CN214281736U

CN214281736U - Circuit board

Info

Publication number: CN214281736U
Application number: CN202120431826.9U
Authority: CN
Inventors: 姜伟
Original assignee: Treasure Electronic Technology (shantou) Ltd
Current assignee: Treasure Electronic Technology (shantou) Ltd
Priority date: 2021-02-26
Filing date: 2021-02-26
Publication date: 2021-09-24
Anticipated expiration: 2031-02-26

Abstract

The utility model relates to a circuit board, including insulating basic unit, circuit layer and heat-conducting layer, insulating basic unit has the first face and the second face of carrying on the back the body and setting up, just the side has between insulating basic unit's the first face and the second face, the circuit layer set up in insulating basic unit first face, the heat-conducting layer set up in insulating basic unit the second face, at least part protrusion in insulating basic unit the side sets up, insulating basic unit runs through first face with the through-hole has been seted up to the second face, be provided with in the through-hole with the heat conduction post that the heat conduction layer is connected, heat conduction post global with the wall portion of through-hole is connected. The circuit board can have good heat dissipation effect through the cooperation of heat conduction post and heat-conducting layer.

Description

Circuit board

Technical Field

The utility model relates to the field of electronic technology, especially, relate to circuit board.

Background

When the circuit board is applied to some fields, electronic component can give off great heat at the operation in-process, if not in time give off the heat of circuit board, then cause the high temperature of electronic component and circuit board very easily, and then lead to electronic component and circuit board to damage, and the radiating effect of present circuit board is not good.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide a circuit board.

The utility model provides a circuit board, includes insulating basic unit, circuit layer and heat-conducting layer, insulating basic unit has the first face and the second face that set up mutually, just the side has between insulating basic unit's first face and the second face, the circuit layer set up in insulating basic unit's first face, the heat-conducting layer set up in insulating basic unit's the second face, the at least part protrusion of heat-conducting layer in insulating basic unit's the side sets up, insulating basic unit runs through first face with the through-hole has been seted up to the second face, be provided with in the through-hole with the heat conduction post that the heat conduction layer is connected, the heat conduction post global with the wall portion of through-hole is connected.

In one embodiment, the thermally conductive layer is an aluminum plate.

In one embodiment, the heat-conducting column is an aluminum column.

In one embodiment, the wall of the through hole is provided with a copper layer, which is welded to the aluminum pillar.

In one embodiment, the thermally conductive post is a graphite post.

In one embodiment, the heat conducting layer is provided with heat dissipation grooves at positions protruding out of the side faces of the insulating base layer.

In one embodiment, the insulating base layer further comprises an ink layer, and the ink layer is arranged on the surface of the insulating base layer and the surface of the circuit layer.

The circuit board can absorb heat from the surface of the insulating substrate through the heat conduction layer, or transmit the heat inside the insulating base layer to the heat conduction layer through the heat conduction columns, and after the heat conduction layer absorbs heat, the surface of the circuit board is kept at a temperature higher than the ambient environment due to good heat conduction performance of the circuit board, so that the heat conduction layer is favorable for continuously emitting the heat to the ambient air, and the heat dissipation effect is achieved. And, the heat-conducting layer can also be with heat guide to the position of self protrusion in the side, the part of heat-conducting layer protrusion in the side can contact with the air better to this heat radiating area that increases makes the heat-conducting layer give off the heat to around betterly, like this, can reduce the temperature of circuit board well.

Drawings

Fig. 1 is a schematic perspective view of a circuit board according to an embodiment.

Fig. 2 is a schematic structural diagram of a direction of a circuit board according to an embodiment.

Fig. 3 is a schematic structural diagram of a direction of a circuit board according to another embodiment.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 and 2, in one embodiment, a circuit board 10 is provided, the circuit board 10 including an insulating base layer 100, a circuit layer 200 and a heat conductive layer 300, the insulation base layer 100 has a first side 101 and a second side 102 that are oppositely disposed, and the insulation base layer 100 has a side surface 103 between the first surface 101 and the second surface 102, the circuit layer 200 is disposed on the first side 101 of the insulation base layer 100, the heat conduction layer 300 is disposed on the second side 102 of the insulation base layer 100, at least a portion of the heat conductive layer 300 protrudes from the side surface 103 of the insulation base layer 100 to form a heat dissipation protrusion 210, the insulation base layer 100 has a through hole 104 penetrating the first surface 101 and the second surface 102, a heat conduction column 400 connected to the heat conduction layer 300 is provided in the through hole 104, and the circumferential surface of the heat conduction column 400 is connected to the wall of the through hole 104. It is understood that the insulating base layer 100 may also be referred to as an insulating substrate and the thermally conductive layer 300 may also be referred to as a thermally conductive plate. The wiring layer 200 includes wirings and pads made of a conductive material and attached to the surface of the insulation base layer 100. In the drawings in this embodiment, a single panel, i.e., a layer of wiring, is shown. In other embodiments, the number of the insulation base layer 100 and the number of the wiring layers 200 are plural, respectively, and the insulation base layer 100 and the wiring layers 200 are laminated to form the multilayer copper thick wiring board 10. For ease of understanding, the portion of the heat conduction column 400 that is disposed through the through-hole 104 and the wall of the through-hole are shown as dashed lines in fig. 1.

In this embodiment, the heat conducting layer 300 has a uniform thickness, that is, the heat conducting layer 300 has a plate shape, so that the heat conducting layer can be easily laminated with the insulating base layer.

In this embodiment, the insulation base layer 100 is square and plate-shaped, the first surface 101 and the second surface 102 are disposed opposite to each other and are the surfaces with the largest area of the insulation base layer 100, four side surfaces 103 are formed on the first surface 101 and the second surface 102, and the heat conduction layer 300 is disposed to protrude from the four side surfaces 103 respectively. The area of the heat conductive layer 300 is larger than the area of the insulating base layer 100 as viewed in the thickness direction. Alternatively, the projection of the insulation base layer 100 onto the heat conductive layer 300 falls entirely within the coverage of the insulation base layer 100. This enables the heat conducting layer 300 to better radiate heat to the surroundings. Specifically, the insulation base layer is a preprg (prepreg).

In particular, the wiring layer is made of a conductive material, and in one embodiment, the wiring layer is a copper metal layer. In other embodiments, the trace layer is a conductive ink.

In one embodiment, the thermally conductive layer 300 is an aluminum plate. The aluminum plate has good heat conducting performance, so that heat can be quickly conducted to a cooled position, and heat dissipation is accelerated. In one embodiment, the heat conducting pillars 400 are aluminum pillars having good heat conducting performance, so that heat can be rapidly conducted to the heat conducting layer 300, thereby facilitating heat dissipation from the heat conducting layer 300, and the aluminum material can have good cost performance. In one embodiment, the wall of the through hole 104 is provided with a copper layer 105, and the copper layer 105 is welded to the aluminum pillar. In this embodiment, the copper layer 105 is formed by electroplating, and can be formed without changing the original process, and the aluminum pillar is soldered on the copper layer 105, so as to fill the through hole 104.

In one embodiment, the heat conducting columns are tin columns, wherein the tin columns are obtained through tin spraying, so that the tin columns can be manufactured through the original tin spraying process of the circuit board, and the tin columns are more convenient to manufacture. In one embodiment, the heat-conducting pillar is a copper pillar, which has better heat-conducting property and can be realized through an electroplating process. In one embodiment, the thermally conductive post is a graphite post. The graphite column also has better heat-conducting property, and can realize quickly transferring heat to the heat-conducting layer. In this embodiment, the graphite column may be implemented by a pre-process of a horizontal electroplating apparatus, and of course, other similar apparatuses may be used to implement the same principle.

In order to better dissipate heat, in one embodiment, the heat conducting layer 300 is provided with heat dissipating grooves 211 at positions protruding from the side surface 103 of the insulation base layer 100. In this embodiment, the position of the heat conduction layer 300 protruding from the side surface 103 is defined as a side edge, the side edge of the heat conduction layer 300 is provided with a plurality of heat dissipation grooves 211, and the heat dissipation layer can increase the contact area between the heat conduction layer 300 and the air, thereby increasing the heat dissipation efficiency.

In one embodiment, the circuit board further comprises an ink layer disposed on the surface of the insulating base layer and the surface of the circuit layer. The ink layer is used for covering and protecting the circuit layer and the insulating base layer and is used for avoiding the short circuit and the open circuit of the circuit layer.

For better heat dissipation, as shown in fig. 3, in one embodiment, the heat sink 211 is penetrated by a spring 500, the spring 500 is welded to the wall of the heat sink 211, specifically, the spring 500 is welded to the wall of the heat sink 211 through a solder layer 106, the solder layer can help to transfer heat of the heat conducting layer 300 to the spring 500, and help the spring to dissipate heat outwards, and meanwhile, the welding of the spring to the wall of the heat sink can make the spring stably disposed in the heat sink, so that the spring has better buffering performance. In this embodiment, one end of the spring 500 protrudes from the first surface 101, and the other end of the spring 500 protrudes from the heat conducting layer 300. The heat of the heat conductive layer 300 is transferred to the spring 500, and the spring 500 has a large surface area and can radiate the heat to the outside well. Meanwhile, the spring 500 may play a role of buffering, and may protect the circuit board 10 when the circuit board 10 shakes. Specifically, the spring is a metal spring, which is beneficial to heat conduction and heat dissipation. In order to increase the heat dissipation efficiency of the spring, in one embodiment, the spring is a copper spring, so that the spring can better absorb heat and diffuse outwards. Simultaneously, the spring that copper made can be better with soldering tin layer welding.

The circuit board 10 can absorb heat from the surface of the insulating substrate through the heat conducting layer 300, or transmit the heat inside the insulating base layer 100 to the heat conducting layer 300 through the heat conducting posts 400, after the heat conducting layer 300 absorbs heat, the surface maintains a temperature higher than the ambient environment due to good heat conducting performance, so that the heat conducting layer 300 is favorable for continuously radiating the heat to the ambient air, and the heat radiating effect is achieved. Moreover, the heat conduction layer 300 can guide heat to the position where the heat conduction layer protrudes from the side surface 103, and the part of the heat conduction layer 300 protruding from the side surface 103 can be better contacted with air, so that the heat dissipation area is increased, the heat conduction layer 300 can better radiate heat to the periphery, and thus, the temperature of the circuit board 10 can be well reduced. It can be seen that the circuit board 10 of the present application has a good heat dissipation effect.

Moreover, the heat conducting layer 300 only needs to be pressed onto the insulating base layer 100 in a pressing process, and an additional manufacturing process is not needed, so that the structure of the heat conducting layer 300 protruding out of the side surface 103 can be better adapted to the process of the circuit board 10 compared with the traditional heat dissipation structures such as heat dissipation fins, and the like, and the heat conducting layer has the advantages of simple process and good stability.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The circuit board is characterized by comprising an insulation base layer, a circuit layer and a heat conduction layer, wherein the insulation base layer is provided with a first surface and a second surface which are arranged in a back-to-back mode, a side face is arranged between the first surface and the second surface of the insulation base layer, the circuit layer is arranged on the first surface of the insulation base layer, the heat conduction layer is arranged on the second surface of the insulation base layer, at least part of the heat conduction layer protrudes out of the side face of the insulation base layer, the insulation base layer penetrates through the first surface and the second surface and is provided with a through hole, a heat conduction column connected with the heat conduction layer is arranged in the through hole, and the peripheral surface of the heat conduction column is connected with the wall portion of the through hole.

2. The wiring board of claim 1, wherein the thermally conductive layer is an aluminum plate.

3. The wiring board of claim 1, wherein the heat-conducting post is an aluminum post.

4. The wiring board of claim 3, wherein the wall of the through-hole is provided with a copper layer, the copper layer being soldered to the aluminum post.

5. The wiring board of claim 1, wherein the thermally conductive posts are graphite posts.

6. The circuit board of claim 1, wherein the heat conducting layer has heat dissipating slots formed at positions protruding from the side surfaces of the insulating base layer.

7. The wiring board of any one of claims 1-6, further comprising an ink layer disposed on the surface of the insulating base layer and the surface of the wiring layer.