CN214279936U - Novel film uncovering system - Google Patents
Novel film uncovering system Download PDFInfo
- Publication number
- CN214279936U CN214279936U CN202022542723.8U CN202022542723U CN214279936U CN 214279936 U CN214279936 U CN 214279936U CN 202022542723 U CN202022542723 U CN 202022542723U CN 214279936 U CN214279936 U CN 214279936U
- Authority
- CN
- China
- Prior art keywords
- membrane
- take
- wafer
- film
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a novel take off membrane system, include wafer, protection film, take off membrane sticky tape, gyro wheel, the laminating of protection film one side is on the wafer, take off membrane sticky tape and the another side of protection film through taking off the bonding of membrane heating head, the gyro wheel sets up and is located above the wafer and takes off membrane sticky tape, take off membrane heating head for oval, the size is 50mm 4mm, the wafer top is equipped with the camera, takes off membrane heating head size change back, takes off the membrane and does not have the obscission, and the camera carries out image formation to appointed region, and real time monitoring takes off the membrane state, and operating personnel can audio-visual observation membrane's state, has solved the problem of the position and the state of difficult judgement membrane. The hidden quality trouble is avoided.
Description
Technical Field
The utility model relates to a semiconductor manufacturing equipment field especially relates to a novel take off membrane system.
Background
In the traditional semiconductor wafer film uncovering method, a film uncovering adhesive tape and a film on the surface of a wafer are heated by a film uncovering heating head, and pressure is applied to fully adhere the film uncovering adhesive tape and the film. And then the film removing adhesive tape drives the protective film on the surface of the wafer to be removed through the movement of the mechanical roller.
At the present stage, the heating head for heating and pressurizing the film-removing adhesive tape and the protective film on the surface of the wafer is smaller in size. Because the film has high viscosity, when the tension of a bonding position is greater than the adhesive force under the condition that the stress area is certain in the film uncovering process, the bonding part is easy to fall off, the film cannot be successfully uncovered, and the equipment has frequent failure. When the bonding position of the film is peeled off, since the peeled film is completely peeled off by the driving of the rollers, people cannot visually see the state between the rollers, for example, whether the film on the surface of the wafer is peeled off? If the wafer protective film is already uncovered, the film falls off when moving between the rollers, and quality accidents can occur when an operator rotates the wafer to uncover the film for the second time.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect of prior art, the utility model provides a novel take off membrane system, include wafer 1, protection film 2, take off membrane sticky tape 3, gyro wheel 4, 2 one sides laminating of protection film are on wafer 1, take off membrane sticky tape 3 and the bonding of protection film 2's another side through taking off membrane heating head, gyro wheel 4 sets up and is located to take off membrane sticky tape 3 top in 1 top of wafer, it is oval to take off the membrane heating head, and the size is 50mm 4mm, 1 top of wafer is equipped with camera 5.
Preferably, the camera 5 is connected with a power supply 6 through a wire.
Preferably, a voltage stabilizing block 7 is arranged between the camera 5 and the power supply 6.
Preferably, the voltage stabilizing block 7 is connected with a display screen 8, and the display screen 8 is connected with the camera 5.
The utility model has the advantages that:
the adhesive force is increased by increasing the adhesive area, the size of the film uncovering heating head is directly increased, the film uncovering device is convenient and simple, the operation is convenient, the original structural design of equipment does not need to be changed, and the film uncovering does not fall off after the size of the film uncovering heating head is changed. By accessing the image monitoring function, the camera images the designated area, the film uncovering state is monitored in real time, an operator can visually observe the state of the film, and the problem that the position and the state of the film are difficult to judge is solved. The hidden quality trouble is avoided.
Drawings
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a system block diagram of a camera;
Detailed Description
In order to make the technical solutions of the present invention better understood and make the above features, objects, and advantages of the present invention more comprehensible, the present invention is further described with reference to the following examples. The examples are intended to illustrate the invention only and are not intended to limit the scope of the invention.
As shown in fig. 1-2, the present invention comprises:
the utility model provides a novel take off membrane system, includes wafer 1, protection film 2, takes off membrane sticky tape 3, gyro wheel 4, 2 one sides laminating of protection film are on wafer 1, take off membrane sticky tape 3 and the bonding of protection film 2 another side through taking off membrane heating head, gyro wheel 4 sets up and is located to take off membrane sticky tape 3 top in 1 top of wafer, it is oval to take off membrane heating head, and the size is 50mm 4mm, 1 top of wafer is equipped with camera 5.
In this embodiment, the camera 5 is preferably connected to a power supply 6 through a wire.
In this embodiment, a voltage stabilizing block 7 is preferably disposed between the camera 5 and the power supply 6.
In this embodiment, the voltage stabilization block 7 is preferably connected to a display screen 8, and the display screen 8 is connected to the camera 5.
The size of the heating head is changed from 10mm by 3mm to 50mm by 4mm by changing the size of the heating head of the stripping film. The adhesive area is increased, the adhesive force is increased, the film removing adhesive tape 3 and the protective film 2 are firmly adhered, and the problem of film removing failure is solved.
Through installing camera monitoring device additional, the real time monitoring is taken off the membrane state between the membrane gyro wheel, provides and observes the visual angle better, has stopped because of the quality accident that can't judge to take off the membrane state and lead to.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.
Claims (4)
1. The utility model provides a novel take off membrane system, its characterized in that, include wafer (1), protection film (2), take off membrane sticky tape (3), gyro wheel (4), protection film (2) one side laminating is on wafer (1), take off the another side of membrane sticky tape (3) and protection film (2) through taking off the bonding of membrane heating head, gyro wheel (4) set up and are located above wafer (1) and take off membrane sticky tape (3) top, take off the membrane heating head and be oval, the size is 50mm 4mm, wafer (1) top is equipped with camera (5).
2. The novel film uncovering system of claim 1, wherein: the camera (5) is connected with a power supply (6) through a lead.
3. The novel film uncovering system of claim 2, wherein: and a voltage stabilizing block (7) is arranged between the camera (5) and the power supply (6).
4. The novel film uncovering system of claim 3, wherein: the voltage stabilizing block (7) is connected with a display screen (8), and the display screen (8) is connected with the camera (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022542723.8U CN214279936U (en) | 2020-11-06 | 2020-11-06 | Novel film uncovering system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022542723.8U CN214279936U (en) | 2020-11-06 | 2020-11-06 | Novel film uncovering system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214279936U true CN214279936U (en) | 2021-09-24 |
Family
ID=77773485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022542723.8U Active CN214279936U (en) | 2020-11-06 | 2020-11-06 | Novel film uncovering system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214279936U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118102512A (en) * | 2024-04-25 | 2024-05-28 | 太仓迪科力科技有限公司 | Heating control system based on film uncovering adhesive tape for semiconductor manufacturing process |
-
2020
- 2020-11-06 CN CN202022542723.8U patent/CN214279936U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118102512A (en) * | 2024-04-25 | 2024-05-28 | 太仓迪科力科技有限公司 | Heating control system based on film uncovering adhesive tape for semiconductor manufacturing process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9289970B2 (en) | Apparatus and method for peeling protective film and method for fabricating stereoscopic image display device | |
| CN214279936U (en) | Novel film uncovering system | |
| CN104527193B (en) | A kind of image system laminator | |
| KR100926117B1 (en) | Test system using a virtual review and method thereof | |
| CN102368130B (en) | Frame gum coating equipment and method of liquid crystal panel | |
| CN108989503A (en) | Display screen structure and electronic equipment | |
| JP2004118012A (en) | Method for sticking polarizing plate to liquid crystal panel | |
| JP2005157012A (en) | Film-sticking method, film-sticking device, and manufacturing method of electronic component using them | |
| CN205829807U (en) | Wide-angle imaging header structure | |
| CN203930274U (en) | The combination unit of glass substrate and backlight | |
| JP4330377B2 (en) | Large pellicle assembly method and large pellicle assembly apparatus | |
| JP3288495B2 (en) | Apparatus for sticking conductive film | |
| CN109164614B (en) | Liquid crystal alignment method and liquid crystal alignment monitoring equipment | |
| CN208671969U (en) | A kind of surface wiping monitoring system device | |
| JPH06163642A (en) | Method of judging whether sticking condition of conductive film is good or bad | |
| KR102291907B1 (en) | A lens assembly device having vision in part of bonding module | |
| CN109604840A (en) | Laser cutting device | |
| CN108535181A (en) | Peel test force system and peel test force method | |
| CN109739035B (en) | Peeling detection system and peeling detection method of liquid crystal panel | |
| CN201279961Y (en) | Release film stripping mechanism | |
| JPH09229817A (en) | Method for inspecting polarizing plate | |
| JPH0346544A (en) | Automatic inspecting device for bandlike body | |
| CN207067006U (en) | TFT and CF connection monitoring integration equipment | |
| CN107509008A (en) | The optics protection element replacement system and its method of monitoring arrangement | |
| CN114677666B (en) | Cab motion attitude detection method and system in vibration test |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |