CN214307962U - Device for treating residual water drops on surface of cleaned wafer - Google Patents
Device for treating residual water drops on surface of cleaned wafer Download PDFInfo
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- CN214307962U CN214307962U CN202120143698.8U CN202120143698U CN214307962U CN 214307962 U CN214307962 U CN 214307962U CN 202120143698 U CN202120143698 U CN 202120143698U CN 214307962 U CN214307962 U CN 214307962U
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- spool box
- silicon chip
- residual water
- silicon
- treating residual
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Abstract
The utility model relates to a be used for handling and wash remaining device of back wafer surface water droplet, affiliated silicon chip surface thing clearing equipment technical field, including the header tank, the header tank on be equipped with the spool box, the spool box in be equipped with a plurality of silicon chips of inlaying with the spool box looks inlay card and being connected, the spool box both ends all be equipped with the connection minor axis of the spool box looks inlay card, the spool box on a plurality of drainage tank that are linked together with the silicon chip that are equipped with, silicon chip upper end be equipped with the spray tube, the spray tube lower extreme be equipped with a plurality of gas blow holes that are located between two silicon chips. Has the characteristics of simple structure, high stability and good use effect. The problem of residual water drops on the surface of the silicon wafer is solved.
Description
Technical Field
The utility model relates to a silicon chip surface thing clean-out equipment technical field, concretely relates to a device for handling wafer surface water droplet remains after the washing.
Background
The silicon wafer coming out of the cleaning station of the photonics double-sided grinder can have residual water dripping on the surface of the silicon wafer, so that the real data of measurement are directly influenced, and the production yield is influenced.
Disclosure of Invention
The utility model discloses mainly solve and have the low and poor not enough of result of use of stability among the prior art, provide a wafer surface water droplet remaining device after being used for handling the clearance washing, it has simple structure, stable high and excellent in use effect's characteristics. The problem of residual water drops on the surface of the silicon wafer is solved.
The above technical problem of the present invention can be solved by the following technical solutions:
the utility model provides a device for handling wafer surface water droplet is remained after washing, includes the header tank, the header tank on be equipped with the spool box, the spool box in be equipped with a plurality of silicon chips of inlaying with the spool box looks grafting and inlaying and be connected, spool box both ends all be equipped with the connection minor axis of header tank looks inlay card, the spool box on a plurality of water drainage tank that are linked together with the silicon chip that are equipped with, silicon chip upper end be equipped with the spray tube, the spray tube lower extreme be equipped with a plurality of gas blow holes that are located between two silicon chips.
Preferably, a connecting bracket is arranged between the two ends of the spray pipe and the water collecting tank.
Preferably, the two upper ends of the spray pipe are respectively provided with a pressing buckle which is fixedly connected with the connecting bracket through bolts.
Preferably, an air pump is arranged on the side edge of the water collecting tank, and an air inlet pipe is arranged between the air pump and the spray pipe.
The utility model discloses can reach following effect:
the utility model provides a be used for handling remaining device of wafer surface water droplet after the clearance cleaning, compare with prior art, have simple structure, stable high and excellent in use effect's characteristics. The problem of residual water drops on the surface of the silicon wafer is solved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: the air pump 1, the intake pipe 2, the pressure is detained 3, the spray tube 4, the hole of blowing 5, silicon chip 6, the spool box 7, linking bridge 8 connects minor axis 9, water drainage tank 10, header tank 11.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.
Example (b): as shown in fig. 1, a device for treating water droplet residues on the surface of a cleaned wafer comprises a water collecting tank 11, wherein a wafer box 7 is arranged on the water collecting tank 11, 23 silicon wafers 6 inserted and embedded with the wafer box 7 are arranged in the wafer box 7, two ends of the wafer box 7 are respectively provided with a connecting short shaft 9 embedded with the water collecting tank 11, 23 water draining grooves 10 communicated with the silicon wafers 6 are arranged on the wafer box 7, a spraying pipe 4 is arranged at the upper end of each silicon wafer 6, and a connecting support 8 is arranged between two ends of each spraying pipe 4 and the water collecting tank 11. The lower end of the spray pipe 4 is provided with 24 air blowing holes 5 positioned between the two silicon wafers 6. The upper ends of the two spray pipes 4 are respectively provided with a pressing buckle 3 which is fixedly connected with the connecting bracket 8 through bolts. An air pump 1 is arranged on the side of the water collecting tank 11, and an air inlet pipe 2 is arranged between the air pump 1 and the spray pipe 4.
In conclusion, the device for treating residual water drops on the surface of the cleaned wafer has the characteristics of simple structure, high stability and good use effect. The problem of residual water drops on the surface of the silicon wafer is solved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without deviating from the basic characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
In conclusion, the above description is only the specific embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any person skilled in the art can make changes or modifications within the scope of the present invention.
Claims (4)
1. An apparatus for treating residual water droplets on a cleaned wafer surface, comprising: including header tank (11), header tank (11) on be equipped with spool box (7), spool box (7) in be equipped with a plurality of with spool box (7) mutually insert inlay silicon chip (6) of being connected, spool box (7) both ends all be equipped with header tank (11) mutually the connection minor axis (9) of inlay card, spool box (7) on a plurality of be equipped with drainage tank (10) that are linked together with silicon chip (6), silicon chip (6) upper end be equipped with spray tube (4), spray tube (4) lower extreme be equipped with a plurality of gas blow hole (5) that are located between two silicon chip (6).
2. An apparatus for treating residual water droplets on a wafer surface after cleaning according to claim 1, wherein: and a connecting support (8) is arranged between the two ends of the spray pipe (4) and the water collecting tank (11).
3. An apparatus for treating residual water droplets on a wafer surface after cleaning as set forth in claim 2, wherein: the upper ends of the two ends of the spray pipe (4) are respectively provided with a pressing buckle (3) which is fixedly connected with the connecting bracket (8) through bolts.
4. An apparatus for treating residual water droplets on a wafer surface after cleaning according to claim 1, wherein: the side of the water collecting tank (11) is provided with an air pump (1), and an air inlet pipe (2) is arranged between the air pump (1) and the spray pipe (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120143698.8U CN214307962U (en) | 2021-01-19 | 2021-01-19 | Device for treating residual water drops on surface of cleaned wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120143698.8U CN214307962U (en) | 2021-01-19 | 2021-01-19 | Device for treating residual water drops on surface of cleaned wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214307962U true CN214307962U (en) | 2021-09-28 |
Family
ID=77828240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120143698.8U Active CN214307962U (en) | 2021-01-19 | 2021-01-19 | Device for treating residual water drops on surface of cleaned wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214307962U (en) |
-
2021
- 2021-01-19 CN CN202120143698.8U patent/CN214307962U/en active Active
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