CN214300423U - Double-sided electroplating device - Google Patents

Abstract

The utility model provides a double-sided electroplating device, which is provided with an electroplating cavity, an object to be electroplated is suitable to be placed in the electroplating cavity in parallel with the horizontal direction, the electroplating device is provided with an electrode group for connecting two surfaces to be electroplated of the object to be electroplated, and electrolyte and anode plates are distributed on two sides of the two surfaces to be electroplated; the anode plate and the electrode group are respectively connected to the positive electrode and the negative electrode of the power supply, and when the power supply is electrified, at least one of the two surfaces to be electroplated is electroplated. According to the utility model discloses a two-sided electroplating device can treat simultaneously that two of electroplating object wait to electroplate the face and carry out two-sided electroplating, or select one of them to wait to electroplate the face and electroplate, has improved the electroplating efficiency of waiting to electroplate the object and the flexibility of electroplating. And the object to be electroplated is placed in the electroplating cavity in parallel to the horizontal direction, so that the object to be electroplated is convenient to take and fix, and the electroplating convenience of the object to be electroplated is improved.

Description

Double-sided electroplating device

Technical Field

The utility model relates to an electronic component processing technology field especially relates to a two-sided electroplating device.

Background

Integrated circuit technology has evolved over the past few decades following moore's law, i.e., the number of transistors that can be accommodated per unit of integrated circuit area can be doubled approximately every 18 months. However, when the size of the transistor is reduced to the nanometer level, it is very difficult to improve the performance of the integrated circuit by reducing the size of the transistor, and as the quality of human life is improved, the diversity of the electronic products is developed, and the final product needs to be developed according to the light, thin, small and fast specifications.

In recent years, the packaging technology has been developed from the traditional way of connecting a die to a printed circuit board by lead wires, to 2.5D and three-dimensional (3D) packaging technologies. The maturation of the "Through-silicon vias (Through-silicon vias)" technology allows for multi-layer stacking, while the bump technology addresses the interconnect requirements in the upper and lower layer stacks. Compared with the traditional lead bonding interconnection package, the through silicon via technology and the bump technology are connected, so that the packaging structure has the advantages of good conductivity, low power consumption and small package volume. In the development of this through-silicon via technology and bump technology, the ability of the metallization process is of critical importance.

In the production process of the wafer, if the metal plating process of the front and back sides of the wafer is needed, the electroplating process is generally carried out twice in one process; for example, in 2.5D and three-dimensional (3D) packaging technologies, a Through-silicon vias (Through-silicon vias) technology is generally adopted, copper is used as a material for a Through hole and rewiring, after a bump electroplating process is performed on the front surface of a wafer, a bump coating process is performed, a glass carrier is bonded, wafer thinning (to 20-200 μm) is performed, a rewiring process is performed on the other surface of the wafer, an electroplating process is performed on the other surface of the wafer, debonding is performed, the coating of the bump is removed, and subsequent processes are performed. Therefore, in the related art, when the electronic components such as the wafer are electroplated, the operation is complicated and inconvenient, and the efficiency is low.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is how to improve the convenience of wafer double-sided electroplating, the utility model provides a double-sided electroplating device.

According to the utility model discloses two-sided electroplating device, electroplating device has the electroplating chamber, waits to electroplate the object and is suitable for being on a parallel with the horizontal direction and place in electroplating chamber, electroplating device has the electrode group of connecting two faces of waiting to electroplate the object, two the both sides of waiting to electroplate the face equally divide and distribute electrolyte and anode plate;

the anode plate and the electrode group are respectively connected to the positive electrode and the negative electrode of a power supply, and when the power supply is electrified, at least one of the two surfaces to be electroplated is electroplated.

According to the utility model discloses two-sided electroplating device can treat two of electroplating object simultaneously and treat that the electroplating face carries out two-sided electroplating, or selects one of them to treat that the electroplating face electroplates, has improved the electroplating efficiency and the flexibility of electroplating of treating the electroplating object. And the object to be electroplated is placed in the electroplating cavity in parallel to the horizontal direction, so that the object to be electroplated is convenient to take and fix, and the electroplating convenience of the object to be electroplated is improved.

According to some embodiments of the present invention, the double-sided plating apparatus comprises: a first housing defining a first chamber; a second housing defining a second chamber; when the first housing and the second housing are connected in the vertical direction, the first chamber and the second chamber constitute the plating chamber.

In some embodiments of the present invention, a groove is formed at a connecting end surface of the first casing and the second casing, and the object to be electroplated is fixed in the electroplating cavity by a fixture fixed in the groove.

According to some embodiments of the invention, the anode plate comprises a first anode plate located in the first chamber and a second anode plate located in the second chamber, the electrode sets comprise a first electrode set located in the first housing and a second electrode set located in the second housing, the power supply comprises a first power supply and a second power supply, the first anode plate and the first electrode set are connected to a positive pole and a negative pole of the first power supply, respectively, and the second anode plate and the second electrode set are connected to a positive pole and a negative pole of the second power supply, respectively;

the surface to be electroplated of the object to be electroplated, which faces the first chamber, is connected with the first electrode group, and the surface to be electroplated of the object to be electroplated, which faces the second chamber, is connected with the second electrode group.

In some embodiments of the present invention, the top wall of the first chamber is provided with a first fixing portion for fixing the first anode plate, and the bottom wall of the second chamber is provided with a second fixing portion for fixing the second anode plate.

According to some embodiments of the present invention, the double-sided plating apparatus further comprises: and a step portion for fixing the electric field adjusting plate is arranged on the inner wall of at least one of the first shell and the second shell.

In some embodiments of the present invention, the first housing and the second housing are all provided with a communication for connecting an electrolyte injection port of the plating chamber.

According to some embodiments of the invention, the first housing and the second housing are all provided with a water injection port for injecting the cleaning liquid.

In some embodiments of the present invention, the connection end face of the first housing and the second housing is provided with a communicating passage between the electroplating chamber and the external reflow tank.

According to some embodiments of the invention, the bottom wall of the electroplating chamber is provided with a drain port for draining liquid in the electroplating chamber.

Drawings

The present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic structural view of a double-sided electroplating apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of a partial structure of a wafer with a gently sloping edge fixed by a clamp according to an embodiment of the present invention;

FIG. 3 is an enlarged view of a portion A circled in FIG. 2;

fig. 4 is a schematic structural diagram of a clamp for fixing a wafer with a glass carrier according to an embodiment of the present invention;

FIG. 5 is an enlarged view of a portion of the structure of portion B circled in FIG. 4;

FIG. 6 is an enlarged partial view of the portion C encircled in FIG. 4;

fig. 7 is a schematic structural view of a wafer being fixed by a clamp according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a wafer cassette for holding a wafer with a glass carrier according to an embodiment of the present invention;

fig. 9 is a schematic view illustrating a robot arm taking out a wafer with a glass carrier from a cassette according to an embodiment of the present invention;

fig. 10 is a schematic view of a robot arm placing a wafer with a glass carrier plate on a first jaw of a fixture 30 according to an embodiment of the present invention;

fig. 11 is a schematic view of a robot placing a second jaw of a fixture on a glass carrier according to an embodiment of the present invention.

Reference numerals: an electroplating device 100, an electroplating cavity 101, an electrolyte injection port 102, a water injection port 103, a reflux tank 104, a discharge port 105, a nitrogen nozzle 106 and an exhaust port 107;

a first case 10, a first chamber 101a, a first anode plate 110, a first electrode group 120, a first fixing portion 130, a first step portion 140, a first field adjustment plate 150;

the second casing 20, the second chamber 101b, the second anode plate 210, the second electrode group 220, the second fixing part 230, the second step part 240, the second field adjusting plate 250;

the clamp 30, the first clamping piece 310, the second clamping piece 320, the fastening component 330;

wafer 500, via 510, redistribution layer 520, UMB layer 530, photoresist layer 540, opening 541;

a glass carrier plate 600, an operation opening 610;

an adhesive glue 700;

a manipulator 800;

a pure water tank 910, a water tank,

an electrolyte recovery tank 920.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

As shown in fig. 1, according to the double-sided plating apparatus 100 of the embodiment of the present invention, the plating apparatus 100 has a plating chamber 101, and an object to be plated is adapted to be placed in the plating chamber 101 in parallel with a horizontal direction. For example, the object to be plated may be the wafer 500, and when the wafer 500 is plated, the wafer 500 may be placed in the plating chamber 101 in parallel with the horizontal direction. The plating apparatus 100 has an electrode group connecting two surfaces to be plated of an object to be plated, and as shown in fig. 2, the electrode group includes a first electrode group 120 and a second electrode group 220, and when the object to be plated is a wafer 500, the first electrode group 120 and the second electrode group 220 are respectively connected to the two surfaces to be plated of the wafer 500.

Electrolyte and anode plates are distributed on two sides of the two surfaces to be electroplated, the anode plates and the electrode groups are respectively connected to the anode and the cathode of a power supply, and when the power supply is electrified, at least one of the two surfaces to be electroplated is electroplated.

That is, when the power is turned on, one of the two surfaces to be plated can be plated, or both of the two surfaces to be plated can be plated at the same time.

It should be noted that, in the related art, when a wafer to be plated is to be plated, the wafer is vertically fixed in the plating chamber. In the present application, the wafer 500 is fixed in the plating chamber 101 in parallel with the horizontal direction. This improves the convenience of mounting and fixing the wafer 500. Referring to fig. 8 to 11, a plurality of wafers 500 to be electroplated are placed in a cassette in parallel with a horizontal direction, when the wafers 500 to be electroplated are electroplated, the robot 800 may directly take out the wafers 500 to be electroplated along the horizontal direction and place the wafers 500 on the first clamping piece 310 of the fixture 30, place the second clamping piece 320 of the fixture 30 above the wafers 500 to be electroplated, and after fixing the wafers 500 to be electroplated through the first clamping piece 310 and the second clamping piece 320, the robot 800 horizontally places the fixed wafers 500 to be electroplated in the chamber 101 to be electroplated.

In the whole process of taking the piece of the wafer 500 to be electroplated for fixation, the wafer 500 to be electroplated is parallel to the horizontal direction, so that the operation of the manipulator 800 is facilitated, and the collision and damage in the overturning process of the wafer 500 to be electroplated can be avoided.

According to the utility model discloses two-sided electroplating device 100 can treat two of electroplating object simultaneously and treat that the electroplating face carries out two-sided electroplating, or selects one of them to treat that the electroplating face electroplates, has improved the electroplating efficiency and the flexibility of electroplating of treating the electroplating object. In addition, the object to be electroplated is placed in the electroplating cavity 101 in parallel to the horizontal direction, so that the object to be electroplated can be conveniently taken and fixed, and the electroplating convenience of the object to be electroplated is improved.

According to some embodiments of the present invention, as shown in fig. 1, a double-sided plating apparatus 100 includes: a first housing 10 and a second housing 20.

Wherein the first housing 10 defines a first chamber 101a and the second housing 20 defines a second chamber 101 b. When the first and second housings 10 and 20 are connected in the vertical direction, the first and second chambers 101a and 101b constitute the plating chamber 101. That is, the first and second housings 10 and 20 are detachable and attachable in the up-down direction, and when the first and second housings 10 and 20 are attached in the up-down direction, the first chamber 101a constitutes an upper half chamber of the plating chamber 101, the second chamber 101b constitutes a lower half chamber of the plating chamber 101, and the object to be plated is located between the first and second housings 10 and 20.

In some embodiments of the present invention, the opposite connection end surfaces of the first casing 10 and the second casing 20 have a groove, and the object to be electroplated is fixed in the electroplating chamber 101 through the fixture 30 fixed in the groove. It should be noted that the inner side of the mating surface of the first housing 10 and the second housing 20 may be recessed toward the inside of the first chamber 101a, and the inner side of the mating surface of the second housing 20 and the first housing 10 may be recessed toward the inside of the second chamber 101b, so that when the first housing 10 and the second housing 20 are fastened, a groove is formed between the mating surfaces of the first housing 10 and the second housing 20, and the object to be plated may be fixed in the groove after being fixed by the fixture 30.

According to some embodiments of the present invention, as shown in fig. 1, the anode plate includes a first anode plate 110 located within the first chamber 101a and a second anode plate 210 located within the second chamber 101 b. When the object to be electroplated is horizontally placed in the electroplating chamber 101, the object to be electroplated is located between the first anode plate 110 and the second anode plate 210.

As shown in fig. 1 and 2, the electrode group includes a first electrode group 120 disposed in the first case 10 and a second electrode group 220 disposed in the second case 20, and the power supply includes a first power supply and a second power supply, the first anode plate 110 and the first electrode group 120 are respectively connected to a positive electrode and a negative electrode of the first power supply, and the second anode plate 210 and the second electrode group 220 are respectively connected to a positive electrode and a negative electrode of the second power supply. The surface to be plated of the object to be plated facing the first chamber 101a is connected to the first electrode group 120, and the surface to be plated of the object to be plated facing the second chamber 101b is connected to the second electrode group 220.

It should be noted that, when the first power supply is powered on, the upper end surface of the object to be plated is electrically connected to the first anode plate 110, and at this time, the upper end surface of the object to be plated may be plated; when the second power supply is powered on, the lower end face of the object to be electroplated is electrically connected with the second anode plate 210, and at the moment, the lower end face of the object to be electroplated can be electroplated; when the first power supply and the second power supply are both powered on, the upper end surface of the object to be electroplated is electrically connected with the first anode plate 110, the lower end surface of the object to be electroplated is electrically connected with the second anode plate 210, and at the moment, the upper end surface and the lower end surface of the object to be electroplated can be electroplated simultaneously.

In some embodiments of the present invention, as shown in fig. 1, the top wall of the first chamber 101a is provided with a first fixing portion 130 for fixing the first anode plate 110, and the bottom wall of the second chamber 101b is provided with a second fixing portion 230 for fixing the second anode plate 210. The first fixing portion 130 and the second fixing portion 230 may be provided as a plurality of pillar structures disposed at intervals, and the first anode plate 110 and the second anode plate 210 may be fixed in the plating chamber 101 by the first fixing portion 130 and the second fixing portion 230, respectively.

According to some embodiments of the present invention, the double-sided plating apparatus 100 further comprises: an electric field adjusting plate, and a step portion for fixing the electric field adjusting plate is provided on an inner wall of at least one of the first and second housings 10 and 20. As shown in fig. 1, a first field control plate 150 is disposed in the first chamber 101a, and a first step portion 140 for fixing the first field control plate 150 is disposed on an inner wall of the first housing 10; a second field control plate 250 is disposed in the second chamber 101b, and a second step portion 240 for fixing the second field control plate 250 is disposed on an inner wall of the second housing 20. By arranging the first electric field adjusting plate 150 and the second electric field adjusting plate 250, the electrode liquids of two surfaces to be plated of objects to be plated can be distributed more uniformly and consistently, so that the plating quality can be improved.

In some embodiments of the present invention, as shown in fig. 1, the first casing 10 and the second casing 20 are both provided with an electrolyte injection port 102 connecting the plating chamber 101. Thereby, the electrolyte can be injected into the plating chamber 101 through the electrolyte injection port 102. As shown in fig. 1, the electrolyte injection port 102 of the first chamber 101a is opened at the top position of the first chamber 101a, and the electrolyte injection port 102 of the second chamber 101b is opened at the bottom position of the second chamber 101 b.

According to some embodiments of the present invention, as shown in fig. 1, the first casing 10 and the second casing 20 are both provided with a water injection port 103 for injecting the cleaning liquid. Thus, clean water can be injected into the plating chamber 101 through the water injection port 103 to clean the plating chamber 101.

In some embodiments of the present invention, as shown in fig. 1, a reflow bath 104 for connecting the plating chamber 101 and the outside is disposed at the connection end surface of the first casing 10 and the second casing 20. The return tank 104 may be connected to the electrolyte recovery tank 920 via a pipe, so that the electrolyte overflowing from the plating chamber 101 may flow into the electrolyte recovery tank 920 via the return tank 104.

According to some embodiments of the present invention, as shown in FIG. 1, the bottom wall of the plating chamber 101 is provided with a drain 105 for draining the liquid in the plating chamber 101. It should be noted that, as shown in fig. 1, the discharge port 105 may communicate with two branches, wherein one branch communicates with the electrolyte recovery tank 920, and can discharge the electrolyte in the electroplating chamber 101 into the electrolyte recovery tank 920; the other branch is communicated with the pure water tank 910, and the cleaning water in the electroplating chamber 101 can be discharged into the pure water tank 910.

Further, as shown in FIG. 1, the pure water tank 910 is connected to the water injection port 103 through a pipe, so that water for cleaning the plating chamber 101 can be recycled. Similarly, the electrolyte recovery tank 920 is connected to the electrolyte injection port 102 through a pipeline, and the electrode solution recovered by the electrolyte recovery tank 920 can also be recycled.

In some embodiments of the present invention, as shown in fig. 2, 4 and 7, the clamp 30 includes: the first clamping piece 310, the second clamping piece 320 and the fastening component 330 are used for placing the wafer 500 to be electroplated between the first clamping piece 310 and the second clamping piece 320 when fixing the wafer 500 to be electroplated, and pressing the first clamp 30 and the second clamp 30 through the fastening component 330 to fix the wafer 500 to be electroplated. The fastening assembly 330 may be a plurality of studs penetrating the first and second clamps 30 and 30. As shown in fig. 7, the first clip sheet 310 and the second clip sheet 320 may be a sheet structure having a square shape and a hollow area in the middle, the area of the hollow area being approximately equal to the area of the wafer 500 to be electroplated.

It should be noted that the double-sided electroplating apparatus 100 of the present invention can be used for double-sided electroplating of an ultra-thin wafer 500 having a gentle slope on the outer periphery, and can also be used for double-sided electroplating of an ultra-thin wafer 500 having a glass carrier 600. The ultra-thin wafer 500 described herein may be understood as a wafer 500 having a thickness in the range of "30 μm to 250 μm".

As shown in fig. 2 and 3, when the plating target is the ultra-thin wafer 500 having a gently sloping outer peripheral edge, the first clamping piece 310 and the second clamping piece 320 are clamped at a thick position of the outer peripheral edge of the ultra-thin wafer 500, so as to facilitate the clamping of the ultra-thin wafer 500, and further, the ultra-thin wafer 500 can be prevented from being damaged during the clamping. The first electrode set 120 and the second electrode set 220 are connected to the upper end surface and the lower end surface of the ultra-thin wafer 500, respectively.

As shown in fig. 3, the outer periphery of the wafer 500 is a gentle slope, the wafer 500 is provided with a through hole 510, the end face of the wafer 500 is sequentially provided with a redistribution layer 520, a UMB layer 530 and a photoresist layer 540 from inside to outside, wherein the photoresist layer 540 is correspondingly provided with an opening 541 at a position where the wafer 500 needs to be electroplated.

As shown in fig. 4-6, when the object to be plated is an ultra-thin wafer 500 having a glass carrier 600, the ultra-thin wafer 500 having the glass carrier 600 is clamped between the first clamping piece 310 and the second clamping piece 320, the upper surface of the wafer 500 is electrically connected to the first electrode set 120, and the lower surface of the wafer 500 is connected to the second electrode set 220 through a plating layer. During the electroplating, the glass carrier 600 may be facing upward, or the wafer 500 may be facing upward.

As shown in fig. 5, the wafer 500 has a through hole 510, the upper end surface of the wafer 500 has a redistribution layer 520, a UMB layer 530, and a photoresist layer 540 from inside to outside, wherein the photoresist layer 540 has an opening 541 corresponding to a position of the wafer 500 to be electroplated.

As shown in fig. 6, the wafer 500 has a redistribution layer 520, a UMB layer 530, and a photoresist layer 540 sequentially from inside to outside on the lower surface, wherein the photoresist layer 540 has an opening 541 corresponding to a position of the wafer 500 to be plated. The glass carrier 600 is bonded to the lower end surface of the wafer 500 by the adhesive 700, and an operation opening 610 is opened at a position of the glass carrier 600 opposite to a portion to be plated of the lower end surface of the wafer 500, so as to plate a corresponding portion of the lower end surface of the wafer 500.

The electroplating apparatus 100 for double-sided electroplating of a wafer 500 according to the present invention will be described in detail below with reference to the accompanying drawings in an exemplary embodiment. It is to be understood that the following description is only exemplary in nature and should not be taken as a specific limitation of the invention.

As shown in fig. 1, the plating apparatus 100 includes: a first housing 10 and a second housing 20, the first housing 10 defining a first chamber 101a and the second housing 20 defining a second chamber 101 b. When the first housing 10 and the second housing 20 are coupled in the vertical direction, the first chamber 101a and the second chamber 101b constitute an electroplating chamber 101, and the wafer 500 to be electroplated is fixed in the electroplating chamber 101 by the jig 30 in parallel to the horizontal direction. As shown in fig. 2, the jig 30 includes: the wafer electroplating device comprises a first clamping piece 310, a second clamping piece 320 and a fastening component 330, wherein the first clamping piece 310 and the second clamping piece 320 are connected through the fastening component 330, so that a wafer 500 to be electroplated is clamped between the first clamping piece 310 and the second clamping piece 320.

The electroplating apparatus 100 has an electrode group connected to two surfaces to be electroplated of the wafer 500 to be electroplated, and an electrolyte and an anode plate are distributed on both sides of the two surfaces to be electroplated, the anode plate and the electrode group are respectively connected to a positive electrode and a negative electrode of a power supply, and when the power supply is powered on, at least one of the two surfaces to be electroplated is electroplated.

Wherein, the anode plate includes a first anode plate 110 in the first chamber 101a and a second anode plate 210 in the second chamber 101b, the electrode sets include a first electrode set 120 in the first casing 10 and a second electrode set 220 in the second casing 20, the power supply includes a first power supply and a second power supply, the first anode plate 110 and the first electrode set 120 are respectively connected to the positive pole and the negative pole of the first power supply, and the second anode plate 210 and the second electrode set 220 are respectively connected to the positive pole and the negative pole of the second power supply;

the surface to be plated of the wafer 500 to be plated facing the first chamber 101a is connected to the first electrode group 120, and the surface to be plated of the wafer 500 to be plated facing the second chamber 101b is connected to the second electrode group 220.

The electrode group is connected with two surfaces to be electroplated of the wafer 500 to be electroplated through contact electrodes arranged on the first clamping piece 310 and the second clamping piece 320.

As shown in fig. 1, an electric field regulation plate is disposed in each of the first chamber 101a and the second chamber 101b, and a step portion for fixing the electric field regulation plate is disposed on an inner wall of each of the first casing 10 and the second casing 20.

The first casing 10 and the second casing 20 are respectively provided with an electrolyte injection port 102 for connecting the electroplating chamber 101 and a water injection port 103 for injecting cleaning liquid, the connecting end face of the first casing 10 and the second casing 20 is provided with a return groove 104 for connecting the electroplating chamber 101 and the outside, and the bottom wall of the electroplating chamber 101 is provided with a discharge port 105 for discharging liquid in the electroplating chamber 101. The first and second casings 10 and 20 are further provided with a nitrogen gas nozzle 106 for injecting nitrogen gas, and the top wall of the first chamber 101a is provided with an exhaust port 107.

When the electroplating device 100 of the present invention is used for electroplating the wafer 500 to be electroplated, the method comprises the following steps:

s1, placing and fixing a second electrode plate in the second chamber;

s2, fixing a second field adjusting plate in the second chamber;

s3, fixing the first clamping piece of the clamp on the second shell to ensure the second shell to be well contacted with the cathode electrode of the first clamping piece part of the clamp;

s4, fixing the wafer to be electroplated on the lower part of the clamp to ensure good contact of the cathode electrode;

s5, placing a second clamping piece of the clamp to be tightly attached to the wafer to be electroplated so as to ensure good contact of the electrodes between the two;

s6, placing and fixing a first anode plate in the first chamber;

s7, fixing an electric field adjusting plate in the first chamber;

and S8, the first shell and the second shell are closed, and the closing must ensure that: the outer side of the electroplating cavity is sealed, and the metal electrode of the first shell at the inner side is in good contact with the electrode on the first clamping piece of the clamp;

s9, opening an exhaust port at the upper end of the first shell, filling electrolyte into the first cavity and the second cavity by the electrolyte supply system, spraying the electrolyte downwards in the first cavity through the opening of the first anode plate, flushing the electrolyte upwards in the second cavity through the opening of the second anode plate, and discharging air in the electroplating cavity through the exhaust port at the top end of the first cavity along with the liquid injection process;

s10, when the electrolyte in the electroplating is full, closing an exhaust port at the top end of the first chamber;

s11, continuously keeping the electrolyte circulating in the whole closed loop at a low speed, switching on a direct current power supply between the anode and the cathode, stirring by a stirring rod at a low speed, and electroplating;

s12, stopping electroplating after the needed thickness of the electroplated layer is reached by controlling the concentration of the electroplating solution, the current between the anode and the cathode and the electroplating time;

s13, opening a drain pipeline valve, closing a pure water reflux valve, and emptying the electroplating solution in the electroplating to an electrolyte reflux groove;

s14, closing the drain valve, opening the pure water pipeline, cleaning the wafer, discharging the cleaned pure water to the pure water tank or the wastewater collection tank, and closing the pure water pipeline after cleaning;

s15, opening a nitrogen pipeline, blowing the heated nitrogen to the surface of the wafer to quickly dry the wafer, and closing the nitrogen pipeline after the drying is finished;

and S16, separating the first shell and the second shell, taking out the second clamping piece of the clamp, and taking out the wafer.

To sum up, the utility model provides a two-sided electroplating device 100 can electroplate for the ultra-thin wafer 500 of the gentle slope form to ultra-thin wafer 500 or the outer peripheral edge that has glass support plate 600, moreover, can realize treating two of electroplating wafer 500 simultaneously and treat that the face of electroplating carries out two-sided electroplating, or selects one of them to treat that the face of electroplating is electroplated, has improved the electroplating efficiency and the flexibility of electroplating of treating electroplating wafer 500. Moreover, the wafer 500 to be electroplated is placed in the electroplating chamber 101 in parallel to the horizontal direction, which is convenient for the wafer taking and fixing operation of the wafer 500 to be electroplated and improves the electroplating convenience of the wafer 500 to be electroplated.

The technical means and functions of the present invention to achieve the intended purpose will be understood more deeply and concretely through the description of the embodiments, however, the attached drawings are only for reference and illustration, and are not intended to limit the present invention.

Claims (9)

1. A double-sided electroplating device is characterized in that the electroplating device is provided with an electroplating cavity, an object to be electroplated is suitable for being placed in the electroplating cavity in parallel to the horizontal direction, the electroplating device is provided with an electrode group for connecting two surfaces to be electroplated of the object to be electroplated, and electrolyte and anode plates are distributed on two sides of the two surfaces to be electroplated;

the anode plate and the electrode group are respectively connected to the positive electrode and the negative electrode of a power supply, and when the power supply is electrified, at least one of the two surfaces to be electroplated is electroplated;

the double-sided plating apparatus includes:

a first housing defining a first chamber;

a second housing defining a second chamber;

when the first housing and the second housing are connected in the vertical direction, the first chamber and the second chamber constitute the plating chamber.

2. The double-sided plating apparatus according to claim 1, wherein a groove is provided at a connecting end face of the first casing and the second casing which are opposed to each other, and the object to be plated is fixed in the plating chamber by a jig fixed in the groove.

3. The double-sided electroplating apparatus according to claim 1, wherein the anode plate comprises a first anode plate located in the first chamber and a second anode plate located in the second chamber, the electrode sets comprise a first electrode set located in the first housing and a second electrode set located in the second housing, the power supply comprises a first power supply and a second power supply, the first anode plate and the first electrode set are respectively connected to a positive electrode and a negative electrode of the first power supply, and the second anode plate and the second electrode set are respectively connected to a positive electrode and a negative electrode of the second power supply;

the surface to be electroplated of the object to be electroplated, which faces the first chamber, is connected with the first electrode group, and the surface to be electroplated of the object to be electroplated, which faces the second chamber, is connected with the second electrode group.

4. The double-sided plating apparatus according to claim 3, wherein the top wall of the first chamber is provided with a first fixing portion for fixing the first anode plate, and the bottom wall of the second chamber is provided with a second fixing portion for fixing the second anode plate.

5. The double-sided plating apparatus as recited in claim 1, further comprising: and a step portion for fixing the electric field adjusting plate is arranged on the inner wall of at least one of the first shell and the second shell.

6. The double-sided plating apparatus according to claim 1, wherein the first casing and the second casing are each provided with an electrolyte injection port communicating with the plating chamber.

7. The double-sided plating apparatus according to claim 1, wherein the first casing and the second casing are each provided with a water injection port for injecting a cleaning liquid.

8. The double-sided plating apparatus according to claim 1, wherein a reflow groove communicating the plating chamber with the outside is provided at a connection end surface of the first housing and the second housing.

9. The double-sided plating apparatus according to any one of claims 1 to 8, wherein a bottom wall of the plating chamber is provided with a drain port for draining a liquid in the plating chamber.

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