CN214281750U - Component carrier for carrying components - Google Patents

Abstract

The utility model provides a part holds carrier for bearing part, a serial communication port, part holds carrier includes the circumference reference mark that forms in the regional department of circumference that part held carrier, and wherein, the position based on circumference reference mark (101) holds carrier surface classification with the part and becomes a plurality of alignment pieces (201). The alignment block includes at least one central fiducial marker. The component carrier further comprises a central reference block area (202) consisting of at least one alignment block, wherein a precise orientation of the component carrier relative to the processing machine can be provided on the basis of the circumferential reference mark (101) and the central reference block area (202).

Description

Component carrier for carrying components

Technical Field

The utility model relates to a part bears carrier for bearing part that has the benchmark sign.

Background

A component carrier, such as a Printed Circuit Board (PCB), carries a plurality of electronic components. Thus, the component carrier comprises a plurality of electrical connections, for example pads, and a plurality of electronic parts and vias (through-hole connections). In order to produce a very precise arrangement of pads and through holes, the component carrier must be very precisely aligned with respect to a machining machine, such as a laser cutter. Furthermore, the alignment of the component carrier is important for, for example, the precise attachment of a solder mask.

In order to provide alignment of the component carrier, it is conventional for the marking elements to be arranged, for example, at corners of the component carrier. However, if there is no space for placing the marking in that region of the component carrier, the alignment of the component carrier is difficult.

Accordingly, it may be desirable to provide a component carrier for precise alignment.

SUMMERY OF THE UTILITY MODEL

According to an exemplary embodiment of the present invention, a component carrier for carrying a component is presented. The component carrier includes a circumferential reference mark formed at a circumferential region of the component carrier, wherein the component carrier surface is classified into a plurality of alignment blocks based on a position of the circumferential reference mark. The alignment block includes at least one central fiducial marker. The central reference block region is classified as comprising at least one alignment block, wherein, based on the circumferential reference mark and the central reference block region, a precise orientation of the component carrier relative to the processing machine can be provided.

The machining machine may be, for example, an X-ray drilling tool or a laser cutting tool. Further, the processing machine may also be a laminator for laminating solder resist layers, such as dry film solder resist layers.

The circumferential reference mark is formed at a circumferential region, and in particular at an edge portion of the component carrier. The circumferential reference marks may be detected by respective alignment detection means, for example by a light detector (e.g. a photodetector).

Typically, the component carrier surface may be sorted by a plurality of (virtual) alignment blocks. The classification is based, for example, on the position of the circumferential (edge) fiducial marks. In particular, between the edge reference marks, a specific pattern of alignment blocks may be defined and classified.

A central fiducial marker is located in some or each alignment block. The central fiducial mark is a physical item on the component carrier. For example, the central reference mark is a through hole or a specific pad that can be detected by the alignment detection apparatus. The position of the central reference mark on the component carrier is known.

For alignment purposes, one or more alignment blocks are summarized to define a central reference block region that depends on the individual alignment characteristics of a particular reference block. For example, the central reference block region may include, for example, four alignment blocks in a column, or four alignment blocks in two parallel columns.

Based on the circumferential reference marks and the central reference block area, a precise orientation of the component carrier relative to the processing machine can be provided.

By the method of the invention, further central reference marks defined in a specific alignment block may be used for aligning the component carrier. Thus, for example, the edge portions are not available for placing the circumferential reference marks, specific areas of the component carrier, wherein sufficient space for defining the central reference mark and the alignment block, respectively, is available for alignment purposes. In particular, the alignment detection means may determine a respective central reference block region, and in particular the arrangement of a particular alignment block within the reference block region. Thus, depending on the predefined reference block area for a particular component carrier, the alignment detection apparatus may determine the alignment of the component carrier. Thus, complex component carriers may also be properly aligned.

According to another exemplary embodiment of the present invention, the circumferential reference mark is formed by one of a through hole, a blind hole and a pad.

According to another exemplary embodiment of the present invention, the center fiducial mark comprises one or more of an alignment through hole, a blind hole and an alignment pad.

According to another exemplary embodiment of the present invention, the central reference block area comprises a linear array of alignment blocks.

According to another exemplary embodiment of the present invention, the central reference block area comprises a further linear column of alignment blocks parallel to the linear column of alignment blocks.

According to another exemplary embodiment of the present invention, the central reference block area comprises alignment blocks in a square arrangement.

According to another exemplary embodiment of the invention, the central reference block area comprises an alignment block arranged in the center of the component carrier.

In one embodiment, the component carrier is shaped as a plate-like piece. This contributes to a compact design, wherein the component carrier still provides a large basis for mounting components thereon. Further, in particular, a bare die is an example of an embedded electronic component, and can be easily embedded in a thin plate-like member such as a printed circuit board due to its small thickness.

In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate, in particular an IC substrate, and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures (e.g. by applying pressure and/or by providing thermal energy). As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The various electrically conductive layer structures may be connected to each other in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and forming vias or any other through hole connections by partially or completely filling them with an electrically conductive material, in particular copper. The filled holes either connect the entire stack (via connections extending through multiple layers or the entire stack) or connect at least two electrically conductive layers (called vias). Similarly, optical interconnects may be formed through the layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to receive one or more components on one or both of the opposing surfaces of a plate-like printed circuit board. They may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers (e.g., glass fibers).

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier relative to the PCB, on which one or more components may be mounted, and may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the components, in particular electronic components, to be mounted thereon (e.g. in the case of Chip Scale Packages (CSP)). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a Printed Circuit Board (PCB), but with a comparatively high density of laterally and/or vertically arranged connections. The transverse connections are, for example, conductive paths, while the vertical connections may be, for example, boreholes. These lateral and/or vertical connections are provided within the substrate and may be used to provide electrical, thermal and/or mechanical connections of a packaged or unpackaged component (e.g., a bare die), particularly an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrate". The dielectric part of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

The substrate or interposer may comprise or consist of at least one layer of: glass, silicon (Si) and/or photoimageable or dryable organic materials such as epoxy based build-up materials (e.g. epoxy based build-up films) or polymer compounds (which may or may not contain photosensitive and/or thermosensitive molecules) such as polyimides or polybenzoxazoles.

In one embodiment, the at least one electrically insulating layer structure comprises a resin or polymer, such as at least one of epoxy, cyanate ester, benzocyclobutene, bismaleimide-triazine, polyphenylene (polyphenylene) derivatives (e.g. based on at least one of polyphenylene ether (PPE), Polyimide (PI), Polyamide (PA), Liquid Crystal Polymer (LCP), Polytetrafluoroethylene (PTFE) and/or combinations thereof. reinforcing structures, such as made of glass (multiple layer glass), such as mesh, fiber, sphere or other types of filler particles, may also be used to form composites. Especially FR4, but other materials, especially epoxy based laminates (e.g. laminated films) or photoimageable dielectric materials may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other low, ultra-low, or ultra-low DK materials can also be applied as electrically insulating structures in component carriers.

In one embodiment, the at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated forms thereof are possible, in particular coated with a superconducting material or a conductive polymer, such as graphene or poly (3, 4-ethylenedioxythiophene) (PEDOT), respectively.

The at least one component may be embedded in the component carrier and/or may be surface mounted on the component carrier. Such components may be selected from: a non-electrically conductive inlay, an electrically conductive inlay (e.g. a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g. a heat pipe), a light guiding element (e.g. a light guide or light conductor connection), an electronic component or a combination thereof. The inlay may be, for example, a metal block with or without a coating of insulating material (IMS inlay), which may be embedded or surface mounted to facilitate heat dissipation. Suitable materials are defined in terms of their thermal conductivity, which should be at least 2W/mK. Such materials are generally based on, but not limited to, metals, metal oxides and/or ceramics, such as copper, alumina (Al)₂O₃) Or aluminum nitride (AlN). Other geometries with increased surface area are also often used in order to increase the heat exchange capacity. Furthermore, the component may be an active electronic component (implementing at least one pn junction), a passive electronic component (e.g., a resistor, inductor, or capacitor), an electronic chip, a memory device (e.g., a DRAM or other data storage), a filter, an integrated circuit (e.g., a Field Programmable Gate Array (FPGA), a Programmable Array Logic (PAL), a Generic Array Logic (GAL), and a complex array logic (cpl)), a filter, a display, and a display, aProgrammable Logic Devices (CPLDs)), signal processing components, power management components (e.g. Field Effect Transistors (FETs), Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), Complementary Metal Oxide Semiconductors (CMOS), Junction Field Effect Transistors (JFETs) or Insulated Gate Field Effect Transistors (IGFETs), all based on semiconductor materials, such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga)₂O₃) Indium gallium arsenide (InGaAs) and/or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, opto-couplers, voltage converters (e.g., DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical converters, sensors, actuators, micro-electromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as the component. Such magnetic elements may be permanent magnetic elements (e.g. ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, such as ferrite cores) or may be paramagnetic elements. However, the component may also be an IC substrate, interposer, or other component carrier, for example in a board-in-board (midplane) configuration. The component may be surface mounted on the component carrier and/or may be embedded within it. In addition, other components may also be used as components, particularly those that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagating from the environment.

In one embodiment, the component carrier is a laminate type component carrier. In such embodiments, the component carrier is a multi-layered structure of compounds that are stacked and joined together by the application of pressure and/or heat.

After processing the inner layer structure of the component carrier, one or both of the opposite major surfaces of the processed layer structure may be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating layer structures and/or electrically conductive layers. And (5) structure. In other words, lamination may continue until the desired number of layers is obtained.

After completion of the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure, the obtained layer structure or component carrier may be subjected to a surface treatment.

In particular, in the case of surface treatment, an electrically insulating solder resist may be applied to one or both of the opposite main surfaces of the layer stack or the component carrier. For example, such a solder resist may be formed over the entire major surface and subsequently patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to the electronic periphery. The surface portion of the component carrier which remains covered with the solder resist can be effectively protected against oxidation or corrosion, in particular a surface portion comprising copper.

In the case of a surface treatment, a surface modification may also be selectively applied to exposed electrically conductive surface portions of the component carrier. Such a surface modification may be an electrically conductive covering material on exposed electrically conductive layer structures (e.g. pads, conductive tracks, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (in particular copper) may be oxidized, thereby reducing the reliability of the component carrier. The surface finish may then for example be formed as an interface between the surface mounted component and the component carrier. The surface modification has the function of protecting the exposed electrically conductive layer structure (in particular the copper circuit) and enabling a bonding process with one or more components (for example by soldering). Examples of suitable materials for surface modification are Organic Solderability Preservative (OSP), chemical nickel immersion gold (ENIG), chemical nickel immersion palladium immersion gold (ENIPIG), gold (in particular hard gold), chemical tin, nickel-gold, nickel-palladium, etc.

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these exemplary embodiments.

Drawings

Fig. 1 shows a component carrier with a circumferential reference mark according to an exemplary embodiment.

Fig. 2 illustrates a component carrier having a plurality of alignment blocks according to an exemplary embodiment.

FIG. 3 illustrates four alignment blocks including a plurality of central fiducial markers according to an exemplary embodiment.

Fig. 4 shows a cross-sectional view of a component carrier comprising a circumferential reference mark and a central reference mark according to an exemplary embodiment.

Fig. 5 shows a component carrier comprising a first pattern of rectangular central reference block areas according to an exemplary embodiment.

Fig. 6 shows a component carrier comprising another pattern of rectangular central reference block areas according to an exemplary embodiment.

Fig. 7 shows a component carrier comprising an overlapping pattern of rectangular central reference block areas according to an exemplary embodiment.

Fig. 8 shows a component carrier comprising another pattern of rectangular central reference block areas according to an exemplary embodiment.

Fig. 9 shows a component carrier comprising a circumferential reference mark and a central reference block region according to an exemplary embodiment.

Fig. 10 illustrates a manufacturing process of a component carrier according to an exemplary embodiment.

Fig. 11 and 12 show overlays of plates, bars, and cells based on specific data according to an example embodiment.

FIG. 13 illustrates a graph showing alignment accuracy, according to an example embodiment.

Detailed Description

The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference signs.

Fig. 1 shows a component carrier with a circumferential reference mark according to an exemplary embodiment. The component carrier 100 comprises a circumferential reference mark 101 formed at a circumferential region of the component carrier 100. The circumferential reference mark 101 is particularly formed at an edge portion of the component carrier 100. The circumferential reference marks may be detected by respective alignment detection means, for example by a light detector (e.g. a photodetector).

Fig. 2 shows a component carrier 100 having a plurality of alignment blocks 201 according to an exemplary embodiment. The component carrier surface is classified into a plurality of alignment patches 201 based on the positions of the edge reference marks 101. Typically, the component carrier surface may be sorted by a plurality of (virtual) alignment blocks 201. The classification is based on, for example, the position of the edge reference mark 101. Specifically, between the edge reference marks 101, a specific pattern of the alignment block 201 may be defined and classified.

FIG. 3 illustrates four alignment blocks 201, each alignment block 201 including a plurality of central fiducial markers 301, according to an example embodiment. The central fiducial marker 301 is a physical item on the component carrier 100. For example, the center reference mark 301 is a through hole or a specific pad that can be detected by the alignment detection apparatus. The position of the central fiducial marker 301 on the component carrier is known (e.g., predefined).

The pattern of the central fiducial marker 301 in a particular alignment block 201 may be individual and may be different relative to adjacent alignment blocks 201 having different patterns of, for example, respective central fiducial markers 301. Further, the central reference block area 202 is defined to be composed of, for example, an arrangement of four alignment blocks 201 shown in fig. 3.

Based on the circumferential reference marks 101 and the central reference block area 202, a precise orientation of the component carrier 100 relative to the machining machine is provided. The machining machine may be, for example, an X-ray drilling tool or a laser cutting tool. Further, the processing machine may also be a laminator for laminating solder resist layers, such as dry film solder resist layers.

For alignment purposes, for example in fig. 3, four alignment blocks 201 are summarized for forming a particular example fiducial block area 202 that depends on the respective alignment characteristics of the particular fiducial block 201.

Based on the circumferential reference marks 101 and the central reference block area 202, a precise orientation of the component carrier 100 relative to the machining machine is possible.

Fig. 4 shows a cross-sectional view of the component carrier 100 comprising a circumferential reference mark 101 and a central reference mark 301 according to an exemplary embodiment.

The component carrier 100 comprises a through hole at a circumferential area forming a circumferential reference mark 101. In a central region of the component carrier 100, a plurality of pads 401, 403 and through holes 402 are formed. For example, a fiducial block 201 may be defined, the fiducial block 201 including, for example, a through hole 402 and a center pad 401, thereby serving as the center fiducial mark 301 defined within the particular fiducial block 201. There may be additional pads 403 that would not be considered for defining the central fiducial marker 301. Each central fiducial mark 301 may be formed on both surfaces of the component carrier 100.

Fig. 5 shows a component carrier 100 comprising a first pattern for a rectangular central reference block area 202, 501, 502, 503 according to an exemplary embodiment.

Each of the central reference block regions 202, 501, 502, 503 may define a rectangular shape consisting of two parallel columns, each of which is defined by four reference blocks 201. Depending on the position of the central reference block regions 202, 501, 502, 503 and, for example, the distance between the central reference block regions 202, 501, 502, 503 from each other or relative to the circumferential reference mark 101, the alignment of the component carrier 100 can be determined. In the example shown, the component carrier 100 comprises 64 alignment blocks 201, wherein 8 alignment blocks 201 arranged in parallel rows define respective central reference block areas 202, 501, 502, 503. Thus, for example, 8 central reference block regions 202, 501, 502, 503 may be defined.

Fig. 6 shows a component carrier 100 comprising another pattern for a rectangular central reference block area 202. In particular, the central reference block area 202, 501, 502, 503 comprises in particular 16 alignment blocks 201, each arranged in a square arrangement (4 × 4). Thus, by defining 64 alignment blocks 201, for example, 16 central reference block regions 202, 501, 502, 503 may be defined.

Fig. 7 shows a component carrier comprising an overlapping pattern for rectangular central reference block regions 202, 501, 502, 503, 701 according to an exemplary embodiment. For example, four alignment blocks 201 form a block configuration and are defined in spaced apart central reference block regions 202, 501, 502, 503. Further, additional overlapping central reference block regions 701 may be defined, which include, for example, alignment blocks 201, the alignment blocks 201 being classified into central reference block regions 202, 501, 502, 503 and overlapping central reference block regions 701.

Fig. 8 shows a component carrier 100 comprising another pattern of rectangular central reference block areas 202, 501, 502, 503 according to an exemplary embodiment. The central reference block areas 202, 501, 502, 503 may be different from each other. For example, each central reference block region 202, 501, 502, 503 may include a different number and arrangement of alignment blocks 201.

Fig. 9 shows a component carrier 100 comprising a circumferential reference mark 101 and one central reference block area 202 according to an exemplary embodiment. Thus, additional alignment improvements are provided without the need for multiple additional central reference block regions 501, 502, 503. Thus, for example, it is possible to improve cavity cut registration from 25 μm to 12.5 μm or 7.5 μm (microns) by adding a pad in the center of each cavity.

Fig. 10 illustrates a manufacturing process of a component carrier according to an exemplary embodiment. For example, in a first step, the component carrier 100 is processed 1001 with X-ray drill holes. Thus, for example, some through holes or blind holes are formed to serve as the circumferential reference mark 101 or the central reference mark 301. Thus, the first alignment of the component carrier may be improved. In the next step, for example, the lithography process 1002 is completed to design a pattern in, for example, the central fiducial mark 301 in the center of each cavity) that is used for subsequent laser dicing alignment requirements. In a further process step, a solder mask 1003, such as a dry film solder mask (DSFM), may be added. Next, a laser dicing step 1004 may be completed, wherein an alignment of the component carrier 100 with respect to the laser dicing apparatus is possible due to the central fiducial mark 301 formed by the pads 401 and the through holes 402, for example, as shown in fig. 4, and in the laser dicing step 1004, a cavity coating step 1005 may be completed. In the final step, control measurements are made 1006 to demonstrate the proper alignment of the laser-cut holes.

In summary, a manufacturing process for a component carrier 100 is described. First, a circumferential reference mark 101 is formed at a circumferential region of the component carrier 100. The component carrier surface is sorted into a plurality of alignment blocks 201 based on the position of the circumferential reference mark 101. At least one central fiducial marker 301 is depicted in the alignment block 201. Furthermore, the central reference block region 202 is composed of at least one alignment block 201, wherein, based on the circumferential reference mark 101 and the central reference block region 202, a precise orientation of the component carrier 100 relative to the processing machine can be provided.

Fig. 11 and 12 show overlay views of a board (e.g. component carrier 100), a stripe-like layer (e.g. solder mask) 1102 and an electronic unit 1103 based on specific data given in a data unit 1101. The data unit 1101 may be based on an Open Database (ODB) system, which is a proprietary CAD-to-CAM data exchange format used in the design and manufacture of electronic devices. The purpose may be to exchange printed circuit board design information between design and manufacturing and between design tools. The alignment of all layers and cells, e.g. the component carrier 100, the electronic unit 1103 and the stripe layer 1102, is shown in fig. 12. For example, each central fiducial block area 202 may define a rectangular shape consisting of two parallel columns, each of which is defined by four fiducial blocks 201. Depending on the position of the central reference block area 202, the alignment of the component carrier 100, the electronic unit 1103 and the strip layer 1102 may be determined.

Fig. 13 shows a graph of alignment accuracy of a center point of a laser cut hole in a component carrier according to an example embodiment. The Upper Specification Limit (USL) is set to: the deviation between the predefined position of the center point of the laser hole with respect to the actual value of the center point of the laser-cut hole is 15 μm. The predefined locations of the laser-cut holes may be centered in the corresponding openings in a predefined pattern, such as an LDI (laser direct imaging) pattern.

As can be seen in fig. 13, by aligning a central reference block area 202 using the circumferential reference mark 101, which central reference block area 202 comprises at least one alignment block 201, the deviation between the predefined position of the central point of the laser hole with respect to the actual position of the central point of the laser-cut hole is only between 4 μm and 8 μm.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The realisation of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, even in the case of substantially different embodiments, it is possible to use the solution shown and a plurality of variants according to the principles of the invention.

List of reference numerals:

100 parts carrier

101 circumferential reference mark

201 alignment block

202 central reference block area

301 central reference mark

401 alignment pad

402 aligned vias

403 pad

501 additional central reference block area

502 additional central reference block area

503 additional central reference block area

701 overlapping central reference block region

1001X-ray borehole

1002 photosensitive layer

1003 solder mask

1004 laser cutting

1005 Chamber coating

1006 measurement step

1101 data unit

1102 strip layer

1103 electronic unit.

Claims (13)

1. A component carrier for carrying a component, characterized in that the component carrier comprises:

a circumferential reference mark (101) formed at a circumferential region of the component carrier (100),

wherein the component carrier surface is classified into a plurality of alignment blocks (201) based on the position of the circumferential reference mark (101),

wherein the alignment block comprises at least one central reference mark (301),

a central reference block area (202) comprising at least one alignment block,

wherein a precise orientation of the component carrier relative to the processing machine can be provided on the basis of the circumferential reference mark (101) and the central reference block region (202).

2. The component carrier according to claim 1, wherein the circumferential reference mark (101) is formed by a through hole.

3. The component carrier according to claim 1, characterized in that the circumferential reference mark (101) is formed by a blind hole.

4. The component carrier according to claim 1, wherein the circumferential reference mark (101) is formed by a pad.

5. The component carrier according to claim 1, wherein the central reference mark (301) comprises one or more alignment through holes (402).

6. The component carrier according to claim 1, wherein the central reference mark (301) comprises one or more blind holes.

7. The component carrier according to claim 1, wherein the central fiducial mark (301) comprises one or more alignment pads (401).

8. The component carrier according to claim 1, wherein the circumferential reference mark (101) is formed at an edge portion of the component carrier (100).

9. The component carrier according to claim 1, wherein the central reference block area (202) comprises a linear array of alignment blocks (201).

10. The component carrier according to claim 9, wherein the central reference block area (202) comprises further linear columns of alignment blocks (201) parallel to the linear columns of alignment blocks (201).

11. The component carrier according to claim 1, wherein the central reference block area (202) comprises alignment blocks (201) arranged in a square.

12. The component carrier according to claim 11, wherein the central reference block area (202) comprises a square arrangement of four alignment blocks (201).

13. The component carrier according to claim 1, wherein the central reference block area (202) comprises an alignment block (201) arranged in the center of the component carrier.

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